Udoo VISION User manual

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This manual is released under Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) license
Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.
SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.
Some of the information found in the UEFI BIOS SETUP Chapter has been extracted from the following copyrighted Insyde Software Corp. documents:
InsydeH2O Setup Utility - User Reference Guide
The above mentioned documents are copyright © 2008 Insyde Software Corp. All rights reserved.
To get the required assistance for any and possible issues, please contact us using the dedicated web form available at http://www.udoo.org/customer-
care/open.php.
Our team is ready to assist.
Revision
Date
Note
Ref
1.0
15th June 2021
First Official Release.
AR
REVISION HISTORY

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INDEX
INTRODUCTION.......................................................................................................................................................................... 6
1.1 Warranty...............................................................................................................................................................................................................................7
1.2 Information and assistance.....................................................................................................................................................................................................8
1.3 RMA number request.............................................................................................................................................................................................................8
1.4 Safety...................................................................................................................................................................................................................................9
1.5 Electrostatic discharges.........................................................................................................................................................................................................9
1.6 RoHS compliance ...............................................................................................................................................................................................................10
1.7 Labels................................................................................................................................................................................................................................10
1.8 FCC certification..................................................................................................................................................................................................................11
1.9 Terminology and definitions ..................................................................................................................................................................................................12
1.10 Reference specifications......................................................................................................................................................................................................14
OVERVIEW ................................................................................................................................................................................15
2.1 Introduction.........................................................................................................................................................................................................................16
2.2 Technical specifications.......................................................................................................................................................................................................17
2.3 Electrical specifications........................................................................................................................................................................................................18
2.3.1 RTC Battery .....................................................................................................................................................................................................................................18
2.3.2 Power consumption..........................................................................................................................................................................................................................19
2.3.3 Power rails naming convention ...........................................................................................................................................................................................................20
2.4 Mechanical specifications.....................................................................................................................................................................................................21
2.5 Block diagram.....................................................................................................................................................................................................................22
CONNECTORS..........................................................................................................................................................................23
3.1 Introduction.........................................................................................................................................................................................................................24
3.2 Connectors overview...........................................................................................................................................................................................................25
3.3 Connectors description........................................................................................................................................................................................................26
3.3.1 Ethernet connectors..........................................................................................................................................................................................................................26
3.3.2 USB ports........................................................................................................................................................................................................................................27
3.3.3 S-ATA Connectors............................................................................................................................................................................................................................28
3.3.4 eDP connector.................................................................................................................................................................................................................................29
3.3.5 miniDP++ Connector.........................................................................................................................................................................................................................30
3.3.6 Audio interfaces................................................................................................................................................................................................................................31
3.3.7 Buttons / LED header........................................................................................................................................................................................................................32
3.3.8 M.2 2260/3042 Socket 2 Key B SSD/WWAN Slot...............................................................................................................................................................................33
3.3.9 M.2 2230 Socket 1 Key E Connectivity Slot.........................................................................................................................................................................................35

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3.3.10 μSD + miniSIM Combo Slot...............................................................................................................................................................................................................36
3.3.11 COM Port Header.............................................................................................................................................................................................................................37
3.3.12 FAN Connector ................................................................................................................................................................................................................................38
3.3.13 Recovery Switch...............................................................................................................................................................................................................................38
3.3.14 GPIO Header ...................................................................................................................................................................................................................................38
3.3.15 ARDUINOTM interface.........................................................................................................................................................................................................................39
BIOS SETUP..............................................................................................................................................................................40
4.1 Aptio setup Utility.................................................................................................................................................................................................................41
4.2 Main setup menu ................................................................................................................................................................................................................42
4.2.1 System Time / System Date...............................................................................................................................................................................................................42
4.3 Advanced menu..................................................................................................................................................................................................................43
4.3.1 Trusted computing submenu..............................................................................................................................................................................................................44
4.3.2 ACPI Settings submenu.....................................................................................................................................................................................................................44
4.3.3 S5 RTC Wake Settings submenu .......................................................................................................................................................................................................45
4.3.4 CPU Configuration submenu..............................................................................................................................................................................................................46
4.3.5 AMI graphic Output Protocol Policy submenu....................................................................................................................................................................................... 47
4.3.6 PCI Subsystems Settings ..................................................................................................................................................................................................................47
4.3.7 Network Stack configuration submenu ................................................................................................................................................................................................48
4.3.8 CSM configuration submenu..............................................................................................................................................................................................................48
4.3.9 NVMe configuration submenu ............................................................................................................................................................................................................49
4.3.10 SDIO configuration submenu..............................................................................................................................................................................................................49
4.3.11 USB configuration submenu...............................................................................................................................................................................................................49
4.3.12 Platform Trust technology submenu ....................................................................................................................................................................................................50
4.3.13 Main Thermal Configuration submenu..................................................................................................................................................................................................50
4.3.14 HSUART Transceiver Configuration submenu.......................................................................................................................................................................................50
4.3.15 Embedded Controller submenu..........................................................................................................................................................................................................51
4.3.16 M.2 peripheral management submenu................................................................................................................................................................................................54
4.4 Security menu.....................................................................................................................................................................................................................55
4.5 Power menu.......................................................................................................................................................................................................................56
4.5.1 Advanced CPU control submenu........................................................................................................................................................................................................58
4.5.2 EC Watchdog Configuration submenu.................................................................................................................................................................................................59
4.5.3 Thermal Zone configuration submenu..................................................................................................................................................................................................59
4.6 Boot menu..........................................................................................................................................................................................................................60
4.6.1 Legacy submenu..............................................................................................................................................................................................................................62
4.7 Exit menu ...........................................................................................................................................................................................................................63
APPENDICES.............................................................................................................................................................................64

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5.1 Thermal Design...................................................................................................................................................................................................................65
5.2 Accessories........................................................................................................................................................................................................................66
5.2.1 Metal case.......................................................................................................................................................................................................................................66

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•Warranty
•Information and assistance
•RMA number request
•Safety
•Electrostatic discharges
•RoHS compliance
•Labels
•FCC certification
•Terminology and definitions
•Reference specifications

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1.1Warranty
This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.
The warranty on this product lasts for 2 years.
Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.
Items cannot be returned unless previously authorized by the supplier.
The authorization is released after completing the specific form available on the web-site http://www.udoo.org/customer-care/ (Open a New Ticket →Return
Merchandise Application). The RMA authorization number must be put both on the packaging and on the documents shipped with the items, which must include all
the accessories in their original packaging, with no signs of damage to, or tampering with, any returned item.
The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.
Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the
Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.
Warning!
All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’s functionalities and could
void the warranty

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1.2Information and assistance
What do I have to do if I’m experiencing problems with my product?
The following services are available:
•UDOO website: visit http://www.udoo.org to receive the latest information on the product. In most cases it is possible to find useful information to solve the
problem.
•UDOO Forum: join to the community of UDOO users. In the forum, available at http://www.udoo.org/forum/, it is possible to search the multiple topics of the
community, and look for other users that had the same kind of problem - and how they solved it. It is also possible to post new topics to ask for specific
help.
•Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:
oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.
oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or
customer neglect.
Note: Please have the following information before asking for technical assistance:
•Name and serial number of the product;
•Description of Customer’s peripheral connections;
•Description of Customer’s software (operating system, version, application software, etc.);
•A complete description of the problem;
•The exact words of every kind of error message encountered.
1.3RMA number request
To request a RMA number, please visit UDOO web-site. On the bottom of the page, please select “Customer Care”, click on the “Open a New ticket”button and.
A RMA Number will be sent within 1 working day (only for on-line RMA requests).

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1.4Safety
The UDOO VISION board uses only extremely-low voltages.
While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.
CE and FCC certification retained using only the UDOO VISION qualified Power Supply Unit. When not using UDOO VISION qualified Power Supply, use 12VDC
(min 36W power) PSUs certified for your country (make sure that the power cable is less than 3 mt. long).
UDOO VISION qualified PSU: XYY-120300U. Input: 100-240VAC 50/60Hz. Output: 12VDC 3A 48WMax
CE and FCC certifications retained with the board equipped with the UDOO VISION metal case. When not available, it is suggested to use a case with the same
attributes as the UDOO VISION metal Case, sold as an accessory (P/N: KTMC-D02-COV01.00).
1.5Electrostatic discharges
The UDOO VISION board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all
the devices and/or components on-board.
This product should be operated in a well-ventilated environment and, if used inside a case, the case should not be covered.
This product should be elevated on a stable, flat, electrically non-conductive surface whilst in operation, and clear from any object that
can induce a short-circuit.
Do not expose it to water, moisture or heat from any source; UDOO VISION is designed for reliable operation at normal ambient room
temperatures.
Avoid handling the warm and moving parts (like the fan) and generally the printed circuit board while it is powered
Whenever handling a UDOO VISION board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static
surface is also highly recommended. During normal work condition of UDOO VISION board, do not touch the product.

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1.6RoHS compliance
The UDOO VISION board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.
1.7Labels
The parts highlighted in red (the QR Code and the Serial Number) will change for every Board.
The S/N is divided in:
YY= Year of Manufacturing.
MM= Month of Manufacturing.
XXXXX= Monthly Progressive Number
In addition, since the UDOO VISION system is susceptible to electrostatic discharges, the right label is included in the package and must be
applied in the final end-user external metal case, to indicate that UDOO VISION includes static sensitives components and do not have to be
touched during normal working mode condition.
UDOO VISION System does not include the metal case, that will be sold as a separate accessory. For this reason, the UDOO VISION
system will include the labels in a separate package shipped by Seco S.p.A. These labels must be properly applied by the customer
in the final end-user external metal case.

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1.8FCC certification
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and,
if not installed andused in accordance with the instructions, may causeharmful interference to radio communications. However, thereis no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Warning!
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.

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1.9Terminology and definitions
ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management
AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface
API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating
Systems
BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading
CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control
DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)
DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock
DP++ Multimode Display Port, a video interface which can support both Display Port displays (directly) and HDMI/DVI displays (by using and external
adapter)
eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays
EHCI Enhanced Host Controller interface, a high-speed controller for USB ports, able to support USB2.0 standard
FFC/FPC Flexible Flat Cable / Flat Panel Cable
GBE Gigabit Ethernet
Gbps Gigabits per second
GND Ground
GPI/O General purpose Input/Output
HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality
I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability
IoT Internet of Things
LPDDR4 Low-Power Double Data Rate Synchronous Dynamic Random Access Memory, 4th generation
M.2 recent specifications for internal expansion modules, which defines many pinouts and sizes for different purposes. Can include SATA, PCI Express,
USB, UART, DP interfaces
Mbps Megabits per second
MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of the
MMC. They are devices that incorporate the flash memories on a single BGA chip.
N.A. Not Applicable
N.C. Not Connected

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OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using
Graphics Processing Units (GPU)
OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics
OS Operating System
OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port.
PCI-e Peripheral Component Interface Express
PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems
PSU Power Supply Unit
PWM Pulse Width Modulation
PWR Power
PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS
S-ATA Serial Advance Technology Attachment, a differential full duplex serial interface for Hard Disks
SD Secure Digital, a memory card type
SDHC Secure Digital Host Controller
SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and
other power supply-related devices
SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually
enabled through a Chip Select line
TBM To be measured
TDP Thermal Design Power, an indication of the amount of heat generated by the processor that must be used for the design of the thermal solution.
TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces
UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the
original BIOS interface
UIM User Identity Module, an extension of SIM modules.
USB Universal Serial Bus
V_REF Voltage reference Pin
xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

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1.10Reference specifications
Here below it is a list of applicable industry specifications and reference documents.
Reference
Link
ACPI
http://www.acpi.info
AHCI
http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html
DDC
http://www.vesa.org
DP, eDP
http://www.vesa.org
Gigabit Ethernet
http://standards.ieee.org/about/get/802/802.3.html
HD Audio
http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf
I2C
http://www.nxp.com/documents/other/UM10204_v5.pdf
Intel®Front Panel I/O connectivity DG
http://www.formfactors.org/developer/specs/A2928604-005.pdf
M.2
http://pcisig.com/specifications
MMC/eMMC
http://www.jedec.org/committees/jc-649
OpenCL
http://www.khronos.org/opencl
OpenGL
http://www.opengl.org
PCI Express
http://www.pcisig.com/specifications/pciexpress
SATA
https://www.sata-io.org
SD Card Association
https://www.sdcard.org/home
SM Bus
http://www.smbus.org/specs
TMDS
http://www.siliconimage.com/technologies/tmds
UEFI
http://www.uefi.org
USB 2.0 and USB OTG
http://www.usb.org/developers/docs/usb_20_070113.zip
USB 3.0
http://www.usb.org/developers/docs/usb_30_spec_070113.zip
Intel®Atom Apollo Lake family
https://ark.intel.com/content/www/us/en/ark/products/codename/80644/apollo-lake.html#@Embedded

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2.1Introduction
UDOO VISION is a system designed specifically for maker s / DIY market, made by a Single Board Computer in pico-ITX form factor (just 100 x 72mm), embedding
both a System-on-Chips (SoC) of the Intel®family of embedded SoCs formerly coded as Apollo Lake, and an Arduino Leonardo compatible platform.
The UDOO VISION Single Board Computer is equipped with an active heatsink with FAN to prevent system hang-off or faults.
The UDOO VISION board represents a junction point between the PC world, represented by the Apollo Lake SoCs, and the Arduino Leonardo World, implemented
on-board using an Atmel ATmega32u4 microcontroller.
All the possible SoCs mounted on UDOO VISION are Quad Core Intel®XX CPUs with 1.6 GHz base frequency and with 64-bit instruction set and very
low TDP. This single chip solution includes the memory controller, which gives support for up 32-bit Quad-Channel LPDDR4 2400 MT/s Memory.
All SOCs embed an Integrated Intel®HD Graphics 500 series controller with up to 18 Execution Units, which offer high graphical performances, with support for
Microsoft®DirectX12, OpenGL 4.3, OpenCL 1.2, OpenGLES 3.0 and HW acceleration for video encoding and decoding of HEVC (H.265), H.264, JPEG/MJPEG.
It is also possible the HW video decoding only of VP9, MPEG2, VC-1 and WMV9. This embedded GPU is able to drive two independent displays, by using the eDP
and the miniDP++ connectors. Any combinations of these video interfaces are supported.
Mass Storage capabilities of the UDOO VISION board include two external S-ATA Gen3 channels (one available on a standard SATA 7p Male connector, the other
on an M.2 Socket 2 Key B Slot), a standard 4-bit SD interface and one optional eMMC Drive soldered on board.
Further features usable on UDOO VISION board are WWAN M.2 Socket 2 Key B Slot connected to a miniSIM slot for modems, seven USB ports (two USB 3.0 on
standard Type-A socket, two USB 2.0 on dual internal pin header, one USB 2.0 on M.2 Socket 1 Key E Connectivity slot, one USB 3.0 on M.2 Key B slot and
another USB 2.0 port used for the communications with the Atmel microcontroller), HD Audio and three PCI Express lanes, (two PCI express lanes are used for the
implementation of the Gigabit Ethernet interfaces, one lane is carried out on M.2 Socket 1 Key E Connectivity Slot) up to 2x Gigabit Ethernet connections, one M.2
Socket 1 Key E Slot for WiFi+BT M.2 modules.
Through the Intel®Apollo Lake SoC s USB interface #6 pass all the communications with the Atmel microcontroller, which implements the Arduino Leonardo interface:
this situation reproduces exactly the situation of an external Arduino board connected to an X86 PC, with the advantages given by an integrated board solution.
All these features, combined together, make UDOO VISION the most powerful maker system ever.
Please refer to following chapter for a complete list of all the integrated peripherals and the characteristics.

2.2Technical specifications
SOC
8th generation Intel®family of SOCs:
Intel®-E3950, Quad Core @1.6GHz, 2MB L2 Cache, 12W TDP
Intel®-E3940, Quad Core @1.6GHz, 2MB L2 Cache, 9.5W TDP
Memory
Up to 8GB 32-bit Quad-Channel LPDDR4 soldered on-board, up to 2400 MT/s
Graphics
Integrated Intel®HD Graphics 500 series controller
Two independent displays support
HW decoding of HEVC(H.265), H.264, MVC , VP8, VP9, MPEG2, VC-1, WMV9,
JPEG/MJPEG formats
HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats
Video Interfaces
eDP connector
miniDP++ connectors
Video Resolution
eDP, resolution up to 3840 x 2160 @60Hz
DP++, resolution up to 4096x2160 @ 60Hz
Mass Storage
Optional eMMC drive onboard, up to 64GB
SATA Gen3 7p M connector
M.2 Key B SSD slot (Type 2242/3042/2280 modules accepted)
microSD Card slot (combo with miniSIM slot)
Networking
2x Gigabit Ethernet LAN ports, using Intel®I21x family Gigabit Ethernet controllers
M.2 Key B WWAN Slot (Type 2260/3042 modules accepted)
M.2 Connectivity Slot (Socket 1 Key E type 2230) for plugging WiFi+BT modules
USB
2 x USB 3.0 ports on Dual Type-A socket
1 x USB 3.0 port on M.2 Key B slot
2 x USB 2.0 host ports on internal dual pin header
1 x USB 2.0 port available on M.2 Key E Slot
PCI-Express
2 x PCI-e x1 port on Gigabit Ethernet Controllers
1 x PCI-e x1 port on M.2 Key E Slot
Audio
HD Audio Codec Cirrus Logic CS4207
Combo TRSS connector with Mic In and Line out support
Serial ports
2 x RS-232/RS-422/RS-485 Serial ports on internal pin header
Other Interfaces
miniSIM slot for M.2 modems (combo with microSD slot)
8 x GPI/Os connector
Tachometric FAN connector
Switch/LED Front Panel Header
Arduino Leonardo compatible interface
Power supply: +12VDC ± 5%
Cabled coin cell battery for RTC
SATA 4p M power connector
Operating temperature: 0°C ÷ +60°C** (Commercial temperature)
Dimensions: picoITX form factor 72x100 mm (2.83”x 3.93”).
Supported Operating Systems:
Microsoft®Windows 10 Enterprise (64-bit)
Microsoft®Windows 10 IoT Core (32- /64-bit)
WindRiver Linux 64-bit
Yocto (64-bit)
** Environmental temperature, measured using UDOO VISION Standard
heatsink

2.3Electrical specifications
The UDOO VISION board needs to be supplied only with an external 12VDC ± 5% power supply, minimum 36W for
basic functionalities recommended.
This voltage can be supplied through a standard 5.7mm (internal pin, diameter 2.0 mm) Power Jack (CN2).
Internal pin is VIN power line.
2.3.1 RTC Battery
For the occurrences when the module is not powered with an external power supply, on board there is a cabled coin Lithium Battery to supply, with a 3V voltage,
the Real Time Clock embedded inside the Intel®SoC.
Battery used is a cabled CR2032S-LD Lithium coin-cell battery, with a nominal capacity of 220mAh.
The battery is not rechargeable, and can be connected to the board using dedicated connector CN3 which is a 2-pin
p1.27 mm type MOLEX p/n 53261-0271 or equivalent, with pinout shown in the table on the left.
Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals.
In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation
before inserting and make sure that they are aligned correctly and are not damaged or leaking.
Never allow the batteries to become short-circuited during handling.
Batteries supplied with UDOO VISIOM are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of
order UDOO VISION, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above
mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.
Battery connector CN3
Pin
Signal
1
VRTC
2
GND
CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

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2.3.2 Power consumption
Using the following setup, and using all possible SoCs offered for UDOO VISION board, the current consumption (RMS) has been measured on the VIN Power line
when the board is supplied through DC power jack CN2 using a +12VDC Notebook DC Adapter.
•O.S. Windows 10 Professional
•USB mouse and keyboard connected
•UEFI BIOS Release 1.01
Independently by the SoC mounted onboard, the following power consumptions are common to all boards:
Battery Backup power consumption: 3.4μA
Soft-Off State power consumption: 78.7mA
Suspend State power consumption: 89.8mA
Please consider that the power consumption depends strongly on the utilization scenario.
For these reasons, it is recommended to use PSU with a minimum power of 36W for basic functionalities
Status
SoC / Configuration
Intel® Atom® E3950
64GB eMMC
8GB RAM
Intel® Atom® E3940
32GB eMMC
4GB RAM
Average Value (60s)
Peak Value
Average Value (60s)
Peak Value
W
A
W
A
W
A
W
A
Idle, power saving configuration
3.45
0.288
4.45
0.370
3.03
0.252
3.44
0.286
OS Boot, power saving configuration
5.95
0.494
14.20
1.183
5.23
0.436
12.04
1.003
Video reproduction@1080p, power saving configuration
6.33
0.527
9.26
0.772
5.69
0.474
8.47
0.705
Video reproduction 4K, power saving configuration
9.57
0.797
14.74
1.228
8.74
0.728
10.75
0.895
Internal Stress Test Tool, maximum performance
22.53
1.887
24.13
2.011
14.56
1.213
15.97
1.330

VISION
UDOO VISION User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: A.R. - Reviewed by M.B. Copyright © 2021 SECO S.p.A
20
2.3.3 Power rails naming convention
In all the tables contained in this manual, Power rails are named with the following meaning:
_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_RUN, +5V_RUN.
_ALW: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW.
Other suffixes are used for application specific power rails, which are derived from same voltage value of voltage switched rails, if it is not differently stated.
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