Texas Instruments TI CC3000 User manual

TI CC3000 Evaluation Module
User's Guide
Literature Number: SWRU326
November 2012

Contents
Preface ....................................................................................................................................... 4
1 Introduction ........................................................................................................................ 5
2 CC3000 EM Board ............................................................................................................... 6
2.1 EM Board Top View ........................................................................................................ 6
2.2 EM Board Bottom View .................................................................................................... 9
2.3 Antenna ..................................................................................................................... 10
2.4 Hardware Setup ........................................................................................................... 13
2.5 Schematics ................................................................................................................. 14
2.6 Bill of Materials (BOM) .................................................................................................... 15
3 Layout Guidelines ............................................................................................................. 16
4 Application Development ................................................................................................... 21
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List of Figures
2-1. CC3000 EM Board Top View.............................................................................................. 6
2-2. CC3000 EM Board Bottom View.......................................................................................... 9
2-3. Antenna Location and RF Trace Routing .............................................................................. 10
2-4. Matching Circuit Between the Antenna and the CC3000 EM Board ............................................... 11
2-5. Return Loss from the ACX Antenna and Matching Circuit........................................................... 11
2-6. Antenna Radiation Patterns.............................................................................................. 12
2-7. Host PCB Mating Connector Arrangement ............................................................................ 13
2-8. Schematics of the CC3000 EM Board.................................................................................. 14
3-1. Module Layout Guidelines................................................................................................ 16
3-2. Module Layout Guidelines................................................................................................ 17
3-3. Trace Design for the PCB Layout ....................................................................................... 18
3-4. Layer 1 Combined With Layer 2......................................................................................... 18
3-5. Antenna and RF Trace Routing Layout Guidelines................................................................... 19
3-6. Power Supply Routing of the CC3000 EM Board..................................................................... 20
4-1. MSP-EXP430FR5739 Test Platform and CC3000 EM Board....................................................... 21
List of Tables
2-1. Key Parts of CC3000 EM Board Top View.............................................................................. 7
2-2. J2 Configuration of the CC3000 EM Board.............................................................................. 7
2-3. Header J4 of the CC3000 EM Board Top View......................................................................... 7
2-4. Header J5 of the CC3000 EM Board Top View......................................................................... 8
2-5. Header J6 of CC3000 EM Board Bottom View ......................................................................... 9
2-6. J7 of CC3000 EM Board Bottom View................................................................................... 9
2-7. BOM for the TI CC3000 EM Board...................................................................................... 15
3-1. Module Layout Guidelines................................................................................................ 17
3-2. Trace Design Measurement Values .................................................................................... 18
3-3. Antenna and RF Trace Routing Layout Guidelines................................................................... 19
3
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Preface
SWRU326–November 2012
Read This First
About This Manual
This user guide describes how to use the TI CC3000 evaluation module (EM) board to evaluate the
performance of the TI CC3000 module.
Related Documentation From Texas Instruments
•TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor Data Sheet (SWRS126)
• CC3000 Wiki for MCU: http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU
If You Need Assistance
The primary sources of CC3000 information are the device-specific data sheets and user’s guides. For the
most up-to-date version of the user’s guide and data sheets, go to http://www.ti.com/product/cc3000.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required
to take whatever measures may be required to correct this interference.
4Read This First SWRU326–November 2012
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Chapter 1
SWRU326–November 2012
Introduction
This user guide describes how to use the TI CC3000 evaluation module (EM) board to evaluate the
performance and functionality of the TI CC3000 module. The CC3000 module is a self-contained Wi-Fi®
solution that enables internet connectivity for a wide variety of microcontroller (MCU) systems. The
SimpleLink Wi-Fi from TI minimizes the host MCU software requirements, making it ideal for low-power
and low-cost applications. The CC3000 EM board is targeted for TI MCUs, such as the MSP430-FR5739
and other various host platforms. This document details the key parts and features of the CC3000 EM
board and the different options available to the user. This document includes layout guidelines to assist
the designer in PCB development.
SimpleLink is a trademark of Texas Instruments.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
5
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Chapter 2
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CC3000 EM Board
This section describes the key parts and features of the CC3000 EM board top and bottom views.
2.1 EM Board Top View
Figure 2-1 shows the key parts and jumpers mounted on the top of the CC3000 EM board. Table 2-1
describes the key parts of the EM board. Table 2-2 describes the J2 configuration of the CC3000 EM
board. Table 2-3 and Table 2-4 describe the J4 and J5 signals, respectively.
Figure 2-1. CC3000 EM Board Top View
6CC3000 EM Board SWRU326–November 2012
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www.ti.com EM Board Top View
Table 2-1. Key Parts of CC3000 EM Board Top View
Key Parts Descriptions
CC3000MOD Core module for performance evaluation (for more information, see the CC3000
module data sheet).
Antenna Can be used for radiated testing by reworking the capacitor to correct pads
J1 U.FL RF connector used for conductive RF test
J2 Used to switch between test mode and operation mode. When pins 2 and 3 are
shorted, J2 runs in operation mode. When pins 1 and 2 are shorted, J2 runs in test
mode.
J3 Used to test power consumption. The pins of the jumper are shorted in operation
mode. For power testing, the jumper is removed and an ammeter bridges the pins.
J4 Through-hole test points (For more information, see Table 2-3.)
J5 Through-hole test points (For more information, see Table 2-4.)
Table 2-2. J2 Configuration of the CC3000 EM Board
Mode Description
Test mode: CC3000 radio tool(1) Connect pins 1 and 2. Test mode is used with the CC3000 radio tool for operating,
testing, and calibrating the CC3000 chip-set designs during development. This tool
uses the RS232/UART pins to run radio frequency (RF) RX and TX tests on the
CC3000 module. For more information, see the CC3000 wiki.
Functional mode: Normal mode Connect pins 2 and 3. Normal mode is for regular functionality between the host
platform and the CC3000 module.
(1) For more information about test software for the PC, go to the CC3000 wiki at
http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU.
Table 2-3. Header J4 of the CC3000 EM Board Top View
J4 Pin Pin Name Pin Type Descriptions
1 GND – Ground
2 Reserved – Reserved
3 Reserved – Reserved
4 Reserved – Reserved
5 WL_RS232_TX Output RS232 transmit output; used for the radio tool serial
interface in test mode. Leave floating in functional mode.
6 WL_RS232_RX Input RS232 receive output; used for the radio tool serial
interface in test mode. Leave floating in functional mode.
7 GND – Ground
8 WL_SPI_CS Input Host interface SPI chip select
9 WL_SPI_DOUT Output Host interface SPI data output
10 WL_SPI_IRQ Output Host interface SPI interrupt request
11 WL_SPI_DIN Input Host interface SPI data input
12 WL_SPI_CLK Input Host interface SPI clock input
7
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EM Board Top View www.ti.com
Table 2-4. Header J5 of the CC3000 EM Board Top View
J5 Pin Pin Name Pin Type Descriptions
1 SCL_CC3000(1) Output I2C clock signal output from the CC3000 module. This
pin is connected to SCL_EEPROM through a 0-Ω
resistor and is not used by end users.
2 SCL_EEPROM(1) Input I2C clock signal input from EEPROM inside the CC3000
module. This pin is connected to SCL_CC3000 using a
0-Ωresistor and is not used by end users.
3 SDA_CC3000(1) Input/Output I2C data signal from the CC3000 module. This pin is
connected to SDA_EEPROM using a 0-Ωresister and is
not used by end users.
4 SDA_EEPROM(1) Input/Output I2C data signal from EEPROM inside the CC3000
module. This pin is connected to the SDA_CC3000
device using a 0-Ωresistor and is not used by end users.
5 VBAT_SW_EN Input Active-high enables the signal from the host device.
6 GND – Ground
7 GND – Ground
8 VIO_HOST Power In VIO power supply from the host to the module. For the
MSP430 host platform, VIO_HOST = VBAT_IN. For other
platforms that have different voltage levels from battery
voltages, R14 can be removed.
9 VBAT_IN Power In Battery voltage input to module. For the MSP430 host
platform, VIO_HOST = VBAT_IN. For other platforms
that have different voltage levels from the battery
voltages, R14 can be removed.
10 GND – Ground
11 Reserved – Reserved
(1) The EM board arrives with EEPROM preprogrammed.
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www.ti.com EM Board Bottom View
2.2 EM Board Bottom View
The two EM board mating connectors J6 and J7 connect to the host platform and are mounted on the
bottom of the EM board, as shown in Figure 2-2.Table 2-5 and Table 2-6 describe the signals brought out
from these two EM mating connectors.
Figure 2-2. CC3000 EM Board Bottom View
Table 2-5. Header J6 of CC3000 EM Board Bottom View
J6 Pin Pin Name Module Pin Type Description
1 GND – Ground
5 Reserved – Reserved
10 VBAT_SW_EN Input Active-high enable signal from the host device
12 WL_SPI_IRQ Output Host interface SPI interrupt request
14 WL_SPI_CS Input Host interface SPI CS
16 WL_SPI_CLK Input Host interface SPI clock input
18 WL_SPI_DIN Input Host Interface SPI data input
19 GND – Ground
20 WL_SPI_DOUT Output Host interface SPI data output
Table 2-6. J7 of CC3000 EM Board Bottom View
J7 Pin Pin Name Module Pin Type Description
2 GND – Ground
7 VBAT_IN Power In Battery voltage input to the module
9 VBAT_IN Power In Battery voltage input to the module
15 Reserved – Reserved
9
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Antenna www.ti.com
2.3 Antenna
The ACX ceramic antenna is mounted on the EM board with a specific layout and matching circuit for the
radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX
ceramic antenna on the EM board and the RF trace routing from the CC3000 module to the antenna.
Figure 2-4 shows the matching circuit between the antenna and the EM board. The return loss is based
on the matching circuit and RF trace routing, as shown in Figure 2-5.Figure 2-6 shows the radiation
patterns on XY, XZ, and YZ planes.
Figure 2-3. Antenna Location and RF Trace Routing
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AT8010-E2R9HAA
2.2 pF
2.2 nH
SWRU326-004
www.ti.com Antenna
Figure 2-4. Matching Circuit Between the Antenna and the CC3000 EM Board
Figure 2-5. Return Loss from the ACX Antenna and Matching Circuit
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YZ plane
XY plane
XZ plane
Unit : dBi
XY plane
Peak gain Avg. gain
0.3 –2.6
XZ plane
Peak gain Avg. gain
1.3 –4.2
YZ plane
Peak gain Avg. gain
0.9 –0.9
Antenna www.ti.com
Figure 2-6. Antenna Radiation Patterns
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1.2 inches
J2 J1
20 19
1
2
20 19
1
2
SWRU326-007
www.ti.com Hardware Setup
2.4 Hardware Setup
Before conducting performance tests, the EM board must be connected to the host platform, either with
the mating connectors (J6 and J7) or the single-row headers (J4 and J5). To use the EM mating
connectors to connect the hardware, the mating EM connector must be lined up and spaced 1.2 inches
apart (see Figure 2-7). To use the single-row headers, the required signals from the EM mating
connectors must be wired to the host platform.
Figure 2-7. Host PCB Mating Connector Arrangement
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Schematics www.ti.com
2.5 Schematics
Figure 2-8 shows the schematics of the CC3000 EM board.
Figure 2-8. Schematics of the CC3000 EM Board
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www.ti.com Bill of Materials (BOM)
2.6 Bill of Materials (BOM)
Table 2-7 lists the BOM for the TI CC3000 EM board.
Table 2-7. BOM for the TI CC3000 EM Board
Items Reference Designator Description
1 U1 TI CC3000 Wi-Fi b/g module (BM)
2 ANT1 ANT, 2.4 GHz, peak gain 2.5 dB
3 J1 Mini RF header receptacle
4 J2 CON male 1 x 3, pitch 2.0 mm
5 J3 CON male 1 x 2, pitch 2.0 mm
6 J6,J7 Female header, Fool Proof H:4.3, 2 x 10, pitch 1.27 mm, SMT
7 C1,C3 CAP 0402 10 pF, 50 V, NPO, ±5%
8 C4,C5 CAP 0402 1 µF, X5R, 6.3 V, ±10%, HF
9 R1, R2, R3, R4, R5, R6, R8, R9, R10, RES 0402, 0-Ωjumper
R11, R13, R15, R16, R17, R18, R19, R20,
R21
10 R14 RES 0603, 0-Ωjumper
15
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Chapter 3
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Layout Guidelines
This section presents guidelines that must be followed when creating a board design incorporating the TI
CC3000 module.
Figure 3-1 shows the TI CC3000 EM four-layer board. Table 3-1 and Figure 3-2 describe instances of
good layout practices.
Figure 3-1. Module Layout Guidelines
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Table 3-1. Module Layout Guidelines
Reference (1) Guideline Description
1 The proximity of ground vias must be close to the pad.
2 Signal traces must not be run underneath the module on the layer where the module is mounted.
3 Have a complete ground pour in layer 2 for thermal dissipation.
4 Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner
layers, if possible.
6 Signal traces can be run on a third layer under the solid ground layer, which is below the module
mounting layer.
(1) See Figure 3-2.
Figure 3-2. Module Layout Guidelines
Figure 3-3 shows the trace design for the PCB. A 50-Ωimpedance match on the trace to the antenna
should be used. Also, 50-Ωtraces are recommended for the PCB layout. Table 3-2 lists the distances
shown in Figure 3-3.Figure 3-4 shows layer 1 with the trace to the antenna over ground layer 2. Table 3-3
and Figure 3-5 describe instances of good layout practices for the antenna and RF trace routing.
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Figure 3-3. Trace Design for the PCB Layout
Figure 3-4. Layer 1 Combined With Layer 2
Table 3-2. Trace Design Measurement Values
Measurement Length
H (height between L1 and L2) 12.0 mil
W (RF trace) 14.3 mil
T (thickness) 1.2 mil
S (separation) 10.0 mil
εr(dielectric) 4.3
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Table 3-3. Antenna and RF Trace Routing Layout Guidelines
Reference (1) Guideline Description
1 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the
trace starts to radiate.
2 The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace
mitered. RF traces must not have sharp corners.
3 RF traces must have via stitching on the ground plane beside the RF trace on both sides.
4 RF traces must have constant impedance (microstrip transmission line).
5 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace.
The ground layer must be solid.
6 There must be no traces or ground under the antenna section.
7 The PCB designer must understand the microstrip model used and the scale line width according to the
microstrip model.
8 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of
the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be
considered.
(1) See Figure 3-5.
Figure 3-5. Antenna and RF Trace Routing Layout Guidelines
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Figure 3-6 shows the supply routing guidelines:
• For power supply routing, the power trace for VBAT must be at least 40 mil wide.
• The 1.8-V trace must be at least 18 mil wide.
• Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.
• If possible, shield VBAT traces with ground above, below, and beside the traces.
Figure 3-6. Power Supply Routing of the CC3000 EM Board
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