Texas Instruments DP83867 User manual

User's Guide
DP83867 SFP Application Interface Card
ABSTRACT
This user's guide describes the design, setup, and function of the DP83867 Single-Port TSN Small Form-
factor Pluggable (SFP) Application Interface Card (AIC). The SPF AIC supports one Ethernet port with
1000/100/10 Mb/s and is compliant with the IEEE 802.3 standard. This reference design supports SGMII for
MAC connections.
The SFP AIC card can be interfaced to the Intel Raptor Lake-P CRB (COM-HPC) design.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Overview............................................................................................................................................................................ 2
1.2 Hardware Features............................................................................................................................................................ 2
1.3 Software Features..............................................................................................................................................................2
1.4 Block Diagram....................................................................................................................................................................2
2 Board Overview...................................................................................................................................................................... 3
2.1 Components.......................................................................................................................................................................3
2.2 SFP Header Signals...........................................................................................................................................................3
3 Quick Start...............................................................................................................................................................................3
4 Schematic, Board Layout, and Bill of Materials...................................................................................................................4
4.1 Board Layout .....................................................................................................................................................................4
4.2 Schematic.......................................................................................................................................................................... 5
4.3 Bill of Materials...................................................................................................................................................................7
5 Revision History......................................................................................................................................................................8
Trademarks
All trademarks are the property of their respective owners.
www.ti.com Table of Contents
SNLU325 – JULY 2023
Submit Document Feedback
DP83867 SFP Application Interface Card 1
Copyright © 2023 Texas Instruments Incorporated

1 Introduction
1.1 Overview
Figure 1-1. DP83867 Single-Port TSN SFP Application Interface Card (Top View)
Figure 1-2. DP83867 Single-Port TSN SFP Application Interface Card (Bottom View)
The DP83867 Single-Port TSN SFP Application Interface Card plugs into the Intel Raptor Lake reference design
through the SFP interface connector. This is an easy way to evaluate the functionality of the DP83867 Ethernet
PHY with the Intel CPU reference design.
The SFP form factor carries the SGMII signaling for the Ethernet port, MDIO/MDC, power supply and control
signals.
The AIC supports MDIO access via dedicated a SMI interface over the SFP interface. The DP83867 PHY use
the MDIO addresses 0 to be addressed via the SMI interface.
1.2 Hardware Features
DP83867 Single-Port TSN SFP Application Interface Card features:
• DP83867 Gbit Ethernet PHY
• SGMII MAC interface
• Common serial management interface (SMI) with MDIO/MDC signals to access DP83867 Ethernet PHY
• One RJ45 jack connector
• Discrete magnetics
• On-board power generation for all PHYs, sourced by 3.3 V power supply through the SFP connector
1.3 Software Features
• The Ethernet PHY MDIO registers can be accessed via the SFP interface.
– DP83867 on Ethernet port has MDIO address #0
1.4 Block Diagram
DP83867 SFP AIC
SFP I/F
Raptor Lake-P CRB
SGMII TX
SGMII RX
SMB_SDA/MDIO
SMB_SCL/MDC
Sideband Signals
DP83867
SGMII TX P/N
SGMII RX P/N
MDIO
MDC
RESET_N
LINK
AUXTX / GPIO
XTAL1
XTAL2
MDI[3:0] RJ45
Figure 1-3. Block Diagram
Introduction www.ti.com
2DP83867 SFP Application Interface Card SNLU325 – JULY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

2 Board Overview
2.1 Components
Figure 2-1 below gives a quick overview of the AIC board. The marked sections are described in the Table 2-1.
Figure 2-1. Connectors, Jumpers and LEDs
Table 2-1. Component Table
Section Description
1 RJ45 Gigabit Ethernet network connection Port 1 / TSN_0
2 DP83867 PHY1 for Port 1
3 Ethernet magnetic
4 SFP interface
5 25 MHz clock generation for PHY
2.2 SFP Header Signals
Please refer to the schematics in section Section 4.2 for the SFP signal assignment and description. The signal
assignment is following the signal layout of the Intel host platform.
2.2.1 MISC0 Signal Header
Table 2-2. SFP Signal Header
Pin Number Signal Description
12 SGMII_SFP_RX_D_N / SGMII_SON
13 SGMII_SFP_RX_D_P / SGMII_SOP
18 SGMII_SFP_TX_D_P / SGMII_SIP
19 SGMII_SFP_TX_D_N / SGMII_SIN
8 LINK
2 PHY GPIO_0 / SFP_AUX_TS
4 MDIO
5 MDC
6 SFP_MD_0, connected to GND
3, 7, 9 Not connected
1, 10, 11, 14, 17, 20 GND
15, 16 3.3V supply
3 Quick Start
1. Power down the Intel host platform (e.g Intel Raptor Lake).
2. Plug-in the DP83867 Single-Port TSN SFP Application Interface Card into the Intel host platform.
3. Power up the Intel host platform.
www.ti.com Board Overview
SNLU325 – JULY 2023
Submit Document Feedback
DP83867 SFP Application Interface Card 3
Copyright © 2023 Texas Instruments Incorporated

4 Schematic, Board Layout, and Bill of Materials
4.1 Board Layout
Figure 4-1. Assembly Drawing Top Layer
Figure 4-2. Assembly Drawing Bottom Layer
Schematic, Board Layout, and Bill of Materials www.ti.com
4DP83867 SFP Application Interface Card SNLU325 – JULY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

4.2 Schematic
GND
PHY1_TD_A_P
PHY1_TD_A_N
PHY1_TD_B_P
PHY1_TD_C_P
PHY1_TD_D_P
PHY1_TD_D_N
PHY1_TD_B_N
PHY1_TD_C_N
GND
GND GND
GND
MDIO Address 0
EARTH_GNDGND
16V
0.1uF
C4
16V
0.1uF
C3
16V
0.1uF
C2
16V
0.1uF
C6
16V
0.1uF
C7 16V
0.1uF
C9
16V
0.1uF
C10
16V
0.1uF
C11
16V
0.1uF
C12
10V
1uF
C22
10V
1uF
C23
10V
1uF
C24
Mode 3
Mode 2
GND
SGMII_RX_N
VCC_2.5V
VCC_1.0V
0.1uFC30
0.1uF
C31
(Mode 1)
(Mode 1)
2.20kR4
2.20kR6
VCC_2.5V
VCC_1.0V
GND
SGMII_SFP_TX_D_P
SGMII_SFP_TX_D_N
SGMII_SFP_RX_D_P
SGMII_SFP_RX_D_N
SFP_LINK
RXCTL
RXCTL
SFP_LINK
SFP_MDC
SFP_MDIO
SFP_RESET_N
1
2
3
4
5
6
7
8
J1
SFP-RJ45 contacts
0.1uFC26
0.1uF
C27
PHY1_TD_A_P
PHY1_TD_A_N
PHY1_TD_B_P
PHY1_TD_C_P
PHY1_TD_D_P
PHY1_TD_D_N
PHY1_TD_B_N
PHY1_TD_C_N
GND
GND
GND
GND
EARTH_GND
2kV
1000pF
C37
2kV
1000pF
C45
RXDATA_0
75.0R1
75.0R2
75.0R5
75.0
R9
0.1uFC25
0.1uFC28
0.1uFC32
0.1uF
C34
1 3
GND 2
GND 4
Y1
GND
P1_TD_A_P
P1_TD_A_N
P1_TD_B_P
P1_TD_B_N
P1_TD_C_P
P1_TD_C_N
P1_TD_D_P
P1_TD_D_N
SGMII_TX_P
SGMII_TX_N
SGMII_RX_P
SGMII_RX_N
1
2
3
24
22
23
5
4
6
20
21
19
7
9
8
11
10
12
18
16
17
14
15
13
74902011 1A
T1
74902011 1A
CLK_OUT
18
GPIO_0
39
GPIO_1
40
GTX_CLK
29
INT/PWDN
44
JTAG_CLK 20
JTAG_TDI 23
JTAG_TDO 21
JTAG_TMS 22
LED_0 47
LED_1 46
LED_2 45
MDC 16
MDIO 17
PAD 49
RBIAS 12
RX_CLK
32 RX_CTRL
38
RX_D0/SGMII_COP
33
RX_D1/SGMII_CON
34
RX_D2/SGMII_SOP
35
RX_D3/SGMII_SON
36
TD_M_A 2
TD_M_B 5
TD_M_C 8
TD_M_D 11
TD_P_A 1
TD_P_B 4
TD_P_C 7
TD_P_D 10
TX_CTRL
37
TX_D0/SGMII_SIN
28
TX_D1/SGMII_SIP
27
TX_D2
26
TX_D3
25
VDD1P0 42
VDD1P0 31
VDD1P0 24
VDD1P0 6
VDDA1P8 48
VDDA1P8 13
VDDA2P5
3
VDDA2P5
9
VDDIO
30
VDDIO
41
VDDIO
19
X_I
15
X_O
14
RESET
43
DP83867ERGZR
U1
PHY1_GPIO_0
PHY1_GPIO_1
SGMII_RX_P
RXDATA_1
2.49k
R8
2.49k
R14
2.49k
R17
2.49k
R15
10.0k
R13
2.20kR7
5.76k
R12
8.2pF
C33
8.2pF
C35
PHY1_GPIO_0
SFP_LINK
+V3.3A
+V3.3A
+V3.3A
+V3.3A
+V3.3A +V3.3A
+V3.3A
10.0kR3
PHY1_GPIO_0
Mode 1
1.00k
R24
1.00k
R25
PHY1_GPIO_1
PHY1_GPIO_1
Mode 1
6.3V
33pF
C16
For SGMII, add same
resistorloadto RXD0/1
as for RXD2/3
RX_D2/RX_D3: optinal
pull-downto discharge
voltagefor mode1.
Figure 4-3. Schematic : DP83867 Ethernet PHY
www.ti.com Schematic, Board Layout, and Bill of Materials
SNLU325 – JULY 2023
Submit Document Feedback
DP83867 SFP Application Interface Card 5
Copyright © 2023 Texas Instruments Incorporated

VeeT
20
TD-
19
TD+
18
VeeT
17
VccT
16
VccR
15
VeeR
14
RD+
13
RD-
12
VeeR
11
BOTTOP
VeeT 1
TX_Fault 2
TX_Disable 3
MOD-DEF2 4
MOD-DEF1 5
MOD-DEF0 6
Rate Select 7
LOS 8
VeeR 9
VeeR 10
EC1
EDGE_CONN_SFP
SFP_LINK
SFP_MD_0
GND
SFP_MDC
SFP_MDIO
GND
+V3.3A
VI N1
7
VI N2
11 FB1 3
FB2 1
PG1 4
PG2 13
SW1 6
SW2 12
COMP/FSET
14
MODE/S YNC
5
EN1
8
EN2
10
GND 2
GND 9
TPS62441WRQRR
U2
+V3.3A
6.3V
10uF
C5
6.3V
10uF
C8
GND
GND
470nHL1
470nH
L2
8.06k
R21
GND
10pF
C1
10pF
C13
30.0k
R11
47.5k
R16
15.0k
R20
20.0k
R10
VCC_1.0V
GND
GND
VCC_2.5V
6.3V
10uF
C14
6.3V
10uF
C15
PHY1_GPIO_0
SFP_LINK
SGMII_SFP_RX_D_N
SGMII_SFP_TX_D_N
SGMII_SFP_RX_D_P
SGMII_SFP_TX_D_P
GND
0
R23
0
R19
0R22
1.00k
R18
PHY1_GPIO_1
0R26 SFP_RESET_N
Figure 4-4. Schematic : SFP Interface and Power
Schematic, Board Layout, and Bill of Materials www.ti.com
6DP83867 SFP Application Interface Card SNLU325 – JULY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

4.3 Bill of Materials
Table 4-1. Bill of Materials
Designator Qty Part Number Description Footprint
C1, C13 2 GJM0335C1E100JB01D CAP, CERM, 10 pF, 25 V, +/- 5%,
C0G/NP0, 0201
201
C2, C3, C4, C6, C7, C9, C10,
C11, C12, C26, C27, C30, C31
13 GRM033C71C104KE14D CAP, CERM, 0.1 uF, 16 V, +/- 10%,
X5R, 0201
201
C5, C8, C14, C15 4 GRM155R60J106ME11 CAP, CERM, 10 uF, 6.3 V, +/- 20%,
X5R, 0402
402
C16 1 GJM0335C0J330JB01D CAP, CERM, 33 pF, 6.3 V,+/- 5%,
C0G/NP0, 0201
201
C22, C23, C24 3 GRM033R61A105ME15D CAP, CERM, 1 uF, 10 V,+/- 20%,
X5R, 0201
201
C25, C28, C32, C34 4 GRM033C71A104KE14D CAP, CERM, 0.1 uF, 10 V,+/- 10%,
X7S, 0201
201
C33, C35 2 GRM0335C1E8R2BA01D CAP, CERM, 8.2 pF, 25 V,+/- 1.2%,
C0G/NP0, 0201
201
C37, C45 2 C1206C102KGRACAUTO CAP, CERM, 1000 pF, 2000 V, +/-
10%, X7R, AEC-Q200 Grade 1,
1206
1206
L1, L2 2 DFE252012PD-R47M Inductor, Shielded, 470 nH, 4.7 A,
0.021 ohm, SMD
1008
R1, R2, R5, R9 4 RC0201FR-0775RL RES, 75.0, 1%, 0.05 W, 0201 201
R3 1 RC0201FR-0710KL RES, 10.0 k, 1%, 0.05 W, 0201 201
R4, R6 2 CRCW02012K20FKED RES, 2.20 k, 1%, 0.05 W, 0201 201
R8, R14, R15, R17 4 CRCW02012K49FKED RES, 2.49 k, 1%, 0.05 W, 0201 201
R10 1 RC0201FR-7D20KL RES, 20.0 k, 1%, 0.05 W, 0201 201
R11 1 RC0201FR-0730KL RES, 30.0 k, 1%, 0.05 W, 0201 201
R12 1 RC0201FR-075K76L RES, 5.76 k, 1%, 0.05 W, 0201 201
R13 1 CRCW020110K0FKED RES, 10.0 k, 1%, 0.05 W, 0201 201
R16 1 RC0201FR-0747K5L RES, 47.5 k, 1%, 0.05 W, 0201 201
R18, R24, R25 3 RC0201FR-071KL RES, 1.00 k, 1%, 0.05 W, 0201 201
R19, R23 2 CRCW02010000Z0ED RES, 0, 5%, 0.05 W, 0201 201
R20 1 RC0201FR-0715KL RES, 15.0 k, 1%, 0.05 W, 0201 201
R21 1 RC0201FR-078K06L RES, 8.06 k, 1%, 0.05 W, 0201 201
T1 1 749020111A 2MM DOUBLE ROW FEMALE IDC
ASSEMB
SME24
U1 1 DP83867ERGZR Extended Temperature Gigabit
Ethernet PHY with SGMII,
RGZ0048B (VQFN-48)
RGZ0048B
U2 1 TPS62441WRQRR 2.7-V to 6-V Adjustable-Frequency
Dual Step-Down Converter in QFN
package
VQFN-HR14
Y1 1 830081609 25 MHz ±10ppm Crystal 8pF 200
Ohms 4-SMD, No Lead
SMT_CRYSTAL_1MM
6_1MM2
Z1 1 SFP-RJ45 X0330 SFP RJ45 Housing
www.ti.com Schematic, Board Layout, and Bill of Materials
SNLU325 – JULY 2023
Submit Document Feedback
DP83867 SFP Application Interface Card 7
Copyright © 2023 Texas Instruments Incorporated

5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
July 2023 * Initial Release
Revision History www.ti.com
8DP83867 SFP Application Interface Card SNLU325 – JULY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

www.ti.com
2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

www.ti.com
3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-delivered-in-japan.html
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-for-power-line-communication.html
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.

www.ti.com
4
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

www.ti.com
5
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated

IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated