Texas Instruments TMUX9832BGAEVM User manual

User's Guide
TMUX9832BGAEVM User's Guide
ABSTRACT
This document is the EVM user’s guide for the TMUX9832BGAEVM, which provides a quick way to evaluate TI’s
TMUX9832 multiplexer device in the ZEH (BGA) package.
Table of Contents
1 Introduction.............................................................................................................................................................................3
2 General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines...............................5
3 Information About Cautions and Warnings..........................................................................................................................6
4 Features...................................................................................................................................................................................6
5 TMUX9832BGAEVM GUI Software Installation.................................................................................................................... 6
5.1 GUI Software Installation................................................................................................................................................... 6
5.2 GUI Software Quick Start...................................................................................................................................................8
6 TMUX9832BGAEVM Setup Procedure.................................................................................................................................. 9
7 TMUX9832BGAEVM Feature Descriptions......................................................................................................................... 10
7.1 SET and CLR Pin Operation............................................................................................................................................ 10
7.2 SPI_MODE and DIN_SEL Operation...............................................................................................................................10
7.3 TX7516 Pulser Interface Headers.................................................................................................................................... 11
7.4 External SPI and LVDS.................................................................................................................................................... 11
7.5 Thermal Shutdown........................................................................................................................................................... 13
7.6 Daisy Chain Operation..................................................................................................................................................... 14
7.7 Channel Loading Options.................................................................................................................................................14
8 Connection Descriptions..................................................................................................................................................... 16
9 Schematic..............................................................................................................................................................................17
10 Bill of Materials................................................................................................................................................................... 19
11 Revision History..................................................................................................................................................................23
List of Figures
Figure 1-1. TMUX9832BGAEVM (Top View)...............................................................................................................................3
Figure 1-2. TMUX9832BGAEVM (Bottom View)......................................................................................................................... 4
Figure 1-3. TMUX9832BGAEVM Functional Block Diagram.......................................................................................................4
Figure 5-1. Download Icon for TMUXHV-EVM GUI..................................................................................................................... 7
Figure 5-2. TMUXHV-EVM GUI Home Tab..................................................................................................................................8
Figure 5-3. TMUXHV-EVM GUI................................................................................................................................................... 8
Figure 7-1. CLR and SET TMUXHV-EVM GUI Buttons.............................................................................................................10
Figure 7-2. SPI_MODE and DIN_SEL Select Headers............................................................................................................. 10
Figure 7-3. Pulser Interface Headers.........................................................................................................................................11
Figure 7-4. SPI Headers............................................................................................................................................................ 11
Figure 7-5. LVDS Resistors....................................................................................................................................................... 12
Figure 7-6. Thermal Shutdown Indicator................................................................................................................................... 13
Figure 7-7. Daisy Chain Headers.............................................................................................................................................. 14
Figure 7-8. Resistor and Capacitor Loading Footprints............................................................................................................. 15
Figure 9-1. TMUX9832BGAEVM Schematic............................................................................................................................. 17
Figure 9-2. TMUX9832BGAEVM Schematic............................................................................................................................. 18
List of Tables
Table 6-1. Terminals, Rails, and Power Supplies.........................................................................................................................9
Table 10-1. Bill of Materials........................................................................................................................................................19
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TMUX9832BGAEVM User's Guide 1
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Trademarks
USB™ is a trademark of USB Implementers Forum.
Texas Instruments™ is a trademark of Texas Instruments.
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All trademarks are the property of their respective owners.
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1 Introduction
This user's guide describes the TMUX9832BGAEVM evaluation module (EVM) and the intended use. This
board allows for the quick prototyping and evaluation of TI’s TMUX9832ZEH multiplexer. The TMUX9832 is
a 32-channel low harmonic distortion, low resistance, low capacitance, high-voltage, analog switch integrated
circuit (IC) with latch-up immunity. Each device has 32 independently selectable 1:1, single-pole, single-throw
(SPST) switch channels. The device only requires a +5 V analog supply, while still being able to support ±110 V
analog signals. TMUX9832 also integrates bleed resistors on the drain (Dx) pins to discharge capacitive loads,
like piezoelectric transducers.
TMUX9832 is an excellent choice for medical ultrasound imaging and other piezoelectric transducer driver
applications. TMUX9832 integrates cascadable 32-bit shift register with latches for controlling each of the 32
switches. The daisy chain capability allows for many TMUX9832 devices to be controlled without requiring a
separate chip-select for every device. To reduce noise in the signal path, due to potential clock feed-through, the
active low latch enable can be held high while data is loaded into the shift registers. Figure 1-1 and Figure 1-2
resembles the received EVM, and the TMUX9832BGAEVM kit contains the items that follow:
1. TMUX9832BGAEVM
2. 1 mini-USB™ cable
Figure 1-1. TMUX9832BGAEVM (Top View)
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Figure 1-2. TMUX9832BGAEVM (Bottom View)
Isolator
Power Terminal
Block
I/O
I/O
Daisy Chain
Outputs
Digital Controls
SPI
SPI Controller
TMUX9832
USB
Figure 1-3. TMUX9832BGAEVM Functional Block Diagram
Introduction www.ti.com
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2 General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety
Guidelines
WARNING
Always follow TI’s setup and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help
ensure your personal safety and those working around you. Contact TI's Product Information Center http://
support/ti./com for further information.
Save all warnings and instructions for future reference.
WARNING
Failure to follow warnings and instructions may result in personal injury, property damage, or death
due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic product typically provided as an open framed, unenclosed printed
circuit board assembly. It is intended strictly for use in development laboratory environments, solely for qualified
professional users having training, expertise, and knowledge of electrical safety risks in development and
application of high voltage electrical circuits. Any other use or application are strictly prohibited by Texas
Instruments™. Unqualified professionals should immediately stop using the HV EVM.
1. Work Area Safety
a. Keep work area clean and orderly.
b. One or more qualified observers must be present anytime circuits are energized.
c. Effective barriers and signage indicating operation of accessible high voltages must be present in the
area where the TI HV EVM and its interface electronics are energized for the purpose of protecting
inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes, and other related
apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located
within a protected Emergency Power Off EPO protected power strip.
e. Use a stable and nonconductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. Do not test
the EVM freehand whenever possible.
2. Electrical Safety
As a precautionary measure, it is always a good engineering practice to assume that the entire EVM may
have fully accessible and active high voltages.
a. De-energize the TI HV EVM and all its inputs, outputs, and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-
energized.
b. With the EVM confirmed de-energized, proceed with the required electrical circuit configurations, wiring,
measurement equipment connection, and other application needs, while still assuming the EVM circuit
and measuring instruments are electrically live.
c. After the EVM is completely ready, energize the EVM as intended.
WARNING
While the EVM is energized, never touch the EVM or its electrical circuits, as they could be at
high voltages capable of causing electrical shock hazard.
3. Personal Safety
a. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields) or
protect the EVM in an adequate lucent plastic box with interlocks to protect it from being accidentally
touched.
Limitation for safe use:
www.ti.com General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines
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Do not use the EVMs as all or part of a production unit.
3 Information About Cautions and Warnings
The information in the warning statement is provided for personal protection and the information in the caution
statement is provided to protect the equipment from damage. Read each caution and warning statement
carefully.
CAUTION
This EVM contains components that can potentially be damaged by electrostatic discharge. Always
transport and store the EVM in the supplied ESD bag when not in use. Handle the EVM with an
antistatic wristband. Operate the EVM on an antistatic work surface. For more information on proper
handling, see Electrostatic Discharge (ESD).
4 Features
The TMUX9832BGAEVM has the following features:
• Integrated SPI controller hardware and GUI for communications with TMUX9832ZEH
• Direct docking headers for easy TX7516 pulser integration
• Power supply terminals for VDD, VLL, and GND with populated decoupling capacitors near the input supply
terminal and device
• Header pins for monitoring all source, drain, and digital control pins
• Selectable SPI_MODE and DIN_SEL headers to control operating mode of TMUX9832ZEH
• Daisy chain headers for easy connections to external boards
• Thermal shutdown monitoring circuit with LED signal
• Test points for VDD, VLL, and GND pins
• SMA footprints for option to install SMA connector on designated source and drain pins
• Probe tip holders for designated source and drain pins
• Resistor and capacitor loading footprints on back of board for customizable load conditions for every source
and drain pin
5 TMUX9832BGAEVM GUI Software Installation
5.1 GUI Software Installation
1. Software Download – live software from dev.ti.com. The live software currently works on Chrome™,
Firefox™, and Safari™ browsers. Internet Explorer is not supported. Users can access the live version
through the link a Texas Instruments representative provides.
2. Click on the application icon within the gallery to launch the software. Click on the prompt to install the TI
Cloud Agent Bridge browser plugin.
3. Offline Software – users can access the latest version of the offline software by navigating to the live version
as noted previously. Look for the download icon and download both the application and runtime for the
operating system as shown in the following figure:
Information About Cautions and Warnings www.ti.com
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Figure 5-1. Download Icon for TMUXHV-EVM GUI
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5.2 GUI Software Quick Start
1. Home Tab
a. The Home Tab displays when launching the hardware software. Select the appropriate EVM GUI
from the drop-down list that appears here. Press connect after selecting the desired device for proper
functionality.
b. The Home tab also contains the shortcut icon to the GUI in the Quick Start page.
Figure 5-2. TMUXHV-EVM GUI Home Tab
1. GUI Control Panel
a. The GUI provides control over the following pins and functionality:
i. DIN – the 32 bits [D0:D31] are used to push data into the devices DIN pin. The ‘WRITE’ button
initializes the actual pushing of the bits starting with bit D31 as MSB.
ii. CLR – the CLR button toggles the CLR GPIO input to the CLR pin on the device. The indicator light
is lit for a ‘high’ state and dimmed for ‘low’ state. The effects of this functionality can be found in the
data sheet.
iii. SET – the SET button toggles the SET GPIO input to the SET pin on the device. The indicator light
is lit for a ‘high’ state and dimmed for ‘low’ state. The effects of this functionality can be found in the
data sheet.
Figure 5-3. TMUXHV-EVM GUI
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6 TMUX9832BGAEVM Setup Procedure
To properly operate the TMUX9832BGAEVM, complete the steps that follow:
1. Download and install the GUI software as described in the previous section.
2. Connect the following jumpers to make sure the TMUX9832 operates as desired:
a. SPI_MODE jumper on J11 to VLL or GND
b. DIN_SEL jumper on J12 to VLL or GND
c. THERM jumper on J13 to enable Thermal Shutdown LED (do not connect if using in daisy chain mode)
d. If using the on-board SPI, then install jumpers on J14-J20 to enable this functionality. Otherwise, leave
the jumpers uninstalled if providing communications externally.
3. Connect all necessary power supplies to the designated power terminal block (J21) inputs and power up the
supplies according to the order in the table that follows:
Table 6-1. Terminals, Rails, and Power Supplies
Terminal Rail Voltage Current Limit
J21-2/J21-3 GND 0V —
J21-1 VDD 5V 10mA
J21-4 VLL 5V 50mA
Note
VLL has a higher current limit because VLL is used to power several other components on the
EVM. Not indicative of typical VLL quiescent current for TMUX9832.
Powering up or down the TMUX9832BGAEVM in an arbitrary sequence can cause damage to the
device.
4. Connect the mini-USB between the PC and TMUX9832BGAEVM connector J23 to power up the SPI
communication block. The green LED (D1) next to J23 illuminates indicating that power is good.
5. Initialize the TMUXHV-EVM GUI by opening up the GUI weblink, and select the proper device from the
drop-down menu, press connect, and make sure that there is a Hardware Connected prompt at the bottom
left side of the GUI. Then click the Quick Start icon to navigate into the GUI.
6. Connect the desired inputs to the source and drain pins and solder on the necessary resistors and
capacitors for test loading (R/C footprints located on the backside of the board for each I/O).
7. Use the TMUXHV-EVM GUI to select and turn on or off the required channels and proceed with evaluating
the TMUX9832ZEH.
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7 TMUX9832BGAEVM Feature Descriptions
7.1 SET and CLR Pin Operation
The SET and CLR pins are useful control logic pins which help select all of the channels to be toggled on or off.
By utilizing the buttons located in the GUI, the user can easily enable all the channels by having the SET pin in
a high state. Conversely, the user can also disable all of the channels by having the CLR asserted. Note that the
CLR signal overrides all other signals. Meaning that the CLR pin takes priority (turning off all of the channels) if
both the CLR and SET pins are asserted.
Figure 7-1. CLR and SET TMUXHV-EVM GUI Buttons
7.2 SPI_MODE and DIN_SEL Operation
The user can configure the TMUX9832ZEH device in a few different ways.
1) The SPI_MODE pin can be utilized to enable single-ended or LVDS SPI mode. When tied to VLL (high),
this allows the TMXU9832ZEH to operate in LVDS SPI mode. When SPI_MODE is tied to GND (low), the
TMUX9832ZEH operates in single-ended SPI mode. The SPI_MODE pin must be asserted high or low prior to
power up as the pin is not configurable after boot-up.
2) The DIN_SEL pin allows the user to configure how the device reads as logic 1 or logic 0. When the DIN_SEL
pin is shorted to GND (low), DIN operates with logic 0 as switch OFF and logic switch ON. When the DIN_SEL
pin is shorted to VLL (high), DIN operates as NDIN, where logic 0 corresponds to switch ON and logic 1
corresponds to switch OFF. The DIN_SEL pin state must not be toggled during any SPI transmission.
Figure 7-2. SPI_MODE and DIN_SEL Select Headers
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7.3 TX7516 Pulser Interface Headers
The TMUX9832BGAEVM allows for easy integration with TI's TX7516 pulser EVM. The J22 header pins are
routed for and fit right into the TX7516 EVM output terminal block for a seamless integration. This helps
eliminate extra parasitic elements that can often be introduced by external wiring and enable a clean and
optimized interface between the two components.
Figure 7-3. Pulser Interface Headers
7.4 External SPI and LVDS
The TMUX9832BGAEVM enables the user to configure the board for use with the integrated SPI controller and
GUI, or to provide an external SPI/LVDS communications setup. To provide an external communications setup,
the user must leave the J14-J20 jumpers uninstalled to prevent unintended operation of the EVM. Next, the
user can then connect their interface to the header pins provided by the J9 block that will communicate with the
TMUX9832.
Figure 7-4. SPI Headers
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This EVM also allows the user to configure the TMUX9832 device for LVDS communications. Setting up the
TMUX9832 device for LVDS communications follows similar instructions as mentioned previously, but there are
additional LVDS component footprints located on the reverse side of the board for the user to install resistors for
an LVDS setup.
Figure 7-5. LVDS Resistors
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7.5 Thermal Shutdown
The TMUX9832ZEH offers a thermal shutdown safety feature to make sure the device does not continue
to operate once internal temperatures exceed the thermal shutdown temperature defined in the data sheet.
When the TMUX9832ZEH enters thermal shutdown, the /THERM pin asserts low and all switches is disabled.
The TMUX9832BGAEVM implements an easy to identify thermal shutdown indicator circuit in which an LED
illuminates if the device enters this condition (only if the J13 header is placed on the EVM). Once the device exits
the thermal shutdown state, the LED turns off, the switches assumes the appropriate state based on the current
digital input conditions, and the /THERM pin goes into a high impedance state.
Figure 7-6. Thermal Shutdown Indicator
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7.6 Daisy Chain Operation
The TMUX9832ZEH enables daisy chaining multiple devices together due to the LE_OUT, CLK_OUT and DOUT
pins. The J10 header (located on the upper right side of the board), allows the user easy access to these pins to
feed into a subsequent system for daisy chaining.
Figure 7-7. Daisy Chain Headers
7.7 Channel Loading Options
The TMUX9832BGAEVM features resistor and capacitor footprints (located on the backside of the board) to let
the user install their own RC loads to evaluate the TMUX9832ZEH. Each input and output have a set of RC load
footprints for maximum flexibility of the loading setup.
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Figure 7-8. Resistor and Capacitor Loading Footprints
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8 Connection Descriptions
Designator Description
J1 Header pins for D0-D15
J2 Header pins for S8-S23
J3 Header pins for D16-D31
J4 Header pins for S0-S7 and S24-S31
J5 Probe tip holder for D0
J6 Probe tip holder for S0
J7 SMA connector for S31
J8 SMA connector for D31
J9 SPI/LVDS header pins
J10 Daisy chain headers
J11 SPI_MODE select headers
J12 DIN_SEL select headers
J13 Thermal shutdown monitor shunt
J14 SPI Shunt - DIN_P
J15 SPI Shunt - CLK_P
J16 SPI Shunt - SET
J17 SPI Shunt - CLR
J18 SPI Shunt - DOUT
J19 SPI Shunt - LE_P
J20 SPI Shunt - VLL
J21 Power terminal block
J22 Direct dock TX7516 pulser headers
J23 USB-mini connector
TP1 VDD test point
TP2 GND test point
TP3 GND test point
TP4 VLL test point
TP5 THERM test point
TP6-TP8 GND test points
C1-C8 Supply decoupling capacitors
DT1 Thermal shutdown indicator LED
D1 Communications power-good LED
RS0-RS31 Load resistor footprints (S-pins)
RD0-RD31 Load resistor footprints (D-pins)
CS0-CS31 Load capacitor footprints (S-pins)
CD0-CD31 Load capacitor footprints (D-pins)
Connection Descriptions www.ti.com
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9 Schematic
Figure 9-1. TMUX9832BGAEVM Schematic
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Figure 9-2. TMUX9832BGAEVM Schematic
Schematic www.ti.com
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10 Bill of Materials
Table 10-1. Bill of Materials
Designator Quantity Value Description Package Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board TMUX9832BGAEVM Any
C1, C4 2 1µF Multilayer Ceramic Capacitors 1µF ±10% 250V
X7T SMD 1812 1812 C4532X7T2E105K250KA TDK
C6, C8 2 0.1µF CAP, CERM, 0.1µF, 250V, ± 10%, X7R, 1206 1206 GRM31CR72E104KW03L MuRata
C9, C10, C13, C14 4 0.1µF CAP, CERM, 0.1µF, 16V, ± 10%, X7R, 0402 402 GRM155R71C104KA88D MuRata
C11 1 22µF CAP, AL, 22µF, 10V, ± 20%, 1.35 ohm, AEC-
Q200 Grade 2, SMD SMT Radial B EEE-FK1A220R Panasonic
C12 1 1µF CAP, CERM, 1µF, 16V, ± 10%, X7R, 0805 805 C0805C105K4RACTU Kemet
C15 1 2.2µF CAP, CERM, 2.2µF, 10V, ± 10%, X7R, 0805 805 LMK212B7225KG-T Taiyo Yuden
C16 1 0.47µF CAP, CERM, 0.47µF, 16V, ± 10%, X5R, 0603 603 GRM188R61C474KA93D MuRata
C17 1 2200pF CAP, CERM, 2200pF, 50V, ± 10%, X7R, 0603 603 C0603C222K5RACTU Kemet
C18, C19 2 30pF CAP, CERM, 30pF, 50V, ± 5%, C0G/NP0, 0603 603 GRM1885C1H300JA01D MuRata
C20, C21 2 220pF CAP, CERM, 220pF, 50V, ± 10%, X7R, 0603 603 C0603C221K5RACTU Kemet
D1 1 Green LED, Green, SMD 7x4mm SSF-LXH305GD-TR Lumex
D3 1 7.5V Diode, Zener, 7.5V, 550mW, SMB SMB 1SMB5922BT3G ON Semiconductor
DT1 1 Red LED, Red, SMD Body1.6x0.8mm APTD1608LSECK/J3-PF Kingbright
FB1 1 Signal Line Ferrite Bead 60Ω at 100MHz
800mA DCR 100mΩ SMD 0603 603 MMZ1608R600ATA00 TDK
H1, H3, H5, H7 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone
H2, H4, H6, H8 4 Machine Screw, Round, #4-40 x 1/4, Nylon,
Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply
J1, J2, J3, J4, J9 5 Header, 100mil, 8x2, Gold, TH 8x2 Header TSW-108-07-G-D Samtec
J5, J6 2 Compact Probe Tip Circuit Board Test Points,
TH, 25 per TH Scope Probe 131-5031-00 Tektronix
J10, J11, J12 3 Header, 2.54mm, 3x1, Gold, TH Header, 2.54mm, 3x1, TH TSW-103-08-G-S Samtec
J13, J14, J15, J16,
J17, J18, J19, J20 8 Header, 2.54mm, 2x1, Tin, TH Header, 2.54mm, 2x1, TH TSW-102-23-T-S Samtec
J21 1 Terminal Block, 100mil, 4X1 TH 10.62x10x6.5 mm 282834-4 TE Connectivity
J22 1 Header, 100mil, 16x2, Gold, TH 16x2 Header TSW-116-07-G-D Samtec
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Table 10-1. Bill of Materials (continued)
Designator Quantity Value Description Package Reference Part Number Manufacturer
J23 1 Connector, Receptacle, Mini-USB Type B, R/A,
Top Mount SMT USB Mini Type B 1734035-2 TE Connectivity
J24, J25, J26, J27,
J28, J29, J30, J31,
J32, J33
10 2 (1 x 2) Position Shunt Connector Red Open
Top, Grip 0.100" (2.54mm) Gold CONN_SHUNT-2POS 2-881545-2 TE
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x
0.200" H - 10,000 per roll
PCB Label 0.650 x 0.200
inch THT-14-423-10 Brady
Q1 1 50V MOSFET, N-CH, 50V, 0.22A, SOT-23 SOT-23 BSS138 Fairchild Semiconductor
R1, R4 2 33k RES, 33 k, 5%, 0.063 W, AEC-Q200 Grade 0,
0402 402 CRCW040233K0JNED Vishay-Dale
R2, R3 2 33 RES, 33.0, 1%, 0.1 W, 0402 402 ERJ-2RKF33R0X Panasonic
R5 1 200 RES, 200, 5%, 0.1 W, AEC-Q200 Grade 0,
0603 603 CRCW0603200RJNEA Vishay-Dale
R6 1 1.50k RES, 1.50 k, 1%, 0.063 W, AEC-Q200 Grade
0, 0402 402 CRCW04021K50FKED Vishay-Dale
R7 1 1.2Meg RES, 1.2M, 5%, 0.063W, AEC-Q200 Grade 0,
0402 402 CRCW04021M20JNED Vishay-Dale
RT1 1 200 RES, 200, 1%, 0.25 W, AEC-Q200 Grade 0,
1206 1206 CRCW1206200RFKEA Vishay-Dale
S1 1 Switch, Tactile, SPST-NO, 0.05A, 12V , SMD 3.5x3.55mm EVQ-P7A01P Panasonic
TP1, TP5 2 Test Point, Multipurpose, Red, TH Red Multipurpose
Testpoint 5010 Keystone
TP2, TP6, TP7, TP8,
TP9 5 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone
TP3 1 Test Point, Multipurpose, Green, TH Green Multipurpose
Testpoint 5126 Keystone
TP4 1 Test Point, Multipurpose, Yellow, TH Yellow Multipurpose
Testpoint 5014 Keystone
U1 1 5V Supply, 220V High Voltage 1:1, 32-Channel
Switch with Latch-Up Immunity NFBGA83 TMUX9832ZEH Texas Instruments
U2 1
High Speed, Robust EMC, Reinforced
Six-Channel Digital Isolator, DBQ0016A
(SSOP-16)
DBQ0016A ISO7761DBQR Texas Instruments
Schematic www.ti.com
20 TMUX9832BGAEVM User's Guide SCDU031B – JULY 2022 – REVISED FEBRUARY 2024
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