Table of Contents
1 High-Density EVM Description.............................................................................................................................................. 3
1.1 Typical Applications............................................................................................................................................................3
2 Test Setup and Procedure......................................................................................................................................................4
2.1 EVM Connections.............................................................................................................................................................. 4
2.2 EVM Setup......................................................................................................................................................................... 5
2.3 Test Equipment.................................................................................................................................................................. 6
2.4 Recommended Test Setup.................................................................................................................................................6
2.5 Test Procedure................................................................................................................................................................... 6
3 Test Data and Performance Curves...................................................................................................................................... 7
3.1 Efficiency and Load Regulation Performance.................................................................................................................... 7
3.2 Waveforms......................................................................................................................................................................... 8
3.3 Bode Plot............................................................................................................................................................................9
3.4 EMI Performance..............................................................................................................................................................11
4 EVM Documentation.............................................................................................................................................................12
4.1 Schematic........................................................................................................................................................................ 12
4.2 Bill of Materials.................................................................................................................................................................13
4.3 PCB Layout...................................................................................................................................................................... 14
4.4 Multi-Layer Stackup......................................................................................................................................................... 16
5 Device and Documentation Support...................................................................................................................................17
5.1 Device Support.................................................................................................................................................................17
5.2 Documentation Support................................................................................................................................................... 17
List of Figures
Figure 2-1. EVM Test Setup.........................................................................................................................................................4
Figure 3-1. Efficiency, VOUT = 5 V, FSW = 1 MHz, AUTO Mode................................................................................................... 7
Figure 3-2. Load Regulation, VOUT = 5 V, FSW = 1 MHz, AUTO Mode........................................................................................ 7
Figure 3-3. Efficiency, VOUT = 3.3 V, FSW = 1 MHz, AUTO Mode................................................................................................ 7
Figure 3-4. Load Regulation, VOUT = 3.3 V, FSW = 1 MHz, AUTO Mode..................................................................................... 7
Figure 3-5. Start-Up to VIN = 24 V............................................................................................................................................... 8
Figure 3-6. Shutdown ................................................................................................................................................................. 8
Figure 3-7. Enable ON and OFF .................................................................................................................................................8
Figure 3-8. Load Transient, 4 A to 8 A at 1 A/µs..........................................................................................................................8
Figure 3-9. Infrared Thermal Image VIN = 12 V, VOUT = 5 V........................................................................................................ 8
Figure 3-10. Infrared Thermal Image VIN = 24 V, VOUT = 5 V...................................................................................................... 8
Figure 3-11. Infrared Thermal Image VIN = 12 V, VOUT = 3.3 V................................................................................................... 9
Figure 3-12. Infrared Thermal Image VIN = 24 V, VOUT = 3.3 V................................................................................................... 9
Figure 3-13. Bode Plot With Four 47-µF, 16-V Output Capacitors (110 µF Effective at 5 VDC, 25°C)........................................9
Figure 3-14. Output Capacitor Voltage Derating Curve............................................................................................................. 10
Figure 3-15. CISPR 11/32 Class B Conducted Emissions: VIN = 24 V, SPSP ON.....................................................................11
Figure 3-16. CISPR 11 Class B Radiated Emissions: VIN = 24 V, SPSP ON.............................................................................11
Figure 4-1. EVM Schematic.......................................................................................................................................................12
Figure 4-2. 3D Top View............................................................................................................................................................ 14
Figure 4-3. 3D Bottom View.......................................................................................................................................................14
Figure 4-4. Top Layer Copper....................................................................................................................................................15
Figure 4-5. Layer 2 Copper........................................................................................................................................................15
Figure 4-6. Layer 3 Copper........................................................................................................................................................16
Figure 4-7. Bottom Layer Copper (Viewed From Top)...............................................................................................................16
Figure 4-8. Layer Stackup......................................................................................................................................................... 16
List of Tables
Table 1-1. TLVM13610 Synchronous Buck DC/DC Power Module Family..................................................................................1
Table 2-1. EVM Power Connections............................................................................................................................................ 4
Table 2-2. EVM Signal Connections............................................................................................................................................ 4
Table 4-1. Component BOM...................................................................................................................................................... 13
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2TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
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