Texas Instruments BQ79600-Q1 User manual

User's Guide
BQ79600-Q1 Evaluation Module
ABSTRACT
The BQ79600-Q1 Evaluation Module user's guide describes the general features, theory of operation, hardware
setup, and use of the BQ79600EVM. Throughout this user's guide, the abbreviations EVM, BQ79600EVM,
and the term evaluation module are synonymous with the BQ79600-Q1 Evaluation Module, unless otherwise
noted. This EVM is an evaluation board for the BQ79600-Q1 device used as a bridge IC to interface between
a microcontroller and the TI battery monitoring ICs (for example, BQ7961x-Q1 and BQ79606A-Q1). The device
translates between the daisy chain interface and SPI/UART interface.
Table of Contents
1 General Description................................................................................................................................................................3
1.1 Key Features......................................................................................................................................................................3
1.2 Key Electrical Parameters..................................................................................................................................................3
2 Theory of Operation................................................................................................................................................................4
2.1 Compatibility with Battery Monitoring Devices................................................................................................................... 5
3 Connectors..............................................................................................................................................................................6
3.1 Primary Input and Output Connectors................................................................................................................................6
4 BQ79600EVM Quick Start Guide..........................................................................................................................................11
4.1 Required Devices for Using the Example Code *Not Available Yet*................................................................................ 11
4.2 Power Connections.......................................................................................................................................................... 11
4.3 Connecting the BQ79600EVM to TMS570 LaunchPad....................................................................................................11
4.4 Connecting BQ79600EVM to BQ79616EVM................................................................................................................... 12
4.5 Connecting BQ79600EVM to BQ79606EVM................................................................................................................... 12
4.6 Software *Not yet available*.............................................................................................................................................13
4.7 GUI...................................................................................................................................................................................13
5 Physical Dimensions............................................................................................................................................................14
5.1 Board Dimensions............................................................................................................................................................14
5.2 Board Mounting................................................................................................................................................................14
6 Schematics, Assembly, Layout, and Bill of Materials (BOM)............................................................................................15
6.1 Schematics.......................................................................................................................................................................15
6.2 Assembly..........................................................................................................................................................................16
6.3 Layout.............................................................................................................................................................................. 17
6.4 Bill of Materials (BOM)..................................................................................................................................................... 22
7 Revision History................................................................................................................................................................... 24
List of Figures
Figure 2-1. System Block Diagram.............................................................................................................................................. 4
Figure 3-1. Keystone5010 (reference image only)...................................................................................................................... 6
Figure 3-2. Samtec Inc. TSW-105-08-L-D-RA (reference image only)........................................................................................7
Figure 3-3. Molex 0022124062 (reference image only)...............................................................................................................8
Figure 3-4. Samtec SSQ-110-03-T-D (reference image only)......................................................................................................8
Figure 4-1. Basic EVM Setup.....................................................................................................................................................11
Figure 4-2. Connection Between BQ79600EVM and TMS570 LaunchPad.............................................................................. 12
Figure 5-1. Board Dimensions................................................................................................................................................... 14
Figure 6-1. BQ79600EVM Schematic Part 1............................................................................................................................. 15
Figure 6-2. BQ79600EVM Schematic Part 2............................................................................................................................. 16
Figure 6-3. BQ79600EVM Assembly Top.................................................................................................................................. 16
Figure 6-4. BQ79600EVM Assembly Bottom............................................................................................................................ 17
Figure 6-5. BQ79600EVM Top Overlay..................................................................................................................................... 17
Figure 6-6. BQ79600EVM Bottom Overlay................................................................................................................................18
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Figure 6-7. BQ79600EVM Top Solder....................................................................................................................................... 18
Figure 6-8. BQ79600EVM Top Layer.........................................................................................................................................19
Figure 6-9. BQ79600EVM Internal Signal Layer 1 - GND Plane............................................................................................... 19
Figure 6-10. BQ79600EVM Internal Signal Layer 2 - GND Plane............................................................................................. 20
Figure 6-11. BQ79600EVM Bottom Layer................................................................................................................................. 20
Figure 6-12. BQ79600EVM Bottom Solder................................................................................................................................21
Figure 6-13. BQ79600EVM Drill Drawing.................................................................................................................................. 21
List of Tables
Table 1-1. Key Electrical Parameters...........................................................................................................................................3
Table 3-1. Jumper Placements.................................................................................................................................................... 6
Table 3-2. Pin Description............................................................................................................................................................7
Table 3-3. Connector Information................................................................................................................................................ 7
Table 3-4. Pin Description............................................................................................................................................................7
Table 3-5. Connector Information................................................................................................................................................ 8
Table 3-6. Connector Information................................................................................................................................................ 8
Table 3-7. Pin Description - J7.....................................................................................................................................................8
Table 3-8. Pin Description - J9.....................................................................................................................................................9
Table 3-9. Connector Information.............................................................................................................................................. 10
Table 3-10. Pin Description - J10...............................................................................................................................................10
Table 3-11. Pin Description - J11............................................................................................................................................... 10
Table 4-1. Connections Between BQ79600EVM High Side and BQ79616EVM Low Side........................................................12
Table 4-2. Connections Between BQ79616EVM High Side and BQ79600EVM Low Side (for ring architecture only)..............12
Table 4-3. Connections Between BQ79600EVM High Side and BQ79606EVM Low Side........................................................13
Table 4-4. Connections Between BQ79606EVM High Side and BQ79600EVM Low Side (for ring architecture only)..............13
Table 6-1. Bill of Materials .........................................................................................................................................................22
Trademarks
LaunchPad™ and Code Composer Studio™ are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
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1 General Description
TI's BQ79600EVM Battery Management System (BMS) is an evaluation board for the BQ79600-Q1 device used
as a bridge IC to interface between a microcontroller and the TI battery monitoring ICs (for example, BQ7961x-
Q1 and BQ79606A-Q1). The BQ79600EVM can be powered through a PMIC device or directly through a 12-V
battery. The device has an Auto Host Wake-up function that can be utilized with the BQ7961x-Q1 family to
automatically wake up the host when an unmasked fault is detected in the battery monitoring ICs when using
ring architecture. See the BQ79600-Q1 data sheet for more details.
The BQ79600EVM enables communication between a controller and one or more battery modules to perform
State of Charge (SOC) and State of Health (SOH) estimation. The EVM is equipped with an UART/SPI to enable
a host device to communicate to the BQ79600-Q1 device and an isolated differential daisy chain interface to
enable communication to a stack of battery monitoring ICs. The BQ79600EVM acts as a communication bridge
between the host and the battery modules.
The BQ79600EVM is controlled using a PC-hosted GUI. Communication between the PC and the
BQ79600EVMs is through an USB2ANY UART interface or an USB2ANY SPI. Communication between the
BQ79600EVM and all BQ79616EVMs in the stack is via the isolated, daisy-chain differential communication
bus. The GUI allows configuration of the BQ79600EVMs to configure the communication interface to the host
(UART/SPI) and to the stacked devices, as well as to enable/disable the automatic host wake-up function. The
BQ79616EVMs can also be configured using the GUI to monitor cells and other analog data channels, control
balancing, and monitor details of any faults.
1.1 Key Features
This EVM includes the following features:
• UART interface for communication to the host, configurable through jumpers
• SPI for communication to the host, configurable through jumpers
• Supports host communication through FTDI (UART only), USB2ANY, or TMS57012 microcontroller (direct
connection to XL2-TMS57012 LAUNCHPAD boosterpack)
• Isolated differential daisy chain communications with optional ring architecture
• Jumpers to configure 5-V or 12-V options (use 5-V option when powering through PMIC and 12-V option
when powering directly from 12-V battery and to use automatic host wake-up function)
• LEDs to indicate when the device is awake and when there is an unmasked fault
1.2 Key Electrical Parameters
The following table identifies the key electrical parameters:
Table 1-1. Key Electrical Parameters
Parameter Value
Maximum operating voltage (BAT pin powered by battery) 24 V (J1 and J3 shunts placed in 1-2 position)
Minimum operating voltage (BAT pin powered by battery) 5.5 V (J1 and J3 shunts placed in 1-2 position)
Maximum operating voltage (BAT pin powered by 5-V regulator) 5.25 V (J1 and J3 shunts placed in 2-3 position)
Minimum operating voltage (BAT pin powered by 5-V regulator) 4.75 V (J1 and J3 shunts placed in 2-3 position)
Ambient temperature –40 °C to 105 °C
SPI clock frequency 2Mbps to 6Mbps
UART baud rate 1Mbps
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2 Theory of Operation
Figure 2-1 shows the system stack diagram.
Figure 2-1. System Block Diagram
The typical BMS system consists of a Battery Management Unit (BMU) and one or more stacked Cell Monitoring
Units (CMU). The BMU must be isolated from the CMU using transformers to keep the high voltage of the
stacked battery modules isolated from the BQ79600 bridge device and the microcontroller.
The typical simplified bridge circuit in the BMU system has three main components, as shown in Figure 2-1:
• Host controller - in this case a TMS570 LaunchPad™
• Power management IC (PMIC)
• BQ79600-Q1 isolated communication bridge device - in this case a BQ79600EVM
The BQ79600 device can be powered from the 12-V battery directly or from the PMIC. When powered from the
12-V battery, the reverse wake-up function on the BQ79600 can be used in a ring architecture to wake up the
PMIC and the microcontroller with an unmasked fault is detected.
All commands and data between the host and the BQ79600 bridge device are communicated through either a
UART or a SPI communication connection. The BQ79600EVM can support a host PC or microcontroller (via
the FTDI connection header, the USB2ANY connection header, or the LAUNCHXL2-TMS57012 LaunchPad
boosterpack). The BQ79600 remains idle until a command is received from the host. All commands and data
between the BQ79600 and the cell monitoring devices, such as BQ79616, is communicated through the daisy
chain interface.
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The typical flow for the host to go through is the following simplified sequence:
1. Wake up the BQ79600EVM board by sending a WAKE-UP pulse using the UART/SPI interface.
2. Send a send wake up command to the BQ79600EVM to wake up the stacked cell monitoring devices.
3. Autoaddress and initialize bridge and stacked devices.
4. Send a sample command to the BQ79616-Q1 to read the cell measurement results.
5. The host uses the cell measurement data to calculate an average and determine the highest or lowest cells
and determine the cells that must be balanced.
6. If no stop command is sent, then the BQ79616-Q1 has a built-in timeout (set by the user), after which time
the discharge is stopped automatically.
7. The host can then decide to repeat the process (back to step 4) or return later. When using the BQ79616-Q1
in a ring architecture, the host can enable the sniffer detector on the BQ79600-Q1 and the FAULT tones
in the BQ97616-Q1, then send the stacked devices to SLEEP and the bridge and itself to shutdown, and
the AUTO reverse wake-up function wakes up the PMIC and MCU if an unmasked fault from the stacked
devices is detected by the bridge.
2.1 Compatibility with Battery Monitoring Devices
The BQ79600-Q1 is fully compatible with the BQ7961x-Q1 family, supporting automatic host wake up through
the INH pin when an unmasked fault is detected in the high voltage battery pack. The BQ79600-Q1 is also
compatible with BQ79606A-Q1 devices without the fault interface.
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3 Connectors
3.1 Primary Input and Output Connectors
3.1.1 Jumper Placements
The following table explains each of the jumpers available for user flexibility.
Table 3-1. Jumper Placements
Pinheader Contacts Jumper Connection Populated by Default?
J1 1-2, 2-3 INH connection to 100-k pulldown
for 12-V operation (1-2), or to
BAT for 5-V operation (2-3)
Yes (2-3)
J3 1-2, 2-3 BAT connection to 12-V power
supply (1-2), or to CVDD and 5-V
power supply (2-3)
Yes (2-3)
J5 1-2 LED connection on DVDD to
indicate the device is awake
Yes
J6 1-2, 2-3 VIO connection to 3.3-V supply
from MCU (1-2) or to 5-V supply
from MCU (2-3)
Yes (1-2)
J8 1-2 LED connection on nFAULT
AVDD to indicate a fault on
NFAULT pin (must have J13
shunt connected)
Yes
J10 1-2, 2-3 nUART_SPIRDY pullup to VIO
for SPI (1-2), or pulldown to GND
for UART (2-3)
Yes (2-3)
J11 1-2, 2-3 nCS pullup to VIO for SPI (1-2),
or pulldown to GND for UART
(2-3)
Yes (2-3)
J12 1-2, 2-3 SCLK pullup to VIO (1-2) or
pulldown to GND for SPI/UART
(2-3)
Yes (2-3)
J13 1-2 NFAULT pullup to VIO Yes
3.1.2 Power Supply
The power supply connection is made from either the 5-V test point or 12-V test point. When powering the EVM
directly through the 12-V battery, configure jumpers J1 and J3 in the "12V" configuration and connect the 12-V
battery to the 12-V test point. If the EVM is powered up through a PMIC, configure jumpers J1 and J3 in the "5V"
configuration and connect the PMIC 5-V output to the 5-V test point.
Figure 3-1. Keystone5010 (reference image only)
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Table 3-2. Pin Description
Pin Name Comments
1 DVDD 1.8-V regulated output. DVDD supplies the internal digital circuits
2 NFAULT Fault indication output
3 VIO Power supply input for UART/SPI input/output pins
4 RX/MOSI UART receiver input or SPI controller out peripheral in
5 TX/MISO UART transmitter output or SPI controller in peripheral out
6 SCLK SPI clock input
7 nCS Active low chip select pin for SPI
8 nUART/SPI (SPI_RDY) This pin is used as an input pin to select SPI or UART interface before device finishes wakeup/
reset initialization
9 GND Ground
10 COMLP AC coupled bi-directional I/O pin for daisy chain (VIF) communication
11 COMLN AC coupled bi-directional I/O pin for daisy chain (VIF) communication
12 COMHP AC coupled bi-directional I/O pin for daisy chain (VIF) communication
13 COMHN AC coupled bi-directional I/O pin for daisy chain (VIF) communication
14 CVDD Dedicated 5-V supply used for the daisy chain communications
15 BAT Battery supply Input
16 INH Inhibit pin to control system voltage regulators
3.1.3 Host Interface
There are three different ways for the host to connect to the BQ79600EVM: using the USB2ANY interface
adaptor, the UART FTDI cable ( to communicate through UART only), or using the LAUNCHXL2-TMS57012
microcontroller BoosterPack connector.
The 10-pin J4 - serial connector is used to connect the BQ79600EVM to a PC running the GUI or to a host
controller. Texas Instruments recommends using the USB2ANY interface adaptor which includes the proper
10-pin cable.
Figure 3-2. Samtec Inc. TSW-105-08-L-D-RA (reference image only)
Table 3-3. Connector Information
Designator Manufacturer Part Number Mating Connector
J4 Samtec Inc. Manufacturer: TSW-105-08-L-
D-RA
10-pin ribbon connector packaged with USB2ANY
Table 3-4. Pin Description
Pin Name
1 NC
2 nUART/SPI (SPI_RDY) signal from BQ79600-Q1
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Table 3-4. Pin Description (continued)
Pin Name
3 USB2ANY SCLK (SCLK of BQ79600-Q1)
4 nFAULT signal from BQ79600-Q1
5 GND
6 USB2ANY 3.3 V
7 USB2ANY TX (MOSI_RX of BQ79600-Q1)
8 USB2ANY RX (MISO_TX of BQ79600-Q1)
9 USB2ANY CS (nCS of BQ79600-Q1)
10 NC
The 6-pin J2 - serial connector is used to connect the BQ79600EVM to a PC running the GUI or to a host
controller through a TTL-232R-5V FTTI cable. Only UART is supported.
Figure 3-3. Molex 0022124062 (reference image only)
Table 3-5. Connector Information
Designator Manufacturer Part Number Mating Connector
J2 Molex Manufacturer: 0022124062 6-pin connector in TTL-232R-5V
FTTI cable
The 20-pin J7 - serial connector and the 20-pin J9-serial connector are used to connect the BQ79600EVM to a
host controller. The BoosterPack in the LAUNCHXL2-TMS57012 LaunchPad™ can be directly plugged into the
J7 and J9 connectors.
Figure 3-4. Samtec SSQ-110-03-T-D (reference image only)
Table 3-6. Connector Information
Designator Manufacturer Part Number Mating Connector
J7, J9 Samtec Manufacturer: SSQ-110-03-T-D 20-pin connector 0.100" (2.54mm)
in TMS570LS12x LaunchPad™
Table 3-7. Pin Description - J7
Pin Name
1 MCU 3.3 V
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Table 3-7. Pin Description - J7 (continued)
Pin Name
2 MCU 5 V
3 NC
4 GND
5 MCU RX (MISO_TX of BQ79600-Q1)
6 NC
7 MCU TX (MOSI_RX of BQ79600-Q1)
8 NC
9 NC
10 NC
11 NC
12 NC
13 MCU SCLK (SCLK of BQ79600-Q1)
14 NC
15 NC
16 NC
17 NC
18 NC
19 NC
20 NC
Table 3-8. Pin Description - J9
Pin Name
1 NC
2 GND
3 NC
4 NC
5 NC
6 MCU CS (nCS of BQ79600-Q1)
7 NC
8 NC
9 NC
10 NC
11 NC
12 MCU SPI3SIMO ( MOSI_RX of BQ79600-Q1 )
13 NC
14 MCU SPI3SOMI ( MISO_TX of BQ79600-Q1 )
15 NC
16 NC
17 nUART/SPI (SPI_RDY) signal from BQ79600-Q1
18 NC
19 nFAULT signal from BQ79600-Q1
20 NC
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3.1.4 High-Side and Low-Side Communications
There are two sets of 4-position molex connectors available on each board. These provide high-side (J11) and
low-side (J10) communications between stacked EVM devices.
Table 3-9. Connector Information
Designator Manufacturer Part Number Mating Connector
J10/J11 Molex Manufacturer:
0705510038
Digi-Key: WM14059-ND
Manufacturer:
0050579404
Digi-Key: WM2902-ND
Table 3-10. Pin Description - J10
Pin Name Comments
1 COML_N COM lowside negative
2 COML_P COM lowside positive
3 N/A Unused
4 N/A Unused
Table 3-11. Pin Description - J11
Pin Name Comments
1 N/A Unused
2 N/A Unused
3 COMH_P COM highside positive
4 COMH_N COM highside negative
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4 BQ79600EVM Quick Start Guide
This section includes hardware setup instructions, connection procedures, and software and GUI instructions.
Figure 4-1. Basic EVM Setup
4.1 Required Devices for Using the Example Code *Not Available Yet*
The system example code is implemented using the LAUNCHXL2-TMS57012 LaunchPad™ board
(TMS570LS1224 MCU), the BQ79600EVM, and the BQ79616EVM via Code Composer Studio.
The part numbers of the evaluation modules are LAUNCHXL2-TMS57012, BQ79600EVM-030,
BQ79616EVM-021. These boards are available from the TI eStore (https://estore.ti.com/) or from your local
TI sales representative. For more details and information related to the LaunchPad™ modules, see the specific
module user's guide.
4.2 Power Connections
The BQ79600EVM can be powered up either using a 5-V supply or a 12-V supply. To use the 5-V option, make
sure that jumpers J1 and J3 are connected in the "5V" position as labeled in the board, and then connect the
positive terminal of the 5-V supply to the "5V" testpoint provided on the board, and the power supply negative
terminal to the "GND" testpoint provided on the board, or any "GND" standoff provided. To use the 12-V option,
verify that jumpers J1 and J3 are connected in the "12V" position as labeled in the board, and then connect the
positive terminal of the 12-V supply to the "12V" testpoint provided on the board, and the power supply negative
terminal to the "GND" testpoint provided on the board, or any "GND" standoff provided.
4.3 Connecting the BQ79600EVM to TMS570 LaunchPad
The EVMs are connected using the female connectors J7 and J9 on the bottom side of the BQ79600EVM and
the male connectors J2, J3, J4, and J5 on the top side of the LAUNCHXL2-TMS57012 LaunchPad™. Connect
the J7 20-pin female connector on the bottom side of the BQ79600EVM to the J2 and J3 10-pin male connectors
on top side of the LAUNCHXL2-TMS57012 LaunchPad™, and J9 20-pin female connector on the bottom side
of the BQ79600EVM to the J4 and J5 10-pin male connectors on the top side of the LAUNCHXL2-TMS57012
LaunchPad™, as shown in the following figure. By default, the TMS570 LaunchPad is powered by the USB port
on the host computer. Remove JP1 from the LaunchPad for correct operation.
The microcontroller is used to supply VIO voltage to the device. The user can select either the 3.3-V or 5-V
option. To use 3.3 V, make sure that JP2 on the microcontroller LaunchPad is connected and set jumper J6 in
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the 1-2 position (this is the default configuration on the EVM). To use 5 V, verify that JP3 on the microcontroller
LaunchPad is connected and set jumper J6 in the 2-3 position.
Figure 4-2. Connection Between BQ79600EVM and TMS570 LaunchPad
4.4 Connecting BQ79600EVM to BQ79616EVM
The EVMs are connected using 4-position Molex connectors. The BQ79600EVM has a high side (J15)and low
side (J14) communication connector available on each board. By default the isolation filters for the vertical
interface on the BQ79600EVM are set to transformer isolation. There are also footprints on the board to populate
a different transformer model. More details can be found in the schematic near the end of this user guide. To
connect the BQ79600EVM to the BQ79616EVM using NORTH direction for communication, connect J15 on the
BQ79600EVM to J10 on the BQ79616EVM. If several BQ79616EVMs are stacked, connect them as indicated in
the EVM user's guide for the device. If using ring architecture, connect J11 of the top most BQ79616EVM to J14
on the BQ79600EVM.
Table 4-1. Connections Between BQ79600EVM High Side and BQ79616EVM Low Side
Connection Name BQ79600EVM High Side BQ79616EVM Low Side
COMH_N to COML_N J15 pin 4 J10 pin 1
COMH_P to COML_P J15 pin 3 J10 pin 2
Table 4-2. Connections Between BQ79616EVM High Side and BQ79600EVM Low Side (for ring
architecture only)
Connection Name BQ79600EVM Low Side BQ79616EVM High Side
COML_N to COMH_N J14 pin 1 J11 pin 4
COML_P to COMH_P J14 pin 2 J11 pin 3
4.5 Connecting BQ79600EVM to BQ79606EVM
The EVMs are connected using 4-position Molex connectors. The BQ79600EVM has a high side (J15) and
low side (J14) communication connector available on each board. To connect the BQ79600EVM to the
BQ79606EVM using NORTH direction for communication, connect J15 on the BQ79600EVM to J5 on the
BQ79606EVM. If several BQ79606EVMs are stacked, connect them as indicated in the EVM user's guide for the
device. If using ring architecture, connect J6 of the top most BQ79606EVM to J14 on the BQ79600EVM.
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Table 4-3. Connections Between BQ79600EVM High Side and BQ79606EVM Low Side
Connection Name BQ79600EVM High Side BQ79606EVM Low Side
COMH_N to COML_N J15 pin 4 J5 pin 1
COMH_P to COML_P J15 pin 3 J5 pin 2
Table 4-4. Connections Between BQ79606EVM High Side and BQ79600EVM Low Side (for ring
architecture only)
Connection Name BQ79600EVM Low Side BQ79606EVM High Side
COML_N to COMH_N J14 pin 1 J6 pin 4
COML_P to COMH_P J14 pin 2 J6 pin 3
4.6 Software *Not yet available*
The example code only provides a control interface to the BQ79600-Q1 and BQ79616-Q1 and does not provide
any other communications interface to the outside world. The customer is expected to develop their own
communication implementation. Examples of communications interfaces available to the TMS570 are SPI, CAN,
or UART. For the TMS570 example code, UART is the communication protocol used between the microcontroller
and BQ79600-Q1 device.
Importing a project into Code Composer Studio™ :
1. Launch the provided file: BQ79600-Q1 Example Code 0.1 Installer.exe and extract files to the default path
provided ( C:\ti\bq79600-Q1 Example Code 0.1 ).
2. Launch Code Composer Studio (CCS):
Start → Programs → Texas Instruments → Code Composer Studio v8 → Code Composer Studio v8
3. When Code Composer Studio v8 launches, CCS requests a workspace is selected, choose
“C:\myWorkspace”. Once CCS loads, go to:
Project → Import CSS Projects... → Select search-directory
4. In Select search-directory, browse to the folder:
C:\ti\bq79600-Q1 Example Code 0.1
5. In Discovered projects:, check BQ79600-Q1 example code
4.7 GUI
For initial evaluation, using the graphical user's interface (GUI) can be beneficial. The GUI provides a point and
click interface to become familiar with the BQ79600. During the initial sampling phase, contact your local TI FAE
to get the latest GUI version.
To get started with the GUI, refer to the BQAutoEval GUI User Guide document.
4.7.1 GUI UART Connection
The physical setup for the GUI is the same as for the microcontroller, but instead uses an USB2ANY interface
and 10-pin cable for the UART/SPI connections on J4. The USB2ANY has a USB Mini-B connector on the right
side. Plug the provided USB cable (or any USB cable with a Mini-B connector) into the USB2ANY. Plug the other
end of the cable (USB ‘A’) into the computer. Then connect the 10-pin connector cable to J4 of the USB2ANY
(middle most connector) and the key side must be facing upwards when connecting to the EVM header J4. Refer
to the figure below and this is explained in more detail in the USB2ANY user guide and the BQAutoEval GUI
user guide.
www.ti.com BQ79600EVM Quick Start Guide
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5 Physical Dimensions
5.1 Board Dimensions
Board dimensions: 2.300 in. × 5.130 in.
Board height:
• Top - Tallest component (shunts) is 0.35 in. (8.8 mm) above PCB.
• Bottom - Tallest component (transformers) is 0.41 in. (10.5 mm) above PCB.
5.2 Board Mounting
Figure 5-1 illustrates the EVM board dimensions.
Figure 5-1. Board Dimensions
Physical Dimensions www.ti.com
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6 Schematics, Assembly, Layout, and Bill of Materials (BOM)
The BQ79600EVM schematics, assembly, layout, and BOM are provided in their respective sections.
6.1 Schematics
BQ796 00 P WQ1
DVDD
1
MOS I/RX
4
MISO/T X
5
GND 9
SC LK
6
COMHN 12
nUART/S PI (S P I_RDY) 8
FAULT 2
CS
7
CVDD
14
COMHP 13
COMLN 11
COMLP 10
BAT
15
VIO
3
INH 16
U1
GND
BAT
INH
CVDD
VIO
MOSI_RX
MIS O _TX
SCLK
nCS
nFAULT
nUART_S P IRDY
COMHP
COMHN
COMLP
COMLN
DVDD
VIO
MOSI_RX
MIS O _TX
nFAULT
1
2
3
J1 0
1
2
3
J11
SCLKnUART_S P IRDY nC S
1
2
J1 3
5 4 1 2 3 6
J2
100k
R4
1
2
3
J1
INH
BAT
GND
GND
COMHN
COMLP
COMLN
COMHP
1
3 5 7 9
J4 A
2
4
6 8
10
J4 B
GND
MOSI_RX MISO_ TX
470nF
C2
470nF
C3
GND
0.1 uF
C4
GND
10.0k
R1610.0k
R14
10.0k
R13
100k
R12
SCLK
UART/SP I Con ne ction
Powe r s up ply a nd re vers e wa ke up (BAT and INH conne ction )
GND
Pin Description
5 TX - to microcontroller UART RX
4 RX - to microcontroller UART TX
2 FAULTn - to microcontroller GPIO
1 GND - shared GND with microcontroller
Pin Description
8 TX - to microcontroller UART RX
7 RX - to microcontroller UART TX
4 FAULTn - to microcontroller GPIO
5 GND - shared GND with microcontroller
GND
Gre e n
12
D2
200
R11
1
2
J8
TP16
GND
TP17
GND
DVDD nFAULT
TP1
VIO
TP2
sC LK
TP3
RX
TP4
TX
TP5
nCS
TP6
SPI_RDY
TP7
CVDD
TP1 0
BAT
TP1 2
NFAULT
TP11
DVDD
CVDD
BAT
nUART_S P IRDYVIO SCLK MOSI_RX MIS O _TX nCS
GND
200
R5
3
1
2
Q1
GND
10M
R6
GND
1 2
J5
DVDD
GND
nFAULT_P VIO MOSI_RX MISO_ TX
3 VIO- to microcontroller 3.3/5V
GND
100k
R18
100k
R19
100k
R20
VIO nFAULT_P nUART_S P IRDY nCS
9 nCS - CS pin
3 SCLK - clock pin
2 nUART_SPIRDY - SPI_RDY pin
1
2
3
J3CVDD
BAT
Te st po ints (a ll exce pt COMH/COML)
TP1 3
INH
INH
TP15
GND
10
R1
10.0k
R15
3.3V5V
MCU_UART_RX
MCU_UART_TX
SCLK
nCS
1: MCU +3V3 to VIO selection jumper
3
5: MCU RX to BQ79600 MISO_TX
7: MCU TX to BQ79600 MOSI_RX
10
12
13: MCU SPI3CLK to BQ79600 SCLK
18
20
2: MCU 5V to VIO selection jumper
4: MCU GND to BQ79600 GND
6
8
9
11
14
16
17
19
1
3
5
7
9
11
13
15
17: MCU GIOA1 to BQ79600 nUART_SPIRDY
19: MCU GIOA0 to BQ79600 nFAULT_P
nUART_SPIRDY
MCU_SPI3SIMO
MCU_SPI3SOMI
1
2
3
J6
VIO selection from MCU
VIO
3.3V
5V
FTDI / USB2ANY / MCU conne ction
nFAULT_P
GND
UART FTDI connection circuit
USB2ANY UART/SPI connection
TMS570LS04x/03x launchpad connection
Pin Description Pin Description
Pin Description
nFAULT_P
1
2
3
J1 2
10.0k
R17
10
12: MCU SPI3SIMO to BQ79600 MOSI_RX
18
20
2: MCU GND to BQ79600 GND
4:
6: MCU SP31CS1 to BQ79600 nCS
8
14: MCU SPI3SOMI to BQ79600 MISO_TX
16
Pin Description
15
0
R8
0
R10
0
R9
0
R7
MOSI_RX MCU_UART_TX
MISO_TX MCU_UART_RX
MOSI_RX
MISO_TX
MCU_SPI3SIMO
MCU_SPI3SOMI
1
3
56
4
2
7
910
8
12 11
14 13
16 15
18 17
20 19
J7
SSQ-11 0-03-T-D
1
3
56
4
2
7
910
8
12 11
14 13
16 15
18 17
20 19
J9
SSQ-11 0-03-T-D
TP1 4
INH_OUT
INH_OUT
1.00M
R3
5.1 V
D1
SZMM3Z5V1S T1G
100k
R2
INH_OUT
Re d
12
D3
TP18
GND
TP9
5V
TP8
12V
100nF
C1
GND GND
GND GND
Figure 6-1. BQ79600EVM Schematic Part 1
www.ti.com Schematics, Assembly, Layout, and Bill of Materials (BOM)
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COMHN
COMHP
4
1
2
3
J1 5
ISO_ CO MHN
ISO_ CO MHP
4
1
2
3
J1 4
COMLP
COMLN
ISO_ CO MLN
ISO_ CO MLP
1
2
3
4 5
6
7
8
T3
ISO_COMLP
ISO_COMLN 1
2
3
4 5
6
7
8
T4
ISO_COMHP
100pF
C13
100pF
C14
2200 pF
C15
2200 pF
C17
470uH
12
3 4
L2
2200 pF
C18
2200 pF
C16
470uH
1 2
34
L1
COMLP_OPT
COMLN_OPT
COMLN_OPT
COMLP_OPT
ISO_COMLN
ISO_COMLP COMHP_OPT
COMHN_OPT ISO_COMHN
ISO_COMHP
0
R56
0
R46
0
R55
0
R45
COMHP
ISO_COMHN
COMLN
COMLP
1
2
J17
1
2
J16
499
R27
499
R29
499
R28
499
R30
1
2
3
J1 9
1
2
3
J1 8
COMHN
COMHP
COMLN
COMLP
100pF
C11
100pF
C12
100pF
C10
100pF
C9
1
3
2
D4
1
3
2
D5
6
52
1
3 4
T1
HMU1228NL
6
52
1
3 4
T2
HMU1228NL
COML/COMH Te s t points
51
R23
51
R33
51
R24
51
R34
Ca pacitor + cho ke isolation option (COML) Ca pacitor + cho ke isolation configuration (COMH)
Tranforme r isolation o ptions (COML) Tranforme r isolation o ptions (COMH)
COMHN
ISO_COMLP
ISO_COMLN
100pF
C7
ISO_COMHP
ISO_COMHN
COMHP_OPT
COMHN_OPT
100pF
C8
0
R37
0
R41
0
R38
0
R42
0
R21
0
R31
0
R22
0
R35
0
R39
0
R40
0
R43
0
R44
0
R25
0
R26
0
R36
0
R32
0
R47
0
R51
0
R48
0
R52
0
R49
0
R53
0
R50
0
R54
COMLP_OPT
COMLN_OPT
COMHP_OPT
COMHN_OPT
10nF
C5
10nF
C6
GND
GND GND
GND
GNDGND
GND
GND GND
GND GND
Figure 6-2. BQ79600EVM Schematic Part 2
6.2 Assembly
Figure 6-3. BQ79600EVM Assembly Top
Schematics, Assembly, Layout, and Bill of Materials (BOM) www.ti.com
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Figure 6-4. BQ79600EVM Assembly Bottom
6.3 Layout
Figure 6-5. BQ79600EVM Top Overlay
www.ti.com Schematics, Assembly, Layout, and Bill of Materials (BOM)
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Figure 6-6. BQ79600EVM Bottom Overlay
Figure 6-7. BQ79600EVM Top Solder
Schematics, Assembly, Layout, and Bill of Materials (BOM) www.ti.com
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Figure 6-8. BQ79600EVM Top Layer
Figure 6-9. BQ79600EVM Internal Signal Layer 1 - GND Plane
www.ti.com Schematics, Assembly, Layout, and Bill of Materials (BOM)
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Figure 6-10. BQ79600EVM Internal Signal Layer 2 - GND Plane
Figure 6-11. BQ79600EVM Bottom Layer
Schematics, Assembly, Layout, and Bill of Materials (BOM) www.ti.com
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