Texas Instruments DP83867 User manual

User's Guide
DP83867 SFP Application Interface Card
ABSTRACT
This user's guide describes the design, setup, and function of the DP83867 Single-Port TSN Small Form-
factor Pluggable (SFP) Application Interface Card (AIC). The SPF AIC supports one Ethernet port with
1000/100/10 Mb/s and is compliant with the IEEE 802.3 standard. This reference design supports SGMII for
MAC connections.
The SFP AIC card can be interfaced to the Intel Raptor Lake-P CRB (COM-HPC) design.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Overview............................................................................................................................................................................ 2
1.2 Hardware Features............................................................................................................................................................ 2
1.3 Software Features..............................................................................................................................................................2
1.4 Block Diagram....................................................................................................................................................................2
2 Board Overview...................................................................................................................................................................... 3
2.1 Components.......................................................................................................................................................................3
2.2 SFP Header Signals...........................................................................................................................................................3
3 Quick Start...............................................................................................................................................................................3
4 Schematic, Board Layout, and Bill of Materials...................................................................................................................4
4.1 Board Layout .....................................................................................................................................................................4
4.2 Schematic.......................................................................................................................................................................... 5
4.3 Bill of Materials...................................................................................................................................................................7
5 Revision History......................................................................................................................................................................8
Trademarks
All trademarks are the property of their respective owners.
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1 Introduction
1.1 Overview
Figure 1-1. DP83867 Single-Port TSN SFP Application Interface Card (Top View)
Figure 1-2. DP83867 Single-Port TSN SFP Application Interface Card (Bottom View)
The DP83867 Single-Port TSN SFP Application Interface Card plugs into the Intel Raptor Lake reference design
through the SFP interface connector. This is an easy way to evaluate the functionality of the DP83867 Ethernet
PHY with the Intel CPU reference design.
The SFP form factor carries the SGMII signaling for the Ethernet port, MDIO/MDC, power supply and control
signals.
The AIC supports MDIO access via dedicated a SMI interface over the SFP interface. The DP83867 PHY use
the MDIO addresses 0 to be addressed via the SMI interface.
1.2 Hardware Features
DP83867 Single-Port TSN SFP Application Interface Card features:
• DP83867 Gbit Ethernet PHY
• SGMII MAC interface
• Common serial management interface (SMI) with MDIO/MDC signals to access DP83867 Ethernet PHY
• One RJ45 jack connector
• Discrete magnetics
• On-board power generation for all PHYs, sourced by 3.3 V power supply through the SFP connector
1.3 Software Features
• The Ethernet PHY MDIO registers can be accessed via the SFP interface.
– DP83867 on Ethernet port has MDIO address #0
1.4 Block Diagram
DP83867 SFP AIC
SFP I/F
Raptor Lake-P CRB
SGMII TX
SGMII RX
SMB_SDA/MDIO
SMB_SCL/MDC
Sideband Signals
DP83867
SGMII TX P/N
SGMII RX P/N
MDIO
MDC
RESET_N
LINK
AUXTX / GPIO
XTAL1
XTAL2
MDI[3:0] RJ45
Figure 1-3. Block Diagram
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2 Board Overview
2.1 Components
Figure 2-1 below gives a quick overview of the AIC board. The marked sections are described in the Table 2-1.
Figure 2-1. Connectors, Jumpers and LEDs
Table 2-1. Component Table
Section Description
1 RJ45 Gigabit Ethernet network connection Port 1 / TSN_0
2 DP83867 PHY1 for Port 1
3 Ethernet magnetic
4 SFP interface
5 25 MHz clock generation for PHY
2.2 SFP Header Signals
Please refer to the schematics in section Section 4.2 for the SFP signal assignment and description. The signal
assignment is following the signal layout of the Intel host platform.
2.2.1 MISC0 Signal Header
Table 2-2. SFP Signal Header
Pin Number Signal Description
12 SGMII_SFP_RX_D_N / SGMII_SON
13 SGMII_SFP_RX_D_P / SGMII_SOP
18 SGMII_SFP_TX_D_P / SGMII_SIP
19 SGMII_SFP_TX_D_N / SGMII_SIN
8 LINK
2 PHY GPIO_0 / SFP_AUX_TS
4 MDIO
5 MDC
6 SFP_MD_0, connected to GND
3, 7, 9 Not connected
1, 10, 11, 14, 17, 20 GND
15, 16 3.3V supply
3 Quick Start
1. Power down the Intel host platform (e.g Intel Raptor Lake).
2. Plug-in the DP83867 Single-Port TSN SFP Application Interface Card into the Intel host platform.
3. Power up the Intel host platform.
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4 Schematic, Board Layout, and Bill of Materials
4.1 Board Layout
Figure 4-1. Assembly Drawing Top Layer
Figure 4-2. Assembly Drawing Bottom Layer
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4.2 Schematic
GND
PHY1_TD_A_P
PHY1_TD_A_N
PHY1_TD_B_P
PHY1_TD_C_P
PHY1_TD_D_P
PHY1_TD_D_N
PHY1_TD_B_N
PHY1_TD_C_N
GND
GND GND
GND
MDIO Address 0
EARTH_GNDGND
16V
0.1uF
C4
16V
0.1uF
C3
16V
0.1uF
C2
16V
0.1uF
C6
16V
0.1uF
C7 16V
0.1uF
C9
16V
0.1uF
C10
16V
0.1uF
C11
16V
0.1uF
C12
10V
1uF
C22
10V
1uF
C23
10V
1uF
C24
Mode 3
Mode 2
GND
SGMII_RX_N
VCC_2.5V
VCC_1.0V
0.1uFC30
0.1uF
C31
(Mode 1)
(Mode 1)
2.20kR4
2.20kR6
VCC_2.5V
VCC_1.0V
GND
SGMII_SFP_TX_D_P
SGMII_SFP_TX_D_N
SGMII_SFP_RX_D_P
SGMII_SFP_RX_D_N
SFP_LINK
RXCTL
RXCTL
SFP_LINK
SFP_MDC
SFP_MDIO
SFP_RESET_N
1
2
3
4
5
6
7
8
J1
SFP-RJ45 contacts
0.1uFC26
0.1uF
C27
PHY1_TD_A_P
PHY1_TD_A_N
PHY1_TD_B_P
PHY1_TD_C_P
PHY1_TD_D_P
PHY1_TD_D_N
PHY1_TD_B_N
PHY1_TD_C_N
GND
GND
GND
GND
EARTH_GND
2kV
1000pF
C37
2kV
1000pF
C45
RXDATA_0
75.0R1
75.0R2
75.0R5
75.0
R9
0.1uFC25
0.1uFC28
0.1uFC32
0.1uF
C34
1 3
GND 2
GND 4
Y1
GND
P1_TD_A_P
P1_TD_A_N
P1_TD_B_P
P1_TD_B_N
P1_TD_C_P
P1_TD_C_N
P1_TD_D_P
P1_TD_D_N
SGMII_TX_P
SGMII_TX_N
SGMII_RX_P
SGMII_RX_N
1
2
3
24
22
23
5
4
6
20
21
19
7
9
8
11
10
12
18
16
17
14
15
13
74902011 1A
T1
74902011 1A
CLK_OUT
18
GPIO_0
39
GPIO_1
40
GTX_CLK
29
INT/PWDN
44
JTAG_CLK 20
JTAG_TDI 23
JTAG_TDO 21
JTAG_TMS 22
LED_0 47
LED_1 46
LED_2 45
MDC 16
MDIO 17
PAD 49
RBIAS 12
RX_CLK
32 RX_CTRL
38
RX_D0/SGMII_COP
33
RX_D1/SGMII_CON
34
RX_D2/SGMII_SOP
35
RX_D3/SGMII_SON
36
TD_M_A 2
TD_M_B 5
TD_M_C 8
TD_M_D 11
TD_P_A 1
TD_P_B 4
TD_P_C 7
TD_P_D 10
TX_CTRL
37
TX_D0/SGMII_SIN
28
TX_D1/SGMII_SIP
27
TX_D2
26
TX_D3
25
VDD1P0 42
VDD1P0 31
VDD1P0 24
VDD1P0 6
VDDA1P8 48
VDDA1P8 13
VDDA2P5
3
VDDA2P5
9
VDDIO
30
VDDIO
41
VDDIO
19
X_I
15
X_O
14
RESET
43
DP83867ERGZR
U1
PHY1_GPIO_0
PHY1_GPIO_1
SGMII_RX_P
RXDATA_1
2.49k
R8
2.49k
R14
2.49k
R17
2.49k
R15
10.0k
R13
2.20kR7
5.76k
R12
8.2pF
C33
8.2pF
C35
PHY1_GPIO_0
SFP_LINK
+V3.3A
+V3.3A
+V3.3A
+V3.3A
+V3.3A +V3.3A
+V3.3A
10.0kR3
PHY1_GPIO_0
Mode 1
1.00k
R24
1.00k
R25
PHY1_GPIO_1
PHY1_GPIO_1
Mode 1
6.3V
33pF
C16
For SGMII, add same
resistorloadto RXD0/1
as for RXD2/3
RX_D2/RX_D3: optinal
pull-downto discharge
voltagefor mode1.
Figure 4-3. Schematic : DP83867 Ethernet PHY
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VeeT
20
TD-
19
TD+
18
VeeT
17
VccT
16
VccR
15
VeeR
14
RD+
13
RD-
12
VeeR
11
BOTTOP
VeeT 1
TX_Fault 2
TX_Disable 3
MOD-DEF2 4
MOD-DEF1 5
MOD-DEF0 6
Rate Select 7
LOS 8
VeeR 9
VeeR 10
EC1
EDGE_CONN_SFP
SFP_LINK
SFP_MD_0
GND
SFP_MDC
SFP_MDIO
GND
+V3.3A
VI N1
7
VI N2
11 FB1 3
FB2 1
PG1 4
PG2 13
SW1 6
SW2 12
COMP/FSET
14
MODE/S YNC
5
EN1
8
EN2
10
GND 2
GND 9
TPS62441WRQRR
U2
+V3.3A
6.3V
10uF
C5
6.3V
10uF
C8
GND
GND
470nHL1
470nH
L2
8.06k
R21
GND
10pF
C1
10pF
C13
30.0k
R11
47.5k
R16
15.0k
R20
20.0k
R10
VCC_1.0V
GND
GND
VCC_2.5V
6.3V
10uF
C14
6.3V
10uF
C15
PHY1_GPIO_0
SFP_LINK
SGMII_SFP_RX_D_N
SGMII_SFP_TX_D_N
SGMII_SFP_RX_D_P
SGMII_SFP_TX_D_P
GND
0
R23
0
R19
0R22
1.00k
R18
PHY1_GPIO_1
0R26 SFP_RESET_N
Figure 4-4. Schematic : SFP Interface and Power
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4.3 Bill of Materials
Table 4-1. Bill of Materials
Designator Qty Part Number Description Footprint
C1, C13 2 GJM0335C1E100JB01D CAP, CERM, 10 pF, 25 V, +/- 5%,
C0G/NP0, 0201
201
C2, C3, C4, C6, C7, C9, C10,
C11, C12, C26, C27, C30, C31
13 GRM033C71C104KE14D CAP, CERM, 0.1 uF, 16 V, +/- 10%,
X5R, 0201
201
C5, C8, C14, C15 4 GRM155R60J106ME11 CAP, CERM, 10 uF, 6.3 V, +/- 20%,
X5R, 0402
402
C16 1 GJM0335C0J330JB01D CAP, CERM, 33 pF, 6.3 V,+/- 5%,
C0G/NP0, 0201
201
C22, C23, C24 3 GRM033R61A105ME15D CAP, CERM, 1 uF, 10 V,+/- 20%,
X5R, 0201
201
C25, C28, C32, C34 4 GRM033C71A104KE14D CAP, CERM, 0.1 uF, 10 V,+/- 10%,
X7S, 0201
201
C33, C35 2 GRM0335C1E8R2BA01D CAP, CERM, 8.2 pF, 25 V,+/- 1.2%,
C0G/NP0, 0201
201
C37, C45 2 C1206C102KGRACAUTO CAP, CERM, 1000 pF, 2000 V, +/-
10%, X7R, AEC-Q200 Grade 1,
1206
1206
L1, L2 2 DFE252012PD-R47M Inductor, Shielded, 470 nH, 4.7 A,
0.021 ohm, SMD
1008
R1, R2, R5, R9 4 RC0201FR-0775RL RES, 75.0, 1%, 0.05 W, 0201 201
R3 1 RC0201FR-0710KL RES, 10.0 k, 1%, 0.05 W, 0201 201
R4, R6 2 CRCW02012K20FKED RES, 2.20 k, 1%, 0.05 W, 0201 201
R8, R14, R15, R17 4 CRCW02012K49FKED RES, 2.49 k, 1%, 0.05 W, 0201 201
R10 1 RC0201FR-7D20KL RES, 20.0 k, 1%, 0.05 W, 0201 201
R11 1 RC0201FR-0730KL RES, 30.0 k, 1%, 0.05 W, 0201 201
R12 1 RC0201FR-075K76L RES, 5.76 k, 1%, 0.05 W, 0201 201
R13 1 CRCW020110K0FKED RES, 10.0 k, 1%, 0.05 W, 0201 201
R16 1 RC0201FR-0747K5L RES, 47.5 k, 1%, 0.05 W, 0201 201
R18, R24, R25 3 RC0201FR-071KL RES, 1.00 k, 1%, 0.05 W, 0201 201
R19, R23 2 CRCW02010000Z0ED RES, 0, 5%, 0.05 W, 0201 201
R20 1 RC0201FR-0715KL RES, 15.0 k, 1%, 0.05 W, 0201 201
R21 1 RC0201FR-078K06L RES, 8.06 k, 1%, 0.05 W, 0201 201
T1 1 749020111A 2MM DOUBLE ROW FEMALE IDC
ASSEMB
SME24
U1 1 DP83867ERGZR Extended Temperature Gigabit
Ethernet PHY with SGMII,
RGZ0048B (VQFN-48)
RGZ0048B
U2 1 TPS62441WRQRR 2.7-V to 6-V Adjustable-Frequency
Dual Step-Down Converter in QFN
package
VQFN-HR14
Y1 1 830081609 25 MHz ±10ppm Crystal 8pF 200
Ohms 4-SMD, No Lead
SMT_CRYSTAL_1MM
6_1MM2
Z1 1 SFP-RJ45 X0330 SFP RJ45 Housing
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5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
July 2023 * Initial Release
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STANDARD TERMS FOR EVALUATION MODULES
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evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
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clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
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or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
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2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
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WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
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User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
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3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.