Texas Instruments Tiva TM4C123G User manual

Tiva™C Series TM4C123G LaunchPad
Evaluation Board
User's Guide
Literature Number: SPMU296
April 2013

Contents
1 Board Overview .................................................................................................................. 4
1.1 Kit Contents .................................................................................................................. 5
1.2 Using the Tiva C Series LaunchPad ..................................................................................... 5
1.3 Features ...................................................................................................................... 5
1.4 BoosterPacks ................................................................................................................ 6
1.5 Specifications ................................................................................................................ 6
2 Hardware Description .......................................................................................................... 7
2.1 Functional Description ...................................................................................................... 7
2.1.1 Microcontroller ...................................................................................................... 7
2.1.2 USB Connectivity .................................................................................................. 8
2.1.3 Motion Control ...................................................................................................... 8
2.1.4 User Switches and RGB User LED .............................................................................. 9
2.1.5 Headers and BoosterPacks ....................................................................................... 9
2.2 Power Management ....................................................................................................... 11
2.2.1 Power Supplies ................................................................................................... 11
2.2.2 Hibernate .......................................................................................................... 11
2.2.3 Clocking ............................................................................................................ 12
2.2.4 Reset ............................................................................................................... 12
2.3 In-Circuit Debug Interface (ICDI) ........................................................................................ 12
2.3.1 Virtual COM Port ................................................................................................. 12
3 Software Development ....................................................................................................... 13
3.1 Software Description ...................................................................................................... 13
3.2 Source Code ............................................................................................................... 13
3.3 Tool Options ................................................................................................................ 13
3.4 Programming the Tiva C Series LaunchPad Evaluation Board ..................................................... 14
4 References, PCB Layout, and Bill of Materials ...................................................................... 15
4.1 References ................................................................................................................. 15
4.2 Component Locations ..................................................................................................... 16
4.3 Bill of Materials (BOM) .................................................................................................... 17
A Schematics ....................................................................................................................... 19
2Contents SPMU296–April 2013
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List of Figures
1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board.............................................................. 4
2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram.......................................................... 7
4-1. Tiva C Series LaunchPad Component Locations (Top View) ....................................................... 16
4-2. Tiva C Series LaunchPad Dimensions ................................................................................. 17
List of Tables
1-1. EK-TM4C123GXL Specifications ......................................................................................... 6
2-1. USB Device Signals ........................................................................................................ 8
2-2. User Switches and RGB LED Signals ................................................................................... 9
2-3. J1 Connector ................................................................................................................ 9
2-4. J2 Connector............................................................................................................... 10
2-5. J3 Connector............................................................................................................... 10
2-6. J4 Connector............................................................................................................... 11
2-7. In-Circuit Debug Interface (ICDI) Signals .............................................................................. 12
2-8. Virtual COM Port Signals................................................................................................. 12
4-1. EK-TM4C123GXL Bill of Materials ..................................................................................... 17
3
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Power Select
Switch Green Power LED
USB Connector
(Power/ICDI)
Reset Switch
RGB User LED
User Switch 2User Switch 1
USB Micro-A/-B
Connector
(Device)
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
Tiva C Series
LaunchPad
BoosterPack XL
Interface (J1, J2, J3,
and J4 Connectors)
MSP430
LaunchPad-Compatible
BoosterPack Interface
MSP430
LaunchPad-Compatible
BoosterPack Interface
Tiva
TM4C123GH6PMI
Microcontroller
Tiva
TM4C123GH6PMI
Microcontroller
Chapter 1
SPMU296–April 2013
Board Overview
The Tiva™ C Series TM4C123G LaunchPad Evaluation Board (EK-TM4C123GXL) is a low-cost
evaluation platform for ARM®Cortex™-M4F-based microcontrollers. The Tiva C Series LaunchPad design
highlights the TM4C123GH6PMI microcontroller USB 2.0 device interface, hibernation module, and motion
control pulse-width modulator (MC PWM) module. The Tiva C Series LaunchPad also features
programmable user buttons and an RGB LED for custom applications. The stackable headers of the Tiva
C Series TM4C123G LaunchPad BoosterPack XL interface demonstrate how easy it is to expand the
functionality of the Tiva C Series LaunchPad when interfacing to other peripherals on many existing
BoosterPack add-on boards as well as future products. Figure 1-1 shows a photo of the Tiva C Series
LaunchPad.
Figure 1-1. Tiva C Series TM4C123G LaunchPad Evaluation Board
Tiva, MSP430, Code Composer Studio are trademarks of Texas Instruments.
Cortex is a trademark of ARM Limited.
ARM, RealView are registered trademarks of ARM Limited.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners.
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www.ti.com Kit Contents
1.1 Kit Contents
The Tiva C Series TM4C123G LaunchPad Evaluation Kit contains the following items:
• Tiva C Series LaunchPad Evaluation Board (EK-TM4C123GXL)
• On-board In-Circuit Debug Interface (ICDI)
• USB micro-B plug to USB-A plug cable
•README First document
1.2 Using the Tiva C Series LaunchPad
The recommended steps for using the Tiva C Series TM4C123G LaunchPad Evaluation Kit are:
1. Follow the README First document included in the kit. The README First document will help you
get the Tiva C Series LaunchPad up and running in minutes. See the Tiva C Series LaunchPad web
page for additional information to help you get started.
2. Experiment with LaunchPad BoosterPacks. A selection of Tiva C Series BoosterPacks and
compatible MSP430™ BoosterPacks can be found at the TI MCU LaunchPad web page.
3. Take your first step toward developing an application with Project 0 using your preferred ARM
tool-chain and the Tiva C Series TivaWare Peripheral Driver Library. Software applications are
loaded using the on-board In-Circuit Debug Interface (ICDI). See Chapter 3,Software Development,
for the programming procedure. The TivaWare for C Series Peripheral Driver Library Software
Reference Manual contains specific information on software structure and function. For more
information on Project 0, go to the Tiva C Series LaunchPad wiki page.
4. Customize and integrate the hardware to suit an end application. This user's manual is an
important reference for understanding circuit operation and completing hardware modification.
You can also view and download almost six hours of training material on configuring and using the
LaunchPad. Visit the Tiva C Series LaunchPad Workshop for more information and tutorials.
1.3 Features
Your Tiva C Series LaunchPad includes the following features:
• Tiva TM4C123GH6PMI microcontroller
• Motion control PWM
• USB micro-A and micro-B connector for USB device, host, and on-the-go (OTG) connectivity
• RGB user LED
• Two user switches (application/wake)
• Available I/O brought out to headers on a 0.1-in (2.54-mm) grid
• On-board ICDI
• Switch-selectable power sources:
– ICDI
– USB device
• Reset switch
• Preloaded RGB quickstart application
• Supported by TivaWare for C Series software including the USB library and the peripheral driver library
• Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface, which features stackable headers to
expand the capabilities of the Tiva C Series LaunchPad development platform
– For a complete list of available BoosterPacks that can be used with the Tiva C Series LaunchPad,
see the LaunchPad web page.
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BoosterPacks www.ti.com
1.4 BoosterPacks
The Tiva C Series LaunchPad provides an easy and inexpensive way to develop applications with the
TM4C123GH6PM microcontroller. Tiva C Series BoosterPacks and MSP430 BoosterPacks expand the
available peripherals and potential applications of the Tiva C Series LaunchPad. BoosterPacks can be
used with the Tiva C Series LaunchPad or you can simply use the on-board TM4C123GH6PM
microcontroller as its processor. See Chapter 2 for more information.
Build your own BoosterPack and take advantage of Texas Instruments’ website to help promote it! From
sharing a new idea or project, to designing, manufacturing, and selling your own BoosterPack kit, TI offers
a variety of avenues for you to reach potential customers with your solutions.
1.5 Specifications
Table 1-1 summarizes the specifications for the Tiva C Series LaunchPad.
Table 1-1. EK-TM4C123GXL Specifications
Parameter Value
4.75 VDC to 5.25 VDC from one of the following sources:
• Debugger (ICDI) USB Micro-B cable (connected to a
Board supply voltage PC)
• USB Device Micro-B cable (connected to a PC)
2.0 in x 2.25 in x 0.425 in (5.0 cm x 5.715 cm x 10.795
Dimensions mm) (L x W x H)
• 3.3 VDC (300 mA max)
Break-out power output • 5.0 VDC (depends on 3.3 VDC usage, 23 mA to 323
mA)
RoHS status Compliant
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TM4C123GH6PMI
Debug Breakout Pads
ICDI
USB Debug
Connector
USB Device
Connector
Power Select
Switch
ICDI
USB
VDD
JTAG/SWD
UART0
GPIO
GPIO
GPIO
GPIO
I/O
I/O
Device
Power
Management
Breakout Pads
HIB WAKE
User
Switches
RGB LED
Tiva C Series
LaunchPad-Specific
BoosterPackXL
Expansion Headers
TM
MSP430
LaunchPad-Compatible
Expansion Headers
TM
Chapter 2
SPMU296–April 2013
Hardware Description
The Tiva C Series LaunchPad includes a TM4C123GH6PM microcontroller and an integrated ICDI as well
as a range of useful peripheral features (as the block diagram in Figure 2-1 shows). This chapter
describes how these peripherals operate and interface to the microcontroller.
Figure 2-1. Tiva C Series LaunchPad Evaluation Board Block Diagram
2.1 Functional Description
2.1.1 Microcontroller
The TM4C123GH6PM is a 32-bit ARM Cortex-M4-based microcontroller with 256-kB Flash memory, 32-
kB SRAM, and 80-MHz operation; USB host, device, and OTG connectivity; a Hibernation module and
PWM; and a wide range of other peripherals. See the TM4C123GH6PM microcontroller data sheet
(literature number SPMS376) for complete device details.
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Functional Description www.ti.com
Most of the microcontroller signals are routed to 0.1-in (2.54-mm) pitch headers. An internal multiplexer
allows different peripheral functions to be assigned to each of these GPIO pads. When adding external
circuitry, consider the additional load on the evaluation board power rails.
The TM4C123GH6PM microcontroller is factory-programmed with a quickstart demo program. The
quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the
quickstart application has been replaced with a user program.
2.1.2 USB Connectivity
The EK-TM4C123GXL is designed and functions as a USB device without hardware modification. The
USB device signals are dedicated to USB functionality and are not shared with the BoosterPack headers.
The USB device signals are listed in Table 2-1.
Table 2-1. USB Device Signals
GPIO Pin Pin Function USB Device
PD4 USB0DM D–
PD5 USB0DP D+
The TM4C123GH6PM target device is also capable of USB embedded host and on-the-go (OTG)
functions. OTG functionality can be enabled by populating R25 and R29 with 0-Ωresistors. These
resistors connect the USB ID and USB VBUS signals to PB0 and PB1. When these resistors are populated,
PB0 and PB1 must remain in the respective USB pin mode configurations to prevent device damage. PB0
and PB1 are also present on the J1 BoosterPack header. Therefore, if R25 or R29 are populated, care
must be taken not to conflict these signals with BoosterPack signals.
USB embedded host operation can be enabled in the same way for USB devices that are self-powered.
Providing power when acting as a USB host requires a BoosterPack with power switching and appropriate
connectors. All USB host signals are available on the BoosterPack interface except D+ and D–, which are
only available on the USB micro-A/-B connector and the two adjacent test points.
When connected as a USB device, the evaluation board can be powered from either the ICDI or the USB
Device connectors. The user can select the power source by moving the POWER SELECT switch (SW3)
to the Device position. See the Power Management schematic (appended to this document).
2.1.3 Motion Control
The EK-TM4C123GXL includes the Tiva C-Series Motion Control PWM technology, featuring two PWM
modules capable of generating 16 PWM outputs. Each PWM module provides a great deal of flexibility
and can generate simple PWM signals—for example, those required by a simple charge pump—as well
as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three
generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter
bridge.
Two quadrature encoder interfaces (QEI) are also available to provide motion control feedback. See the
Headers and BoosterPacks section of this document for details about the availability of these signals on
the BoosterPack interface.
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2.1.4 User Switches and RGB User LED
The Tiva C Series LaunchPad comes with an RGB LED. This LED is used in the preloaded RGB
quickstart application and can be configured for use in custom applications.
Two user buttons are included on the board. The user buttons are both used in the preloaded quickstart
application to adjust the light spectrum of the RGB LED as well as go into and out of hibernation. The user
buttons can be used for other purposes in the user’s custom application.
The evaluation board also has a green power LED. Table 2-2 shows how these features are connected to
the pins on the microcontroller.
Table 2-2. User Switches and RGB LED Signals
GPIO Pin Pin Function USB Device
PF4 GPIO SW1
PF0 GPIO SW2
PF1 GPIO RGB LED (Red)
PF2 GPIO RGB LED (Blue)
PF3 GPIO RGD LED (Green)
2.1.5 Headers and BoosterPacks
The two double rows of stackable headers are mapped to most of the GPIO pins of the TM4C123GH6PM
microcontroller. These rows are labeled as connectors J1, J2, J3, and J4. Connectors J3 and J4 are
located 0.1 in (2.54 mm) inside of the J1 and J2 connectors. All 40 header pins of the J1, J2, J3, and J4
connectors make up the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface. Table 2-3
through Table 2-6 show how these header pins are connected to the microcontroller pins and which GPIO
functions can be selected.
NOTE: To configure the device peripherals easily and intuitively using a graphical user interface
(GUI), see the Tiva C Series Pinmux Utility found at www.ti.com/tool/lm4f_pinmux. This easy-
to-use interface makes setting up alternate functions for GPIOs simple and error-free.
Table 2-3. J1 Connector(1)
Analog Tiva C GPIOPCTL Register Setting
On-
Function Series
J4 Pin GPIO board MCU
GPIO Function 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
1.01 3.3 V
1.02 PB5 AIN11 – 57 – SSI2Fss – M0PWM3 – – T1CCP1 CAN0Tx – – –
1.03 PB0 USB0ID – 45 U1Rx – – – – – T2CCP0 – – – –
1.04 PB1 USB0VBUS – 46 U1Tx – – – – – T2CCP1 – – – –
1.05 PE4 AIN9 – 59 U5Rx – I2C2SCL M0PWM4 M1PWM2 – – CAN0Rx – – –
1.06 PE5 AIN8 – 60 U5Tx – I2C2SDA M0PWM5 M1PWM3 – – CAN0Tx – – –
1.07 PB4 AIN10 – 58 – SSI2Clk – M0PWM2 – – T1CCP0 CAN0Rx – – –
1.08 PA5 – – 22 – SSI0Tx – – – – – – – – –
1.09 PA6 – – 23 – – I2C1SCL – M1PWM2 – – – – – –
1.10 PA7 – – 24 – – I2C1SDA – M1PWM3 – – – – – –
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
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Functional Description www.ti.com
Table 2-4. J2 Connector(1)
Analog Tiva C GPIOPCTL Register Setting
Function
J4 On-board Series
GPIO
Pin Function MCU
GPIO 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
2.01 GND
2.02 PB2 – – 47 – – I2C0SCL – – – T3CCP0 – – – –
2.03 PE0 AIN3 – 9 U7Rx – – – – – – – – – –
2.04 PF0 – USR_SW2/ 28 U1RTS SSI1Rx CAN0Rx – M1PWM4 PhA0 T0CCP0 NMI C0o – –
WAKE (R1)
2.05 RESET
PB7 – – 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –
PD1 AIN6 Connected 62 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –
2.06 for MSP430
Compatibility
(R10)
PB6 – – 1 – SSI2Rx – M0PWM0 – – T0CCP0 – – – –
PD0 AIN7 Connected 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –
2.07 for MSP430
Compatibility
(R9)
2.08 PA4 – – 21 – SSI0Rx – – – – – – – – –
2.09 PA3 – – 20 – SSI0Fss – – – – – – – – –
2.10 PA2 – – 19 – SSI0Clk – – – – – – – – –
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
Table 2-5. J3 Connector(1)
Analog Tiva C GPIOPCTL Register Setting
Function
J4 On-board Series
GPIO
Pin Function MCU
GPIO 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
3.01 5.0 V
3.02 GND
PD0 AIN7 – 61 SSI3Clk SSI1Clk I2C3SCL M0PWM6 M1PWM0 – WT2CCP0 – – – –
PB6 – Connected 1 – SSI2Rx – M0PWM0 – T0CCP0 – – – –
3.03 for MSP430
Compatibilit
y (R9)
PD1 AIN6 – 92 SSI3Fss SSI1Fss I2C3SDA M0PWM7 M1PWM1 – WT2CCP1 – – – –
PB7 – Connected 4 – SSI2Tx – M0PWM1 – – T0CCP1 – – – –
3.04 for MSP430
Compatibilit
y (R10)
3.05 PD2 AIN5 63 SSI3Rx SSI1Rx – M0FAULT0 – – WT3CCP0 USB0EPE
N
3.06 PD3 AIN4 – 64 SSI3Tx SSI1Tx – – – – WT3CCP1 USB0PFLT – – –
3.07 PE1 AIN2 – 8 U7Tx – – – – – – – – –
3.08 PE2 AIN1 – 7 – – – – – – – – – – –
3.09 PE3 AIN0 – 6 – – – – – – – – – – –
3.10 PF1 – – 29 U1CTS SSI1Tx – – M1PWM5 – T0CCP1 – C1o TRD1 –
(1) Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad.
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Table 2-6. J4 Connector
Analog Tiva C GPIOPCTL Register Setting
On-
Function
J4 Series
GPIO board
Pin MCU
GPIO Function 1 2 3 4 5 6 7 8 9 14 15
Pin
AMSEL
4.01 PF2 – Blue LED 30 – SSI1Clk – M0FAULT0 M1PWM6 – T1CCP0 – – – TRD0
(R11)
4.02 PF3 – Green 31 – SSI1Fss CAN0Tx – M1PWM7 – T1CCP1 – – – TRCLK
LED
(R12)
4.03 PB3 – – 48 – – I2C0SDA – – – T3CCP1 – – – –
4.04 PC4 C1– – 16 U4Rx U1Rx – M0PWM6 – IDX1 WT0CCP0 U1RTS – – –
4.05 PC5 C1+ – 15 U4Tx U1Tx – M0PWM7 – PhA1 WT0CCP1 U1CTS – – –
4.06 PC6 C0+ – 14 U3Rx – – – – PhB1 WT1CCP0 USB0EPE – – –
N
4.07 PC7 C0– – 13 U3Tx – – – – – WT1CCP1 USB0PFLT – – –
4.08 PD6 – – 53 U2Rx – – – – PhA0 WT5CCP0 – – – –
4.09 PD7 – – 10 U2Tx – – – – PhB0 WT5CCP1 NMI – – –
4.10 PF4 – USR_SW 5 – – – – M1FAULT0 IDX0 T2CCP0 USB0EPE – – –
1 (R13) N
Connectors J1 and J2 of the Tiva C Series TM4C123G LaunchPad BoosterPack XL Interface provide
compatibility with MSP430 LaunchPad BoosterPacks. Highlighted functions (shaded cells) in Table 2-3
through Table 2-5 indicate configuration for compatibility with the MSP430 LaunchPad.
A complete list of Tiva C Series BoosterPacks and Tiva C Series LaunchPad-compatible MSP430
BoosterPacks is available at www.ti.com/tm4c123g-launchpad.
2.2 Power Management
2.2.1 Power Supplies
The Tiva C Series LaunchPad can be powered from one of two power sources:
• On-board ICDI USB cable (Debug, Default)
• USB device cable (Device)
The POWER SELECT switch (SW3) is used to select one of the two power sources. Select only one
source at a time.
2.2.2 Hibernate
The Tiva C Series LaunchPad provides an external 32.768-kHz crystal (Y1) as the clock source for the
TM4C123GH6PM Hibernation module clock source. The current draw while in Hibernate mode can be
measured by making some minor adjustments to the Tiva C Series LaunchPad. This procedure is
explained in more detail later in this section.
The conditions that can generate a wake signal to the Hibernate module on the Tiva C Series LaunchPad
are waking on a Real-time Clock (RTC) match and/or waking on assertion of the WAKE pin. (1) The second
user switch (SW2) is connected to the WAKE pin on the microcontroller. The WAKE pin, as well as the
VDD and HIB pins, are easily accessible through breakout pads on the Tiva C Series LaunchPad. See the
appended schematics for details.
spacer
spacer
spacer
spacer
(1) If the board does not turn on when you connect it to a power source, the microcontroller might be in Hibernate mode (depending on the
programmed application). You must satisfy one of the programmed wake conditions and connect the power to bring the microcontroller
out of Hibernate mode and turn on the board.
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In-Circuit Debug Interface (ICDI) www.ti.com
There is no external battery source on the Tiva C Series LaunchPad Hibernation module, which means
the VDD3ON power control mechanism should be used. This mechanism uses internal switches to
remove power from the Cortex-M4 processor as well as to most analog and digital functions while
retaining I/O pin power.
To measure the Hibernation mode current or the Run mode current, the VDD jumper that connects the 3.3
V pin and the MCU_PWR pin must be removed. See the complete schematics (appended to this
document) for details on these pins and component locations. An ammeter should then be placed
between the 3.3 V pin and the MCU_PWR pin to measure IDD (or IHIB_VDD3ON). The TM4C123GH6PM
microcontroller uses VDD as its power source during VDD3ON Hibernation mode, so IDD is the Hibernation
mode (VDD3ON mode) current. This measurement can also be taken during Run mode, which measures
IDD the microcontroller running current.
2.2.3 Clocking
The Tiva C Series LaunchPad uses a 16.0-MHz crystal (Y2) to complete the TM4C123GH6PM
microcontroller main internal clock circuit. An internal PLL, configured in software, multiples this clock to
higher frequencies for core and peripheral timing.
The Hibernation module is clocked from an external 32.768-KHz crystal (Y1).
2.2.4 Reset
The RESET signal into the TM4C123GH6PM microcontroller connects to the RESET switch and to the
ICDI circuit for a debugger-controlled reset.
External reset is asserted (active low) under any of three conditions:
• Power-on reset (filtered by an R-C network)
• RESET switch held down
• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be
supported by all debuggers)
2.3 In-Circuit Debug Interface (ICDI)
The Tiva C Series LaunchPad evaluation board comes with an on-board In-Circuit Debug Interface (ICDI).
The ICDI allows for the programming and debug of the TM4C123GH6PM using the LM Flash Programmer
and/or any of the supported tool chains. Note that the ICDI supports only JTAG debugging. An external
debug interface can be connected for Serial Wire Debug (SWD) and SWO (trace).
Table 2-7 shows the pins used for JTAG and SWD. These signals are also mapped out to easily
accessible breakout pads and headers on the board.
Table 2-7. In-Circuit Debug Interface (ICDI) Signals
GPIO Pin Pin Function
PC0 TCK/SWCLK
PC1 TMS/SWDIO
PC2 TDI
PC3 TDO/SWO
2.3.1 Virtual COM Port
When plugged in to a PC, the device enumerates as a debugger and a virtual COM port. Table 2-8 shows
the connections for the COM port to the pins on the microcontroller.
Table 2-8. Virtual COM Port Signals
GPIO Pin Pin Function
PA0 U0RX
PA1 U0TX
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Chapter 3
SPMU296–April 2013
Software Development
This chapter provides general information on software development as well as instructions for Flash
memory programming.
3.1 Software Description
The TivaWare software provided with the Tiva C Series LaunchPad provides access to all of the
peripheral devices supplied in the design. The Tiva C Series Peripheral Driver Library is used to operate
the on-chip peripherals as part of TivaWare.
TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These
applications demonstrate the capabilities of the TM4C123GH6PM microcontroller, as well as provide a
starting point for the development of the final application for use on the Tiva C Series LaunchPad
evaluation board.
3.2 Source Code
The complete source code including the source code installation instructions are provided at
www.ti.com/tm4c123g-launchpad. The source code and binary files are installed in the DriverLib tree.
3.3 Tool Options
The source code installation includes directories containing projects and/or makefiles for the following tool-
chains:
• Keil ARM RealView®Microcontroller Development System
• IAR Embedded Workbench for ARM
• Sourcery CodeBench
• Texas Instruments' Code Composer Studio™ IDE
Download evaluation versions of these tools from the TI website. Due to code size restrictions, the
evaluation tools may not build all example programs. A full license is necessary to re-build or debug all
examples.
Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for
example, Quickstart-Keil, Quickstart-IAR) which are available for download from the evaluation kit section
of the TI website at www.ti.com/tiva-c.
For detailed information on using the tools, see the documentation included in the tool chain installation or
visit the respective web site of the tool supplier.
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Programming the Tiva C Series LaunchPad Evaluation Board www.ti.com
3.4 Programming the Tiva C Series LaunchPad Evaluation Board
The Tiva C Series LaunchPad software package includes pre-built binaries for each of the example
applications. If you have installed TivaWare to the default installation path of
C:\ti\TivaWare_C_Series_<version>, you can find the example applications in
C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl . The on-board ICDI is used with the
LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad.
Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board
using the ICDI:
1. Install LM Flash Programmer on a PC running Microsoft®Windows®.
2. Switch the POWER SELECT switch to the right for Debug mode.
3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB
port on the board.
4. Verify that the POWER LED D4 on the board is lit.
5. Run the LM Flash Programmer.
6. In the Configuration tab, use the Quick Set control to select the EK-TM4C123GXL evaluation board.
7. Move to the Program tab and click the Browse button. Navigate to the example applications directory
(the default location is C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c123gxl ).
8. Each example application has its own directory. Navigate to the example directory that you want to
load and then into the directory which contains the binary (*.bin) files. Select the binary file and click
Open.
9. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check
Reset MCU After Program.
Program execution starts once the Verify process is complete.
14 Software Development SPMU296–April 2013
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Chapter 4
SPMU296–April 2013
References, PCB Layout, and Bill of Materials
4.1 References
In addition to this document, the following references are available for download at www.ti.com:
• Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).
• LM Flash Programmer tool. Available for download at www.ti.com/tool/lmflashprogrammer.
• TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.
• TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).
• TPS73633 Low-Dropout Regulator with Reverse Current Protection Data Sheet (literature number
SBVS038)
• Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs
Additional support:
• RealView MDK (www.keil.com/arm/rvmdkkit.asp)
• IAR Embedded Workbench (www.iar.com).
• Sourcery CodeBench development tools (www.codesourcery.com/gnu_toolchains/arm).
15
SPMU296–April 2013 References, PCB Layout, and Bill of Materials
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Component Locations www.ti.com
4.2 Component Locations
Plots of the top-side component locations are shown in Figure 4-1 and the board dimensions are shown in
Figure 4-2.
Figure 4-1. Tiva C Series LaunchPad Component Locations (Top View)
16 References, PCB Layout, and Bill of Materials SPMU296–April 2013
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www.ti.com Bill of Materials (BOM)
Figure 4-2. Tiva C Series LaunchPad Dimensions
NOTE: Units are in mils (one thousandth of an inch): 1 mil = 0.001 inch (0.0254 mm).
4.3 Bill of Materials (BOM)
Table 4-1 shows the bill of materials for the EK-TM4C123GXL evaluation board.
Table 4-1. EK-TM4C123GXL Bill of Materials
Item Ref Des Qty Description Manufacturer Manufacturer Part No
1 C1-2, C7, C12, C14 5 Capacitor, 0402, X5R, 10 V, Low Johanson Dielectrics 100R07X105KV4T
ESR Inc
2 C25-26, C31-32 4 Capacitor, 10 pF, 50 V, 5%, Murata GRM1555C1H100JZ01D
NPO/COG, 0402
3 C28-29 2 Capacitor, 24 pF, 50 V, 5%, TDK C1005C0G1H240J
NPO/COG, 0402
4 C3, C5, C8, C15, 7 Capacitor, 0.01 μF 25 V, 10% Taiyo Yuden TMK105B7103KV-F
C18-19, C21 0402 X7R
5 C4, C6, C10-11, C17, 8 Capacitor, 0.1 μF 16 V, 10% 0402 Taiyo Yuden EMK105B7104KV-F
C20, C23-24 X7R
6 C9, C22 2 Capacitor, 2.2 μF, 16 V, 10%, Murata GRM188R61C225KE15D
0603, X5R
7 D1 1 LED, Tri-Color RGB, 0404 SMD Everlight 18-038/RSGHBHC1-S02/2T
Common Anode
8 D4 1 LED, Green 565 nm, Clear 0805 Lite-On LTST-C171GKT
SMD
9 H24 1 Header, 1x2, 0.100, T-Hole, 3M 961102-6404-AR
Vertical Unshrouded, 0.220 Mate FCI 68001-102HLF
10 H25 1 Jumper, 0.100, Gold, Black, Sullins SPC02SYAN
Closed
11 J1, J3 2 Header, 2x10, T-Hole Vertical Samtec SSW-110-23-S-D
unshrouded stacking
17
SPMU296–April 2013 References, PCB Layout, and Bill of Materials
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Bill of Materials (BOM) www.ti.com
Table 4-1. EK-TM4C123GXL Bill of Materials (continued)
Item Ref Des Qty Description Manufacturer Manufacturer Part No
12 J11 1 USB Connector, Micro B Recept Hirose ZX62-B-5PA
RA SMT BTTM MNT
13 J2, J4 2 Header, 1x2, 0.100, SMT, Samtec TSM-110-01-S-DH-A-P-TR
Horizontal Unshrouded, 0.230 4UCON 10995
Mate Major League TSHSM-110-D-02-T-H-AP-
Electronics TR-P-LF
14 J9 1 USB Connector, Micro A/B Hirose ZX62-AB-5PA
Receptacle SMD
15 Q1-3 3 NPN SC70 pre-biased Diodes Inc DTC114EET1G
16 R1-2, R9-16, R20, 12 Resistor, 0 Ω1/10W 0603 SMD Panasonic ERJ-3GEY0R00V
R26
17 R18-19, R21-23, R28 6 Resistor, 10 kΩ, 1/10W, 5%, 0402 Yageo RC0402FR-0710KL
Thick Film
18 R3-5, R8, R27 5 Resistor, 330 Ω, 1/10W, 5%, 0402 Yageo RC0402FR-07330RL
19 R31 1 Resistor, 1 MΩ1/10W, 5%, 0402 Rohm MCR01MRTF1004
20 RESET SW1, SW2 3 Switch, Tact 6 mm SMT, 160gf Omron B3S-1000
21 SW3 1 Switch, DPDT, SMT 300 mA × 2 at C K Components JS202011SCQN
6 V
22 U1, U2 2 Tiva C Series MCU Texas Instruments TM4C123GH6PMI
TM4C123GH6PM
23 U8 1 Regulator, 3.3 V, 400 mA, LDO Texas Instruments TPS73633DRBT
24 Y1 1 Crystal, 32.768 kHz Radial Can Abracon AB26TRB-32.768KHZ- T
25 Y2, Y5 2 Crystal, 16.00 MHz 5.0x3.2mm NDK NX5032GA-16.000000 MHz
SMT Abracon ABM3-16.000 MHz-B2- T
PCB Do Not Populate List
(Shown for information only)
26 C31, C34 2 Capacitor, 0.1 μF 16 V, 10% 0402 Taiyo Yuden EMK105B7104KV-F
X7R
27 D2 1 Diode, Dual Schottky, SC70, Diodes Inc BAS70W-05-7-F
BAS70 Common Cathode
28 R17 1 Resistor, 10 kΩ1/10W 5%, 0402 Yageo RC0402FR-0710KL
Thick Film
29 R24 1 Resistor, 330 Ω, 1/10W, 5%, 0402 Yageo RC0402FR-07330RL
30 R25, R29-30 3 Resistor, 0 Ω, 1/10W 0603 Panasonic ERJ-3GEY0R00V
31 U4 1 IC, Single Voltage Supervisor, 5V, Texas Instruments TLV803MDBZR
DBV
18 References, PCB Layout, and Bill of Materials SPMU296–April 2013
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated

Appendix A
SPMU296–April 2013
Schematics
This section contains the complete schematics for the Tiva C Series LaunchPad board.
• Microcontroller, USB, Expansion, Buttons, and LED
• Power Management
• In-Circuit Debug Interface
19
SPMU296–April 2013 Schematics
Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated

www.ti.com

108 WILD BASIN ROAD, SUITE 350

AUSTIN TX, 78746

TIVA MICROCONTROLLERS

TEXAS INSTRUMENTS

0.3

EK-TM4C123GXL

Tiva TM4C123G LaunchPad

Microcontroller, USB, Expansion, Buttons and LED

DGT

2/20/2013

EK-TM4C123GXL Rev A.sch

OF

1

3

SHEET

PART NO.

DATE

REVISION

DESIGNER

FILENAME

DESCRIPTION

PROJECT

R

J1 and J2 provide compatability with

Booster Packs designed for MSP430 Launchpad

J3 and J4 sit 100 mils inside J1 and J2 to provide

extended functions specific to this board.

See the board user manual for complete table of pin mux functions

1

VB

2

D-

3

D+

4

ID

5

G

6

8

9

7

J9

CON-USB-MICROAB

1

2

3

4

5

6

7

8

9

10

J1

CON_110_100

1

2

3

4

5

6

7

8

9

10

J2

CON_110_100

SW1

SW2

R8

330

1

2

3

4

5

6

7

8

9

10

J3

CON_110_100

1

2

3

4

5

6

7

8

9

10

J4

CON_110_100

1

PB6

4

PB7

5

PF4

6

PE3

7

PE2

8

PE1

9

PE0

10

PD7

13

PC7

14

PC6

15

PC5

16

PC4

17

PA0

18

PA1

19

PA2

20

PA3

21

PA4

22

PA5

23

PA6

24

PA7

28

PF0

29

PF1

30

PF2

31

PF3

43

PD4

44

PD5

45

PB0

46

PB1

47

PB2

48

PB3

49

PC3

50

PC2

51

PC1

52

PC0

53

PD6

58

PB4

57

PB5

59

PE4

60

PE5

61

PD0

62

PD1

63

PD2

64

PD3

U1-A

TM4C123G

1

A

2

R

3

G

4

B

D1

RGB_LED_0404_COMA

R9

0

R10

0

R1

0

R2

0

R11

0

R12

0

R13

0

R14

0

R4

330

B

E

C

Q2

DTC114EET1G

R3

330

B

E

C

Q1

DTC114EET1G

R5

330

B

E

C

Q3

DTC114EET1G

R25

0

R29

0

USB_DM

USB_DP

DEBUG/VCOM

GPIO

GPIO

PA2

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD6

PD7

PE0

PE1

PE2

PE3

PE4

PE5

PA0/U0RX_VCP_TXD

PA1/U0TX_VCP_RXD

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

DEBUG_PC3/TDO/SWO

USB_DM

USB_DP

USR_SW2

USR_SW1

GPIO

PB0

PB1

PB4

PB7

PB6

+3.3V

USR_SW2

USR_SW1

+USB_VBUS

WAKE

PB6

PB7

TARGETRST

PF4

PF3

PF2

PF1

PF0

PF4

PD7

+VBUS

PF2

PF3

PB2

+VBUS

LED_B

PB5

PE4

PE5

PA6

PA2

PA3

PA4

PF0

PE0

PF1

PB3

PC4

PC5

PC6

PC7

PD6

PA5

PA7

PD0

PD1

PD2

PD3

PE1

PE2

PE3

PD0

PD1

LED_G

LED_R

LED_R

LED_B

LED_G

PB1

PB0
