Texas Instruments LM61460EVM User manual

User’s Guide
LM61460-Q1 EVM User's Guide
ABSTRACT
The LM61460-Q1 evaluation module (EVM) is designed to help customers evaluate the performance of the
LM61460-Q1 synchronous step-down voltage converter. This EVM implements the LM61460-Q1 in a 14-pin
wettable flanks Hotrod™ package, as shown in Table 1-1. It is capable of delivering 5-V output voltage and up to
6-A load current with exceptional efficiency and output accuracy in a very small solution size. The EVM provides
multiple power connectors and test points. It also provides a good layout example, which is optimized for EMI
and thermal performance.
Table 1-1. Device and Package Configurations
CONVERTER IC PACKAGE
U1 LM61460-Q1 14-pin wettable flanks Hotrod package 4.0 mm × 3.5 mm × 1.0 mm
Figure 1-1. LM61460EVM Front
Figure 1-2. LM61460EVM Angle
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Table of Contents
1 Introduction.............................................................................................................................................................................4
1.1 LM61460 Synchronous Step-Down Voltage Converter......................................................................................................4
1.2 LM61460-Q1 Evaluation Module........................................................................................................................................5
2 Quick Start...............................................................................................................................................................................6
3 Detailed Descriptions............................................................................................................................................................. 7
4 Schematic................................................................................................................................................................................9
4.1 Alternative BOM Configurations.......................................................................................................................................10
5 Board Layout.........................................................................................................................................................................11
6 LM61460EVM Board Test Results....................................................................................................................................... 13
6.1 EMI...................................................................................................................................................................................13
6.2 Board Efficiency............................................................................................................................................................... 14
6.3 Load Regulation............................................................................................................................................................... 16
7 Bill of Materials..................................................................................................................................................................... 18
8 Revision History................................................................................................................................................................... 20
List of Figures
Figure 1-1. LM61460EVM Front.................................................................................................................................................. 1
Figure 1-2. LM61460EVM Angle................................................................................................................................................. 1
Figure 1-1. LM61460-Q1 Pin Configuration (Top View)...............................................................................................................4
Figure 1-2. LM61460-Q1 Schematic............................................................................................................................................4
Figure 2-1. Top View of LM61460-Q1 EVM................................................................................................................................. 6
Figure 4-1. LM61460-AS-400K Rev A EVM Schematic.............................................................................................................. 9
Figure 5-1. Top 3D View.............................................................................................................................................................11
Figure 5-2. Top Layer.................................................................................................................................................................11
Figure 5-3. Signal Layer 1 - Ground Plane................................................................................................................................ 11
Figure 5-4. Signal Layer 2 - Routing.......................................................................................................................................... 11
Figure 5-5. Bottom Layer........................................................................................................................................................... 12
Figure 5-6. Bottom 3D view....................................................................................................................................................... 12
Figure 6-1. Conducted EMI Measurement with CISPR 25 Class 5 Limit Lines (150 kHz to 30 MHz)....................................... 13
Figure 6-2. Conducted EMI Measurement with CISPR 25 Class 5 Limit Lines (30 MHz to 110 MHz)...................................... 13
Figure 6-3. Radiated EMI Measurement with Horizontal Bicon Antenna Under CISPR 25 Class 5 Limits............................... 13
Figure 6-4. Radiated EMI Measurement with Vertical Bicon Antenna Under CISPR 25 Class 5 Limits....................................13
Figure 6-5. Radiated EMI Measurement with Horizontal Log Antenna Under CISPR 25 Class 5 Limits.................................. 14
Figure 6-6. Radiated EMI Measurement with Vertical Log Antenna Under CISPR 25 Class 5 Limits.......................................14
Figure 6-7. Radiated EMI Measurement with Rod Antenna Under CISPR 25 Class 5 Limits................................................... 14
Figure 6-8. FSW = 400 kHz, 5 VOUT, Auto Mode.......................................................................................................................14
Figure 6-9. FSW = 400 kHz, 5 VOUT, FPWM Mode................................................................................................................... 14
Figure 6-10. FSW = 400 kHz, 3.3 VOUT, Auto Mode..................................................................................................................15
Figure 6-11. FSW = 400 kHz, 3.3 VOUT, FPWM Mode.............................................................................................................. 15
Figure 6-12. FSW = 2.2 MHz, 5 VOUT, Auto Mode.................................................................................................................... 15
Figure 6-13. FSW = 2.2 MHz, 5 VOUT, FPWM Mode.................................................................................................................15
Figure 6-14. FSW = 2.2 MHz, 3.3 VOUT, Auto Mode................................................................................................................. 15
Figure 6-15. FSW = 2.2 MHz, 3.3 VOUT, FPWM Mode..............................................................................................................15
Figure 6-16. FSW = 400 kHz, 5 VOUT, Auto Mode.....................................................................................................................16
Figure 6-17. FSW = 400 kHz, 5 VOUT, FPWM Mode................................................................................................................. 16
Figure 6-18. FSW = 400 kHz, 3.3 VOUT, Auto Mode..................................................................................................................16
Figure 6-19. FSW = 400 kHz, 3.3 VOUT, FPWM Mode.............................................................................................................. 16
Figure 6-20. FSW = 2.2 MHz, 5 VOUT, Auto Mode.................................................................................................................... 16
Figure 6-21. FSW = 2.2 MHz, 5 VOUT, FPWM Mode.................................................................................................................16
Figure 6-22. FSW = 2.2 MHz, 3.3 VOUT, Auto Mode................................................................................................................. 17
Figure 6-23. FSW = 2.2 MHz, 3.3 VOUT, FPWM Mode..............................................................................................................17
List of Tables
Table 1-1. Device and Package Configurations...........................................................................................................................1
Table 1-1. EVM Variants.............................................................................................................................................................. 5
Table 4-1. Different BOM Configurations................................................................................................................................... 10
Table 7-1. LM61460EVM-xS-400K Rev A EVM Bill of Materials............................................................................................... 18
Trademarks
Hotrod™ is a trademark of Texas Instruments.
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All trademarks are the property of their respective owners.
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1 Introduction
1.1 LM61460 Synchronous Step-Down Voltage Converter
The LM61460-Q1 device is an easy-to-use synchronous step-down DC/DC converter capable of driving up to
6 A of load current from a supply voltage ranging from 3 V to 36 V. The LM61460-Q1 provides exceptional
efficiency and output accuracy in a very small solution size. The LM61460-Q1 is capable of delivering 6 A of load
current and is peak current limit controlled. The following are additional features that provide both flexible and
easy-to-use solutions for a wide range of applications:
• Adjustable switching frequency
• Synchronization to an external clock
• FPWM variant (LM61460AFS)
• Power-good flag
• Precision enable
Automatic frequency foldback at light load and optional external bias improve efficiency over the entire load
range. The device requires few external components and has a pinout designed for optimal EMI and thermal
performance. Protection features include the following:
• Thermal shutdown
• Input undervoltage lockout
• Cycle-by-cycle current limiting
• Hiccup short-circuit protection
The LM61460-Q1 device is pin-to-pin compatible with the LM61440-Q1 for easy output current scaling.
For a quick reference, Figure 1-1 shows the pin configuration of the LM61460-Q1 and Figure 1-2 shows the
simplified schematic. See the LM61460-Q1 Automotive 3-V to 36-V, 6-A, Low-Noise Synchronous Step-Down
Converter Data Sheet for more detailed feature descriptions and design guide.
3.5 mm
4 mm
BIAS
CBOOT RBOOT
EN/
SYNC
RESET
VIN1 VIN2
PGND1 PGND2
SW
FB
AGND
VCC
RT
Figure 1-1. LM61460-Q1 Pin Configuration (Top
View)
LM61460-Q1
RESET
EN/SYNC
RT
PGND1
AGND
VCC
CBOOT
SW
FB
BIAS
RBOOT
3.0 V to 36 V input
VIN1
PGND2
VIN2
Figure 1-2. LM61460-Q1 Schematic
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1.2 LM61460-Q1 Evaluation Module
The LM61460-Q1 EVM has the board populated with the LM61460 in either one of two variants. Based on the
label populated, you can figure out which device trim is populated on the EVM and the corresponding features.
This board uses the LM61460-Q1 and limiting current to 6 A and comes with auto mode enabled.
Table 1-1. EVM Variants
LABEL U1 IOUT
SWITCHING
FREQUENCY
VIN
RANGE VOUT
AUTO
MODE FPWM SPREAD SPECTRUM
LM61460EVM
-AS-400K
LM61460AAS
QRJRRQ1 6 A 400 kHz 3 to 36 V 5 V Enabled Disabled Enabled
LM61460EVM
-FS-400K
LM61460AFS
QRJRRQ1 6 A 400 kHz 3 to 36 V 5 V Disabled Enabled Enabled
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2 Quick Start
1. Connect the voltage supply between the VIN and GND connectors or between VIN_EMI and GND_EMI to
include the on-board input filter in the input path. Use short and thick gauge wires to minimize inductance
and IR drop. Note that sense points for VIN and VOUT are provided.
2. Connect the load of the converter between VOUT and GND connectors using short and thick wires.
3. Set the supply voltage at an appropriate level between 6 V to 36 V. The 6 V minimum ensures enough head
room for VOUT to equal 5 V at a 6 A load current. Set the current limit of the supply to an appropriate level to
supply needed current and protection.
4. Turn on the power supply. With the default configuration, the EVM powers up and provides VOUT = 5 V.
5. Monitor the output voltage with sense points. The maximum load current must be 6 A with the LM61460-Q1.
Note that the maximum output current may need to derate if ambient temperature is high, especially if device
is operated at higher frequency, for example, 2.2MHz.
See Figure 2-1 for connector locations.
Figure 2-1. Top View of LM61460-Q1 EVM
CAUTION
Caution Hot surface.
Contact may cause burns.
Do not touch.
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3 Detailed Descriptions
This section describes the connectors on the EVM and how to properly connect, set up, and use the EVM. See
Figure 2-1 for a top view of the EVM.
VOUT Output voltage of the converter
VOUT connectors connect to the power inductor and output capacitors. Connect the load between
VOUT connector and the GND connector right next to it to provide load current. Connect the loading
device to the board with short and thick wires to handle the large DC output current.
GND Ground of the converter
The GND is connected to the PGND and AGND pins of the device, as well as the ground of the
input and output capacitors. The GND connections next to VIN, VIN_EMI, and VOUT connectors are
meant for current return path for the supply voltage and load, respectively. Connectors are provided
in pairs to allow easy and accurate sensing of voltages. Connect to supply and load grounds with
short and thick wires. Other GND connectors are for signal measurement and probing.
VIN Input voltage to the converter
The VIN connector connects to the input capacitors and the VIN pins of the LM61460-Q1. Connect
the supply voltage from a power supply or a battery between VIN and GND connectors as power
input to the device. The voltage range must be higher than 3.9 V for the device to start up. VIN
higher than 6 V provides regulated 5 V output voltage. VIN must be no higher than 36 V to avoid
damaging the device. After start-up, the device stays active until VIN drops below 3 V. The current
limit on the supply must be high enough to provide the needed supply current. Otherwise, the supply
voltage does not maintain the desired voltage. The supply voltage must be connected to the board
with short and thick wires to handle the pulsing input current. If long cables are used to power up
the board, damping must be provided by added CFLT3 and RFLT3 to avoid oscillation between the
cable parasitic inductance and the low-ESR ceramic capacitors.
VIN_EMI Input voltage to input filter of the converter
If the input filter is desired between the supply and the LM61460-Q1, connect the supply voltage
between VIN_EMI and GND_EMI. The supply voltage must be connected to the board with short
and thick wires to handle pulsing input current.
The input filter consists of the following: CF1, CF2, CF3, CF4, CF5, CF6, and L2. CD1, CD2, RD1,
and RD2 are provided to allow more options to during filter design. To include the input filter in
the power path, connect the supply voltage between the VIN_EMI and GND_EMI connectors. The
output of the filter is connected to VIN, which is connected to the VIN pins of the LM61460-Q1 and
the input capacitors.
Conducted EMI arises from the normal operation of switching circuits. The ON and OFF actions of
the power switches generate large discontinuous currents. The discontinuous currents are present
at the input side of buck converters. Voltage ripple generated by discontinuous currents can be
conducted to the voltage supply for the buck converter. Without filtering, excessive input voltage
ripple can compromise operation of other circuits connected to this source. The input filter helps
smooth out the voltage perturbations leading to less noise at the power source.
GND_EMI Ground return for the input filter
This is the current return path for the supply connected to VIN_EMI. It provides a short-loop
connection to the input filter capacitors to best filter the conducted noise generated from the PCB.
Use VIN_EMI and GND_EMI connection if input filter is used and conducted EMI test is desired.
CLK For synchronization clock input
The CLK input connector is designed for external clock input to the EN/SYNC pin. Switching action
of the buck is synchronized to the external clock when it is present. The operation mode changes to
forced PWM mode automatically, maintaining a constant switching frequency at light load.
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EN To monitor the EN pin or input EN control signal
This test point is used to monitor the voltage on the device EN pin. By default, the EN pin is
connected to the mid-point of an enable divider. Note that the lower resistor in this divider, RENB, is
not populated.
PG To monitor the PGOOD/RESET pin
The PGOOD flag indicates whether the output voltage is within the regulation band. The PGOOD
pin of the device is an open-drain output and it is pulled up to VOUT on this board through a pullup
resistor. This flag is high impedance when the output voltage is in regulation.
Vinj To aid when making bode plots
There is a low value resistor, Rinj, between VOUT and this node. This feedback divider of the board
is connected to this node as well. Stimulus can be applied between this node and VOUT when
taking measurements for bode plots.
VOUTS Kelvin sensing for VOUT
This connector is provided to allow VOUT to be measured more accurately.
VINS Kelvin sensing for VIN
This connector is provided to allow VIN to be measured more accurately.
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4 Schematic
The bill of materials from EVM Variants is tabulated in Section 7. In addition, Figure 4-1 shows the corresponding
schematic.
Figure 4-1. LM61460-AS-400K Rev A EVM Schematic
Note
Long leads and additional inductance in used to power the DC/DC may cause issues for ideal device
operation. RD2, CD2, RD1, and CD1 are placeholders for damping networks to be populated. For
more information regarding this topic, reference the EMI Filter Components and Their Nonidealities for
Automotive DC/DC Regulators Technical Brief.
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4.1 Alternative BOM Configurations
Table 4-1. Different BOM Configurations
VOUT FREQUENCY RFBB RT COUT CIN + CHF L1
3.3 V 400 kHz 43.2 kΩ 33.2 kΩ 6 x 22 µF 2 x 4.7 µF + 2 x
100 nF
4.7 µH
(XHMI6060)
3.3 V 2100 kHz 43.2 kΩ 6.04 kΩ 3 x 22 µF 2 x 4.7 µF + 2 x
100 nF
1 µH (XEL5030)
5 V 400 kHz 24.9 kΩ 33.2 kΩ 4 x 22 µF 2 x 4.7 µF + 2 x
100 nF
4.7 µH
(XHMI6060)
5 V 2100 kHz 24.9 kΩ 6.04 kΩ 3 x 22 µF 2 x 4.7 µF + 2 x
100 nF
1 µH (XEL5030)
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5 Board Layout
Figure 5-1 through Figure 5-6 show the board layout for the LM61460-Q1 EVM. The EVM offers resistors,
capacitors, and test points to configure the following:
• Output voltage
• Precision enable pin
• Set frequency
• External clock synchronization
The 14-pin Hotrod package offers a very small size and low-noise solution. The PCB consists of a 4-layer
design. There are 2-oz copper planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat
with an array of thermal vias to connect to all four layers.
Test points have been provided for ease of use to connect the power supply and required load, and to monitor
critical signals.
Figure 5-1. Top 3D View Figure 5-2. Top Layer
Figure 5-3. Signal Layer 1 - Ground Plane Figure 5-4. Signal Layer 2 - Routing
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Figure 5-5. Bottom Layer Figure 5-6. Bottom 3D view
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6 LM61460EVM Board Test Results
6.1 EMI
The EMI measurements were taken following CISPR 25, Class 5 standards. The measurements were taken at
13.5 VIN, 5 VOUT with a 6 A load.
Figure 6-1. Conducted EMI Measurement with
CISPR 25 Class 5 Limit Lines (150 kHz to 30 MHz)
Figure 6-2. Conducted EMI Measurement with
CISPR 25 Class 5 Limit Lines (30 MHz to 110 MHz)
Figure 6-3. Radiated EMI Measurement with
Horizontal Bicon Antenna Under CISPR 25 Class
5 Limits
Figure 6-4. Radiated EMI Measurement with
Vertical Bicon Antenna Under CISPR 25 Class 5
Limits
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Figure 6-5. Radiated EMI Measurement with
Horizontal Log Antenna Under CISPR 25 Class 5
Limits
Figure 6-6. Radiated EMI Measurement with
Vertical Log Antenna Under CISPR 25 Class 5
Limits
Figure 6-7. Radiated EMI Measurement with Rod Antenna Under CISPR 25 Class 5 Limits
6.2 Board Efficiency
This section provides efficiency plots for the board with LMQ61460AAS populated for Auto mode efficiency and
LMQ61460AFS populated for FPWM mode efficiency. For 2.1-MHz data, the output stage has to be changed
from the default BOM. The inductor (L1) selected was XEL5030-102MEB.
Load Current (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 0.2 0.5 1 2 3 5 710
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-8. FSW = 400 kHz, 5 VOUT, Auto Mode
Load Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-9. FSW = 400 kHz, 5 VOUT, FPWM Mode
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Output Current (A)
Efficiency (%)
0.001 0.010.02 0.05 0.1 0.2 0.5 1 2 3 45 7 10
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-10. FSW = 400 kHz, 3.3 VOUT, Auto Mode
Output Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-11. FSW = 400 kHz, 3.3 VOUT, FPWM Mode
Load Current (A)
Efficiency (%)
0.001 0.010.02 0.05 0.1 0.2 0.5 1 2 3 45 7 10
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-12. FSW = 2.2 MHz, 5 VOUT, Auto Mode
Load Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-13. FSW = 2.2 MHz, 5 VOUT, FPWM Mode
Output Current (A)
Efficiency (%)
0.001 0.010.02 0.05 0.1 0.2 0.5 1 2 3 45 7 10
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-14. FSW = 2.2 MHz, 3.3 VOUT, Auto Mode
Output Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-15. FSW = 2.2 MHz, 3.3 VOUT, FPWM Mode
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6.3 Load Regulation
This section provides efficiency plots for the board with LM61460AAS populated for Auto mode efficiency and
LM61460AFS populated for FPWM mode efficiency. For 2-MHz data, the output stage has to be changed from
the default BOM. The inductor (L1) selected was XEL5030-102MEB.
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-16. FSW = 400 kHz, 5 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-17. FSW = 400 kHz, 5 VOUT, FPWM Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-18. FSW = 400 kHz, 3.3 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-19. FSW = 400 kHz, 3.3 VOUT, FPWM Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-20. FSW = 2.2 MHz, 5 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-21. FSW = 2.2 MHz, 5 VOUT, FPWM Mode
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Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-22. FSW = 2.2 MHz, 3.3 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-23. FSW = 2.2 MHz, 3.3 VOUT, FPWM Mode
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7 Bill of Materials
The bill of material is shown Table 7-1 for Rev A of the LM61460EVM-AS-400K and LM61460EVM-FS-400K. Note that the BOM difference between the
two EVM variants is the selection of the IC populated (U1).
Table 7-1. LM61460EVM-xS-400K Rev A EVM Bill of Materials
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
C1, C4 2 4.7 µF CAP, CERM, 4.7 µF, 50 V, ±20%, X7R, AEC-
Q200 Grade 1, 1210
1210 UMK325B7475MMHT Taiyo Yuden
C2, C3 2 0.022 µF CAP, CERM, 0.022 µF, 50 V, ±10%, X7R, 0402 0402 GRM155R71H223KA12D MuRata
C5 1 1 µF CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0805 0805 C0805C105K3RACTU Kemet
C6, C7, C8, C9 4 22 µF CAP, CERM, 22 µF, 16 V, ±20%, X7R, AEC-
Q200 Grade 1, 1210
1210 CGA6P1X7R1C226M250
AC
TDK
C12 1 1000 pF CAP, CERM, 1000 pF, 50 V, ±0%, X7R, 0603 0603 C0603C102K5RACTU Kemet
C13 1 0.1 µF CAP, CERM, 0.1 µF, 10 V, ±10%, X7R, 0603 0603 C0603X104K8RACTU Kemet
C15 1 1 µF CAP, CERM, 1 µF, 16 V, ±10%, X7R, 0603 0603 885012206052 Wurth Elektronik
C16 1 22 pF CAP, CERM, 22 pF, 50 V, ±5%, C0G/NP0,
AEC-Q200 Grade 1, 0603
0603 CGA3E2C0G1H220J080
AA
TDK
C17, C18, C19, C20 4 2.2 µF CAP, CERM, 2.2 µF, 50 V, ±10%, X7R, AEC-
Q200 Grade 1, 0805
0805 CGA4J3X7R1H225K125
AB
TDK
C21, C22 2 0.47 µF CAP, CERM, 0.47 µF, 50 V, ±10%, X7R, AEC-
Q200 Grade 1, 0603
0603 CGA3E3X7R1H474K080
AE
TDK
J1, J2, J3 3 Terminal Block, 5 mm, 2x1, Tin, TH Terminal Block, 5 mm,
2x1, TH
691 101 710 002 Wurth Elektronik
J4 1 Header, 100 mil, 3x1, Gold, TH Header, 100 mil, 3x1, TH HTSW-103-07-G-S Samtec
L1 1 4.7 µH Inductor, Shielded, Hyperflux, 4.7 µH, 7.4 A,
0.0143 Ω, SMD
6.65x6.45 mm 74439346047 Wurth Elektronik
L2 1 1.2 µH Shielded Molded Inductor 7.5 A, 11.3
mΩ Max 2-SMD
SMD2 744316220 Wurth Electronics
LBL1 1 PCB Label 0.650 x 0.200
inch
THT-14-423-10 Brady
R1, R6 2 1.00 k RES, 1.00 k, 1%, 0.25 W, 1206 1206 RC1206FR-071KL Yageo America
R2 1 0 RES, 0, 5%, 0.1 W, 0603 0603 RC0603JR-070RL Yageo
R3 1 33.2 k RES, 33.2 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603 CRCW060333K2FKEA Vishay-Dale
R4, R7 2 100 k RES, 100 k, 1%, 0.1 W, 0603 0603 RC0603FR-07100KL Yageo
R5 1 100 RES, 100, 1%, 0.1 W, 0603 0603 RC0603FR-07100RL Yageo
R8 1 24.9 k RES, 24.9 k, 1%, 0.1 W, 0603 0603 RC0603FR-0724K9L Yageo
R9 1 1.00 k RES, 1.00 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF1001V Panasonic
R10 1 255 k RES, 255 k, 1%, 0.1 W, 0603 0603 RC0603FR-07255KL Yageo
Bill of Materials www.ti.com
18 LM61460-Q1 EVM User's Guide SNVU621D – MAY 2019 – REVISED JULY 2021
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Table 7-1. LM61460EVM-xS-400K Rev A EVM Bill of Materials (continued)
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
SH-J1 1 Shunt, 100 mil, Gold plated, Black Shunt 2 pos. 100 mil 881545-2 TE Connectivity
TP1, TP9 2 Test Point, Multipurpose, Red, TH Red Multipurpose
Testpoint
5010 Keystone
TP2, TP3, TP5, TP6 4 Test Point, Multipurpose, Black, TH Black Multipurpose
Testpoint
5011 Keystone
TP4, TP7 2 Test Point, Multipurpose, Orange, TH Orange Multipurpose
Testpoint
5013 Keystone
TP8, TP10 2 Test Point, Multipurpose, White, TH White Multipurpose
Testpoint
5012 Keystone
U1 (changes based on
EVM variant)
1 Automotive 6-A Low Noise Synchronous Buck
Regulators, RJR0014A (VQFN-HR-14)
RJR0014A LM61460AASQRJRRQ1
(LM61460EVM-AS-400K)
or
LM61460AFSQRJRRQ1
(LM61460EVM-FS-400K
Texas Instruments
C10, C11 0 22 µF CAP, CERM, 22 µF, 16 V, ±20%, X7R, AEC-
Q200 Grade 1, 1210
1210 CGA6P1X7R1C226M250
AC
TDK
C14 0 1 µF CAP, CERM, 1 µF, 10 V, ±10%, X7R, 0603 0603 GRM188R71A105KA61D MuRata
C23, C24 0 1 µF CAP, CERM, 1 µF, 50 V, ±10%, X7R, 0603 0603 UMK107AB7105KA-T Taiyo Yuden
FID1, FID2, FID3, FID4,
FID5, FID6
0 Fiducial mark. There is nothing to buy or
mount.
N/A N/A N/A
R11, R12 0 0.51 RES, 0.51, 1%, 0.25 W, 0805 0805 CRM0805-FX-R510ELF Bourns
R13 0 100 k RES, 100 k, 1%, 0.1 W, 0603 0603 RC0603FR-07100KL Yageo
www.ti.com Bill of Materials
SNVU621D – MAY 2019 – REVISED JULY 2021
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LM61460-Q1 EVM User's Guide 19
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8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (December 2019) to Revision D (July 2021) Page
• Updated the numbering format for tables, figures, and cross-references throughout the document. ................6
• Added R11 to Section 7 ................................................................................................................................... 18
Changes from Revision B (November 2019) to Revision C (December 2019) Page
• Added plots to Section 6.1 ...............................................................................................................................13
• Added Section 6.2 ........................................................................................................................................... 14
• Added Section 6.3 ........................................................................................................................................... 16
Revision History www.ti.com
20 LM61460-Q1 EVM User's Guide SNVU621D – MAY 2019 – REVISED JULY 2021
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