V-TEK Royce DE35-ST User manual

DE35-ST & DE35-300
User’s Guide
User’s Guide #D292469I
Royce Instruments
480 Technology Way
Napa, CA 94558
PH [phone]
www.royceinstruments.com
V-TEK, Inc.
751 Summit Avenue
Mankato, MN 56001
PH [phone]
www.vtekusa.com

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BLANK PAGE

EC Declaration of Conformity
Manufacturer’s Name: V-TEK Inc.
Manufacturer’s Address: 751 Summit Avenue
Mankato, MN 56001
Bearing sole responsibility, hereby declare that the product referred to by this declaration is in conformity
with the following standards or normative documents:
Description: Royce Die Sorter
Specification: Model DE35-ST
Serial #: XXXXXXX
The following standards have either been referred to or been complied with in part or in full as
relevant :
Low Voltage Directive (LVD)
EN 61010
Safety Requirements for Electrical Equipment for
Measurement, Control and Laboratory Use
89/336/EEC
Electromagnetic Compatibility (EMC)
EN61326: 1997
EN55011: 1998
2011/65/EU
RoHS 2
Restriction of Hazardous Substances
Full Name of responsible person and place of signing
Mitchell Jacobs
Place V-TEK Inc. Position President/CEO
Signature Date 02/11/2021
751 Summit Avenue, Mankato, Minnesota 56001 USA
Telephone: [phone] Fax No. [phone]

DE35-ST Operating Instructions
D292469I 3
CONTENTS
Contents 3
Introduction & Overview 7
Overview 7
Utility Requirements 8
Installed Dimensions: DE35-ST 8
Installed Dimensions: DE35-300 8
Machine Setup & Installation 9
Safety Instructions 10
Unpacking & Installation 12
Uncrate the DE35/DE35-300 12
Unpack the Carton 12
Setup & Start-Up 13
Connections & Setup 13
Power Up 14
Installing an Eject Head 15
Installing a Pickup Tip 16
Installing the Wafer Holder 17
Check Follow Focus & Zoom Center 18
System Alignment: DE35 19
System Alignment: DE35-300 21
Basic Operation 26
Operational Set Up 26
Calibrating Waffle Packs 42
Full Cycle: Pick & Place in Single Step Mode 43
Detailed Operation 45
Menus 45
Overview 45

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Output Select 46
Synchronized Die Lift: 49
X-Axis Placement Sequence: 50
Inspections Options 52
Die Inverter: Selected/Not Selected 52
Output Sizes Menu 53
Modes of Operation 57
Run Mode 57
Keyboard Function in Run Mode 57
Single Step Mode 61
Keyboard Function in Single Step/Teach Mode 61
Pick & Place Cycle 63
Teach Mode 66
Output Setup 67
Changing Output Sizes 67
Selecting a New Die Count 67
Selecting a New Waffle Pack Type 67
Calibrating Waffle Packs 68
Programming Waffle Pack Dimensions 70
Erasing Unwanted Pattern Numbers 72
Changing Output Configuration 73
Pickup Head Adjustment 74
Adjusting the Pickup Height and Position 74
Adjusting the Die Pickup Delay 74
Adjusting Lift to Search Height 75
Adjusting Pickup Tip Height at Placement 75
Adjusting Die Pickup Tip Force 76
Adjusting Pickup Tip Purge (Blow Off) 77
Die Eject System 79
Adjusting the Die Ejector 79

DE35-ST Operating Instructions
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Adjusting the Die to the Pickup Tip: DE35-ST 81
Die Inverter System 83
Die Inverting Cycle 84
Die Inverting Discussion 86
Adjust Die Inverter Home Position 87
Adjust the Inverter Flexure 88
Adjust Inverter Z & Y Position 88
Non-Surface Contact Operation 89
Non-Surface Contact Pickup Cycle 89
Edge Pick Up 91
Adjust Pickup Grippers 92
Replace Gripper Fingers 93
Die Underside Inspection 95
Adjust Pickup Tip Height at Underside Inspection 95
Underside Inspection Cycle 96
Die Facet Inspection 97
Adjust Pickup Tip Height at Facet Inspection 97
Adjust Die Position on Rotating Spindle at Facet Inspection 97
Facet Inspection Cycle 99
Wafer Holders 100
Wafer Holder Interlock 101
Film Frame Holders 102
Operation of Expanding Film Frame Holder 102
Ring Holders 103
Operation of Expanding Ring Holder 103
DES-AUM Die Eject Actuator 105
Adjust Needle Speed & Height 105
Basic Troubleshooting & Maintenance 107

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Preventative Maintenance Schedule 107
Bi-monthly Maintenance 107
Semi-Annual Maintenance: 109
Maintenance Procedures 111
Setting the Camera Tube Mounting Position 111
Optical Center and Follow Focus Setup 111
Adjusting Pickup Height at the Pick Position 112
Adjust Pickup Height at Place Positions 112
Eject Head Maintenance, Needle Replacement and Planarization. 113
Needle Replacement and Planarization: EJT, EJTN, EJM, EJMN, EJA, EJAN
113
Required Tooling & Supplies: 113
Links: 113
General Mirror Use Tips: 113
Eject Head Overview 114
0.75” Diameter Eject Heads 114
1.1, 1.5 & 2.0 Diameter Eject Heads 115
Needle Replacement & Planarization of 0.75 inch diameter (small) Eject Heads
117
Removal of broken needles 117
Insertion of new needle(s) and planarization. 119
Removal of broken needles 122
Eject Needle List 128
Appendices 130
Appendix A: Table of Recommended Eject Heads 130
Appendix B: Table of Recommended Pick-Up Tips 132
Appendix C: Recommended Spare Parts 134
Immediate Production Back Up Spare Parts 134
Production Back Up Spare Parts 134
Long Term Spare Parts 135
Appendix D: Table of Fluoroware Waffle Pack Dimensions 136

DE35-ST Operating Instructions
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Introduction & Overview
Overview
The DE35 ST and DE35-300 semi-automatic die pick-and-place systems are a simple low
cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die
can be placed into waffle packs, gel packs, film frames, or directly onto substrates. The
DE35-ST and DE35-300 will handle die sizes from as small as 0.008 inch square to over 1.0
inch square.
Setup and option information is preserved in non-volatile memory so that following a
weekend shutdown, for example, you can restart the machine without further setup.
Waffle pack pockets for die placement are automatically selected. Manual selection using
the keyboard arrow keys enables completion of partially filled waffle packs. If a grading
output mode is selected, the machine places the die in the next pocket of the
corresponding waffle pack and advises the operator when any of the waffle packs are full.
Standard configuration is for Surface contact pick up, where the die is lifted by an eject
needle and the pickup tip touches the die and holds the die with vacuum. The system is
also available in a Non-Surface Contact, (NSC) configuration. In NSC, the die is picked by
the edges using tweezers like fingers.
Additional options available with the DE35 Series allow for Underside inspection of the
die picked and Facet inspection for Laser Diode operations.

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Utility Requirements
AIR 40 - 80 psi (2.7 - 5.4 atm), oil free
Tubing, polyurethane, 85A, 1/8 ID, 1/4 OD, 126 PSI MAX @ 75 DEG F,
TRANSPARENT BLUE, or equivalent (customer supplied).
Note: Oil free air preferred since some discharge to atmosphere will take place.
VACUUM 20 in Hg (508 mm Hg)
Tubing, vinyl (PVC OR TYGON), 1/8 ID, 1/4 OD, CLEAR, or equivalent
(customer supplied)
ELECTRICAL 110-220 VAC, 50 - 60 HZ
POWER 25 watts continuous, 50 watts intermittent
FUSE: DE35-ST 5 Amp
DE35-300 5 Amp
Installed Dimensions: DE35-ST
WIDTH 45 in. (1.15m)
DEPTH 33 in. (0.83m)
HEIGHT 25 in. (0.66m)
WEIGHT 205 lb. (93 kg)
Note: All dimensions are approximate and subject to change without notice.
Installed Dimensions: DE35-300
WIDTH 48.0 in. (1.22m)
DEPTH 40.3 in. (1.02m)
HEIGHT 26 in. (0.66m)
WEIGHT 430 lb. (195 kg)
Note: All dimensions are approximate and subject to change without notice.

DE35-ST Operating Instructions
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Machine Setup & Installation
The DE35 ST Die Pick and Place System is intended to be installed in a facility meeting
the listed environmental requirements unless otherwise specified in a particular section.
•Indoor use
•Altitude up to 2000 meters
•60 to 70 degrees Fahrenheit
•Maximum Relative Humidity of 10 to 90 percent, non-saturating.
•Main supply voltage fluctuations not to exceed ±10% of nominal voltage.
•Transient over-voltages according to installation categories: Over voltage
Categories II
•Pollution Degree 2
If the equipment is used in a manner not specified by the manufacturer, the protection
provided by the equipment may be impaired.