Texas Instruments BQ2515 EVM Series User manual

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BQ2515xEVM Evaluation Module
User's Guide
SLUUBV0A–July 2018–Revised August 2019
BQ2515xEVM Evaluation Module
This user's guide provides detailed testing instructions for the BQ2515x evaluation module (EVM). Also
included are descriptions of the necessary equipment, equipment setup, procedures, the printed-circuit
board layouts, schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations EVM,BQ2515xEVM, and the term evaluation module are
synonymous with the BQ2515x evaluation module, unless otherwise noted.
Contents
1 Introduction ................................................................................................................... 2
1.1 EVM Features....................................................................................................... 2
1.2 I/O Descriptions..................................................................................................... 2
2 Test Summary................................................................................................................ 4
2.1 Equipment ........................................................................................................... 4
2.2 Charge Mode........................................................................................................ 5
2.3 Ship Mode ........................................................................................................... 6
2.4 Warning .............................................................................................................. 6
2.5 Comparison Table .................................................................................................. 6
3 Board Layouts, Schematics, and Bill of Materials....................................................................... 7
3.1 Board Layouts....................................................................................................... 7
3.2 Schematics......................................................................................................... 12
3.3 Bill of Materials .................................................................................................... 15
List of Figures
1 BQ2515xEVM Connections ............................................................................................... 3
2 Connections for Test Setup ................................................................................................ 5
3 BQStudio Software Tool .................................................................................................... 6
4 Top Overlay .................................................................................................................. 7
5 Top Layer..................................................................................................................... 7
6 Signal Layer 1................................................................................................................ 8
7 Signal Layer 2................................................................................................................ 8
8 Bottom Layer................................................................................................................. 9
9 Bottom Overlay............................................................................................................... 9
10 Top Solder Mask ........................................................................................................... 10
11 Bottom Solder Mask ....................................................................................................... 10
12 Drill Drawing ................................................................................................................ 11
13 Board Dimensions.......................................................................................................... 11
14 BQ2515xEVM Schematic ................................................................................................ 12
15 BQ2515xEVM Jumper Connectors ..................................................................................... 13
16 BQ2515xEVM Interface Connector ..................................................................................... 13
17 User Menu Switches....................................................................................................... 14
18 LDO for Display/Other Peripherals....................................................................................... 14
List of Tables
1 Device Data Sheet........................................................................................................... 2

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2 Jumper Connections ........................................................................................................ 2
3 Recommended Operating Conditions..................................................................................... 3
4 Comparison Table........................................................................................................... 6
5 Bill of Materials ............................................................................................................. 15
Trademarks
Microsoft, Windows are registered trademarks of Microsoft Corporation.
All other trademarks are the property of their respective owners.
1 Introduction
The BQ2515xEVM is an evaluation kit for the BQ2515x integrated battery charge management IC. The
BQ2515x is an integrated battery charge management IC that integrates the most common functions
for wearable devices: Linear charger, regulated output/ load switch, manual reset with timer, ADC and
ship mode function.
1.1 EVM Features
Key features of this EVM include:
• 500mA Linear battery charger
• I2C Configurable Battery Regulation Voltage with 0.5% Accuracy
• Configurable Termination Current down to 0.5mA
• Programmable thermal charging profile with configurable Hot, Warm, Cool and Cold thresholds
• Power Path Management for powering the system and charging the battery
• 10nA Ship Mode battery Iddq for longest shelf life
• One I2C Configurable Load Switch or 150mA LDO Output
• One Button Wake-up and Reset Input with Adjustable Timers
• ADC Monitoring of Input voltage, Battery voltage, Charge current, Battery Thermistor
• I2C Communication Control
See the device data sheet (SLUSD04) for detailed features and operation of the integrated circuit (IC).
Table 1. Device Data Sheet
Device Data Sheet
BQ25150 SLUSD04
BQ25155 SLUSDO1
1.2 I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. Jumper Connections
Jumper Name Description Setting
J1 Micro USB connector (optional for VIN) NA
J2, J3 Board connector to other modules NA
J4 External LDO ON Not Connected
J5 TS potentiometer connector Connected
J6 VIN and GND connector NA
J7 VBAT and GND connector NA
J8 EV2400 Connector NA
J9 ADC potentiometer connector Connected
J10 Battery Pack Connector NA

VIN
VIO/VDD
Connection
Charge
Enable/
Disable
Low Power Mode /MR Push Button
EV2400 Connector
VBAT
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Table 2. Jumper Connections (continued)
J11 VIO connector to VDD or 3p3V Connect VDD to VIO
J12 /LP connector to GPIO or VIO Connect /LP to VIO
J13 /CE connector ro GPIO or VIO Connect /CE to VIO
J14 Display connector for other modules NA
J15 PMID to VINLS connector Connected
J16 On board LED pullup to VDD or PMID Connected to PMID
J17 I2C Pullup Connected
Table 3 lists the recommended operating conditions for this EVM.
Figure 1. BQ2515xEVM Connections
Table 3. Recommended Operating Conditions
Symbol Description MIN TYP MAX Unit
Supply voltage, VVBUS Input voltage from AC adapter 5 20 V
Battery voltage, VBAT in charge mode Voltage applied at VBAT terminal 4.2 V
IBAT Fast charging current 0.5 A
Discharging current through internal MOSFET 1 A
Supply current, IIN Maximum input current from AC adapter input 0.6 A

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2 Test Summary
2.1 Equipment
This section includes a list of supplies required to perform tests on this EVM.
1. Powersupply (PS#1), Powersupply (PS#2): Keithley 2400 Powersupply or equivalent
2. SC#1- SC#3: 4 channel Oscilloscope
3. Computer: A computer with at least one USB port and a USB cable
4. PC communication interface:
5. Software: Download bqStudio from Texas Instruments
Double click the Battery management studio installation file and then follow the installation steps. The
software supports Microsoft®Windows®7 and Windows 10 operating systems.

V
V
+
+±
±
SC#1
SC#2
V+
±
SC#1
PS#1 PS#2
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2.2 Charge Mode
Connect the equipment as following:
Power supply PS#1: VIN of the BQ2515x at 5V
Power supply PS#2: VBAT of the BQ2515x at 3.7V
Scope channel SC#1: VIN
Scope channel SC#2: VPMID
Scope channel SC#3: VBAT
Turn ON the supply PS#2, then turn ON the supply PS#1. The VPMID will rise to the level of VIN. The
device will begin to charge as long as /CE pin jumper is disconnected(J13 being pulled off will result in the
pulldown internal to the device, charge enabled) ,the TS is left at default configuration and there are no
other faults.
To adjust the charge current or change other parameters, connect the EV2400 to the EVM and then
startup BQStudio.
Select the Charger_ 1_00-bq25150.bqz from the Charger selection for the BQ25150EVM or
charger_1_00-bq25155.bqz from the charger selection for the BQ25155EVM. Click “Read Register” to
read all the registers and navigate to the Field View to make changes.
Figure 2. Connections for Test Setup

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2.3 Ship Mode
To go to Ship Mode, turn OFF VIN (PS#1). Make sure /LP pin is connected to VIO(J12) and VIO is
connected to VDD through J11. Read all the registers and click the Shipmode Enable checkbox (Bit B7
on register 0x35) to go to Ship Mode. You can know that you are in Ship Mode as the voltage on PMID
(SC#2) will fall to 0V.
Figure 3. BQStudio Software Tool
2.4 Warning
The warning label indicates when there is a fault during communication with the MCU.
2.5 Comparison Table
Refer to the data sheet for detailed information on register defaults.
Table 4. Comparison Table
BQ25150 BQ25155
Default PMID voltage when adapter is present VIN level 4.5 V (can be adjusted through
I2C)
Input current limit default 100 mA 500 mA
VINDPM Enabled Disabled
Warm battery discharge Yes (up to 5 mA) Yes (up to 20 mA)
IMAX limiting Yes No, saves area
Wake from Shipmode timer 2s 125 ms
VINUVLO (battery present) 3.4 V 3.15 V
Device ID 0x20 0x35

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3 Board Layouts, Schematics, and Bill of Materials
3.1 Board Layouts
Figure 4 through Figure 12 show the PCB board layouts.
Figure 4. Top Overlay
Figure 5. Top Layer

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Figure 6. Signal Layer 1
Figure 7. Signal Layer 2

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Figure 8. Bottom Layer
Figure 9. Bottom Overlay

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Figure 10. Top Solder Mask
Figure 11. Bottom Solder Mask

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Figure 12. Drill Drawing
Figure 13. Board Dimensions

VIN
GND
1uF
C4
4.7uF
C6
PMID
VIO
1
2
3
4
5
6
7
8
9
10
11
J1
CONN_105017-0001
GND GND
GND
GND
VINLS
TS
ADCIN
4.7uF
C1
GND
2.2uF
C3
GND
VLDO
1uF
C2
/LP
/PG
/INT
GND
GND
GND
VDD
TP9 TP10
TP1
TP3
TP7
TP5
TP8
ADCIN
VBAT
TP2
TP6
TP4
R3
SCL
/MR
/CE
GND
SDA
1 2
J9
BQ2515x Low Iq Battery Charger with Powerpath Management, LDO and ADC
TS
GND
R4
1
2
J5
TP12
21
S1
Switch_PushButton
14.3k
R2
DNP
TS
14.3k
R5
DNP
VDD
/PG 14.3k
R6
DNP
IN
A1
PMID
A2
BAT A3
GND A4
PG B1
PMID
B2
BAT B3
TS
B4
CE
C2
MR
C1
IMAX
C3
ADCIN
C4
VDD
D1
INT D2
LP D3
LDO D4
VIO
E1
SDA
E2 SCL
E3
VINLS
E4
BQ25150YFPR
U1
0.1uF
C5
TP13
TP11
10.0k
R1
10k
10k
+3p3V
14.3k
R14
14.3k
R15
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3.2 Schematics
Figure 14 and Figure 16 show the schematics for the BQ2515x EVM.
Figure 14. BQ2515xEVM Schematic

J1.2
J1.3
J1.4
SW3
J1.6
J1.7
J1.8
GND J2.3
J2.4
J2.5
SW2
SW1
J2.8
J2.9
J2.10
5
4
1
2
3
6
7
8
9
10
J2
5
4
1
2
3
6
7
8
9
10
J3
Display RST
+3p3V
Interface Connector
/CE
/LP
LED1
LED2
SDA
SCL
/INT
Fault LED
1 2 3
J11
10k
R10 10k
R9
VIO
VIO
VDD
/LP
VIO
499
R8
1 2
D1
LTST-C190CKT
/PG
/INT
1
2
3
J16
PMID
1
2
3
4
5
6
J14
GND
Display RST
M2
1
2
M1
J10
VBAT
GND
1 2
J7
VBAT
GND
4 1 2 3
J8
22/05/3041
GND
EV2400 I2C
Jumper Connections/ LEDs
+3p3V
VINLS
1 2
J15
PMID
/CE
J1.7
J1.8
1 2
D2
LTST-C190CKT
1 2
D3
LTST-C190CKT
499
R11
499
R12
GND
J2.8
J2.9
1 2
J6
VIN
GND
TP16
TP15
SCL
SDA
TP14
+3p3V
1 2 3
J13
VIO
1 2 3
J12
1
2
J17
VIO
SDA
SCL
SDA SCL
10.0k
R7
VIO
1 2
D4
LTST-C190CKT
499
R13
J2.4
J2.3
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Figure 15. BQ2515xEVM Jumper Connectors
Figure 16. BQ2515xEVM Interface Connector

IN
1OUT 5
EN
3
2
4
GND
TPS78233DDCT
U2
1
2
J4
PMID +3p3V
GND
1uF
C7
1uF
C8
LDO for Display/ Other peripherals
GND GND GND
21
SW1
Switch_PushButton
21
SW2
Switch_PushButton
21
SW3
Switch_PushButton
SW3SW2SW1
User Menu Switches
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Figure 17. User Menu Switches
Figure 18. LDO for Display/Other Peripherals

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3.3 Bill of Materials
The bill of materials is shown in the following table.
(1) Unless otherwise noted in the Alternate PartNumber and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
Table 5. Bill of Materials
Designator Quantity Value Description Package
Reference Part Number Manufactu rer Alternate Part Number(1) Alternate Manufacturer(1)
C1, 1 4.7uF CAP, CERM, 4.7 µF, 10 V, +/-
20%, X5R, 0402 0402 GRM155R61A475MEAAD MuRata
C2, C4, C7, C8 4 1uF CAP, CERM, 1 µF, 25 V, +/-
10%, X5R, 0402 0402 C1005X5R1E105K050BC TDK
C3 1 2.2uF CAP, CERM, 2.2 uF, 10 V, +/-
10%, X7S, 0402 0402 C1005X7S1A225K050BC TDK
C5 1 0.1uF CAP, CERM, 0.1 uF, 25 V, +/-
10%, X7R, 0402 0402 GRM155R71E104KE14D MuRata
C6
(BQ25150EVM) 1 4.7uF CAP, CERM, 4.7 µF, 10 V, +/- 20%, X5R, 0402 0402 GRM155R61A475MEAAD MuRata
C6
(BQ25155EVM) 1 10uF CAP, CERM, 10 µF, 10 V,+/- 20%, X5R, 0402 0402 0402ZD106MAT2A AVX
D1, D2, D3, D4 4 Red LED, Red, SMD Red LED,
1.6x0.8x0.8mm LTST-C190CKT Lite-On
J1 1 Receptacle, Micro-USB-B,
Right Angle, SMD Micro USB receptacle 105017-0001 Molex
J2, J3 2 Connector, Receptacle,
100mil, 10x1, Gold plated, TH 10x1 Receptacle SSW-110-23-F-S Samtec
J4, J5, J6, J7, J9,
J15, J17 7 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins
Connector
Solutions
J8 1 Header (friction lock), 100mil,
4x1, R/A, TH 4x1 R/A Header 22-05-3041 Molex
J10 1 Header (shrouded), 2mm,
2x1, R/A, SMT Header, 2x1, 2mm, R/A S2B-PH-SM4-TB(LF)(SN) JST
Manufactur
ing
J11, J12, J13, J16 4 Header, 100mil, 3x1, Tin, TH Header, 3 PIN,
100mil, Tin PEC03SAAN Sullins
Connector
Solutions
J14 1 Receptacle, 2.54mm, 6x1,
Gold, TH Receptacle,
2.54mm, 6x1,
Gold, TH PPPC061LFBN-RC Sullins
Connector
Solutions
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H -
10,000 per roll PCB Label 0.650≈
x 0.200"W THT-14-423-10 Brady - -

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Table 5. Bill of Materials (continued)
Designator Quantity Value Description Package
Reference Part Number Manufactu rer Alternate Part Number(1) Alternate Manufacturer(1)
R1, R7 2 10.0kΩRES, 10.0 k, 1%, 0.2 W, AEC-
Q200 Grade 0, 0402 0402 ERJPA2F1002X Panasonic
R3, R4 2 10kΩTrimmer, 10k ohm, 0.25W, TH 4.5x8x6.7mm 3266W-1-103LF Bourns
R8, R11, R12, R13 4 499ΩRES, 499, 1%, 0.063 W, 0402 0402 CRCW0402499RFKED Vishay-
Dale
R9, R10 2 10kΩRES, 10 k, 5%, 0.063 W,
0402 0402 CRCW040210K0JNED Vishay- Dale
S1, SW1, SW2,
SW3 4Switch, Tactile, SPST-NO, 0.05A, 12V, SMT Switch, 4.4x2x2.9 mm TL1015AF160QG E-Switch
SH-J1, SH-J2, SH-
J3, SH-J4, SH-J5,
SH-J6, SH-J7, SH-
J8, SH-J9 9 1x2 Shunt, 100mil, Gold plated,
Black Shunt SNT-100-BK-G Samtec 969102-0000-DA 3M
TP1, TP2, TP4,
TP5, TP7, TP14 6Test Point, Multipurpose, Orange, TH Orange
Multipurpose
Testpoint 5013 Keystone
TP3, TP6, TP8,
TP12 4Test Point, Multipurpose, White, TH White
Multipurpose
Testpoint 5012 Keystone
TP9, TP10, TP11 3 Test Point, Multipurpose,
Black, TH Black Multipurpose Testpoint 5011 Keystone
TP13, TP15, TP16 3 Test Point, Miniature, Yellow,
TH Yellow Miniature Testpoint 5004 Keystone
U1
(BQ25150EVM) 1BQ25150YFP, YFP0020ACAC (DSBGA-20) YFP0020ACAC BQ25150YFPR Texas
Instrument
sBQ25150YFPT Texas Instruments
U1
(BQ25155EVM) 1BQ25155, YFP0020ACAC (DSBGA-20) YFP0020ACAC BQ25155YFPR Texas
Instrument
sBQ25155YFPT Texas Instruments
U2 1
Single Output LDO, 150 mA,
Fixed 3.3 V Output, 2.2 to 5.5
V Input, with 0.5 uA Quiescent
Current, 5-pin SOT (DDC),
-40 to 125 degC, Green
(RoHS and no Sb/Br)
DDC0005A TPS78233DDCT Texas Instrument
s
FID1, FID2, FID3 0 Fiducial mark. There is
nothing to buy or mount. Fiducial N/A N/A
R2, R5, R6 0 14.3k RES, 14.3 k, 1%, 0.063 W,
0402 0402 CRCW040214K3FKED Vishay- Dale

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PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.