Texas Instruments TLVM13610EVM User manual

User’s Guide
TLVM13610EVM Buck Regulator Evaluation Module
ABSTRACT
With an input operating voltage range from 3 V to 36 V and rated output current up to 8 A, the TLVM13610
synchronous buck power modules provides flexibility, scalability, and optimized solution size for a wide range of
applications. With integrated power MOSFETs, buck inductor and PWM controller, these modules enable DC/DC
solutions with high density, low EMI, and ease of design.
Table 1-1. TLVM13610 Synchronous Buck DC/DC Power Module Family
DC/DC MODULE RATED IOUT PACKAGE DIMENSIONS FEATURES EMI MITIGATION
TLVM13610 8A B3-QFN (22) 6.5 × 7.5 (mm) RT adjustable FSW
Slew-rate control, integrated input,
VCC and BOOT capacitors
The TLVM13610EVM uses the TLVM13610 easy-to-use synchronous buck module IC with an output voltage
range of 1 V to 9 V and an output current up to 8 A. The default output voltage of the EVM is set to 5 V can be
adjusted to 3.3 V through a jumper setting.
The solution supports adjustable input voltage UVLO for application-specific power-up and power-down
requirements, PGOOD indicator for sequencing and output voltage monitoring, and is set to AUTO mode for
high efficiency at light-load applications.
www.ti.com
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 1
Copyright © 2023 Texas Instruments Incorporated

Table of Contents
1 High-Density EVM Description.............................................................................................................................................. 3
1.1 Typical Applications............................................................................................................................................................3
2 Test Setup and Procedure......................................................................................................................................................4
2.1 EVM Connections.............................................................................................................................................................. 4
2.2 EVM Setup......................................................................................................................................................................... 5
2.3 Test Equipment.................................................................................................................................................................. 6
2.4 Recommended Test Setup.................................................................................................................................................6
2.5 Test Procedure................................................................................................................................................................... 6
3 Test Data and Performance Curves...................................................................................................................................... 7
3.1 Efficiency and Load Regulation Performance.................................................................................................................... 7
3.2 Waveforms......................................................................................................................................................................... 8
3.3 Bode Plot............................................................................................................................................................................9
3.4 EMI Performance..............................................................................................................................................................11
4 EVM Documentation.............................................................................................................................................................12
4.1 Schematic........................................................................................................................................................................ 12
4.2 Bill of Materials.................................................................................................................................................................13
4.3 PCB Layout...................................................................................................................................................................... 14
4.4 Multi-Layer Stackup......................................................................................................................................................... 16
5 Device and Documentation Support...................................................................................................................................17
5.1 Device Support.................................................................................................................................................................17
5.2 Documentation Support................................................................................................................................................... 17
List of Figures
Figure 2-1. EVM Test Setup.........................................................................................................................................................4
Figure 3-1. Efficiency, VOUT = 5 V, FSW = 1 MHz, AUTO Mode................................................................................................... 7
Figure 3-2. Load Regulation, VOUT = 5 V, FSW = 1 MHz, AUTO Mode........................................................................................ 7
Figure 3-3. Efficiency, VOUT = 3.3 V, FSW = 1 MHz, AUTO Mode................................................................................................ 7
Figure 3-4. Load Regulation, VOUT = 3.3 V, FSW = 1 MHz, AUTO Mode..................................................................................... 7
Figure 3-5. Start-Up to VIN = 24 V............................................................................................................................................... 8
Figure 3-6. Shutdown ................................................................................................................................................................. 8
Figure 3-7. Enable ON and OFF .................................................................................................................................................8
Figure 3-8. Load Transient, 4 A to 8 A at 1 A/µs..........................................................................................................................8
Figure 3-9. Infrared Thermal Image VIN = 12 V, VOUT = 5 V........................................................................................................ 8
Figure 3-10. Infrared Thermal Image VIN = 24 V, VOUT = 5 V...................................................................................................... 8
Figure 3-11. Infrared Thermal Image VIN = 12 V, VOUT = 3.3 V................................................................................................... 9
Figure 3-12. Infrared Thermal Image VIN = 24 V, VOUT = 3.3 V................................................................................................... 9
Figure 3-13. Bode Plot With Four 47-µF, 16-V Output Capacitors (110 µF Effective at 5 VDC, 25°C)........................................9
Figure 3-14. Output Capacitor Voltage Derating Curve............................................................................................................. 10
Figure 3-15. CISPR 11/32 Class B Conducted Emissions: VIN = 24 V, SPSP ON.....................................................................11
Figure 3-16. CISPR 11 Class B Radiated Emissions: VIN = 24 V, SPSP ON.............................................................................11
Figure 4-1. EVM Schematic.......................................................................................................................................................12
Figure 4-2. 3D Top View............................................................................................................................................................ 14
Figure 4-3. 3D Bottom View.......................................................................................................................................................14
Figure 4-4. Top Layer Copper....................................................................................................................................................15
Figure 4-5. Layer 2 Copper........................................................................................................................................................15
Figure 4-6. Layer 3 Copper........................................................................................................................................................16
Figure 4-7. Bottom Layer Copper (Viewed From Top)...............................................................................................................16
Figure 4-8. Layer Stackup......................................................................................................................................................... 16
List of Tables
Table 1-1. TLVM13610 Synchronous Buck DC/DC Power Module Family..................................................................................1
Table 2-1. EVM Power Connections............................................................................................................................................ 4
Table 2-2. EVM Signal Connections............................................................................................................................................ 4
Table 4-1. Component BOM...................................................................................................................................................... 13
Trademarks
HotRod™ is a trademark of Texas Instruments.
WEBENCH® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
Table of Contents www.ti.com
2TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

1 High-Density EVM Description
The TLVM13610EVM features the TLVM13610 synchronous buck power module configured for operation with
typical 3-V to 36-V input bus applications. This wide-VIN range DC/DC solution offers outsized voltage rating and
operating margin to withstand supply-rail voltage transients.
The output voltage can be set to either 3.3 V or 5 V and switching frequency can each be set to one of five
popular values (400 kHz, 700 kHz, 1 MHz, 1.4 MHz, and 2.2 MHz) by using configuration jumpers. Additionally,
a resistor placeholder footprint is on the backside of the EVM to allow adjustment of the switching frequency
outside of the five jumper settings.
The EVM provides the full 8-A output current rating of the device. The selected input and output capacitors
accommodate the entire range of input voltage and the selectable output voltages on the EVM and are available
from multiple component vendors. Input and output voltage sense terminals and a test point header facilitate
measurement of the following:
• Efficiency and power dissipation
• Line and load regulation
• Load transient response
• Enable ON, OFF
• Bode plot (crossover frequency and phase margin)
PCB layout maximizes thermal performance and minimizes output ripple and noise.
1.1 Typical Applications
•Test and measurement, aerospace and defense
•Factory automation and control, power delivery
•Inverting buck-boost (IBB) circuits requiring negative output voltage
www.ti.com High-Density EVM Description
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 3
Copyright © 2023 Texas Instruments Incorporated

2 Test Setup and Procedure
2.1 EVM Connections
Referencing the EVM connections described in Table 2-1, use the recommended test setup in Figure 2-1
to evaluate the TLVM13610. Working at an ESD-protected workstation, make sure that any wrist straps,
bootstraps, or mats are connected and referencing the user to earth ground before power is applied to the
EVM.
ACOM
Ammeter 1 Electronic Load
+ -
V
Voltmeter 1
COM V
Voltmeter 2
COM
Oscilloscope
+
Power Supply
ACOM
Ammeter 2
-
Figure 2-1. EVM Test Setup
CAUTION
Caution Hot surface.
Contact may cause burns.
Do not touch.
SPACER
Table 2-1. EVM Power Connections
LABEL DESCRIPTION
VIN+ Positive input power connection
VIN– Negative input power connection
VOUT+ Positive output power connection
VOUT– Negative output power connection
Table 2-2. EVM Signal Connections
LABEL DESCRIPTION
VIN S+ Positive input sense terminal. Connect the multimeter positive lead for measuring efficiency.
VIN S– Negative input sense terminal. Connect a multimeter negative lead for measuring efficiency.
VOUT S+ Positive output sense terminal. Connect a multimeter positive lead for measuring efficiency and line and load regulation.
VOUT S– Negative output sense terminal. Connect the multimeter negative lead for measuring efficiency and line and load
regulation.
GND Ground reference point
SW Switch node monitor output
Test Setup and Procedure www.ti.com
4TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

Table 2-2. EVM Signal Connections (continued)
LABEL DESCRIPTION
EN Precision enable input and input voltage UVLO protection. Tie EN to GND to disable the regulator. Use a logic signal to
control EN for remote ON and OFF functionality. Leave EN open for UVLO turn-on thresholds set at 6 V.
PG Power-good monitor output. PG is an open-drain flag with a 100-kΩ pullup resistor to VOUT.
CHA, CHB
Bode plot measurement and signal injection. A 10-Ω resistor from CHA to CHB facilitates oscillator signal injection for bode
plot measurement. Remove the jumper and apply a swept-frequency signal between CHA and CHB while measuring the
respective response at each terminal for loop gain measurement.
2.2 EVM Setup
• Use the VIN S+ and VIN S– test points along with the VOUT S+ and VOUT S– test points located near the
power terminal blocks as voltage monitoring points where voltmeters are connected to measure the input and
output voltages, respectively. Do not use these sense terminals as the input supply or output load connection
points. The PCB traces connected to these sense terminals are not designed to support high currents.
• The VOUT SELECT header (J4) allows selection of either 3.3 V or 5 V. Before applying power to the EVM,
make sure that the jumper is present and properly positioned for the intended output voltage. Always remove
input power before changing the jumper settings.
• The FSW SELECT header (J5) allows selection of a suitable switching frequency:
– 400 kHz
– 700 kHz
– 1 MHz
– 1.4 MHz
– 2.2 MHz
Before applying power to the EVM, make sure that the jumper is present and properly positioned for the
intended switching frequency. Always remove input power before changing the jumper settings.
www.ti.com Test Setup and Procedure
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 5
Copyright © 2023 Texas Instruments Incorporated

2.3 Test Equipment
Voltage Source: The input voltage source VIN must be a 36-V variable DC source capable of supplying 6 A.
Multimeters:
•Voltmeter 1: Measure the input voltage at VIN S+ to VIN S–.
•Voltmeter 2: Measure the output voltage at VOUT S+ to VOUT S–.
•Ammeter 1: Measure the input current. Set the ammeter to 1-second aperture time.
•Ammeter 2: Measure the output current. Set the ammeter to 1-second aperture time.
Electronic Load: Use an electronic load set to constant-resistance (CR) or constant-current (CC) mode and
capable of 0 ADC to 6 ADC. For a no-load input current measurement, disconnect the electronic load as it can
draw a small residual current.
Oscilloscope: With the scope set to 20-MHz bandwidth and AC coupling, measure the output voltage ripple
directly across an output capacitor with a short ground lead normally provided with the scope probe. Place the
oscilloscope probe tip on the positive terminal of the output capacitor, holding the ground barrel of the probe
through the ground lead to the negative terminal of the capacitor. TI does not recommend using a long-leaded
ground connection because this can induce additional noise given a large ground loop. To measure other
waveforms, adjust the oscilloscope as needed.
Safety: Always use caution when touching any circuits that can be live or energized.
2.4 Recommended Test Setup
2.4.1 Input Connections
• Prior to connecting the DC input source, set the current limit of the input supply to 0.1-A maximum. Ensure
the input source is initially set to 0 V and connected to the VIN+ and VIN– connection points as shown in
Figure 2-1.
• Connect voltmeter 1 at VIN S+ and VIN S– connection points to measure the input voltage.
• Connect ammeter 1 to measure the input current and set it to at least a 0.1-second aperture time.
2.4.2 Output Connections
• Connect an electronic load to the VOUT+ and VOUT– connections as shown in Figure 2-1. Set the load to
constant-resistance mode or constant-current mode at 0 A before applying input voltage.
• Connect voltmeter 2 at VOUT S+ and VOUT S– sense points to measure the output voltage.
• Connect ammeter 2 to measure the output current.
2.5 Test Procedure
2.5.1 Line, Load Regulation and Efficiency
• Set up the EVM as described in Test Setup and Procedure.
• Set load to constant resistance or constant current mode to sink 0 A.
• Increase the input source voltage from 0 V to 24 V; use voltmeter 1 to measure the input voltage.
• Increase the current limit of the input supply to 8 A.
• Use voltmeter 2 to measure the output voltage, VOUT, and vary the load current from 0-A to 8-A DC; VOUT
must remain within the load regulation specification.
• Set the load current to 4 A (50% rated load) and vary the input source voltage from 6 V to 36 V; VOUT must
remain within the line regulation specification.
• Set the load current to 8 A (100% rated load) and measure the efficiency at typical input voltages (12 V, 24 V,
and 36 V).
• Decrease the load to 0 A. Decrease the input source voltage to 0 V.
CAUTION
Extended operation at high output current can raise component temperatures above 55°C. To
avoid risk of a burn injury, do not touch the components until they have cooled sufficiently after
disconnecting power.
Test Setup and Procedure www.ti.com
6TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

3 Test Data and Performance Curves
Because actual performance data can be affected by measurement techniques and environmental variables,
these curves are presented for reference and can differ from actual field measurements. Unless otherwise
indicated, VIN = 24 V, VOUT = 5 V, IOUT = 8 A, and FSW = 1 MHz.
3.1 Efficiency and Load Regulation Performance
This section provides efficiency and load regulation plots for the EVM.
Output Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7 8
70
75
80
85
90
95
100
VIN = 12 V
VIN = 24 V
VIN = 36 V
Figure 3-1. Efficiency, VOUT = 5 V, FSW = 1 MHz,
AUTO Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7 8
4.95
4.975
5
5.025
5.05
VIN = 12 V
VIN = 24 V
VIN = 36 V
Figure 3-2. Load Regulation, VOUT = 5 V, FSW = 1
MHz, AUTO Mode
Output Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7 8
70
75
80
85
90
95
100
VIN = 12 V
VIN = 24 V
VIN = 36 V
Figure 3-3. Efficiency, VOUT = 3.3 V, FSW = 1 MHz,
AUTO Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7 8
3.255
3.27
3.285
3.3
3.315
3.33
3.345
VIN = 12 V
VIN = 24 V
VIN = 36 V
Figure 3-4. Load Regulation, VOUT = 3.3 V, FSW = 1
MHz, AUTO Mode
www.ti.com Test Data and Performance Curves
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 7
Copyright © 2023 Texas Instruments Incorporated

3.2 Waveforms
CH 1 ( VIN )
CH 2 ( VOUT )
CH 3 ( PG )
Figure 3-5. Start-Up to VIN = 24 V Figure 3-6. Shutdown
Figure 3-7. Enable ON and OFF
CH 3 ( VOUT )
CH 4 ( IOUT )
Figure 3-8. Load Transient, 4 A to 8 A at 1 A/µs
FSW = 1 MHz IOUT = 8 A PDIS = 3.49 W
Figure 3-9. Infrared Thermal Image VIN = 12 V, VOUT
= 5 V
FSW = 1 MHz IOUT = 8 A PDIS = 4.06 W
Figure 3-10. Infrared Thermal Image VIN = 24 V,
VOUT = 5 V
Test Data and Performance Curves www.ti.com
8TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

FSW = 1 MHz IOUT = 8 A PDIS = 3.27 W
Figure 3-11. Infrared Thermal Image VIN = 12 V,
VOUT = 3.3 V
FSW = 1 MHz IOUT = 8 A PDIS = 3.84 W
Figure 3-12. Infrared Thermal Image VIN = 24 V,
VOUT = 3.3 V
3.3 Bode Plot
Figure 3-13 provides the bode plot at VIN = 24 V, VOUT = 5 V, FSW = 1 MHz, and IOUT = 8 A. Figure 3-14 shows
a typical capacitance versus voltage curve for a 47-µF, 16-V, X6S output capacitor to highlight the effective
capacitance value of a ceramic. See component details in Bill of Materials.
Figure 3-13. Bode Plot With Four 47-µF, 16-V Output Capacitors (110 µF Effective at 5 VDC, 25°C)
www.ti.com Test Data and Performance Curves
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 9
Copyright © 2023 Texas Instruments Incorporated

DC Bias (V)
Effective Capacitance (µF)
Figure 3-14. Output Capacitor Voltage Derating Curve
Test Data and Performance Curves www.ti.com
10 TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

3.4 EMI Performance
See the Schematic and Bill of Materials for details of the input EMI filter to pass CISPR 11/32 Class B conducted
emissions.
Frequency (MHz)
Magnitude (dBµV)
0.1 0.2 0.3 0.5 0.7 1 2 3 4 5 6 78 10 20 3030
-15
0
15
30
45
60
75
CISPR 11/32 Class B QP detector
CISPR 11/32 Class B AVG detector
Evaluation Board
Default EVM VOUT = 5 V FSW = 1 MHz
Figure 3-15. CISPR 11/32 Class B Conducted
Emissions: VIN = 24 V, SPSP ON
Frequency (MHz)
Magnitude (dBµV/m)
0 100 200 300 400 500 600 700 800 900 1000
0
5
10
15
20
25
30
35
40
45
50
CISPR11 Class B Limit
Evaluation Board (Horizontal)
Evaluation Board (Vertical)
Additional 2 × 10
pF CIN with EMI
filter removed
VOUT = 5 V FSW = 1 MHz
Figure 3-16. CISPR 11 Class B Radiated
Emissions: VIN = 24 V, SPSP ON
www.ti.com Test Data and Performance Curves
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 11
Copyright © 2023 Texas Instruments Incorporated

4 EVM Documentation
4.1 Schematic
Figure 4-1 illustrates the EVM schematic.
Figure 4-1. EVM Schematic
EVM Documentation www.ti.com
12 TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

4.2 Bill of Materials
Table 4-1. Component BOM
REF DES QTY VALUE DESCRIPTION PACKAGE PART NUMBER MANUFACTURER
C1 1 100 µF CAP, AL, 100 µF, 50 V, 0.34 Ω, 8x10 UUD1H101MNL1GS Nichicon
C2, C3, C4, C5 4 10 µF CAP, CERM, 10 µF, 50 V, X7R 1210 GRM32ER71H106KA12L MuRata
C6, C7, C8, C9 4 2.2 µF CAP, CERM, 2.2 µF, 50 V, X7R 0805 CGA4J3X7R1H225K125AB TDK
C10, C11, C12, C13 4 47 µF CAP, CERM, 47 µF, 16 V, X6S 1210 GRM32EC81C476ME15L MuRata
C14 1 0.1 µF CAP, CERM, 0.1 µF, 25 V, X7R 0603 CGA3E2X7R1E104K080AA TDK
C15 1 1 µF CAP, CERM, 1 µF, 25 V, X7R 0603 C0603C105K3RACTU Kemet
C17 1 0.15 µF CAP, CERM, 0.15 µF, 50 V, X7R 0603 CGA3E3X7R1H154K080AB TDK
C18 0 10 pF CAP, CERM, 10 pF, 50 V, C0G/NP0 0402 CGA2B2C0G1H100D050BA TDK
H1, H2, H3, H4 4 Standoff, Hex, 0.5"L #4-40 Nylon - 1902C Keystone
H5, H6, H7, H8 4 Screw, Pan Head , 4-40, 3/8", Nylon - NY PMS 440 0038 PH B&F Fastener Supply
J1, J2 2 TERM BLOCK 2POS 5mm, TH - 1729018 Phoenix Contact
J3, J6 2 Header, 100mil, 3 × 1, Gold, TH - PBC03SAAN Sullins Connector Solutions
J4 1 Header, 100mil, 2 × 1, Gold, TH - PBC02SAAN Sullins Connector Solutions
J5 1 Header, 100mil, 5 × 2, Tin, TH - PEC05DAAN Sullins Connector Solutions
L1 1 1.5 µH Shielded power inductor 1.5 µH, 10.2A 10.5 mΩ Max - XGL4030-152MEC Coilcraft
R1 1 0 RES, 0, 5%, 0.1 W 0603 CRCW06030000Z0EA Vishay-Dale
R2 1 0 RES, 0, 0%, 0.2 W 0402 CRCW04020000Z0EDHP Vishay-Dale
R3 1 187 kΩ RES, 187 kΩ, 1%, 0.1 W 0603 CRCW0603187KFKEA Vishay-Dale
R4 1 49.9 kΩ RES, 49.9 kΩ, 1%, 0.1 W 0603 CRCW060349K9FKEA Vishay-Dale
R5 1 10 Ω RES, 10.0 Ω, 1%, 0.063 W 0402 CRCW040210R0FKED Vishay-Dale
R6 1 100 kΩ RES, 100 kΩ, 1%, 0.1 W 0603 CRCW0603100KFKEA Vishay-Dale
R7 1 100 kΩ RES, 100 kΩ, 1%, 0.063 W 0402 CRCW0402100KFKED Vishay-Dale
R8 1 43.2 kΩ RES, 43.2 kΩ, 1%, 0.063 W 0402 CRCW040243K2FKED Vishay-Dale
R9 1 59.0 kΩ RES, 59.0 kΩ, 1%, 0.063 W 0402 CRCW040259K0FKED Vishay-Dale
R10 1 40.2 kΩ RES, 40.2 kΩ, 1%, 0.063 W 0402 CRCW040240K2FKED Vishay-Dale
R11 1 22.6 kΩ RES, 22.6 kΩ, 1%, 0.063 W 0402 CRCW040222K6FKED Vishay-Dale
R12 1 15.8 kΩ RES, 15.8 kΩ, 1%, 0.063 W 0402 CRCW040215K8FKED Vishay-Dale
R13 1 11.0 kΩ RES, 11.0 kΩ, 1%, 0.063 W 0402 CRCW040211K0FKED Vishay-Dale
R14 1 6.8 kΩ RES, 6.8 kΩ, 5%, 0.063 W 0402 CRCW04026K80JNED Vishay-Dale
R15 0 4.99 kΩ RES, 4.99 kΩ, 1%, 0.063 W 0402 CRCW04024K99FKED Vishay-Dale
R17 0 4.99 MΩ RES, 4.99 MΩ, 1%, 0.1 W 0603 CRCW06034M99FKEA Vishay-Dale
SH-J1, SH-J2, SH-J3,
SH-J4, SH-J5, SH-J6 6 1 × 2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8 8 Test Point, Miniature, SMT - 5019 Keystone
U1 1 TLVM13610RDFR B3QFN-22 TLVM13610RDFR Texas Instruments
www.ti.com EVM Documentation
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 13
Copyright © 2023 Texas Instruments Incorporated

4.3 PCB Layout
Figure 4-2 through Figure 4-7 show the PCB layout images, including 3D views, copper layers, assembly
drawings, and layer stackup diagram. The PCB is 62-mils standard thickness with 2-oz copper on all layers.
Figure 4-2. 3D Top View
Figure 4-3. 3D Bottom View
EVM Documentation www.ti.com
14 TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

Figure 4-4. Top Layer Copper
Figure 4-5. Layer 2 Copper
www.ti.com EVM Documentation
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 15
Copyright © 2023 Texas Instruments Incorporated

Figure 4-6. Layer 3 Copper
Figure 4-7. Bottom Layer Copper (Viewed From Top)
4.4 Multi-Layer Stackup
Figure 4-8. Layer Stackup
EVM Documentation www.ti.com
16 TLVM13610EVM Buck Regulator Evaluation Module SLVUCN1 – JANUARY 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated

5 Device and Documentation Support
5.1 Device Support
5.1.1 Development Support
For development support see the following:
• For TI's reference design library, visit TI Reference Design library
• For TI's WEBENCH Design Environment, visit the WEBENCH® Design Center
• To design a low-EMI power supply, review TI's comprehensive EMI Training Series
• To design an inverting buck-boost (IBB) regulator, visit DC/DC inverting buck-boost modules
• TI Reference Designs:
–Multiple output power solution for Kintex 7 application
–Arria V power reference design
–Altera Cyclone V SoC power supply reference design
–Space-optimized DC/DC inverting power module reference design with minimal BOM count
–3- to 11.5-VIN, –5-VOUT, 1.5-A inverting power module reference design for small, low-noise systems
• Technical Articles:
–Powering medical imaging applications with DC/DC buck converters
–How to create a programmable output inverting buck-boost regulator
• To view a related device of this product, see the LM61495 36-V, 10-A synchronous buck converter
5.1.1.1 Custom Design With WEBENCH® Tools
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance.
• Run thermal simulations to understand board thermal performance.
• Export customized schematic and layout into popular CAD formats.
• Print PDF reports for the design, and share the design with colleagues.
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, Innovative DC/DC Power Modules selection guide
• Texas Instruments, Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Package
Technology white paper
• Texas Instruments, Benefits and Trade-offs of Various Power-Module Package Options white paper
• Texas Instruments, Simplify Low EMI Design with Power Modules white paper
• Texas Instruments, Power Modules for Lab Instrumentation white paper
• Texas Instruments, An Engineer's Guide To EMI In DC/DC Regulators e-book
• Texas Instruments, Soldering Considerations for Power Modules application report
• Texas Instruments, Practical Thermal Design With DC/DC Power Modules application report
• Texas Instruments, Using New Thermal Metrics application report
• Texas Instruments, AN-2020 Thermal Design By Insight, Not Hindsight application report
• Texas Instruments, Using the TPSM53602/3/4 for Negative Output Inverting Buck-Boost Applications
application report
www.ti.com Device and Documentation Support
SLVUCN1 – JANUARY 2023
Submit Document Feedback
TLVM13610EVM Buck Regulator Evaluation Module 17
Copyright © 2023 Texas Instruments Incorporated

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

www.ti.com
2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

www.ti.com
3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-delivered-in-japan.html
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-for-power-line-communication.html
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.