User’s Guide
TPS1HC30-Q1 Evaluation Module
ABSTRACT
The TPS1HC30EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS1HC30-Q1 automotive high side switch. The TPS1HC30EVM
contains everything needed to test and assess the TPS1HC30-Q1 before designing it into part of a greater
application power system. The evaluation module is designed to either be used as a standalone board with an
attached voltage supply and output load or in conjunction with an underlying Texas Instruments microcontroller
by using the standardized BoosterPack™ headers. A wide range of application features such as current sensing,
programmable current limiting, and transient suppression are enabled and visible through use of this evaluation
module.
Table of Contents
1 Introduction.............................................................................................................................................................................2
2 BoosterPack™ Operation....................................................................................................................................................... 3
3 TPS1HC30EVM Schematic ....................................................................................................................................................4
4 Connection Descriptions....................................................................................................................................................... 5
5 Current Limit and Current Sense Configuration..................................................................................................................6
6 Transient Protection............................................................................................................................................................... 7
7 TPS1HC30EVM Assembly Drawings and Layout................................................................................................................ 8
8 Bill Of Materials.....................................................................................................................................................................14
9 Appendix - TPL0102-100 Resistance Codes...................................................................................................................... 16
List of Figures
Figure 3-1. TPS1HC30EVM Schematic.......................................................................................................................................4
Figure 7-1. Top Layer...................................................................................................................................................................8
Figure 7-2. Power Layer.............................................................................................................................................................. 9
Figure 7-3. Ground Layer.......................................................................................................................................................... 10
Figure 7-4. Bottom Layer........................................................................................................................................................... 11
Figure 7-5. 3D View - Top.......................................................................................................................................................... 12
Figure 7-6. 3D View - Bottom.....................................................................................................................................................13
List of Tables
Table 2-1. BoosterPack™ Pin Assignment................................................................................................................................... 3
Table 4-1. Connections and Test Points...................................................................................................................................... 5
Table 4-2. Jumper Configurations................................................................................................................................................5
Trademarks
BoosterPack™ and LaunchPad™ are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
www.ti.com Table of Contents
SLVUCI3 – JUNE 2022
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