WNC IMQ5 User manual

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User Manual
Project Name: IMQ5 Module
Author: Wistron NeWeb Corporation
Revision: 0.5
Revision Date: 2020/03/06

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Contact Information
Technical Support website
https://SupportIoT.wnc.com.tw
Company Website
www.wnc.com.tw
Revision History
Rev. #
Author
Summary of Changes
Date
0.1
WNC
Draft release
2019/11/28
0.2
WNC
Update operating voltage
2019/11/29
0.3
WNC
Add FCC IC Statement
2020/02/20
0.4
WNC
Delete interface and Extended operating
temperature range
2020/02/28
0.5
WNC
Update operating temperature
2020/03/06

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© Wistron NeWeb Corporation
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE
EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR
DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC.
LIMITATION OF LIABILITY
THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN
REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS
DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE
MATERIAL CONTAINED HEREIN WITHOUT WNC’S PRIOR EXPRESS WRITTEN CONSENT. WNC
SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE
MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT.

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Contents
Contact Information................................................................................................................. 2
Revision History........................................................................................................................ 2
Contents.................................................................................................................................... 4
1. Introduction.......................................................................................................................... 6
1.1. RF band support........................................................................................................6
1.2. Features.................................................................................................................... 6
1.3. Architecture.............................................................................................................. 7
1.4. Connection Interface................................................................................................ 8
1.5. Environmental Specifications and Certifications...................................................... 8
1.5.1. Environmental Specifications........................................................................8
1.5.2. Certifications................................................................................................. 8
1.5.3. Green Product Compliance........................................................................... 8
2. Pin Definitions...................................................................................................................... 9
2.1. LGA Module Pin Diagram..........................................................................................9
2.2. LGA Module Pin Definitions....................................................................................10
3. Electrical Specifications...................................................................................................... 14
3.1. Power supply.......................................................................................................... 14
3.2. RF Specifications..................................................................................................... 14
3.2.1. Band support...............................................................................................14
3.2.2. Bandwidth support..................................................................................... 15
3.2.3. RF transmit specifications........................................................................... 15
3.2.4. RF receiver specifications............................................................................16

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3.2.5. GNSS receiver specifications....................................................................... 16
4. Software Interface.............................................................................................................. 16
4.1. Support tools.......................................................................................................... 16
4.2. USB interface.......................................................................................................... 17
5. Mechanical..........................................................................................................................17
5.1. PCBA Form Factor................................................................................................... 17
6. Design Guide.......................................................................................................................20
6.1. Power supply...........................................................................................................20
6.2. RF connection......................................................................................................... 21
6.3. Reflow..................................................................................................................... 24
7. Labeling and Packaging...................................................................................................... 27
7.1. Labeling...................................................................................................................27
7.2. Packaging................................................................................................................ 27
7.3. MSL level.................................................................................................................29
8. Safety Recommendation.................................................................................................... 30
Initialisms................................................................................................................................36

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1. Introduction
The WNC IMQ5 module includes the Qualcomm MDM9205 Cat. M1 baseband, a complete
LTE RF front-end, memory, and required circuitry to fulfill requirements of 3GPP E-UTRA
(Long Term Evolution - LTE, Rel-14 specifications). The IMQ5 module provides a variety of
interfaces including USB, SPI, UART, GPIO, PCM, I2C, and USIM.
1.1. RF band support
This section lists the main features and functions that the IMQ5 module supports. Table 1-1
specifies wireless technologies supported.
Module
LTE CAT M1
LTE CAT NB2
GPRS/EGPRS
GNSS
IMQ5
√
×
×
√
Table 1-1. IMQ5 module overview
Note: √= supported, ×= not supported
1.2. Features
Feature list:
LTE 3GPP release 14
3GPP category support: LTE Cat. M1 with 1.2 Mbps for UL, 375 Kbps for DL
LTE Support Bands:B2/4/12/13/25/26
Power Class 5: 20dBm
GNSS: GPS, GLONASS
Cortex A7 microprocessor (performance enhanced)
IPv4/IPv6-supported
AT command set

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LwM2M, FOTA
SMS over NAS
Interfaces
HS USB 2.0 with integrated PHY
Dual UART interfaces (4 bit and 2 bit) for data transfer and diagnostic tools
I2C/SPI interface
USIM interface
GPIOs
ADC
PCM/I2S
1.3. Architecture
The architecture of the IMQ5 is presented in Figure 1-1 as an LGA function block diagram.
Figure 1-1. LGA function block diagram

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1.4. Connection Interface
The IMQ5 module is LGA device. All electrical and mechanical connections are made
through the 80 pads on the bottom side of a PCB.
1.5. Environmental Specifications and Certifications
1.5.1. Environmental Specifications
The environmental specifications for both operating and storage conditions are defined in
the Table below.
Condition
Temperature Range
Remark
Normal operating
temperature range
–20 °C to 60 °C
Fully functional and in compliance with 3GPP
specifications
Extended operating
temperature range
–40 °C to 85°C
RF performance may be affected outside the
normal range, but the module will still function.
Storage
–40 °C to 85 °C
Table 1-2. Temperature range
Note: All temperatures above refer to ambient temperatures.
1.5.2. Certifications
The IMQ5 module is certified to be compliant with PTCRB, GCF, FCC, IC and
ATT/VZ/SPN/TMO (TBD) regulations and standards.
1.5.3. Green Product Compliance
RoHS (2011/65/EU)

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2. Pin Definitions
2.1. LGA Module Pin Diagram
The IMQ5 LGA module pin layout is illustrated below.

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Figure 2-1. LGA pad diagram (top view)
2.2. LGA Module Pin Definitions
A complete list with related details for the module pinout are listed in the Table below:
Pin No.
Pin definition/type
Voltage Level (V)
Min.
Typ.
Max.
13
GND
-
0
-
14
GND
-
0
-
15
RF_1(LTE TRX)
-
-
-
16
GND
-
0
-
17
GND
-
0
-
18
GND
-
0
-
19
GND
-
0
-
20
GND
-
0
-
21
RF_2(ANSS)
-
-
-
22
GND
-
0
-
23
GND
-
0
-
24
GND
-
0
-
37
VCC1
2.85
3.8
4.5
38
VCC2
2.85
3.8
4.5
39
VCC3
2.85
3.8
4.5
40
VCC4
2.85
3.8
4.5