Texas Instruments FDC1004QEVM User manual

FDC1004QEVM User Guide
User's Guide
Literature Number: SNAU178
April 2015

Contents
1 Introduction......................................................................................................................... 4
2 Setup.................................................................................................................................. 4
2.1 FDC1004QEVM .......................................................................................................... 4
2.2 Input/Output Connector Description ................................................................................... 5
2.3 HW Setup ................................................................................................................. 6
2.4 SW Setup ................................................................................................................. 6
2.5 Operation.................................................................................................................. 6
3 Board Layout....................................................................................................................... 6
4 Schematic........................................................................................................................... 8
Revision History.......................................................................................................................... 10
2Table of Contents SNAU178–April 2015
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List of Figures
1 FDC1004QEVM : Sections................................................................................................. 5
2 Top Layer Routing........................................................................................................... 6
3 Bottom Layer Routing....................................................................................................... 7
4 FDC1004QEVM Schematic ................................................................................................ 8
List of Tables
1 Ordering....................................................................................................................... 4
2 J1, J2 Pin Out ................................................................................................................ 5
3 J4 Pin Out..................................................................................................................... 5
4 J5 Pin Out..................................................................................................................... 6
5 Bill of Materials............................................................................................................... 9
3
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User's Guide
SNAU178–April 2015
FDC1004QEVM User's Guide
1 Introduction
The FDC1004QEVM evaluation kit is a plug and play system to test and evaluate the FDC1004Q, AEC-
Q100 qualified, 4-channel capacitive to digital converter. The EVM is a breakable PCB which consists of 3
sections. The first section is a USB to I2C converter based on MSP430F5528 micro-controller, the second
section contains the FDC1004Q and the third section is a touchless sensor (to demonstrate the sensitivity
of the FDC1004Q) . The third section can be removed and replace with customized sensors to evaluate
the capabilities of the FDC1004Q in various applications. The FDC1004QEVM can be used with the
FDC1004EVM GUI. The software is able to configure the FDC1004Q’s registers, display on four graphs
(one for each measurement) the capacitive values and export data in CSV format.
The EVM contains one FDC1004Q (See Table 1).
Table 1. Ordering
DEVICE IC Package
U1 FDC1004QDGS VSSOP 10pin
2 Setup
This section provides a general description about FDC1004QEVM, its I/O connectors and how to properly
setup the evaluation module.
2.1 FDC1004QEVM
The FDC1004QEVM is divided in three sections:
1. USB to I2C section: this has the purpose to interface the communication of FDC1004Q to a USB port.
2. FDC1004Q section: this section embeds FDC1004Q capacitive to digital converter.
3. Sensor section: this section contains a capacitive sensor that can be used for human proximity.
The EVM has precut lines on the borders of each section that allow for a flexible and specific system
design. As an example of the flexibility of this design, the sensor can be replaced with a customer sensor,
or the MCU section can be separated to allow for a remote placement of the FDC1004Q.
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FDC1004USB to I2C SENSOR
www.ti.com Setup
Figure 1. FDC1004QEVM : Sections
2.2 Input/Output Connector Description
J1, J2: 4x1 Header: the I/O ports of sections between the USB to I2C and the FDC1004Q sections. This
provides the I2C communication channel and the power connections between these two sections should
the EVM be separated into sections. A simple 4 wire cable can be used to interface the sections.
Table 2. J1, J2 Pin Out
Pin Pin Description
J1.1 J2.1 GND
J1.2 J2.2 VDD
J1.3 J2.3 SCL
J1.4 J2.4 SDA
J3: USB interface to connect the EVM to a PC; it also provides power to the EVM.
J4: 10x1 Headers. This is not populated by default. It provides an easy method to change sensors or to
remotely place the sensor away from the FDC1004Q. This connector with its counterpart, J5, allows the
communication of the two modules through a 10-wire cable.
Table 3. J4 Pin Out
Pin Description
J4.1 GND
J4.2 SHLD1
J4.3 CIN1
J4.4 CIN2
J4.5 SHLD1
J4.6 SHLD2
J4.7 CIN3
J4.8 CIN4
J4.9 SHLD2
J4.10 GND
J5: 10x1 Header, for the electrical connection between the FDC1004 and the sensor section.
5
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Table 4. J5 Pin Out
Pin Description
J5.1 Not Connected
J5.2 SHLD1
J5.3 CIN1
J5.4 Not Connected
J5.5 SHLD1
J5.6 Not Connected
J5.7 Not Connected
J5.8 Not Connected
J5.9 Not Connected
J5.10 Not Connected
2.3 HW Setup
The power supply of FDC1004Q is provided by the LDO (U4), which is sourced from the USB 5.0V. The
I2C communication with FDC1004Q is fully managed by the MSP430F5528IRGC microcontroller (U3).
The FDC1004Q has a fixed I2C address.
2.4 SW Setup
Ensure that the FDC1004QEVM GUI and the drivers have been installed on the host computer. Plug the
EVM into an available USB port on the host.
2.5 Operation
Plug the EVM into the host computer. The host computer should automatically detect the device as an
EVM. Launch the GUI and configure the desired data acquisition mode for FDC1004Q. Then, it should
automatically start measuring on the configured sensors.
3 Board Layout
Figure 2 and Figure 3 show the board layout of the FDC1004QEVM.
Sensor layout has been designed to demonstrate human proximity sensing with a single sensor. A shield
layer below the sensor and a shield ring around the sensor is designed to significantly reduce parasitic
capacitance interference from directions not intended to sense the target. The intended sensing area for
this EVM is towards the top side of the sensor. For more information about shielding, refer to the
application note Capacitive Sensing: The Ins and Outs of Active Shielding (SNOA926).
Figure 2. Top Layer Routing
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Figure 3. Bottom Layer Routing
7
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FID2
FID1
FID3
SV601125
A
PCB Number:
PCB Rev:
LOGO
PCB
Texas Instruments
1300pF
C11
GND VDD
0.47µF
C17
GND
1300pF
C19
GND
GND
SDA
SCL
VBUS
VUSB
1300pF
C6
GND
220pF
C10
GND
DP
DM
PUR
33k
R5
2200pF C7
GND VDD
5.6V D21
MMSZ5232B-7-F
VBUS
GND
GND
1300pF C3
GND
IN
1OUT 5
2
CBYP 4
ON/OFF
3
GND
U4
LP2985AIM5-3.3/NOPB
GND
0.01µF C4
2.2µF
C15
VDD
GND
GND
1
2
3
4
6
5
J3
48037-2200
GND GND
IO1
1
IO2
2
GND
3IO3 4
IO4 5
VCC 6
U2
1300pF C5
GND
33 R8
33
R9
DM
33k
R40
33k R20
GND
DP PUR
GND
VDD
SCL
SDA
VBUS
GND
VDD
SCL
SDA
SBWTCK
SBWTDIO
SCL
SDA
VDD
VDD
GND
0.1µF C1
GND
CIN1
CIN2
CIN3
CIN4
SHLD1
SHLD2
SHLD2 SHLD1
CIN1
CIN2
CIN3
CIN4
GND
5 4 1 2 3 6 7 8 9
10
J4
4 1 2 3
J1 TSW-104-07-G-S
4 1 2 3
J2 TSW-104-07-G-S
51pF
CS1
51pF
CS2
GND
GND
SHLD2 SHLD1
GND
SHLD1
CIN1
SHLD1
4.99k
R10
4.99k
R11
1µF C20
GND
LOGO
PCB
Texas Instruments
GND
100pF COFF
5 4 1 2 3 6 7 8 9
10
J5
P6.0/CB0/A0 1 P6.1/CB1/A1 2 P6.2/CB2/A2 3 P6.3/CB3/A3 4 P6.4/CB4/A4 5 P6.5/CB5/A5 6 P6.6/CB6/A6 7 P6.7/CB7/A7 8
P5.0/A8/VREF+/VEREF+
9
P5.1/A9/VREF-/VEREF-
10
AVCC1
11
P5.4/XIN
12
P5.5/XOUT
13
AVSS1 14
DVCC1
15 DVSS1 16
VCORE
17
P1.0/TA0CLK/ACLK
18
P1.1/TA0.0
19
P1.2/TA0.1
20
P1.3/TA0.2
21
P1.4/TA0.3
22
P1.5/TA0.4
23
P1.6/TA1CLK/CBOUT
24
P1.7/TA1.0
25
P2.0/TA1.1 26 P2.1/TA1.2 27
P2.2/TA2CLK/SMCLK 28
P2.3/TA2.0 29 P2.4/TA2.1 30 P2.5/TA2.2 31
P2.6/RTCCLK/DMAE0 32
P2.7/UCB0STE/UCA0CLK 33
P3.0/UCB0SIMO/UCB0SDA
34
P3.1/UCB0SOMI/UCB0SCL
35
P3.2/UCB0CLK/UCA0STE
36
P3.3/UCA0TXD/UCA0SIMO
37
P3.4/UCA0RXD/UCA0SOMI
38
DVSS2 39
DVCC2
40
P4.0/PM_UCB1STE/PM_UCA1CLK 41
P4.1/PM_UCB1SIMO/PM_UCB1SDA 42
P4.2/PM_UCB1SOMI/PM_UCB1SCL 43
P4.3/PM_UCB1CLK/PM_UCA1STE 44
P4.4/PM_UCA1TXD/PM_UCA1SIMO 45
P4.5/PM_UCA1RXD/PM_UCA1SOMI 46
P4.6/PM_NONE 47 P4.7/PM_NONE 48
VSSU 49
PU.0/DP
50
PUR
51
PU.1/DM
52
VBUS
53
VUSB
54
V18
55
AVSS2 56
P5.2/XT2IN
57
P5.3/XT2OUT
58
TEST/SBWTCK 59
PJ.0/TDO 60
PJ.1/TDI/TCLK 61
PJ.2/TMS 62
PJ.3/TCK 63
RST/NMI/SBWTDIO 64
QFN PAD 65
U3 MSP430F5528IRGC
GND
GND
GND
GND
1.0k R6
1.0k R7
18pF
C9
18pF
C8
24.000MHz
1 3
4 2
G
G
Y1
Green
12
D1
10µF C2
L1 VLS201610ET-100M
Super Red
12
D2
CIN1
PROXIMITY
SHLD1
SENSOR
SHLD1 1
CIN1
2
CIN2
3
CIN3
4
CIN4
5
SHLD2 6
GND 7
VDD
8SCL 9
SDA 10
U1 FDC1004QDGS
Schematic www.ti.com
4 Schematic
Figure 4. FDC1004QEVM Schematic
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www.ti.com Schematic
Table 5. Bill of Materials
Qty Designator Description Footprint Manufacturer Part
Number
1 C1 CAP, CERM, 0.1uF, 6.3V, +/-10%, X5R, 0402 402 C1005X5R0J104K050BA
1 C2 CAP CER 10UF 10V 10% X5R 0603 603 C1608X5R1A106K080AC
4 C3, C5, CAP CER 0.1UF 16V 5% X7R 0402 402 0402YC132KAT2A
C11, C19
1 C4 CAP, CERM, 0.01uF, 25V, +/-5%, C0G/NP0, 0603 603 C1608C0G1E103J080AA
1 C6 CAP CER 220PF 50V 1% NP0 0402 402 0402YC132KAT2A
1 C7 CAP, CERM, 2200pF, 50V, +/-10%, X7R, 0603 603 C0603X222K5RACTU
2 C8, C9 CAP CER 18PF 100V 5% NP0 0603 603 GRM1885C2A300JA01D
1 C10 CAP, CERM, 220pF, 50V, +/-1%, C0G/NP0, 0603 603 06035A221FAT2A
1 C15 CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603 603 C0603C225K8PACTU
1 C17 CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603 603 C0603C474K8RACTU
1 C20 CAP, CERM, 1uF, 6.3V, +/-20%, X5R, 0402 402 C1005X5R0J105M050BB
0 COFF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1535C1H101JDD5D
0 CS1, CS2 CAP, CERM, 51pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1555C1H510JA01D
1 D1 LED SMARTLED GREEN 570NM 0603 603 LG L29K-G2J1-24-Z
1 D2 LED 660NM SUPER RED DIFF 0603SMD 603 SML-LX0603SRW-TR
1 D21 Diode, Zener, 5.6V, 500mW, SOD-123 SOD-123 MMSZ5232B-7-F
0 J1, J2 Header, TH, 100mil, 4x1, Gold plated, 230 mil above TSW-104-07-G-S TSW-104-07-G-S
insulator
1 J3 Connector, USB Type A, 4POS R/A, SMD CONN_USB_04803722 480372200
00
0 J4 Receptacle, 50mil 10x1, R/A, TH CONN_851-43-010-20- 851-43-010-20-001000
001000
0 J5 Header, 50mil, 10x1, R/A, TH CONN_850-80-010-20- 850-80-010-20-001101
001101
1 L1 INDUCTOR POWER 10UH .45A SMD VLS201610E VLS201610ET-100M
1 R5 RES, 33k ohm, 5%, 0.063W, 0402 402 CRCW040233K0JNED
2 R6, R7 RES 1K OHM 1/10W 5% 0402 SMD 402 CRCW040233R0JNED
2 R8, R9 RES, 33 ohm, 5%, 0.063W, 0402 402 CRCW040233R0JNED
2 R10, R11 RES, 4.99k ohm, 1%, 0.063W, 0402 402 CRCW04024K99FKED
1 R20 RES,1M ohm, 5%, 0.063W, 0402 402 RC0402JR-071ML
1 R40 RES 1.5K OHM 1/16W 5% 0402 SMD 402 CRCW04021K50JNED
1 U1 Q Grade 4-Channel Capacitance-to-Digital Converter DGS0010A FDC1004QDGS
for Capacitive Sensing Solutions, DGS0010A
1 U2 4-CHANNEL ESD-PROTECTION ARRAY FOR DRY0006A TPD4E004DRY
HIGH-SPEED DATA INTERFACES, DRY006A
1 U3 Mixed Signal MicroController, RGC0064B RGC0064B MSP430F5528IRGCT
1 U4 Micropower 150 mA Low-Noise Ultra Low-Dropout MF05A_N LP2985AIM5-3.3/NOPB
Regulator, 5-pin SOT-23, Pb-Free
1 Y1 CRYSTAL 24.000MHZ 18PF SMD ABMM ABMM-24.000MHZ-B2-T
9
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Revision History www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
April 2015 * Initial release.
10 Revision History SNAU178–April 2015
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