TYAN GT24-B7016-LE Quick start guide

http://www.tyan.com
1
GT24-B7016-LE
Service Engineer’s Manual

http://www.tyan.com
2

http://www.tyan.com
3
PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.
Copyright 2011 MiTAC International Corporation. All rights reserved.
TYAN®is a registered trademark of MiTAC International Corporation.
Version 1.0
Disclaimer
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to
printing. MiTAC assumes no liability whatsoever, and disclaims any
express or implied warranty, relating to sale and/or use of TYAN®products
including liability or warranties relating to fitness for a particular purpose or
merchantability. MiTAC retains the right to make changes to produce
descriptions and/or specifications at any time, without notice. In no event
will MiTAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting
from errors or inaccuracies of information contained in this document.
Trademark Recognition
All registered and unregistered trademarks and company names
contained in this manual are property of their respective owners including,
but not limited to the following.
TYAN®is a trademark of MiTAC International Corporation.
Intel®is a trademark of Intel®Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
IBM®, PC®, AT®and PS/2®are trademarks of IBM Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.

http://www.tyan.com
4
Federal Communication Commission (FCC)
Notice for the USA
Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules
Operation is subject to the following conditions:
1) This device may not cause harmful interference;
2) This device must accept any interference received including
interference that may cause undesired operation. If this equipment
does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the
user is encouraged to try one or more of the following measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and the receiver.
– Plug the equipment into an outlet on a circuit different from that of
the receiver.
Consult the dealer on an experienced radio/television technician for
help.
Notice for Canada
This apparatus complies with the Class A limits for radio interference as
specified in the Canadian Department of Communications Radio
Interference Regulations. (Cet appareil est conforme aux norms de
Classe A d’interference radio tel que specifie par le Ministere Canadien
des Communications dans les reglements d’ineteference radio.)
Notice for Europe (CE Mark)
This product is in conformity with the Council
Directive 89/336/EEC, 92/31/EEC (EMC).
CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according
to manufacturer instructions and in accordance with your local
regulation`ns.

http://www.tyan.com
5
About this Manual
This manual provides you with instructions on installing your TYAN
GT24-B7016-LE. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.
This manual consists of the following parts:
Chapter1: Provides an introduction to the TYAN
GT24-B7016-LE barebones, standard parts list,
describes the external components, gives a
table of key components, and provides block
diagram of the system.
Chapter2: Covers procedures on installing the CPU,
memory modules and hard drives.
Chapter3: Covers removal and replacement procedures
for preinstalled components.
Appendix: List the cable connection and FRU part tables
for reference of system setup, and technical
support in case a problem arises with your
system.
For information on the motherboard, please refer to the attached
motherboard user’s manual. You can find the detailed description
about jumper and BIOS settings from the motherboard manual.

http://www.tyan.com
6
SAFETY INFORMATION
Before installing and using TYAN GT24-B7016-LE, take note of the
following precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third
pin to ground the unit and prevent electric shock. Do not defeat the
purpose of this pin. If you outlet does not support this kind of plug,
contact your electrician to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it
will not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high
voltage components and result in shock and damage to the
components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks
to verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

http://www.tyan.com
7
Table of Contents
Chapter 1: Overview.........................................................................9
1.1 About the TYAN GT24-B7016-LE ............................................ 9
1.2 Product Models......................................................................... 9
1.3 Features.................................................................................. 10
1.4 Standard Parts List ................................................................. 14
1.4.1 Box Contents ................................................................... 14
1.4.2 Accessories ..................................................................... 15
1.5 Optional Parts ......................................................................... 16
1.6 About the Product................................................................... 17
1.6.1 System Front View........................................................... 17
1.6.2 System Rear View ........................................................... 17
1.6.3 LED Definitions ................................................................ 18
1.6.4 Motherboard (S7016-LE) Layout ..................................... 20
1.6.5 Jumpers & Connectors .................................................... 21
1.6.6 System Block Diagram .................................................... 22
1.6.7 Internal View .................................................................... 23
Chapter 2: Setting Up..................................................................... 25
2.0.1 Before you Begin ............................................................. 25
2.0.2 Work Area........................................................................ 25
2.0.3 Tools ................................................................................ 25
2.0.4 Precautions...................................................................... 26
2.1 Installing Motherboard Components....................................... 27
2.1.1 Removing the Chassis Cover .......................................... 27
2.1.2 Installing the CPU and Heatsink...................................... 28
2.1.3 Installing the Memory....................................................... 31
2.1.4 Installing Hard Drives....................................................... 36
2.1.5 Installing the PCI-E Cards ............................................... 38
2.2 Rack Mounting........................................................................ 39

http://www.tyan.com
8
2.2.1 Installing the Server in a Rack......................................... 39
2.2.2 Installing the inner Rails to the Chassis........................... 40
2.2.3 Installing the Outer Rails to the Rack .............................. 41
2.2.4 Rack mounting the Server ............................................... 43
Chapter 3: Replacing Pre-Installed Components ........................ 45
3.1 Introduction ............................................................................. 45
3.2 Disassembly Flowchart........................................................... 45
3.3 Removing the Cover............................................................... 47
3.4 Replacing Motherboard Components..................................... 47
3.4.1 Replacing Expansion Card .............................................. 47
3.4.2 Disconnecting All Motherboard Cables ........................... 49
3.4.3 Removing the Motherboard ............................................. 50
3.5 Replacing the Slim DVD-RW ................................................ 51
3.6 Replacing the LED Control Board......................................... 53
3.6.1 M1008 LED Control Board Features ............................... 55
3.6.2 M1008 LED Control Board Connector Pin Definition ...... 55
3.7 Replacing the System Fan.................................................... 56
3.8 Replacing the M1232 HDD Board ........................................ 59
3.8.1 M1232 HDD Board Features ........................................... 61
3.8.2 M1232 HDD Board Connector Pin Definitions ................ 63
3.9 Replacing the Power Distribution Board ............................... 65
3.10 Replacing the Power Supply............................................... 66
Appendix I: Cable Connection Tables ..........................................67
Appendix II: Technical Support..................................................... 69

http://www.tyan.com
9
Chapter 1: Overview
1.1 About the TYAN GT24-B7016-LE
Congratulations on your purchase of the TYAN®GT24-B7016-LE, a highly
optimized rack-mountable barebone system. GT24-B7016-LE is designed
to support up to two Intel® “Nehalem-EP processors and up to 144GB
DDR3-800/1066/1333 memory, providing a rich feature set and incredible
performance. Leveraging advanced technology from Intel®,
GT24-B7016-LE server system is capable of offering scalable 32 and 64-bit
computing, high bandwidth memory design, and lightning-fast PCI-E bus
implementtation.GT24-B7016-LE not only empowers your company in
nowadays IT demand but also offers a smooth path for future application
usage.
TYAN®is also proud to deliver GT24-B7016-LE in flavor while supporting
up to four hot-swap hard drives and one slim SATA DVD ROM.
GT24-B7016-LE uses TYAN®’s latest chassis featuring a robust structure
and a solid mechanical enclosure. All of this provides GT24-B7016-LE the
power and flexibility to meet the needs of nowadays server application.
1.2 Product Models
Model HDD Bays Power supply
B7016G24W4HR-LE Hot-swap,
4HDDs 450W redundant PSU
B7016G24V4HR-LE Hot-swap,
4HDDs 450W redundant PSU

http://www.tyan.com
10
1.3 Features
TYAN GT24-B7016-LE (B7016G24W4HR-LE/B7016G24V4HR-LE)
Form Factor 1U Rackmount
Chassis Name GT24
Dimension (D x W x H)
25.4" x 17.2" x 1.72" (645 x 436 x 43.6mm)
Motherboard S7016-LEWGM3NR-LE/S7016-LEGM3NR-LE
System
Gross Weight 16 kg
Buttons (1) RST / (1) NMI / (1) ID / (1) PWR w/ LED
LEDs (1) ID / (1) Warning / (3) LAN / (1) BMC
Front Panel
I/O Ports (2) USB ports
Type / Q'ty 3.5" /2.5” Hot-Swap / (4)
External Drive
Bay
Supported HDD
Interface
SAS 3.0Gb/s / SATA-II 3.0Gb/s
System
Cooling
Configuration
FAN (5) 4cm fans
Peripherals Type of ODD / Q'ty Slim-type SATA DVD-RW / (1)
Type ERPU-1U
Input Range Full-range AC(100-240V)
Frequency 47~63 Hertz
Output Watts 450 Watts
Power Supply
Efficiency PFC / 80-plus
Supported CPU Series
Intel Xeon Processor 5500 Series
Socket Type / Q'ty LGA1366 / (2)
Thermal Design Power
(TDP) wattage
95W
Processor
System Bus
Up to 4.8/ 5.86/ 6.4GT/s with Intel QuickPath Interconnect
(QPI) support

http://www.tyan.com
11
Chipset IOH / ICH Intel 5500 / ICH10R
Supported DIMM Qty
(18) DIMM sockets
DIMM Type / Speed DDR3 800/1066/1333 RDIMM/UDIMM
Capacity Up to 144GB at launch w/ dual rank RDIMMs
Memory channel 6 Channels (3 Channels per CPU)
Memory
Memory voltage 1.5V
PCI-E (1) PCI-E Gen.2 x8 slot / (1) PCI-E Gen.2 x16 slot (w/ x8 link)
Expansion
Slots
Pre-install TYAN Riser
Card
M2083-RS, PCI-E x16 1U riser card (left) / M2081-2, PCI-E x8
1U riser card (right)
Port Q'ty (3)
LAN
Controller Intel 82574L / Intel 82576EB
Controller
LSI SAS1068E
Speed 3.0 Gb/s
SAS
(optional)
RAID RAID 0/1/1E (LSI Integrated RAID)
Controller
ICH10R
Speed 3.0 Gb/s
Storage
SATA
RAID RAID 0/1/10/5 (Intel Matrix RAID)
Connector type D-Sub 15-pin
Resolution 1600x1200@75Hz
Graphic
Chipset ServerEngines Pilot2
USB (4) ports (2 at front, 2 at rear)
COM (1) DB-9 COM port
PS/2 (1) PS/2 connector (for Keyboard and Mouse)
VGA (1) D-Sub 15-pin port
I/O Ports
RJ-45 (3) ports
Chipset Winbond W83793G
System
Monitoring
Voltage Monitors voltage for CPU, memory, chipset & power supply

http://www.tyan.com
12
Temperature Monitors temperature for CPU & system environment
LED Fan fail LED indicator / Over temperature warning indicator
Others Chassis intrusion detection / Watchdog timer support
Onboard Chipset Onboard ServerEngines Pilot2
ServerEngines Pilot2
IPMI Feature
IPMI 2.0 compliant baseboard management controller (BMC) /
Supports storage over IP and remote platform-flash/ BIOS
update / Hardware-based security engine for SSL acceleration
Server
Management
ServerEngines Pilot2
iKVM Feature
Highest resolution secured KVM over IP / Dual 10/100/1000
Mb/s MAC interfaces
Brand / ROM size AMI / 4MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot /
ACPI 2.0 power management /Power on mode after power
recovery / User-configurable H/W monitoring /
Auto-configurable of hard disk types / Multiple boot options
Operating
System
OS supported list Please refer to our OS supported list.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint
Yes
Barebone (1) GT24B7016-LE Barebone
Installation CD (1) TYAN installation CD
Heatsink / Cooler (2) CHSK-0380, LGA1366 CPU heatsinks for S7016-LE
Rail kit (1) CRAL-0031, sliding rail kit for KGT24
Package
Contains
Mounting Ear (1) CEAR-0050, mounting ear kit for GT20/ GT24

http://www.tyan.com
13
Others (1) HDD screw pack
Power Cord (2) CCBL-0316, CCC/China

http://www.tyan.com
14
1.4 Standard Parts List
This section describes GT24-B7016-LE package contents and
accessories. Open the box carefully and ensure that all components are
present and undamaged. The product should arrive packaged as
illustrated below.
1.4.1 Box Contents
Component Description
1U chassis,(4) hot swap HDDbays
TYAN®S7016-LE system board
(pre-installed)
450W redundant Power Supply
(5) System FAN
M1008：
LED control board (pre-installed)
M1232 HDD Board
M2091 PCI-E riser card
M7016-PBD Power Distribution Board
(pre-installed)

http://www.tyan.com
15
1.4.2 Accessories
If any items are missing or appear damaged, contact your retailer or
browse to TYAN®’s website for service: http://www.tyan.com
The web site also provides information of other TYAN®products, as
well as FAQs, compatibility lists, BIOS settings, etc.
1 x TYAN®
Motherboard
Drive CD
2 x Heatsinks
HDD Screws Power Cables
Mounting Ears &
Screws

http://www.tyan.com
16
Rail Kit
Rail with Bracket x 2 Screw Pack
1.5 Optional Parts
Item
Model
Number
Picture Quantity Description
Chassis
Front-Bezel CFBZ-0070 1 Front Bezel for GT series 1U
chassis

http://www.tyan.com
17
1.6 About the Product
The following views show you the product.
1.6.1 System Front View
Control board
Slim SATA DVD-RW drive
USB ports ID button Reset button
NMI button
1.6.2 System Rear View
NIC3
Hot-swap HDD Ba
y
s
ID LED
Warnin
g
LED
BMC LED
Power button
(
with LED
)
NIC2
NIC1

http://www.tyan.com
18
1.6.3 LED Definitions
Front Panel
LED State Color Description
On Green System is turned on
On Green System is under S1 or S3 state
Power
LED
Off Off Power off
Blinking Green LAN active
On Green LAN linked
NIC1
off off LAN not linked
Blinking Green LAN active
On Green LAN linked
NIC2
off off LAN not linked
Blinking Green LAN active
On Green LAN linked
NIC3
off off LAN not linked
On Red
Fan fail /Over temperature
/Over voltage
Warning
LED Off Off No failure
On Blue System identified
ID LED Off Off System not identified
On Amber PSU fail
Blinking Amber PSU alert
BMC LED
Off Off No failure
Rear I/O
LAN1/LAN2
LED State Color Description
On Green 10Mb/100Mb/1000Mb linked
Blinking Green 10Mb/100Mb/1000Mb activity
RJ-45
Linkage/
Activity(left) Off Off No LAN linked
On Amber 1000Mb linked/activity
On Green 100Mb linked/activity
RJ-45
Linkage/
Activity(Right) Off Off 10Mb mode or No LAN linked
NOTE: “Left” and “Right” are viewed from the rear panel.

http://www.tyan.com
19
LAN3
LED State Color Description
On Green 10Mb/100Mb/1000Mb linked
Blinking Green 10Mb/100Mb/1000Mb activity
RJ-45 Linkage/
Activity(left) Off Off No LAN linked
On Amber 1000Mb linked/activity
On Green 100Mb linked/activity
RJ-45 Linkage/
Activity(Right) Off Off 10Mb mode or No LAN linked
ID LED
LED State Color Description
On Blue System identified
ID LED Off Off System not identified

http://www.tyan.com
20
1.6.4 Motherboard (S7016-LE) Layout
The diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram.