Texas Instruments FDC1004QEVM User manual

FDC1004QEVM User Guide
User's Guide
Literature Number: SNAU178
April 2015

Contents
1 Introduction......................................................................................................................... 4
2 Setup.................................................................................................................................. 4
2.1 FDC1004QEVM .......................................................................................................... 4
2.2 Input/Output Connector Description ................................................................................... 5
2.3 HW Setup ................................................................................................................. 6
2.4 SW Setup ................................................................................................................. 6
2.5 Operation.................................................................................................................. 6
3 Board Layout....................................................................................................................... 6
4 Schematic........................................................................................................................... 8
Revision History.......................................................................................................................... 10
2Table of Contents SNAU178–April 2015
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List of Figures
1 FDC1004QEVM : Sections................................................................................................. 5
2 Top Layer Routing........................................................................................................... 6
3 Bottom Layer Routing....................................................................................................... 7
4 FDC1004QEVM Schematic ................................................................................................ 8
List of Tables
1 Ordering....................................................................................................................... 4
2 J1, J2 Pin Out ................................................................................................................ 5
3 J4 Pin Out..................................................................................................................... 5
4 J5 Pin Out..................................................................................................................... 6
5 Bill of Materials............................................................................................................... 9
3
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User's Guide
SNAU178–April 2015
FDC1004QEVM User's Guide
1 Introduction
The FDC1004QEVM evaluation kit is a plug and play system to test and evaluate the FDC1004Q, AEC-
Q100 qualified, 4-channel capacitive to digital converter. The EVM is a breakable PCB which consists of 3
sections. The first section is a USB to I2C converter based on MSP430F5528 micro-controller, the second
section contains the FDC1004Q and the third section is a touchless sensor (to demonstrate the sensitivity
of the FDC1004Q) . The third section can be removed and replace with customized sensors to evaluate
the capabilities of the FDC1004Q in various applications. The FDC1004QEVM can be used with the
FDC1004EVM GUI. The software is able to configure the FDC1004Q’s registers, display on four graphs
(one for each measurement) the capacitive values and export data in CSV format.
The EVM contains one FDC1004Q (See Table 1).
Table 1. Ordering
DEVICE IC Package
U1 FDC1004QDGS VSSOP 10pin
2 Setup
This section provides a general description about FDC1004QEVM, its I/O connectors and how to properly
setup the evaluation module.
2.1 FDC1004QEVM
The FDC1004QEVM is divided in three sections:
1. USB to I2C section: this has the purpose to interface the communication of FDC1004Q to a USB port.
2. FDC1004Q section: this section embeds FDC1004Q capacitive to digital converter.
3. Sensor section: this section contains a capacitive sensor that can be used for human proximity.
The EVM has precut lines on the borders of each section that allow for a flexible and specific system
design. As an example of the flexibility of this design, the sensor can be replaced with a customer sensor,
or the MCU section can be separated to allow for a remote placement of the FDC1004Q.
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FDC1004USB to I2C SENSOR
www.ti.com Setup
Figure 1. FDC1004QEVM : Sections
2.2 Input/Output Connector Description
J1, J2: 4x1 Header: the I/O ports of sections between the USB to I2C and the FDC1004Q sections. This
provides the I2C communication channel and the power connections between these two sections should
the EVM be separated into sections. A simple 4 wire cable can be used to interface the sections.
Table 2. J1, J2 Pin Out
Pin Pin Description
J1.1 J2.1 GND
J1.2 J2.2 VDD
J1.3 J2.3 SCL
J1.4 J2.4 SDA
J3: USB interface to connect the EVM to a PC; it also provides power to the EVM.
J4: 10x1 Headers. This is not populated by default. It provides an easy method to change sensors or to
remotely place the sensor away from the FDC1004Q. This connector with its counterpart, J5, allows the
communication of the two modules through a 10-wire cable.
Table 3. J4 Pin Out
Pin Description
J4.1 GND
J4.2 SHLD1
J4.3 CIN1
J4.4 CIN2
J4.5 SHLD1
J4.6 SHLD2
J4.7 CIN3
J4.8 CIN4
J4.9 SHLD2
J4.10 GND
J5: 10x1 Header, for the electrical connection between the FDC1004 and the sensor section.
5
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Table 4. J5 Pin Out
Pin Description
J5.1 Not Connected
J5.2 SHLD1
J5.3 CIN1
J5.4 Not Connected
J5.5 SHLD1
J5.6 Not Connected
J5.7 Not Connected
J5.8 Not Connected
J5.9 Not Connected
J5.10 Not Connected
2.3 HW Setup
The power supply of FDC1004Q is provided by the LDO (U4), which is sourced from the USB 5.0V. The
I2C communication with FDC1004Q is fully managed by the MSP430F5528IRGC microcontroller (U3).
The FDC1004Q has a fixed I2C address.
2.4 SW Setup
Ensure that the FDC1004QEVM GUI and the drivers have been installed on the host computer. Plug the
EVM into an available USB port on the host.
2.5 Operation
Plug the EVM into the host computer. The host computer should automatically detect the device as an
EVM. Launch the GUI and configure the desired data acquisition mode for FDC1004Q. Then, it should
automatically start measuring on the configured sensors.
3 Board Layout
Figure 2 and Figure 3 show the board layout of the FDC1004QEVM.
Sensor layout has been designed to demonstrate human proximity sensing with a single sensor. A shield
layer below the sensor and a shield ring around the sensor is designed to significantly reduce parasitic
capacitance interference from directions not intended to sense the target. The intended sensing area for
this EVM is towards the top side of the sensor. For more information about shielding, refer to the
application note Capacitive Sensing: The Ins and Outs of Active Shielding (SNOA926).
Figure 2. Top Layer Routing
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Figure 3. Bottom Layer Routing
7
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FID2
FID1
FID3
SV601125
A
PCB Number:
PCB Rev:
LOGO
PCB
Texas Instruments
1300pF
C11
GND VDD
0.47µF
C17
GND
1300pF
C19
GND
GND
SDA
SCL
VBUS
VUSB
1300pF
C6
GND
220pF
C10
GND
DP
DM
PUR
33k
R5
2200pF C7
GND VDD
5.6V D21
MMSZ5232B-7-F
VBUS
GND
GND
1300pF C3
GND
IN
1OUT 5
2
CBYP 4
ON/OFF
3
GND
U4
LP2985AIM5-3.3/NOPB
GND
0.01µF C4
2.2µF
C15
VDD
GND
GND
1
2
3
4
6
5
J3
48037-2200
GND GND
IO1
1
IO2
2
GND
3IO3 4
IO4 5
VCC 6
U2
1300pF C5
GND
33 R8
33
R9
DM
33k
R40
33k R20
GND
DP PUR
GND
VDD
SCL
SDA
VBUS
GND
VDD
SCL
SDA
SBWTCK
SBWTDIO
SCL
SDA
VDD
VDD
GND
0.1µF C1
GND
CIN1
CIN2
CIN3
CIN4
SHLD1
SHLD2
SHLD2 SHLD1
CIN1
CIN2
CIN3
CIN4
GND
5 4 1 2 3 6 7 8 9
10
J4
4 1 2 3
J1 TSW-104-07-G-S
4 1 2 3
J2 TSW-104-07-G-S
51pF
CS1
51pF
CS2
GND
GND
SHLD2 SHLD1
GND
SHLD1
CIN1
SHLD1
4.99k
R10
4.99k
R11
1µF C20
GND
LOGO
PCB
Texas Instruments
GND
100pF COFF
5 4 1 2 3 6 7 8 9
10
J5
P6.0/CB0/A0 1 P6.1/CB1/A1 2 P6.2/CB2/A2 3 P6.3/CB3/A3 4 P6.4/CB4/A4 5 P6.5/CB5/A5 6 P6.6/CB6/A6 7 P6.7/CB7/A7 8
P5.0/A8/VREF+/VEREF+
9
P5.1/A9/VREF-/VEREF-
10
AVCC1
11
P5.4/XIN
12
P5.5/XOUT
13
AVSS1 14
DVCC1
15 DVSS1 16
VCORE
17
P1.0/TA0CLK/ACLK
18
P1.1/TA0.0
19
P1.2/TA0.1
20
P1.3/TA0.2
21
P1.4/TA0.3
22
P1.5/TA0.4
23
P1.6/TA1CLK/CBOUT
24
P1.7/TA1.0
25
P2.0/TA1.1 26 P2.1/TA1.2 27
P2.2/TA2CLK/SMCLK 28
P2.3/TA2.0 29 P2.4/TA2.1 30 P2.5/TA2.2 31
P2.6/RTCCLK/DMAE0 32
P2.7/UCB0STE/UCA0CLK 33
P3.0/UCB0SIMO/UCB0SDA
34
P3.1/UCB0SOMI/UCB0SCL
35
P3.2/UCB0CLK/UCA0STE
36
P3.3/UCA0TXD/UCA0SIMO
37
P3.4/UCA0RXD/UCA0SOMI
38
DVSS2 39
DVCC2
40
P4.0/PM_UCB1STE/PM_UCA1CLK 41
P4.1/PM_UCB1SIMO/PM_UCB1SDA 42
P4.2/PM_UCB1SOMI/PM_UCB1SCL 43
P4.3/PM_UCB1CLK/PM_UCA1STE 44
P4.4/PM_UCA1TXD/PM_UCA1SIMO 45
P4.5/PM_UCA1RXD/PM_UCA1SOMI 46
P4.6/PM_NONE 47 P4.7/PM_NONE 48
VSSU 49
PU.0/DP
50
PUR
51
PU.1/DM
52
VBUS
53
VUSB
54
V18
55
AVSS2 56
P5.2/XT2IN
57
P5.3/XT2OUT
58
TEST/SBWTCK 59
PJ.0/TDO 60
PJ.1/TDI/TCLK 61
PJ.2/TMS 62
PJ.3/TCK 63
RST/NMI/SBWTDIO 64
QFN PAD 65
U3 MSP430F5528IRGC
GND
GND
GND
GND
1.0k R6
1.0k R7
18pF
C9
18pF
C8
24.000MHz
1 3
4 2
G
G
Y1
Green
12
D1
10µF C2
L1 VLS201610ET-100M
Super Red
12
D2
CIN1
PROXIMITY
SHLD1
SENSOR
SHLD1 1
CIN1
2
CIN2
3
CIN3
4
CIN4
5
SHLD2 6
GND 7
VDD
8SCL 9
SDA 10
U1 FDC1004QDGS
Schematic www.ti.com
4 Schematic
Figure 4. FDC1004QEVM Schematic
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www.ti.com Schematic
Table 5. Bill of Materials
Qty Designator Description Footprint Manufacturer Part
Number
1 C1 CAP, CERM, 0.1uF, 6.3V, +/-10%, X5R, 0402 402 C1005X5R0J104K050BA
1 C2 CAP CER 10UF 10V 10% X5R 0603 603 C1608X5R1A106K080AC
4 C3, C5, CAP CER 0.1UF 16V 5% X7R 0402 402 0402YC132KAT2A
C11, C19
1 C4 CAP, CERM, 0.01uF, 25V, +/-5%, C0G/NP0, 0603 603 C1608C0G1E103J080AA
1 C6 CAP CER 220PF 50V 1% NP0 0402 402 0402YC132KAT2A
1 C7 CAP, CERM, 2200pF, 50V, +/-10%, X7R, 0603 603 C0603X222K5RACTU
2 C8, C9 CAP CER 18PF 100V 5% NP0 0603 603 GRM1885C2A300JA01D
1 C10 CAP, CERM, 220pF, 50V, +/-1%, C0G/NP0, 0603 603 06035A221FAT2A
1 C15 CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603 603 C0603C225K8PACTU
1 C17 CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603 603 C0603C474K8RACTU
1 C20 CAP, CERM, 1uF, 6.3V, +/-20%, X5R, 0402 402 C1005X5R0J105M050BB
0 COFF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1535C1H101JDD5D
0 CS1, CS2 CAP, CERM, 51pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1555C1H510JA01D
1 D1 LED SMARTLED GREEN 570NM 0603 603 LG L29K-G2J1-24-Z
1 D2 LED 660NM SUPER RED DIFF 0603SMD 603 SML-LX0603SRW-TR
1 D21 Diode, Zener, 5.6V, 500mW, SOD-123 SOD-123 MMSZ5232B-7-F
0 J1, J2 Header, TH, 100mil, 4x1, Gold plated, 230 mil above TSW-104-07-G-S TSW-104-07-G-S
insulator
1 J3 Connector, USB Type A, 4POS R/A, SMD CONN_USB_04803722 480372200
00
0 J4 Receptacle, 50mil 10x1, R/A, TH CONN_851-43-010-20- 851-43-010-20-001000
001000
0 J5 Header, 50mil, 10x1, R/A, TH CONN_850-80-010-20- 850-80-010-20-001101
001101
1 L1 INDUCTOR POWER 10UH .45A SMD VLS201610E VLS201610ET-100M
1 R5 RES, 33k ohm, 5%, 0.063W, 0402 402 CRCW040233K0JNED
2 R6, R7 RES 1K OHM 1/10W 5% 0402 SMD 402 CRCW040233R0JNED
2 R8, R9 RES, 33 ohm, 5%, 0.063W, 0402 402 CRCW040233R0JNED
2 R10, R11 RES, 4.99k ohm, 1%, 0.063W, 0402 402 CRCW04024K99FKED
1 R20 RES,1M ohm, 5%, 0.063W, 0402 402 RC0402JR-071ML
1 R40 RES 1.5K OHM 1/16W 5% 0402 SMD 402 CRCW04021K50JNED
1 U1 Q Grade 4-Channel Capacitance-to-Digital Converter DGS0010A FDC1004QDGS
for Capacitive Sensing Solutions, DGS0010A
1 U2 4-CHANNEL ESD-PROTECTION ARRAY FOR DRY0006A TPD4E004DRY
HIGH-SPEED DATA INTERFACES, DRY006A
1 U3 Mixed Signal MicroController, RGC0064B RGC0064B MSP430F5528IRGCT
1 U4 Micropower 150 mA Low-Noise Ultra Low-Dropout MF05A_N LP2985AIM5-3.3/NOPB
Regulator, 5-pin SOT-23, Pb-Free
1 Y1 CRYSTAL 24.000MHZ 18PF SMD ABMM ABMM-24.000MHZ-B2-T
9
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Revision History www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
April 2015 * Initial release.
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated

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