Texas Instruments BQ79606EVM User manual

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BQ79606A-Q1 Evaluation Module
User's Guide
SLOU471E–May 2017–Revised April 2019
BQ79606A-Q1 Evaluation Module
This user's guide describes the general features, theory of operation, hardware setup, and use of the
BQ79606EVM. Throughout this user's guide, the abbreviations EVM,BQ79606EVM, and the term
evaluation module are synonymous with the BQ79606A-Q1 Evaluation Module, unless otherwise noted.
This EVM is an evaluation board of the BQ79606A-Q1 device for use in large format lithium-ion batteries
that provides monitoring, balancing, and communications.
Contents
1 General Description ......................................................................................................... 5
1.1 Key Features ........................................................................................................ 5
1.2 Key Electrical Parameters ......................................................................................... 5
2 Theory of Operation ......................................................................................................... 6
2.1 Single Board......................................................................................................... 7
2.2 Stacked Systems ................................................................................................... 7
3 Connectors ................................................................................................................... 7
3.1 Primary Input and Output Connectors ........................................................................... 7
4 BQ79606EVM Quick Start Guide ........................................................................................ 11
4.1 Required Devices ................................................................................................. 12
4.2 Power Connections ............................................................................................... 12
4.3 Connecting the BQ79606EVM to TMS570 LaunchPad ..................................................... 12
4.4 Stacking BQ79606EVMs ........................................................................................ 13
4.5 Software ............................................................................................................ 13
4.6 GUI.................................................................................................................. 14
5 Physical Dimensions....................................................................................................... 15
5.1 Board Dimensions................................................................................................. 15
5.2 Board Mounting.................................................................................................... 15
6 Schematic, Assembly, Layout, and BOM .............................................................................. 17
6.1 Schematic ......................................................................................................... 17
6.2 Assembly........................................................................................................... 19
6.3 Layout .............................................................................................................. 21
6.4 Bill of Materials (BOM) ........................................................................................... 29
List of Figures
1 System Stack Diagram...................................................................................................... 6
2 Molex 39502-1009 (Reference Image Only)............................................................................. 7
3 Molex 22-12-4062 (Reference Image Only).............................................................................. 8
4 Sullins Connector Solutions PEC06DAAN (Reference Image Only).................................................. 9
5 Basic EVM Setup .......................................................................................................... 11
6 Advanced EVM Setup ..................................................................................................... 11
7 Board Dimensions ......................................................................................................... 16
8 BQ79606EVM Schematic Part 1 ........................................................................................ 17
9 BQ79606EVM Schematic Part 2 ........................................................................................ 17
10 BQ79606EVM Schematic Part 3 ........................................................................................ 18
11 BQ79606EVM Schematic Part 4......................................................................................... 18
12 BQ79606EVM Assembly Top ............................................................................................ 19
13 BQ79606EVM Assembly Bottom ........................................................................................ 20

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14 BQ79606EVM Top Overlay .............................................................................................. 21
15 BQ79606EVM Top Solder ................................................................................................ 22
16 BQ79606EVM Top Layer ................................................................................................. 23
17 BQ79606EVM Internal Signal Layer 1 - GND Plane ................................................................. 24
18 BQ79606EVM Internal Signal Layer 2 .................................................................................. 25
19 BQ79606EVM Bottom Layer ............................................................................................. 26
20 BQ79606EVM Bottom Solder ............................................................................................ 27
21 BQ79606EVM Bottom Overlay .......................................................................................... 28
22 BQ79606EVM Drill Drawing .............................................................................................. 29
List of Tables
1 Connector Information ...................................................................................................... 7
2 Pin Description............................................................................................................... 8
3 Connector Information ...................................................................................................... 8
4 Pin Description............................................................................................................... 8
5 Connector Information ...................................................................................................... 9
6 Pin Description - J16 ....................................................................................................... 9
7 Pin Description - J15 ...................................................................................................... 10
8 Connector Information .................................................................................................... 10
9 Pin Description - J5 ....................................................................................................... 10
10 Pin Description - J6 ....................................................................................................... 10
11 Connections Between BQ79606EVM and TMS570 LaunchPad .................................................... 12
12 Connections Between High-Side/Low-Side BQ79606EVMs ......................................................... 13
Trademarks
LaunchPad, Code Composer Studio are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
WARNING
Warning: To minimize risk of fire hazard, always verify and follow
any specific safety instructions and application considerations
related to the batteries being used in conjunction with this EVM.
Always follow TI’s set-up and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help
ensure your personal safety and the safety of those working around you. Contact TI’s Product Information
Center http://support/ti./com for further information.
Save all warnings and instructions for future reference.
Failure to follow warnings and instructions may result in personal injury, property damage, or
death due to electrical shock and/or burn hazards.

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The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed
printed-circuit-board assembly. It is intended strictly for use in development laboratory environments,
solely for qualified professional users having training, expertise, and knowledge of electrical safety risks in
development and application of high-voltage electrical circuits. Any other use or application are strictly
prohibited by Texas Instruments. If you are not suitably qualified, you should immediately stop from further
use of the HV EVM.
1. Work Area Safety:
1. Keep work area clean and orderly.
2. Qualified observer(s) must be present any time circuits are energized.
3. Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
4. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other
related apparatus used in a development environment exceeding 50 VRMS or 75 VDC must be
electrically located within a protected Emergency Power Off (EPO) protected power strip.
5. Use a stable and non-conductive work surface.
6. Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety:As a precautionary measure, it is always a good engineering practice to assume that
the entire EVM may have fully accessible and active high voltages.
1. De-energize the TI HV EVM and all its inputs, outputs, and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely
de-energized.
2. With the EVM confirmed de-energized, proceed with required electrical circuit configurations,
wiring, measurement equipment hook-ups and other application needs, while still assuming the
EVM circuit and measuring instruments are electrically live.
3. Once EVM readiness is complete, energize the EVM as intended.

!
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WARNING: while the EVM is energized, never touch the EVM or its electrical circuits as they
could be at high voltages capable of causing electrical shock hazard.
3. Personal Safety:
1. Wear personal protective equipment, for example, latex gloves or safety glasses with side shields
or protect EVM in an adequate lucent plastic box with interlocks from accidental touch.
4. Limitation for Safe Use:
1. EVMs are not to be used as all or part of a production unit.
The following warnings and cautions are noted for the safety of anyone using or working close to the
BQ76920 EVM. Observe all safety precautions.
Caution Do not leave EVM powered when unattended.
Danger High
Voltage The BQ79606EVM is not rated as a high voltage EVM, has smaller clearances than normally used on high voltage boards and does not have
an isolation boundary. If you apply high voltage to this board, all terminals
should be considered high voltage.
spacer
Electric shock is possible when connecting the board to live wire. The
board should be handled with care by a professional.
spacer
For safety, use of isolated test equipment with overvoltage and
overcurrent protection is highly recommended.
CAUTION
The circuit module has signal traces, components, and component leads on the
bottom of the board. This may result in exposed voltages, hot surfaces, or
sharp edges. Do not reach under the board during operation.
CAUTION
The circuit module may be damaged by overtemperature. To avoid damage,
monitor the temperature during evaluation and provide cooling, as needed, for
your system environment.
CAUTION
Some power supplies can be damaged by application of external voltages. If
using more than 1 power supply, check your equipment requirements and use
blocking diodes or other isolation techniques, as needed, to prevent damage to
your equipment.
CAUTION
The communication interface is not isolated on the EVM. Be sure no ground
potential exists between the computer and the EVM. Also be aware that the
computer will be referenced to the Battery- potential of the EVM.

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1 General Description
TI's BQ79606EVM Battery Management System (BMS) is an evaluation board of the BQ79606A-Q1
device for use in large format lithium-ion batteries that provide monitoring, balancing, and
communications. Each BQ79606EVM can manage up to 6 cells (30-V max) for Li-ion battery applications.
Up to 64 BQ79606EVM modules can be stacked, for packs up to 1300 V. The system provides fast cell
balancing, diagnostics, and module to controller communication. Independent protection circuitry is also
provided. Please see the BQ79606A-Q1 data sheet for more details.
The BQ79606EVM is equipped with precision measurement and synchronous communication to enable a
master controller to perform State of Charge (SOC) and State of Health (SOH) estimation. Highly-accurate
cell voltages and a fast sampling time for the entire battery pack allows more efficient operation of battery
modules and more accurate SOC and SOH calculations. Communication with stacked BQ79606EVMs is
via an isolated daisy-chain differential bus.
Control a single EVM or multiple stacked BQ79606EVMs using a PC-hosted GUI. Communication
between the PC and the lowest in a stack of BQ79606EVMs is via an FTDI USB-to-TTL (5 V) serial
interface cable. Communication between all other EVMs in the stack is via the isolated, daisy-chain
differential communication bus. The PC GUI allows configuration of the BQ79606EVMs to monitor cells
and other analog data channels, control balancing, and monitor details of any faults.
1.1 Key Features
This EVM includes the following features:
• Passive cell balancing
• Isolated communications (1 kV)
• Flexible architecture for up to 6 cells
• UART interface
• High-accuracy cell voltage measurement
• Diagnostics
• Resistor ladder to simulate cell voltages
1.2 Key Electrical Parameters
The following table identifies the key electrical parameters:
Maximum battery pack voltage (stacked EVMs) 1300 V
Maximum operating voltage 30 V
Minimum operating voltage 5.5 V
Maximum cell open circuit voltage 5 V
Ambient temperature –40 ºC to 105 ºC
Nominal operating temperature –20 ºC to 60 ºC
Cell balancing current Approximately 100 mA

bq79606EVM
bq79606-Q1
COML FAULTL COMH FAULTH
UART UART
Balance and Filter
Components
Balance and Filter
Components
Module
Connector
Isolation
Components
TMS570
Launchpad bq79606-Q1
COML FAULTL COMH FAULTH
bq79606-Q1
COML FAULTL COMH FAULTH
Boundary Low Voltage
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2 Theory of Operation
Figure 1 shows the system stack diagram.
Figure 1. System Stack Diagram
The BMS system is designed to prolong the useful life of lithium-ion cells in battery packs through passive
balancing. The battery pack is broken into a series of modules, each of which contains up to 6 cells. This
system will monitor voltages of individual battery cells and transfer charge from the module stack to an
under-charged cell or take charge from an over-charged cell and transfer it to the module stack. The BMS
allows battery-powered electric machines to use smaller battery packs and use fewer charging cycles to
perform the same amount of work. It also improves the overall lifetime of Li-ion battery packs by
preventing under- and overvoltage damage from occurring.
The typical BMS system with stacked modules has three main sub-systems, as shown in Figure 1:
• Host controller - in this case a TMS570 LaunchPad™
• A BQ79606A-Q1 configured as an isolated communication bridge device - another BQ79606EVM can
support this
• BQ79606EVM based modules attached to cells - these can be stacked up to 64 total (including the
bridge device)
All commands and data are communicated with a host via either a UART or daisy-chain communication
connection. The BQ79606A will remain idle until a command is received from the host. The BQ79606A
can support a host PC or microcontroller (via the UART connection header) or a daisy-chain interface from
a BQ79606A-Q1 implemented as a communication bridge.

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The typical flow is for the host to go through the following simplified sequence:
1. Wakeup the BQ79606EVM board by sending a WAKEUP pulse when using the UART interface, or
sending a WAKE tone when using the BQ79606EVM in a stack of other BQ79606EVM boards for a
large battery pack or a BQ79606-Q1 configured as a bridge. Initialize the BQ79606A-Q1 to be ready
for use.
2. Send a sample command to the BQ79606A-Q1 to read the cell measurement results.
3. The host will use the cell measurement data to calculate an average and determine the highest or
lowest cells and determine the cells that should be balanced.
4. If no stop command is sent, the BQ79606A-Q1 has a built-in timeout (set by the user), after which time
the discharge will be stopped automatically.
5. The host can then decide to repeat the process (back to step 2) or send commands to shutdown the
BQ79606EVM and return later.
2.1 Single Board
As a single board the BMS can passively balance up to 6 cells, up to 30 V of total voltage. Communication
to the BQ79606EVM is handled by the daisy-chain communications bus from another BQ79606A-Q1 or
the UART host interface.
2.2 Stacked Systems
The BMS boards may be stacked up to 1300 V. Communication to the BQ79606EVM is handled by the
daisy-chain communications bus from another BQ79606A-Q1.
3 Connectors
3.1 Primary Input and Output Connectors
3.1.1 Battery Connector
The battery cell connections are made from connector J1. Cell voltage measurements and balancing
currents use these connections. Short unused channels to the top cell connection in the wiring harness to
support fewer than 6 cells.
Figure 2. Molex 39502-1009 (Reference Image Only)
Table 1. Connector Information
Designator Manufacturer Part Number Mating Connector
J1 Molex Manufacturer: 39502-1009
Digi-Key: WM7777-ND Manufacturer: 39500-0009 Digi-Key: WM7739-ND

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Table 2. Pin Description
Pin Name Comments
1 PWR Positive terminal of BAT6, connect LDOIN and BAT6 by placing J2
2 CELL6 Positive terminal of BAT6
3 CELL5 Positive terminal of BAT5, negative terminal of BAT6
4 CELL4 Positive terminal of BAT4, negative terminal of BAT5
5 CELL3 Positive terminal of BAT3, negative terminal of BAT4
6 CELL2 Positive terminal of BAT2, negative terminal of BAT3
7 CELL1 Positive terminal of BAT1, negative terminal of BAT2
8 CELL0 Negative terminal of BAT1, local ground for module
9 GND EVM GND, connect BAT0 and GND by placing J3
3.1.2 Host Interface
The 6-pin J8 - Serial connector is used to connect the BQ79606EVM to a PC running the GUI or to a host
controller. Signals at the J8 - Serial connector are 5-V TTL signals. Texas Instruments recommends using
FTDI’s USB-to-TTL serial converter cable to allow connection with the USB port of a PC. The
recommended cable is available from FTDI (http://www.ftdichip.com), and the appropriate part number for
the 1.8-meter cable is TTL-232R-5V.
Figure 3. Molex 22-12-4062 (Reference Image Only)
Table 3. Connector Information
Designator Manufacturer Part Number Mating Connector
J8 Molex Manufacturer: 22-12-4062 Manufacturer: 22-01-2061
Digi-Key: WM1579-ND
Contacts:
Manufacturer: 08-55-0101 (22-30 AWG)
Digi-Key: WM2312CT-ND
Table 4. Pin Description
Pin Name Mating Cable Color
1 Ground Black
2 FAULT signal from BQ79606A-Q1 Black
3 5-V input from PC Red
4 TX from PC (BQ79606A-Q1 RX) Orange

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Table 4. Pin Description (continued)
5 TX from BQ79606A-Q1 (PC RX) Yellow
6 WAKE signal from PC Green
3.1.3 GPIO or Thermistor Inputs
There are 6 GPIO pins (with a parallel set of 6 connected to the same signal) which can also be used as
thermistor connections. The first two columns of pins (J15 and the left column of J16) are tied together by
row with the GPIO in ascending order (top row is GPIO1, second row is GPIO2, etc). The third column of
pins (the right column of J16) are all GND. The board provides a 10-kΩpullup to TSREF.
Figure 4. Sullins Connector Solutions PEC06DAAN (Reference Image Only)
Table 5. Connector Information
Designator Manufacturer Part Number Mating Connector
J16 Tyco Electronic Manufacturer: 43045-1601 Manufacturer: 43025-1600
Digi-Key: WM2490-ND
Contacts:
Manufacturer: 43030-0012 (22-30 AWG)
Digi-Key: WM2779CT-ND
Table 6. Pin Description - J16
Pin Name Comments
1 GPIO1 Thermistor 1 connection (on-board 10-kΩpullup to TSREF)
2 GND Ground
3 GPIO2 Thermistor 2 connection (on-board 10-kΩpullup to TSREF)
4 GND Ground
5 GPIO3 Thermistor 3 connection (on-board 10-kΩpullup to TSREF)
6 GND Ground
7 GPIO4 Thermistor 4 connection (on-board 10-kΩpullup to TSREF)
8 GND Ground
9 GPIO5 Thermistor 5 connection (on-board 10-kΩpullup to TSREF)
10 GND Ground
11 GPIO6 Thermistor 6 connection (on-board 10-kΩpullup to TSREF)
12 GND Ground

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Table 7. Pin Description - J15
Pin Name Comments
1 GPIO1 Tied to J16 Pin 1
2 GPIO2 Tied to J16 Pin 3
3 GPIO3 Tied to J16 Pin 5
4 GPIO4 Tied to J16 Pin 7
5 GPIO5 Tied to J16 Pin 9
6 GPIO6 Tied to J16 Pin 11
3.1.4 High-Side and Low-Side Communications
There are two sets of 4-position molex connectors available on each board. These provide high-side (J6)
and low-side (J5) communications between stacked EVM devices.
Table 8. Connector Information
Designator Manufacturer Part Number Mating Connector
J5/J6 Molex Manufacturer:
0705510038
Digi-Key: WM14059-ND
Manufacturer:
0050579404
Digi-Key: WM2902-ND
Table 9. Pin Description - J5
Pin Name Comments
1 COML_N COM lowside negative
2 COML_P COM lowside positive
3 FAULTL_N FAULT lowside negative
4 FAULTL_P FAULT lowside positive
Table 10. Pin Description - J6
Pin Name Comments
1 FAULTH_P FAULT highside positive
2 FAULTH_N FAULT highside negative
3 COMH_P COM highside positive
4 COMH_N COM highside negative

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4 BQ79606EVM Quick Start Guide
Figure 5. Basic EVM Setup
Figure 6. Advanced EVM Setup

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This section includes hardware setup instructions, connection procedures, and software and GUI
instructions.
4.1 Required Devices
The system is implemented using the TMS570LS04 LaunchPad™ board (TMS570LS0432 MCU) and the
BQ79606EVM.
The part numbers of the evaluation modules are LAUNCHXL-TMS57004 and BQ79606EVM. These
boards are available from the TI eStore (https://estore.ti.com/) or from your local TI sales representative.
For more details and information related to the LaunchPad modules, see the specific module user's guide.
4.1.1 LaunchPad Required Modification
To allow use of the SCI1 UART pin on the LaunchPad with the BQ79606EVM, remove resistor R8.
4.2 Power Connections
If powering the BQ79606EVM using the included resistor ladder as cells, simply ensure that the power
supply positive terminal is connected to the "VSTACK" or "PWR" testpoints provided on the board, and the
power supply negative terminal is connected to the "GND" or "Cell0" testpoints provided on the board, or
any "GND" standoff provided.
If not using the resistor ladder, the power supply positive terminal must be connected to the "PWR"
testpoint, and the power supply negative terminal must be connected to the "Cell0" testpoint.
Also ensure that headers J2 and J3 are both jumpered, to allow for power and ground to be supplied from
the "battery stack" (resistor ladder).
4.2.1 On-Board Resistor Ladder - Power Supply
The BQ79606EVM utilizes an on-board resistor ladder to simplify the evaluation process. Each of the six
resistors is nominally 1 kΩ, resulting in roughly one-sixth of the module voltage at each cell connection. By
default, all actuators of SW2 are positioned closest to the IC, which is the "off" or "open" state. In this
state, none of the resistors are connected to the BQ79606A sense and balance connections.
To simulate connected cells to the sense and balance connections (using a power supply), all switch
actuators on SW2 must be moved towards the module connector J1. Moving the actuators in this manner
connects the BQ79606A to the resistor ladder, and allows for simulated cell measurements.
4.2.2 On-Board Resistor Ladder - Using Actual Battery Cells
When using actual battery cells, disconnect the resistor ladder by moving all switch actuators on SW2 to
the "OFF" position (away from J1).
4.3 Connecting the BQ79606EVM to TMS570 LaunchPad
The EVMs are connected using a standard wire jumper; Table 11 shows the connections between the two
EVMs. By default, the TMS570 LaunchPad is powered by the USB port on the host computer. VIO on the
BQ79606EVM can be powered by 3.3 V or 5 V supplies from the TMS570 (3.3 V used in this example).
Table 11. Connections Between BQ79606EVM and TMS570 LaunchPad
Connection Name BQ79606EVM TMS570 LaunchPad
TX J8 pin 5 J1 pin 3 (SCI1_RX)
RX J8 pin 4 J1 pin 4 (SCI1_TX)
nWAKE J8 pin 6 J2 pin 3 (GIOA0)
nFAULT J8 pin 2 J2 pin 4 (GIOA1)
VIO J8 pin 3 J1 pin 1 (+3V3)
GND J8 pin 1 J2 pin 1 (DGND)

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4.4 Stacking BQ79606EVMs
The EVMs are connected using 4-position Molex connectors. There is a high side (J6) and low side (J5)
communication connector available on each device. A jumper and a switch must be configured for proper
stack operation (see Section 4.4.1 and Section 4.4.2).
Table 12. Connections Between High-Side/Low-Side BQ79606EVMs
Connection Name BQ79606EVM High Side BQ79606EVM Low Side
COMH_N/COML_N J6 pin 4 J5 pin 1
COMH_P/COML_P J6 pin 3 J5 pin 2
FAULTH_N/FAULTL_N J6 pin 2 J5 pin 3
FAULTH_P/FAULTL_P J6 pin 1 J5 pin 4
4.4.1 Base/Stack Jumper Setup - J13
NOTE: Silkscreen for this jumper may be INCORRECT on some EVMs. Please place the jumper as
defined below.
For base devices, ensure that the jumper is placed on the left side of J13. For stack devices, ensure that
the jumper is placed on the right side of J13.
4.4.2 Base/Stack Switch Setup - SW1
For base devices, ensure that the switch is placed in the "BASE" position (up). For stack devices, ensure
that the switch is placed in the "STACK" position (down).
4.5 Software
The software provides a command API and drivers that are capable of implementing the examples
provided in BQ79606A-Q1 Software Design Reference.
The example code only provides a control interface to the BQ79606A-Q1 and does not provide any other
communications interface to the outside world. The customer is expected to develop their own
communication implementation. Examples of communications interfaces available to the TMS570 are SPI,
CAN, or UART. For the TMS570 example code, UART is the communication protocol used between the
microcontroller and BQ79606A-Q1 device.
This firmware provided with this application note provides source code examples of the command
sequences described in the BQ79606A-Q1 Software Design Reference.

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Importing a project into Code Composer Studio ™:
1. Launch the provided file: BQ79606A-Q1 Example Code 0.1 Installer.exe and extract files to the default
path provided (C:\ti\BQ79606A-Q1 Example Code 0.1).
2. Launch Code Composer Studio (CCS):
Start →Programs →Texas Instruments →Code Composer Studio v8 →Code Composer
Studio v8
3. When it launches, CCS requests a workspace is selected, choose “C:\myWorkspace”. Once CCS
loads, go to:
Project →Import CSS Projects... →Select search-directory
4. In Select search-directory, browse to the folder:
C:\ti\BQ79606A-Q1 Example Code 0.1
5. In Discovered projects:, check BQ79606A-Q1 example code
4.6 GUI
For initial evaluation, it may be more beneficial to use the graphical user's interface (GUI), which provides
a "point and click" interface to become familiar with the BQ79606A. During the initial sampling phase,
please contact your local TI FAE to get the latest BQStudio file supporting the BQ79606A (the BQStudio
file will be publicly available after GUI validation and release).
To get started with the GUI, please refer to the Getting Started with the BQ79606A GUI document.
4.6.1 GUI UART Connection
Physical setup for the GUI is the same as for the microcontroller, but will instead use an FTDI cable for
the UART connections on J8. This FTDI cable must have the metal contacts facing upwards when
connecting the 6 pin side of the cable to the EVM, with the other side of the cable connected via USB to
the host PC.

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5 Physical Dimensions
5.1 Board Dimensions
Board dimensions: 4.304 in × 2 in
Board height:
• Top - Tallest component (GPIO, Shunts) is 0.35 in (8.8 mm) above PCB.
• Bottom - Tallest component (Transformers) is 0.41 in (10.5 mm) above PCB.
5.2 Board Mounting
Figure 7 illustrates the EVM dimension drawing.

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Figure 7. Board Dimensions

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6 Schematic, Assembly, Layout, and BOM
Provided are the BQ79606EVM schematic, assembly, layout and BOM in their respective sections.
6.1 Schematic
Figure 8. BQ79606EVM Schematic Part 1
Figure 9. BQ79606EVM Schematic Part 2

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BQ79606A-Q1 Evaluation Module
Figure 10. BQ79606EVM Schematic Part 3
Figure 11. BQ79606EVM Schematic Part 4

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19
SLOU471E–May 2017–Revised April 2019
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BQ79606A-Q1 Evaluation Module
6.2 Assembly
Figure 12. BQ79606EVM Assembly Top

Schematic, Assembly, Layout, and BOM www.ti.com
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BQ79606A-Q1 Evaluation Module
Figure 13. BQ79606EVM Assembly Bottom