Western Digital OpenFlex F3 Series User manual

User Guide
OpenFlex™ F3x00 and E3000
1ET2212
Version 1.1
December 2020

User Guide Table of Contents
Table of Contents
Revision History.................................................................................................................................... iv
Notices....................................................................................................................................................v
Points of Contact..................................................................................................................................vi
Chapter 1. Overview.........................................................................................................1
OpenFlex F3x00 and E3000................................................................................................................2
Servicing Features.........................................................................................................................3
Composable Infrastructures......................................................................................................... 3
NVMe-oF........................................................................................................................................ 4
Supported SKUs............................................................................................................................4
System Architecture Overview........................................................................................................... 5
System High Speed Data Ingest Architecture........................................................................... 5
System Thermal and Cooling...................................................................................................... 5
Electrical Specifications....................................................................................................................... 7
Environmental Specifications.............................................................................................................. 8
Mechanical Specifications................................................................................................................... 8
Performance Specifications................................................................................................................. 9
Physical Design.................................................................................................................................... 11
LEDs.............................................................................................................................................. 13
Cables...........................................................................................................................................16
Restrictions and Limitations............................................................................................................... 16
Site Requirements............................................................................................................................... 17
Power Requirements................................................................................................................... 17
Rack Requirements...................................................................................................................... 17
Thermal and Cooling Requirements..........................................................................................18
Installation and Servicing Requirements................................................................................... 18
Chapter 2. Components............................................................................................... 20
Chassis................................................................................................................................................. 21
i

User Guide Table of Contents
Chassis Specifications................................................................................................................. 21
PSU...................................................................................................................................................... 22
PSU Specifications...................................................................................................................... 22
Fan Module......................................................................................................................................... 23
Fan Module Specifications......................................................................................................... 23
BMC Module....................................................................................................................................... 24
BMC Module Specifications....................................................................................................... 24
Rails......................................................................................................................................................25
Rails Specifications..................................................................................................................... 25
OpenFlexF3x00................................................................................................................................... 26
OpenFlexF3x00 Specifications...................................................................................................26
OpenFlex E3000 Fabric Device Blank...............................................................................................27
E3000 Fabric Device Blank Specifications...............................................................................27
List of Field/Customer Replaceable Units....................................................................................... 28
Chapter 3. Management............................................................................................... 29
OCGUI................................................................................................................................................. 30
Compatible Browsers.................................................................................................................30
Login Page.................................................................................................................................. 30
Dashboard.................................................................................................................................... 31
Storage Device Page..................................................................................................................36
Chassis Device Page.................................................................................................................. 43
Basic Operational Functions...................................................................................................... 50
Maintenance................................................................................................................................ 96
Firmware Upgrade.................................................................................................................... 106
Part Replacement.............................................................................................................................. 113
Fan Module Replacement..........................................................................................................113
PSU Replacement.......................................................................................................................116
BMC Module Replacement.......................................................................................................120
ii

User Guide Table of Contents
OpenFlexF3x00 Replacement...................................................................................................123
Rails Replacement..................................................................................................................... 127
Chassis Replacement................................................................................................................ 145
Chapter 4. Safety......................................................................................................... 166
Electrostatic Discharge.....................................................................................................................167
Optimizing Location..........................................................................................................................167
Power Connections...........................................................................................................................167
Power Cords......................................................................................................................................167
Rackmountable Systems.................................................................................................................. 168
Restricted Access Location............................................................................................................. 168
Safety and Service............................................................................................................................168
Safety Warnings and Cautions........................................................................................................ 169
Chapter 5. Regulatory................................................................................................. 170
Europe (CE Declaration of Conformity)........................................................................................... 171
FCC Class A Notice...........................................................................................................................171
ICES-003 Class A Notice—Avis NMB-003, Classe A....................................................................... 171
Japanese Compliance Statement, Class A ITE................................................................................ 171
KCC Notice (Republic of Korea Only), Class A ITE........................................................................ 172
Taiwan Warning Label Statement, Class A ITE...............................................................................172
iii

User Guide Revision History
Revision History
Date Revision Comment
July 2020 1.0 Initial Release
December 2020 1.1 Added UK Import Representation Contact
iv

User Guide Notices
Notices
Western Digital Technologies, Inc. or its affiliates' (collectively “Western Digital”) general policy does not
recommend the use of its products in life support applications wherein a failure or malfunction of the product
may directly threaten life or injury. Per Western Digital Terms and Conditions of Sale, the user of Western
Digital products in life support applications assumes all risk of such use and indemnifies Western Digital
against all damages.
This document is for information use only and is subject to change without prior notice. Western Digital
assumes no responsibility for any errors that may appear in this document, nor for incidental or consequential
damages resulting from the furnishing, performance or use of this material.
Absent a written agreement signed by Western Digital or its authorized representative to the contrary,
Western Digital explicitly disclaims any express and implied warranties and indemnities of any kind that may,
or could, be associated with this document and related material, and any user of this document or related
material agrees to such disclaimer as a precondition to receipt and usage hereof.
Each user of this document or any product referred to herein expressly waives all guaranties and warranties
of any kind associated with this document any related materials or such product, whether expressed or
implied, including without limitation, any implied warranty of merchantability or fitness for a particular
purpose or non-infringement. Each user of this document or any product referred to herein also expressly
agrees Western Digital shall not be liable for any incidental, punitive, indirect, special, or consequential
damages, including without limitation physical injury or death, property damage, lost data, loss of profits or
costs of procurement of substitute goods, technology, or services, arising out of or related to this document,
any related materials or any product referred to herein, regardless of whether such damages are based on
tort, warranty, contract, or any other legal theory, even if advised of the possibility of such damages.
This document and its contents, including diagrams, schematics, methodology, work product, and
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exclusive property of Western Digital. No intellectual property license, express or implied, is granted by
Western Digital associated with the document recipient's receipt, access and/or use of this document or the
products referred to herein; Western Digital retains all rights hereto.
Western Digital, the Western Digital logo, and OpenFlex are registered trademarks or trademarks of Western
Digital Corporation or its affiliates in the US and/or other countries. All other marks are the property of their
respective owners. Product specifications subject to change without notice. Pictures shown may vary from
actual products. Not all products are available in all regions of the world.
Western Digital
5601 Great Oaks Parkway
San Jose, CA 95119
© 2020 Western Digital Corporation or its affiliates. All Rights Reserved.
v

User Guide Points of Contact
Points of Contact
For further assistance with a Western Digital product, contact Western Digital Datacenter Platforms technical
support. Please be prepared to provide the following information: part number (P/N), serial number (S/N),
product name and/or model number, and a brief description of the issue.
Email:
[e-mail]
Website:
https://portal.wdc.com/Support/s/
UK Import Representation Contact
Western Digital UK Limited Hamilton House, Regent Park, Kingston Road Leatherhead, Surrey KT22 7PL, GB,
United Kingdom
Telephone: [phone]
vi

Western Digital
Overview
In This Chapter:
- OpenFlex F3x00 and E3000..........................2
- System Architecture Overview..................... 5
- Electrical Specifications.................................7
- Environmental Specifications........................8
- Mechanical Specifications............................. 8
- Performance Specifications...........................9
- Physical Design.............................................. 11
- Restrictions and Limitations........................ 16
- Site Requirements.........................................17
1

User Guide 1. Overview
1.1 OpenFlex F3x00 and E3000
1.1 OpenFlex F3x00 and E3000
The OpenFlex F3x00 and E3000 is a 3U rack
mounted data storage enclosure built on the
OpenFlex platform. OpenFlex is Western Digital’s
architecture that supports Open Composable
Infrastructure (OCI). The OpenFlex F3x00 and E3000
are fabric devices that leverage this OCI approach
in the form of disagreggated data storage using
NVMe-over-Fabrics (NVMe-oF™). NVMe-oF is a
networked storage protocol that allows storage
to be disaggregated from compute to make that
storage widely available to multiple applications and
servers. By enabling applications to share a common
pool of storage capacity, data can be easily shared
between applications, or needed capacity can be
allocated to an application regardless of location. Exploiting NVMe™ device-level performance, NVMe-
oF promises to deliver the lowest end-to-end latency from application to shared storage. NVMe-oF
enables composable infrastructures to deliver the data locality benefits of NVMe DAS (low latency, high
performance) while providing the agility and flexibility of sharing storage and compute.
The maximum data storage capacity is 614TB1 when leveraging a full set of 10 F3x00 fabric devices.
The enclosure runs on an input voltage of 200V - 240V and consumes ~1400W of power under typical
conditions. It requires a maximum of 1600W at full load.
Composable Infrastructure
An emerging category of
datacenter infrastructure that
seeks to disaggregate compute,
storage, and networking fabric
resources into shared resource
pools that can be available
for on-demand allocation (i.e.,
“composable”). Composability
occurs at the software level,
disaggregation occurs at the
hardware level using NVMe™-
over-Fabric—will vastly improve
compute and storage utilization,
performance, and agility in the
data center.
OpenFlex
OpenFlex is Western Digital’s
architecture that supports Open
Composable Infrastructure
through storage disaggregation
– both disk and flash natively
attached to a scalable fabric.
OpenFlex does not rule out
multiple fabrics, but whenever
possible, Ethernet will be used as
a unifying connect for both flash
and disk because of its broad
applicability and availability.
Open Composable API
Western Digital's new Open
Composable API is designed
for data center composability.
It builds upon existing industry
standards utilizing the best
features of those standards as
well as practices from proprietary
management protocols.
• 614TB2 • 200V - 240V Input Voltages • Dual 1600W PSUs
• 12GBps NVMe-oF over QSFP28
Cables
• 3U Form Factor • Operational Temperature: 5°C to
35°C
• 68.5 kg (151.1 lbs.) • Hot-swappable PSUs and Fans • Dynamic Provisioning Supported
1. Max storage capacity depends on device version and device configuration.
2

User Guide 1. Overview
1.1 OpenFlex F3x00 and E3000
1.1.1 Servicing Features
The OpenFlex F3x00 and E3000 are equipped with several features that make servicing simpler and safer.
•Every CRU component has been designed with toolless removal features.
•The BMC Module, Fan Module, PSU, and F3x00 devices are all hotswappable components.
This document provides full instructions on how these features operate in the Management (page 29)
section.
1.1.2 Composable Infrastructures
An emerging category of datacenter infrastructure that seeks to disaggregate compute, storage, and
networking fabric resources into shared resource pools that can be available for on-demand allocation (i.e.,
“composable”). Composable occurs at the software level, disaggregation occurs at the hardware level.
Western Digital’s vision for Open Composable Infrastructures is based on four key pillars:
•Open
◦Open in both API and form factor
◦Designed for robust interoperability of multi-vendor solutions
•Scalable
◦Ability to compose solutions at the width of the network
◦Enable self-organizing systems of composable elements that communicate horizontally
•Disaggregated
◦Pools of resources available for any use case that is defined at run time
◦Independent scaling of compute & storage elements to maximize efficiency & agility
•Extensible
◦Inclusive of both disk and flash
◦Entire ecosystem of composable elements managed & orchestrated using a common API
framework
◦Prepared for yet-to-come composable elements – e.g., memory, accelerators
1.1.2.1 Open Composable
The Western Digital Open Composable Infrastructure (OCI) uses a common API to manage and
coordinate with all fabric-attached storage including pools of flash and disk. The infrastructure also
supports the management of networking and compute resources. The API is used for all managed
elements to accelerate the ability to use disaggregated resources where components are no longer sub-
components, but core elements connected to the network.
1.1.2.2 Open Composable API (OCAPI)
Western Digital’s Open Composable API is a RESTful interface for OpenFlex that enables a Unified Fabric
Control Plane for Storage Fabric Devices. This allows for composing disaggregated storage resources—
with compute, networking, and memory—into virtual systems in the future. These virtual systems will be
dynamically provided to the right application at the right time, ensuring SLAs can be met automatically.
3

User Guide 1. Overview
1.1 OpenFlex F3x00 and E3000
•Volume management (create / modify / delete namespaces, format media)
•Monitor hardware sensors (temperatures, voltages, fan speeds, hardware state)
•Configure hardware (update firmware, reboot individual components or systems, assert LEDs)
•Monitor performance (statistics, bandwidth, IOPS, latency)
•Capture inventory data (serial number, part number, etc.)
•Capture log information
•Configure policies (user access lists, authentication, LUN masking, HTTPS/TLS encryption/security
with certificate/key settings)
•Self-discovery of other locally-available resources configurable using the Open Composable API for
OpenFlex
1.1.2.3 OCGUI
The Open Composable Graphical User Interface (OCGUI) is the graphical representation of all of the data
shared up to the fabric by the OCAPI. This GUI is presented to the user by browsing to the IP address
of any device on the fabric. The GUI has a "command-center" design layout that presents all vital health,
utilization, and performance statistics related to devices on the network at a glance.
1.1.3 NVMe-oF
Non-Volatile Memory Express over Fabric (NVMe-oF) is one of the primary enabling technologies for the
OpenFlex platform. NVMe-oF enables the high-speed, low-latency storage performance of NVMe over
a fabric switching network. OpenFlex products drive network communications across the fabric using
100Gb/s Ethernet protocol. This allows for a complex network of computing devices to all share the same
storage resources with very high performance.
1.1.4 Supported SKUs
The following table lists the versions of Western Digital product that are supported by this document.
Table 1: Devices
Device Volume Bandwidth3Drive Writes Encryption Part
Number
OpenFlex F3000 Fabric Device 12.8TB 12GB/s RI-3DW/D ISE 1EX1906
OpenFlex F3000 Fabric Device 12.8TB 12GB/s RI-3DW/D SE 1EX1910
OpenFlex F3100 Fabric Device 12.8TB 12GB/s RI-2DW/D ISE 1EX2413
OpenFlex F3200 Fabric Device 12.8TB 12GB/s RI-2DW/D ISE 1EX2269
OpenFlex F3000 Fabric Device 15.2TB 12GB/s RI-1DW/D ISE 1EX1907
OpenFlex F3000 Fabric Device 15.2TB 12GB/s RI-1DW/D SE 1EX1911
OpenFlex F3100 Fabric Device 15.36TB 12GB/s RI-0.8DW/D ISE 1EX2416
OpenFlex F3200 Fabric Device 15.36TB 12GB/s RI-0.8DW/D ISE 1EX2272
OpenFlex F3000 Fabric Device 25.6TB 12GB/s RI-3DW/D ISE 1EX1908
OpenFlex F3000 Fabric Device 25.6TB 12GB/s RI-3DW/D SE 1EX1912
3. Bandwidth obtained by sequential read
4

User Guide 1. Overview
1.2 System Architecture Overview
Device Volume Bandwidth3Drive Writes Encryption Part
Number
OpenFlex F3100 Fabric Device 25.6TB 12GB/s RI-2DW/D ISE 1EX2414
OpenFlex F3200 Fabric Device 25.6TB 12GB/s RI-2DW/D ISE 1EX2270
OpenFlex F3000 Fabric Device 30.72TB 12GB/s RI-1DW/D ISE 1EX1909
OpenFlex F3000 Fabric Device 30.72TB 12GB/s RI-1DW/D SE 1EX1913
OpenFlex F3100 Fabric Device 30.72TB 12GB/s RI-0.8DW/D ISE 1EX2417
OpenFlex F3200 Fabric Device 30.72TB 12GB/s RI-0.8DW/D ISE 1EX2273
OpenFlex F3100 Fabric Device 51.2TB 12GB/s RI-2DW/D ISE 1EX2415
OpenFlex F3200 Fabric Device 51.2TB 12GB/s RI-2DW/D ISE 1EX2271
OpenFlex F3000 Fabric Device 61.44TB 12GB/s RI-1DW/D SE 1EX1914
OpenFlex F3100 Fabric Device 61.44TB 12GB/s RI-0.8DW/D ISE 1EX2418
OpenFlex F3200 Fabric Device 61.44TB 12GB/s RI-0.8DW/D ISE 1EX2274
1.2 System Architecture Overview
1.2.1 System High Speed Data Ingest Architecture
The system main data ingest architecture uses two separate 50G Ethernet connections each on a dual
QSFP28 connector on the rear I/O of the chassis. This completes the connection from the device that is
inserted into a chassis slot, through the backplane into the QSFP connectors. The architecture supports
the hot swap nature of the devices and does not require any sort of shut down or disconnection before
servicing. Each 100G Ethernet connection is split in half at the QSFP28 connectors resulting in 50G per
connector allowing for dual port functionality with the device.
Figure 2: System High Speed Data Ingest
1.2.2 System Thermal and Cooling
3. Bandwidth obtained by sequential read
5

User Guide 1. Overview
1.2 System Architecture Overview
The following image displays the thermal zones as viewed from the top of the enclosure. When viewing
the enclosure from the front, the right device zone is on the right-hand side and the left device zone is
on the left-hand side. When viewing the enclosure from the rear, the order is reversed. Each of the two
thermal zones contains major components that are thermally maintained within their specific zone.
Figure 3: System Thermal Zones
The E3000 uses a base algorithm, called a thermal algorithm, to control the overall thermal environment of
the system. The system is mechanically separated into two thermal zones to support efficient cooling of
the system components in order to achieve the intended performance of the system. The thermal zones
are split into device zones (the left and right side of the enclosure) and center zone when standing at the
front of the system. The device thermal zones contain up to ten devices or device blanks each that are
cooled by four fan modules that are located directly behind the devices. The four fan modules behind the
devices maintain the cooling for devices contained within the device slot installed into A through J. The
center thermal zone contains the BMC module that is cooled by the fans contained in the redundant PSUs
the are located directly behind the BMC module. The different thermal zones are designed to maintain
proper thermal cooling across the entire system. During servicing the system increases the speed of the
fan modules and PSU fans to maintain a balanced thermal load.
1.2.2.1 System Thermal Algorithm
The System Thermal Algorithm is designed to use temperature sensors and defined thresholds to
determine if the algorithm will select critical, increase, decrease, or no change as the device decision.
The System Thermal Algorithm uses the concept of priorities to ensure the proper function of the system.
As a result, any critical fault results in the system ramping the fans to maximum RPMs to protect the
hardware for the duration of the fault. The fault will remain in a critical state until the fault is fully resolved
and by bringing the temperature back within the specified defined thresholds.
6

User Guide 1. Overview
1.3 Electrical Specifications
The System Thermal Algorithm contains minimum and maximum thresholds related to the ambient
temperature of the system. The system is designed to maintain a maximum ambient temperature of 35°C.
Exceeding 35°C may result in damage to the hardware and potentially void the product warranty. These
thresholds allow for the best possible operating conditions. If the system goes outside of the minimum or
maximum threshold window, the BMC will adjust the fan speed to accommodate the issue and a fault will
be reported. The following table lists the Thermal Algorithm Thresholds along with the related fault levels
and threshold values.
The following table lists the different severity of thermal algorithm critical faults that are reported to the
user.
Table 2: Thermal Algorithm Critical Faults
Component Critical Faults
Device Any sensor >= critical
Not installed FAN
Not installed PSU
Not installed Device or Blank
BMC
Not installed BMC
Any sensor >= criticalPSU
Any critical status on SMBus
The following table lists the device decision values that the system chooses from during operation. It
describes how the pulse width modulation (PWM) of the power that is being distributed to the cooling
fans reacts to different fault types.The fault will be reported based on the severity of the thermal issue.
Table 3: Thermal Algorithm Device Decision for Fan Control
Fault Sensor Value Fan Response
Critical Sensor >= Critical 100% PWM
Increase Sensor >= Max PWM + increase step
Decrease Sensor <= Min PWM - decrease step
No Change Min < Sensor < Max Hold PWM
1.3 Electrical Specifications
Table 4: Electrical Specifications
Specification Value
Max Power Consumption 1600W
Typical Power Consumption ~1400W
Input Voltage 200V - 240V
PSU Connector Type C16
7

User Guide 1. Overview
1.4 Environmental Specifications
Specification Value
Inrush Current Maximum (per PSU) AC line inrush current shall not exceed 40A peak,
for up to one-quarter of the AC cycle after which,
the input current should be no more than the
specified maximum input current.
PSU Efficiency 80 PLUS Platinum
1.4 Environmental Specifications
Table 5: Environmental Specifications
Specification Non-Operational Operational
Temperature -30°C to 60°C 5°C to 35°C
Temperature Gradient 30°C per hour max 20°C per hour max
Temperature De-rating 1°C per 300m above 3000m 1°C per 175m above 950m
Relative Humidity 5-95% Non-Condensing 8-85% Non-Condensing
Relative Humidity Gradient 30% per hour maximum 30% per hour maximum
Altitude -300m to 12,000m / -984 ft. to
39,370 ft
-300m to 3048m / -984 ft. to 10,000
ft.
Cooling N/A 4 Fan Modules (N+1 Supported),
containing two fans per module
1.5 Mechanical Specifications
Table 6: Mechanical Specifications
Specification Non-Operational Operational
Shock 20G, 7ms half sine; 3 positive
and 3 negative pulses in each
axis Z and Y. X axis- 15G, 7ms half
sine, 3 positive and 3 negative
pulses
5G, 11ms half sine; 3 positive and
3 negative pulses in each axis
X, Y, and Z. Minimum 6 seconds
between shocks
Vibration Linear Random: 0.17G, 0 -
peak swept sine; 5 - 500Hz; 1
complete sweep @ 1/2 octave
per minute, ~13 minutes each
axis in X, Y, and Z
Linear Random: 0.50Grms;
5-500Hz; 10 minutes each axis in
X, Y, and Z
Linear Random: 0.54Grms;
1-200Hz; 60 minutes each axis in
X, Y, and Z
Linear Random: 0.15Grms; 5 -
500Hz; 10 minutes each axis in
X, Y, and Z
Swept Sine:0.17 G, 0 - peak,
5-500 Hz 0.5 octaves/min,
approx. 13 minutes each axis
8

User Guide 1. Overview
1.6 Performance Specifications
Specification Non-Operational Operational
Swept Sine: 0.50G, 0 - peak
swept sine; 5 - 500Hz; 1
complete sweep @ 1/2 octave
per minute
Weight 107.04 kg / 236 lbs.
Dimensions W: 448.8 mm x L: 1000 mm x H: 176.7 mm / W: 17.6 in. x L: 39.4 in. x
H: 6.9 in.
System Installation Length 1000 mm / 39.4 in. from the front rack chassis mounts to the rear of
the system
Required Rack Depth 1000 mm / 39.4 in. of usable rack space, frame to frame
Required Rack Width 450mm (17.72in.) with 465mm (18.31in.) ± 1.5mm nominal hole
spacing. See EIA-310 Rack Standard
Rack Units (U) 4U
Vertical Rack Rail Spacing 718 mm – 850 mm / 28.26 in. – 33.46 in.
Table 7: Acoustic Specifications
Quantities Declared Idle
Mode
Operating
Mode
Fan Fail
Mode5Max Fan Mode
A-weighted sound power level1, LWAd {1 B = 10
dB}
8.5 8.5 9.6 9.6
Average A-weighted emission sound pressure
level2, LpAm (dB) {bystander position3}
66.0 66.0 74.9 76.2
Statistical adder for verification4, K (dB) 2.5 2.5 2.5 2.5
Notes on Acoustic Testing Methodology and Environment:
•Background noise: <7dBA
•Environmental test conditions: ~23° C, 57% RH, 101.3 kPa
•Tested configuration: 3U NVMeOF VBOF device with 10 devices installed.
1 Declared A-weighted sound power level for a single machine, calculated per section 4.4.2 of ISO
9296-1988 and measured per ISO 3744
2 Declared A-weighted sound pressure level for a single machine, calculated per section 4.4.4 of
ISO-9296-1988 and measured per ISO 3744
3 The front and rear of the UUT were selected for the bystander location due to access typically from the
cool or hot isle in a data center. This does not meet the four bystander positions as specified in ECMA-74
2012, but the microphones were adjusted to the preferred location.
4 The statistical adder, K, accounts for random measurement error, and is equal to 2.5 dB, which is
appropriate for a 5% risk of rejection for SR = 1.5 dB per section 4.4.2 of ISO 9296-1988.
5 At steady state condition, system/PSU fans reached 100% pwm speeds during fan fail mode testing.
1.6 Performance Specifications
9

User Guide 1. Overview
1.6 Performance Specifications
Table 8: Performance Specifications
Specification Value
Number of Device Slots 10 Dual-port Fabric Device Bays
Data Transfer Rates 12GBps NVMe-oF
Max Raw Data Storage Capacity 614TB4
Ethernet Ports 20 x 50Gbps QSFP28 ( 2 per Fabric Device)
1 x 10/100/1G Ethernet
Table 9: F3000 Performance Specifications by CRU P/N
CRU P/N 1EX1906/
1EX1910
1EX1907/
1EX1911
1EX1908/
1EX1912
1EX1909/
1EX1913 1EX1914
Capacity/
Endurance
12.8TB
3DWPD
15.4TB
1DWPD
25.6TB
3DWPD
30.7TB
1DWPD
61.4TB
1DWPD
Random Read
(4KB, QD=1024)
2021K
IOPs
2021K
IOPs
2004K
IOPs
2002K
IOPs
2220K
IOPs1
Random Write
(4KB, QD=1024)
918K
IOPs
919K
IOPs
609K
IOPs
608K
IOPs
2420K
IOPs1
Random Mixed
70R/30W
(4KB, QD=1024)
1570K
IOPs
1537K
IOPs
1194K
IOPs
1194K
IOPs
2253K
IOPs
Sequential Read
(128KB, QD=320)
11.9 GB/s 11.9 GB/s 11.9 GB/s 11.9 GB/s 11.9 GB/s
Sequential Write
(128KB, QD=320)
9.3 GB/s 9.3 GB/s 10.2 GB/s 10.2 GB/s 11.7 GB/s
Random Write Latency
(4KB, QD=1, 99.99%)
107 µs 114 µs 75.3 µs 76.3 µs 48.9 µs
1 Queue depth for 61.4TB device optimized at 1536, not 1024 as stated for other capacities
Notes on Performance Testing:
•Latency measured through a single Mellanox SN2700 switch
•K IOPs = IOPs x 1000
•Devices pre-conditioned with 2 full sequential fills
Table 10: F3100 Performance Specifications by CRU P/N
CRU P/N 1EX2413 1EX2416 1EX2414 1EX2417 1EX2415 1EX2418
Capacity/
Endurance
12.8TB
2DWPD
15.4TB
0.8DWPD
25.6TB
2DWPD
30.7TB
0.8DWPD
51.2TB
2DWPD
61.4TB
0.8DWPD
Random Read
(4KB, QD=1024)
2199K
IOPs
2111K
IOPs
2164K
IOPs
2160K
IOPs
2176K
IOPs
2191K
IOPs
4. Max storage capacity depends on device version and device configuration.
10

User Guide 1. Overview
1.7 Physical Design
CRU P/N 1EX2413 1EX2416 1EX2414 1EX2417 1EX2415 1EX2418
Random Write
(4KB, QD=1024)
1493K
IOPs
1433K
IOPs
1431K
IOPs
1397K
IOPs
1464K
IOPs
1400K
IOPs
Random Mixed
70R/30W
(4KB, QD=1024)
2199K
IOPs
2137K
IOPs
2183K
IOPs
2188K
IOPs
2227K
IOPs
2251K
IOPs
Sequential Read
(128KB, QD=320)
11.8 GB/s 11.7 GB/s 11.7 GB/s 11.7 GB/s 11.7 11.7 GB/s
Sequential Write
(128KB, QD=320)
9.9 GB/s 9.9 GB/s 9.9 GB/s 9.4 GB/s 9.4 GB/s 9.9 GB/s
Random Write
Latency
(4KB, QD=1, 99.99%)
33.9 µs 33.7 µs 33.7 µs 33.9 µs 33.7 µs 33.5 µs
Notes on Performance Testing:
•K IOPs = IOPs x 1000
•Devices pre-conditioned with 2 full sequential fills
Table 11: F3200 Performance Specifications by CRU P/N
CRU P/N 1EX2513 1EX2516 1EX2514 1EX2517 1EX2515 1EX2518
Capacity/
Endurance
12.8TB
2DWPD
15.4TB
0.8DWPD
25.6TB
2DWPD
30.7TB
0.8DWPD
51.2TB
2DWPD
61.4TB
0.8DWPD
Random Read
(4KB, QD=1024)
2218K
IOPs
2209K
IOPs
2212K
IOPs
2210K
IOPs
2221K
IOPs
2214K
IOPs
Random Write
(4KB, QD=1024)
2130K
IOPs
1998K
IOPs
2124K
IOPs
2129K
IOPs
1930K
IOPs
1907K
IOPs
Random Mixed
70R/30W
(4KB, QD=1024)
2292K
IOPs
882K
IOPs
2256K
IOPs
2252K
IOPs
2308K
IOPs
2285K
IOPs
Sequential Read
(128KB, QD=320)
11.5 GB/s 11.5 GB/s 11.5 GB/s 11.5 GB/s 11.5 GB/s 11.5 GB/s
Sequential Write
(128KB, QD=320)
11.5 GB/s 11.5 GB/s 11.5 GB/s 11.5 GB/s 11.5 GB/s 11.5 GB/s
Random Write
Latency
(4KB, QD=1, 99.99%)
38.5 µs 38.1 µs 38.1 µs 38.0 µs 46.7 µs 38.1 µs
Notes on Performance Testing:
•K IOPs = IOPs x 1000
•Devices pre-conditioned with 2 full sequential fills
1.7 Physical Design
11

User Guide 1. Overview
1.7 Physical Design
The OpenFlex F3x00 and E3000 physical design emphasizes easy access to hot-swappable components,
maximization of data storage capacity in the rack, and bold aesthetic design.
Figure 4: OpenFlex F3x00 and E3000 Layout
The enclosure measures 447.2 mm/17.6 in. wide by 828.04 mm/32.6 in. long. It's height is 130.9 mm/5.2 in.
or 3U. The chassis installation length is 778 mm (30.6 in.) from front rack chassis mounts to rear of system.
Figure 5: OpenFlex F3x00 and E3000 Dimensions
12

User Guide 1. Overview
1.7 Physical Design
1.7.1 LEDs
Chassis LEDs
Figure 6: Chassis Rear IO LEDs
Table 12: Chassis Rear IO LED Flash Patterns
LED Name Color Behavior
Ethernet Link/Activity Green Solid On: Connected
Blink: Activity
Off: No Connection
Green Solid On : Operating at 100 Mbps
Off: Operating at 10 Mbps
Ethernet Speed
Amber Solid On: Operating at 1 Gbps
Off: Operating at 10 Mbps
Blink @ 1 Hz: Enclosure or any component being
identified (fans, PSUs, etc.)
Identification Blue
Off: Enclosure/components not being identified
Solid On: Link operating at maximum speed
Blink @ 3 Hz: Link activity
Green
Off: Default state
Solid On: Link operating at a lower speed, 50G
or less
Blink @ 3 Hz: Low speed link activity
QSFP28 LED
Amber
Blink @ 1 Hz: On/Off - Identify
Power Green Solid On: Enclosure is powered on
13