Tq-systems Tqma8xx User manual

TQMa8Xx

Preliminary User's Manual

TQMa8Xx UM 0002

23.09.2018

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and license expenses.............................................................................................................................................................1

1.2 Registered trademarks ..............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals .......................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge.................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

2.1 Block diagram i.MX 8X...............................................................................................................................................................................4

2.2 Key functions and characteristics...........................................................................................................................................................5

3. ELECTRONICS ...............................................................................................................................................................................................6

3.1 Interfaces to other systems and devices..............................................................................................................................................6

3.1.1 Pin multiplexing ..........................................................................................................................................................................................6

3.1.2 Connector X1................................................................................................................................................................................................7

3.1.3 Connector X2................................................................................................................................................................................................8

3.1.4 Connector X3................................................................................................................................................................................................9

3.2 System components ............................................................................................................................................................................... 10

3.2.1 i.MX 8X CPU................................................................................................................................................................................................ 10

3.2.1.1 i.MX 8X derivatives................................................................................................................................................................................... 10

3.2.1.2 i.MX 8X errata ............................................................................................................................................................................................ 10

3.2.1.3 Boot modes................................................................................................................................................................................................ 10

3.2.2 Memory....................................................................................................................................................................................................... 11

3.2.2.1 DDR3L SDRAM .......................................................................................................................................................................................... 11

3.2.2.2 eMMC NAND flash ................................................................................................................................................................................... 11

3.2.2.3 QSPI NOR flash .......................................................................................................................................................................................... 12

3.2.2.4 EEPROM....................................................................................................................................................................................................... 12

3.2.2.5 EEPROM with temperature sensor...................................................................................................................................................... 13

3.2.3 RTC................................................................................................................................................................................................................ 13

3.2.4 Interfaces .................................................................................................................................................................................................... 14

3.2.5 Reset............................................................................................................................................................................................................. 14

3.2.6 Power........................................................................................................................................................................................................... 15

3.2.6.1 Power supply............................................................................................................................................................................................. 15

3.2.6.2 Power consumption................................................................................................................................................................................ 15

3.2.6.3 LICELL........................................................................................................................................................................................................... 15

3.2.6.4 ADC input voltage V_ADC_IN .............................................................................................................................................................. 16

3.2.6.5 USB_OT [2:1]_VBUS ............................................................................................................................................................................... 16

3.2.6.6 Provided TQMa8Xx voltages ................................................................................................................................................................ 16

3.2.6.7 Voltage monitoring................................................................................................................................................................................. 16

3.2.6.8 Power-Up sequence TQMa8Xx / carrier board ............................................................................................................................... 17

3.2.6.9 Power modes............................................................................................................................................................................................. 17

3.2.6.10 PMIC ............................................................................................................................................................................................................. 17

TABLE OF CONTENTS (continued)

4. MECHANICS ............................................................................................................................................................................................... 18

4.1 Connectors................................................................................................................................................................................................. 18

4.2 Dimensions ................................................................................................................................................................................................ 19

4.3 Component placement.......................................................................................................................................................................... 20

4.4 Adaptation to the environment .......................................................................................................................................................... 21

4.5 Protection against external effects..................................................................................................................................................... 21

4.6 Thermal management............................................................................................................................................................................ 21

4.7 Structural requirements......................................................................................................................................................................... 21

4.8 Notes of treatment .................................................................................................................................................................................. 21

5. SOFTWARE.................................................................................................................................................................................................. 21

6. SAFETY REQUIREMENTS AND PROTECTIVE RE ULATIONS......................................................................................................... 22

6.1 EMC............................................................................................................................................................................................................... 22

6.2 ESD................................................................................................................................................................................................................ 22

6.3 Operational safety and personal security......................................................................................................................................... 22

6.4 Climate and operational conditions................................................................................................................................................... 23

6.5 Reliability and service life ...................................................................................................................................................................... 23

7. ENVIRONMENT PROTECTION................................................................................................................................................................ 24

7.1 RoHS............................................................................................................................................................................................................. 24

7.2 WEEE®.......................................................................................................................................................................................................... 24

7.3 REACH®........................................................................................................................................................................................................ 24

7.4 EuP................................................................................................................................................................................................................ 24

7.5 Battery ......................................................................................................................................................................................................... 24

7.6 Packaging................................................................................................................................................................................................... 24

7.7 Other entries.............................................................................................................................................................................................. 24

8. APPENDIX................................................................................................................................................................................................... 25

8.1 Acronyms and definitions ..................................................................................................................................................................... 25

8.2 References.................................................................................................................................................................................................. 27

TABLE DIRECTORY

Table 1: Terms and conventions..............................................................................................................................................................2

Table 2: Pinout connector X1....................................................................................................................................................................7

Table 3: Pinout connector X2....................................................................................................................................................................8

Table 4: Pinout connector X3....................................................................................................................................................................9

Table 5: i.MX 8X derivatives.................................................................................................................................................................... 10

Table 6: Boot-Mode / BT_FUSE_SEL..................................................................................................................................................... 10

Table 7: EEPROM........................................................................................................................................................................................ 12

Table 8: Manufacturer EEPROM ............................................................................................................................................................ 13

Table 9: Temperature sensor SE97BTP................................................................................................................................................ 13

Table 10: Reset and config signals.......................................................................................................................................................... 14

Table 11: TQMa8Xx power consumption @ 3.3 V .............................................................................................................................. 15

Table 12: TQMa8Xx LICELL........................................................................................................................................................................ 15

Table 13: USB_OT [2:1]_VBUS ................................................................................................................................................................ 16

Table 14: Provided TQMa8Xx voltages.................................................................................................................................................. 16

Table 15: Provided PMIC signals ............................................................................................................................................................. 17

Table 16: TQMa8Xx connectors............................................................................................................................................................... 18

Table 17: Carrier board mating connectors......................................................................................................................................... 18

Table 18: Labels on TQMa8Xx.................................................................................................................................................................. 20

Table 19: Climate and operational conditions extended temperature range –25 °C to +85 °C.......................................... 23

Table 20: Climate and operational conditions industrial temperature range –40 °C to +85 °C .......................................... 23

Table 21: Acronyms..................................................................................................................................................................................... 25

Table 22: Further applicable documents.............................................................................................................................................. 27

ILLUSTRATION DIRECTORY

Illustration 1: Block diagram i.MX 8X CPU.......................................................................................................................................................4

Illustration 2: Block diagram TQMa8Xx............................................................................................................................................................6

Illustration 3: Block diagram DDR3L interface............................................................................................................................................ 11

Illustration 4: Block diagram eMMC interface............................................................................................................................................. 11

Illustration 5: Block diagram QSPI interface ................................................................................................................................................ 12

Illustration 6: Block diagram EEPROM interface......................................................................................................................................... 12

Illustration 7: Block diagram temperature sensor interface................................................................................................................... 13

Illustration 8: Block diagram Reset................................................................................................................................................................. 14

Illustration 9: Block diagram power supply................................................................................................................................................. 15

Illustration 10: Block diagram power supply carrier board....................................................................................................................... 17

Illustration 11: TQMa8Xx dimensions, side view.......................................................................................................................................... 19

Illustration 12: TQMa8Xx CPU position, top view......................................................................................................................................... 19

Illustration 13: TQMa8Xx dimensions, top view through TQMa8Xx................................................................................................... 19

Illustration 14: TQMa8Xx, component placement top............................................................................................................................... 20

Illustration 15: TQMa8Xx, component placement bottom....................................................................................................................... 20

REVISION HISTORY

Rev. Date Name Pos. Modification

0001 19.06.2018 Petz Initial release

0002 23.09.2018 Petz

All

Illustration 2

Table 10

Table 19, Table 20

Links updated, ® and ™ added/updated

Names of i.MX 8X derivatives corrected

Remarks clarified

“Package temperature” replaced with “Case temperature”

Case temperature DDR3L SDRAM changed to +95 °C

1. ABOUT THIS MANUAL

1.1 Cop right and license expenses

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially

in electronic, machine readable, or in any other form without the written consent of TQ-Systems mbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems mbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems mbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in the Preliminary User's Manual, including those protected by a third party, unless

specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the

present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected

by a third party.

1.3 Disclaimer

TQ-Systems mbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or

of good quality. Nor does TQ-Systems mbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems mbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there

is no proven intentional or negligent fault of TQ-Systems mbH.

TQ-Systems mbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it

without special notification.

Important Notice:

Before using the MBa8Xx or parts of the schematics of the MBa8Xx, you must evaluate it and determine if it is suitable for your

intended application. You assume all risks and liability associated with such use. TQ-Systems mbH makes no other warranties

including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited

by law, TQ-Systems mbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the

usage of the MBa8Xx or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems mbH

ut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ- roup

Web: TQ- roup

1.5 Tips on safet

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 S mbols and t pographic conventions

Table 1: Terms and conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and may damage

or destroy the component.

This symbol indicates a possible source of danger.

Ignoring the instructions described can cause health damage, or damage the hardware.

This symbol represents important details or aspects for working with TQ-products.

Command A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7 Handling and ESD tips

eneral handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is not to touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa8Xx and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems mbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBa8Xx circuit diagram

•MBa8Xx User’s Manual

•i.MX 8X Data Sheet

•i.MX 8X Reference Manual

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqma8xx

2. BRIEF DESCRIPTION

This Preliminary User's Manual describes the hardware of TQMa8Xx revision 01xx in combination with the MBa8Xx revision 01xx

and refers to some software settings. The MBa8Xx serves as an evaluation board for the TQMa8Xx. A certain TQMa8Xx version

does not necessarily provide all features described in this Preliminary User's Manual. This Preliminary User's Manual does also not

replace the NXP i.MX 8X Reference Manual (2). The CPU derivatives provide dual, and quad ARM® Cortex™ A35 cores, and up to

two Dual ARM® Cortex™-M4 co-processors. In addition, the CPUs include an Open L ES 3.0 or 3.1 PU as well as a VPU

supporting up to 4K h.265 decoder.

The TQMa8Xx is a universal Minimodule based on these NXP ARM® Cortex™ A35 i.MX 8X CPUs, see also Table 5.

An i.MX 8X Cortex™ A35 core typically operates at 1.2 Hz.

2.1 Block diagram i.MX 8X

Illustration 1: Block diagram i.MX 8X CPU

(Source: NXP)

The TQMa8Xx extends the TQ-Systems mbH product range and offers an outstanding computing performance.

A suitable i.MX 8X derivative (i.MX 8DualX, i.MX 8DualXPlus, or i.MX 8QuadXPlus) can be selected for each requirement.

All essential CPU signals are routed to the connectors. There are therefore no restrictions for customers using the TQMa8Xx with

respect to an integrated customised design. All essential components like CPU, DDR3L SDRAM, eMMC, and power management

are already integrated on the TQMa8Xx. The main features of the TQMa8Xx are:

•64-bit NXP i.MX 8X CPU with up to 4 × ARM® Cortex™ A35 and 1 × ARM® Cortex™ M4F

•Derivatives: i.MX 8DualX / i.MX 8DualXPlus / i.MX 8QuadXPlus

•Up to 2 byte DDR3L SDRAM, with 2 × 32 bit data bus interface, one channel optional with ECC

•Up to 64 byte eMMC NAND flash

•Up to 256 Mbyte QSPI NOR flash (optional)

•64 kbit EEPROM

•EEPROM + temperature sensor

•NXP Power Management Integrated Circuit PF8100, “ASIL” ready

•All essential CPU signals are routed to the TQMa8Xx connectors

•Extended temperature range

•Boot mode selection on TQMa8Xx

•3.3 V single supply voltage

2.2 Ke functions and characteristics

The following components are implemented on the TQMa8Xx:

•NXP i.MX 8DualX / i.MX 8DualXPlus / i.MX 8QuadXPlus / CPU

•DDR3L SDRAM

•eMMC NAND flash

•QSPI NOR flash

•EEPROM

•EEPROM + Temperature sensor

•RTC (optional)

•Supervisor with Reset structure

•Power supply by PMIC with Power Sequencing (single 3.3 V supply)

•Boot configuration

•Three connectors (2 × 120 pins, 1 × 40 pins)

The following primary interfaces are provided at the TQMa8Xx connectors: 1

•2 × bE ( igabit Ethernet)

•2 × I2C

•1 × JTA

•1 × LVDS interface

•2 × CAN

•3 × SPI

•2 × USB 2.0 OT

•1 × USB 3.0

•2 × UART

•1 × SD 4-bit (SDIO / MMC / SD card)

•1 × QSPI)

•1 × I2S (MCASP)

•1 × PCIe

1: Number of interfaces depend on i.MX 8X derivative.

3. ELECTRONICS

The information provided in this Preliminary User's Manual is only valid in connection with the tailored boot loader,

which is preinstalled on the TQMa8Xx, and the BSP provided by TQ-Systems mbH, see also chapter 5.

Illustration 2: Block diagram TQMa8Xx

3.1 Interfaces to other s stems and devices

3.1.1 Pin multiplexing

When using the CPU signals, the multiple pin configurations by different CPU-internal function units must be taken note of.

NXP provides a tool showing the multiplexing and simplifies the selection and configuration (NXP Pin Mux Tool):

The pin assignment listed in Table 2, Table 3, and Table 4 refers to the corresponding BSP provided by TQ-Systems mbH

in combination with the MBa8Xx.

The electrical and pin characteristics are to be taken from the i.MX 8X Data Sheet (1), the i.MX 8X Reference Manual (2),

and the PMIC Data Sheet (4).

Attention: Destruction or malfunction

Depending on the configuration, many i.MX 8X balls can provide several different functions.

Please take note of the information in the i.MX 8X Reference Manual (2), and the i.MX 8X Errata (3)

concerning the configuration of these pins before integration or start-up of your carrier board.

Improper programming by operating software can cause malfunctions, deterioration or

destruction of the TQMa8Xx.

The meanings given in the following tables must be observed:

RFU: Reserved pins without function.

To support future TQMa8Xx versions, these pins must not be connected.

DNC: These pins must never be wired and must be left open.

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