WNC IMA2 Series User manual

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User Manual
Project Name: IMA2 Series
Author: Wistron NeWeb Corporation
Revision: 1.2
Revision Date: 2020/06/03

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Contact Information
Technical Support Website
https://supportiot.wnc.com.tw/
Company Website
www.wnc.com.tw
Revision History
Rev. #
Author
Summary of Changes
Date
1.0
WNC
Draft release
2020/05/11
1.1
WNC
Update design guide
Update Important Notice to OEM integrators
2020/05/29
1.2
WNC
Update maximum antenna gain
2020/06/03

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© Wistron NeWeb Corporation
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND
IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED,
REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN
PERMISSION FROM WNC.
LIMITATION OF LIABILITY
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR
DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN
THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT
TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS
WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR
DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS
WRITTEN CONSENT.

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Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part
2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to
verify compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while
the transmitter module(s) are installed and operating. The modules should be transmitting and the
evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental
and out of band emissions). The host manufacturer must verify that there are no additional
unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are
complaint with the transmitter(s) rule(s).
End Product Labeling
When the module is installed in the host device, the FCC ID label must be visible through a
window on the final device or it must be visible when an access panel, door or cover is easily re-
moved. If not, a second label must be placed on the outside of the final device that contains the
following text: “Contains FCC ID: NKRIMA2”
“Contains IC: 4441A-IMA2“
The grantee's FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) To comply with FCC/IC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure
condition must not exceed:
Standalone Condition:
。10.0 dBi in PCS band
。7.0 dBi in AWS band
。7.5 dBi in 700 MHz Band
Assuming collocated with an ordinary WLAN transmitter with 5 dBi antenna gain
。7.0 dBi in PCS band
。6.5 dBi in AWS band
。4.0 dBi in 700 MHz Band
In the event that these conditions cannot be met (for example certain laptop configurations or co-

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location with another transmitter), then the FCC/IC authorization is no longer considered valid and
the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module. The end user manual shall include all required regulatory information/warning as show in
this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one of the following
measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate this equipment. This transmitter must not be co-located
or operating in conjunction with any other antenna or transmitter.
Canada Statement
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation,
Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the
following two conditions: (1) This device may not cause interference. (2) This device must accept
any interference, including interference that may cause undesired operation of the device.

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L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR
d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio
exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) L’appareil ne
doit pas produire de brouillage; 2) L’appareil doit accepter tout brouillage radioélec
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm
between the radiator & your body.

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Contents
Contact Information............................................................................................................................ 2
Revision History..................................................................................................................................2
Contents...............................................................................................................................................7
1. Introduction..................................................................................................................................... 9
1.1 General Features................................................................................................................... 9
1.2 Architecture.........................................................................................................................10
1.3 Connection Interface........................................................................................................... 11
1.4 Environmental Specifications and Certifications............................................................... 11
1.4.1 Environmental Specifications.................................................................................. 11
1.4.2 Certifications............................................................................................................ 11
1.4.3 Green Product Compliance......................................................................................11
2. Pin Definitions............................................................................................................................... 12
2.1 LGA Module Pin Diagram..................................................................................................12
2.2 LGA Module Pin Definitions..............................................................................................13
3. Electrical Specifications.................................................................................................................16
3.1 Power Supply...................................................................................................................... 16
3.2 Power Consumption............................................................................................................16
3.3Control Interfaces................................................................................................................17
3.3.1 Power-On Signal.......................................................................................................17
3.3.2 Wake-Up Interface(TBD)..........................................................................................17
3.3.3 Reset Signal.............................................................................................................. 17
3.4UART Interface...................................................................................................................17
3.5UIM Interface......................................................................................................................18
3.6I/O Characteristics...............................................................................................................19
3.7EJTAG Interface................................................................................................................. 19
3.8 ADC Interface.......................................................................................................................20
3.9 RF Interface.........................................................................................................................20
3. 9.1 Bandwidth Support................................................................................................. 20
3. 9.2 RF Transmission Specifications............................................................................... 20
3.9.3 RF Receiver Specifications....................................................................................... 21
3.9.4 RF GNSS Receiver Specifications..............................................................................21
4. Mechanical Information................................................................................................................ 22
4.1 Physical Dimensions........................................................................................................... 22
4.2 Pin Dimensions................................................................................................................... 22
4.3 Marking Information(TBD)................................................................................................ 24
5. Packing Information(TBD)........................................................................................................... 25
5.1 Tape-and-Reel Package.......................................................................................................25
5.2 Single Packaging for Samples.............................................................................................26
5.3 MSL level............................................................................................................................27
6. Design Guide.................................................................................................................................28

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6.1 Power Trace Design............................................................................................................ 28
6.2 RF Pad Design.....................................................................................................................29
6.3 RF Matching Guide.............................................................................................................31
6.4 Mounting Considerations(TBD)......................................................................................... 31
6.5 PCB Pad Design..................................................................................................................34
6.6 LTE Power Saving Mode....................................................................................................35
7.0 Safety Recommendations............................................................................................................35
8.Initialisms....................................................................................................................................... 36

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1. Introduction
The WNC IMA2 series modules include the Altair ALT1250 Cat. M1 baseband, a
complete LTE RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA
and AT&T Wireless LTE Cat. M1 UE specifications. The following table enumerates
the frequencies supported by the IMA2 series modules.
Band
Uplink (MHz)
Downlink (MHz)
LTE Band 2
1,850–1,910
1,930–1,990
LTE Band 4
1,710–1,755
2,110–2,155
LTE Band 12
699–716
729–746
Table 1-1. Band support
Two SKUs are defined according to GNSS support capacity; refer to Table 1-2 for
details.
Module
Power class
GNSS
IMA2
3

IMA2G
3

Table 1-2 SKU description
1.1 General Features
The table below summarizes the IMA2 module features.
General interfaces
•JTAG
•USIM
•PCM/I2C/GPIO
•UART
Supported
frequency bands
• LTE Band 2
• LTE Band 4
• LTE Band 12
Operating voltage
• VCC (range: 3.3 V–4.2 V)
Packaging
• LGA module
• 80 pads (15.5 mm × 15.5 mm × 1.96 mm W/O label)
• RoHS compliant
Table 1-3. General features of the IMA2

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Table 1-4. LTE-related features of the IMA2
1.2 Architecture
The architecture block diagram of the IMA2 series is presented in Figure 1-1 below.
Figure 1-1. IMA2 series block diagram
Standards
compliance
• 3GPP Release 13–compliant; software upgradable to
Release 14
PHY
• Category M1: Up to 300 Kbps DL/375 Kbps UL
• HD-FDD duplexing support
• Power-saving mode
MAC
• Random access procedure in normal subframes
• Scheduling request, buffer status reporting, and power
headroom reporting
• Discontinuous reception (eDRX) with long and short cycles
• IPv4, IPv6
NAS and above
• NAS
• SMS over SG

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1.3 Connection Interface
The IMA2 module is an LGA device. All electrical and mechanical connections are
made through the 80 pads on the bottom side of the PCB.
1.4 Environmental Specifications and
Certifications
1.4.1 Environmental Specifications
The environmental specifications for both operating and storage conditions are
defined in the table below.
Condition
Temperature Range
Remark
Normal ambient
operating temp. range
–20 °C to 60 °C
Fully functional and complies with 3GPP
specifications
Extended ambient
operating temp. range
–40 °C to 85°C (TBD)
RF performance may be affected outside normal
ambient operating range temp., although the
module will still function.
Storage
–40 °C to 85 °C
Table 1-5. Temperature range
1.4.2 Certifications
The IMA2 module is compliant with the following regulations: PTCRB, FCC, IC, and
AT&T TA.
1.4.3 Green Product Compliance
RoHS (2011/65/EU)

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2. Pin Definitions
2.1 LGA Module Pin Diagram
The IMA2 LGA module pin layout is illustrated below.
Figure 2-1. IMA2 LGA module pin layout (top view)

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2.2 LGA Module Pin Definitions
The signals and all the related details are listed in the below table.
Pin No.
Name
Description
13
GND
Ground
14
GND
Ground
15
Main antenna
Main antenna port
16
GND
Ground
17
GND
Ground
18
GND
Ground
19
GND
Ground
20
GND
Ground
21
RF_GNSS
Antenna for a GNSS receiver
22
GND
Ground
23
GND
Ground
24
GND
Ground
37
Power
Power
38
Power
Power
39
Power
Power
40
Power
Power
41
Power
Power
42
Power
Power
43
PMU_VBACKUP
Power Input for Real Time Clock
44
GND
Ground
45
GND
Ground
46
PCM_FS/GPIO46
General purpose input/output
47
PCM_IN/GPIO47
General purpose input/output
48
PCM_OUT/GPIO48
General purpose input/output
49
PCM_CLK/GPIO49
General purpose input/output
50
GND
Ground
51
GND
Ground
52
I2C1_SCL/GPIO01
General purpose input/output
53
I2C1_SDA/GPIO02
General purpose input/output
86
USB_Dp
USB Data Positive
87
VBUS
VBUS (3.3V)

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88
USB_Dn
USB Data Negative
89
UART2_RTS
Request to send for UART 2
90
GND
Ground
91
UART2_CTS
Clear to send for UART 2
92
UART0_CTS
Clear to send for UART 0
93
UART0_TX
Transmit for UART 0
94
UART2_TX
Transmit for UART 2
95
UART0_RX
Receive for UART 0
96
UART2_RX
Receive for UART 2
97
UART0_RTS
Request to send for UART 0
130
ADC1
Analog-to-digital converter
131
ADC2
Analog-to-digital converter
132
GNSS_EN/GPIO08
GNSS external LNA enable/General purpose
input/output
133
UIM_VCC
SIM card power
134
UIM DATA
SIM card data line
135
UIM CLK
SIM card clock line
136
UIM RESET
SIM card reset line
137
UIM DETECT
SIM card detect line
138
NC
Not connected
139
GND
Ground
140
GND
Ground
141
WWAN_STATE
Wireless WAN radio state
142
Power on 1
Power-on of the module (RFU)
143
WAKEUP_OUT
Module wake-up of the host
144
WAKEUP_IN 2
Host wake-up of the module
145
RESET
Hardware reset signal
146
VREF 3
Reference logic voltage (1.8 V voltage)
201
EJ_TCK
EJ_TCK
202
EJ_TDI
EJ_TDI
203
EJ_TDO
EJ_TDO
204
EJ_TMS
EJ_TMS
205
EJ_TRST
EJ_TRST
206
DEBUG_RSTN
Reset pin for the JTAG probe
208
NA
NA
209
NA
NA
210
NA
NA
211
NA
NA

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212
GND
Ground
213
GND
Ground
214
GND
Ground
215
GND
Ground
216
GND
Ground
217
GND
Ground
218
GND
Ground
219
GND
Ground
220
NA
NA
221
NA
NA
222
NA
NA
223
NA
NA
Table 2-1. IMA2 module pin definitions
Notes:
1: Leave pin 142 floating; the module can turn on automatically when a power
supply exists.
2: Pin 144 can be used as a wake-up as the module enters deep-sleep status. The
default configuration is active high to wake up the LGA module.
3: The VREF voltage will turn off when entering the deep sleep state.

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3. Electrical Specifications
3.1 Power Supply
The IMA2 module is supplied through the power signal with the following
characteristics.
Direction
Minimum
Typical
Maximum
Power (37–42)
In
3.3 V
3.8 V
4.2 V
VREF
Out
1.71 V
1.8 V
1.89 V
SIM_VCC (1.8 V)
Out
1.71 V
1.8 V
1.89 V
Table 3-1. Power supply
3.2 Power Consumption
This section describes the typical power consumption of the IMA2 (for reference).
Working Mode
Conditions
Result
Power saving mode
Floor current
1.7uA
LTE Band 2 working mode
Max Tx power without throughput
Power voltage 3.8 V; average current
135mA
LTE Band 4 working mode
Max Tx power without throughput
Power voltage 3.8 V; average current
130mA
LTE Band 12 working mode
Max Tx power without throughput
Power voltage 3.8 V; average current
151mA
Power On
Conditions
Result
Peak power consumption
Power consumption peaks
450mA
Power Off
Conditions
Result
Power off consumption
Only the module; no other devices; only
RTC functions in deep sleep
1.7uA
Table 3-2. LTE power consumption

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3.3Control Interfaces
This section describes the power on/off, wake-up, and reset interface for controlling
the module.
3.3.1 Power-On Signal
This function is not available in the present firmware; the module will be turned on
automatically when the power supply exists. Set this pin as “floating” or use 0 Ω as a
reserve.
3.3.2 Wake-Up Interface(TBD)
3.3.3 Reset Signal
The Reset Signal is a hardware reset signal to control the system reset directly. You
can connect it to a key or a control signal. Reserve a 100k resistor to pull up to VREF
and maintain a sufficient physical distance between the reset signal trace and noise
and radiating signals on the PCB.
3.4UART Interface
There are two UART interfaces: a 4-bit for high-speed data transfer, and the UARTs.
Definitions of the IMA2 are listed below.
1. UART0 for PPP and AT
2. UART2 for firmware download, recovery mode, and firmware debug view
Figure 3-1. UART connection (example)

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3.5UIM Interface
IMA2 modules provide a UIM_DETECT input pin for UIM connectors to detect a UIM
card. When a UIM card is present, UIM_DETECT should be high (1.8 V). If a UIM card
is absent, UIM_DETECT should be low. Pulling UIM_DETECT to VREF with a 100k
resistor is necessary. We recommend placing a 0.1 μF and a 33 pF capacitor between
UIM_VCC and the Ground in parallel. We also recommend placing a 33 pF capacitor
between UIM_RESET, UIM_CLK, and UIM_DATA and the Ground in parallel. Refer to
Figure 5 for details.
We also recommend placing an electrostatic discharge (ESD) protection circuit near
the UIM socket as close as possible. The Ground pin of the ESD protection
component must be well-connected to the Ground plane.
The following figure shows an example of a UIM card circuit. The default
configuration is active High.
Figure 3-2. UIM card circuit example

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3.6I/O Characteristics
The voltage and current characteristics of the various IO pads of the IMA2 versus IO
bank supply voltage are illustrated in the tables below.
Parameter
Drive
Strength
Min.
Nom.
Max.
Unit
VIL
Input Low Voltage
0.3 × VIO
V
VIH
Input High Voltage
0.7 × VIO
V
VOL
Output Low
Voltage
0.2 × VIO
V
VOH
Output High
Voltage
0.8 × VIO
VH
Input Hysteresis
0.1 × VIO
V
IRATED
IO Drive Strength
2 mA
12
mA
Table 3-3. DC characteristics for digital IOs, voltage 1.8 V—BIDIR and IN types
3.7EJTAG Interface
The IMA2 series provides one EJTAG interface; leave JTAG pins floating if not used.
Figure 3-3. EJTAG schematic (example)

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3.8 ADC Interface
The IMA2 contains two ADC ports; the characteristics will be updated according to
the ALT1250 datasheet in the future.
Table 3-4. ADC characteristics (TBD)
3.9 RF Interface
Each IMA2 module has only one RF pad; developers must connect it via the 50 Ω
traces to the main board.
Main antenna pad (Pin15) – RX/TX path
RF GNSS pad (Pin21) – GNSS RX path
3. 9.1 Bandwidth Support
Band
Bandwidth
1.4 MHz
3 MHz
5 MHz
10 MHz
15 MHz
20 MHz
LTE Band 2






LTE Band 4






LTE Band 12




-
-
Table 3-5. Bandwidth support
3. 9.2 RF Transmission Specifications
Band
Item
Parameter
Unit
Min.
Typ.
Max.
LTE Band 2
Max. TX Power
20 MHz 1 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 4
Max. TX Power
20 MHz 1 RBs/QPSK
dBm
20.3
23
25.7
LTE Band 12
Max. TX Power
10 MHz 1 RBs/QPSK
dBm
20.3
23
25.7
Table 3-6. Conductive Tx output power