xFusion Digital Technologies FusionServer 1288H V7 User manual

FusionServer 1288H V7 Server
Technical White Paper
Issue 02
Date 2023-05-25
xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
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All other trademarks and trade names mentioned in this document are the property of their respective
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Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description
and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"
mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technologies Co., Ltd. shall not bear any liability resulting from
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xFusion Digital Technologies Co., Ltd.
Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com
Issue 02 (2023-05-25) Copyright © xFusion Digital Technologies Co., Ltd. i

About This Document
Purpose
This document describes the appearance, features, performance parameters, and
hardware and software compatibility of FusionServer 1288H V7, so that users can
have an in-depth and detailed understanding of FusionServer 1288H V7.
Intended Audience
This document is intended for pre-sales engineers.
Symbolic Conventions
The symbols that may be found in this document are defined as follows:
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, could result in death or serious injury.
Indicates a hazard with a medium risk which, if not
avoided, could result in death or serious injury.
Indicates a low-level hazard which, if not avoided, could
result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in device damage, data loss, device
performance degradation, or other unpredictable results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
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Technical White Paper About This Document
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Change History
Issue Release Date Change Description
01 2023-06-21 This issue is the first official release.
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Contents
About This Document.........................................................................................................ii
1 Overview........................................................................................................................... 1
2 Product Features............................................................................................................. 2
3 Physical Structure........................................................................................................... 5
4 Logic Structure................................................................................................................ 7
5 Hardware Description......................................................................................................9
5.1 Front Panel.................................................................................................................................................. 9
5.1.1 Appearance...............................................................................................................................................9
5.1.2 Indicators and Buttons............................................................................................................................ 10
5.1.3 Ports........................................................................................................................................................14
5.2 Rear Panel.................................................................................................................................................16
5.2.1 Appearance.............................................................................................................................................17
5.2.2 Indicators and Buttons............................................................................................................................ 17
5.2.3 Ports........................................................................................................................................................19
5.3 Processors.................................................................................................................................................20
5.4 Memory......................................................................................................................................................21
5.4.1 DDR5 Memory........................................................................................................................................ 21
5.4.1.1 Memory Identifier................................................................................................................................. 21
5.4.1.2 Memory Subsystem Architecture.........................................................................................................23
5.4.1.3 Memory Compatibility.......................................................................................................................... 24
5.4.1.4 DIMM Installation Rules.......................................................................................................................25
5.4.1.5 Positions of the Memory Modules........................................................................................................26
5.4.1.6 Memory Protection Technologies.........................................................................................................29
5.5 Storage...................................................................................................................................................... 29
5.5.1 Drive Configuration and Drive Numbering.............................................................................................. 29
5.5.1.1 4 x 3.5" Drive Pass-Through Configuration......................................................................................... 29
5.5.1.2 8 x 2.5" Drive Pass-Through Configuration......................................................................................... 31
5.5.1.3 10 x 2.5" Drive Pass-Through Configuration....................................................................................... 33
5.5.1.4 10 x 2.5" Drive NVMe Configuration.................................................................................................... 37
5.5.2 Drive Indicators.......................................................................................................................................38
5.5.3 RAID Controller Card..............................................................................................................................40
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5.6 Network......................................................................................................................................................40
5.6.1 OCP 3.0 NICs......................................................................................................................................... 41
5.7 I/O Expansion............................................................................................................................................ 41
5.7.1 PCIe Card............................................................................................................................................... 41
5.7.2 PCIe Slots...............................................................................................................................................41
5.7.3 PCIe Slot Description..............................................................................................................................42
5.8 PSUs..........................................................................................................................................................44
5.9 Fan Module................................................................................................................................................45
5.10 Board....................................................................................................................................................... 45
5.10.1 Mainboard.............................................................................................................................................46
5.10.2 Drive Backplane....................................................................................................................................48
5.10.3 Fan Board............................................................................................................................................. 51
6 Specifications.................................................................................................................53
6.1 Technical Specifications.............................................................................................................................53
6.2 Environmental Specifications.....................................................................................................................57
6.3 Physical Specifications.............................................................................................................................. 59
7 Software and Hardware Compatibility......................................................................... 61
8 Safety Instructions.........................................................................................................62
8.1 Security......................................................................................................................................................62
8.2 Maintenance and Warranty........................................................................................................................65
9 System Management..................................................................................................... 67
10 Certifications................................................................................................................ 69
A Appendix........................................................................................................................ 71
A.1 Chassis Label Information.........................................................................................................................71
A.1.1 Chassis Head Label............................................................................................................................... 71
A.1.1.1 Nameplate........................................................................................................................................... 72
A.1.1.2 Certificate............................................................................................................................................ 72
A.1.1.3 Quick Access Label.............................................................................................................................74
A.1.2 Chassis Internal Label............................................................................................................................75
A.1.3 Chassis Tail Label...................................................................................................................................75
A.2 Product SN................................................................................................................................................ 76
A.3 Operating Temperature Limitations........................................................................................................... 78
A.4 Nameplate................................................................................................................................................. 83
A.5 RAS Features............................................................................................................................................83
A.6 Sensor List.................................................................................................................................................83
B Glossary......................................................................................................................... 90
B.1 A-E.............................................................................................................................................................90
B.2 F-J............................................................................................................................................................. 91
B.3 K-O............................................................................................................................................................ 91
B.4 P-T.............................................................................................................................................................91
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B.5 U-Z.............................................................................................................................................................92
C Acronyms and Abbreviations...................................................................................... 93
C.1 A-E............................................................................................................................................................ 93
C.2 F-J............................................................................................................................................................. 94
C.3 K-O............................................................................................................................................................95
C.4 P-T.............................................................................................................................................................96
C.5 U-Z............................................................................................................................................................ 98
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1 Overview
FusionServer 1288H V7 (1288H V7) is a new-generation 1U 2-socket rack server
designed for the Internet, Internet Data Center (IDC), cloud computing, enterprise
business, and telecom.
The 1288H V7 server is ideal for IT core services, cloud computing, virtualization,
high-performance computing, distributed storage, big data processing, enterprise or
telecom applications, and other complex workloads.
The 1288H V7 features low power consumption, high scalability, high reliability, and
easy management and deployment.
NO TE
For details about the 1288H V 7 nameplate, see A.4 Nameplate.
Figure 1-1 1288H V7 with 8 x 2.5" drives (example)
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2 Product Features
Performance
● The server supports the new generation of Intel® Xeon® Scalable processors
(Sapphire Rapids), A processor provides up to 60 cores and 120 threads, up to
350 W TDP, a maximum of 4.2 GHz turbo frequency, 2 MB L2 cache and 1.875
MB L3 cache, and four groups of 16 GT/s xGMI links between the processors,
which deliver supreme processing performance.
● The server supports a maximum of 32 DDR5 4800 MT/s registered dual-inline
memory modules (RDIMMs), delivering up to 8192 GB total memory capacity
(calculated using the maximum capacity of a single memory module: 256 GB).
The memory modules feature high speed and availability.
Scalability
● Flexible drive configurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● Up to 4 x 3.5" or 10 x 2.5" front drives + 2 x 2.5" rear drives.
● A maximum of 10 x 2.5" NVMe U.2 drives, improving storage density and I/O
performance.
● The server supports a maximum of three standard PCIe x16 slots, one of which
supports PCIe 5.0.
● Supports two GE/10GE/25GE/100GE OCP 3.0 NICs with bandwidth scalable to
PCIe 4.0 x16 and orderly hot swap.
NO TE
The hot swap of the OCP NIC depends on the OS driver. Ensure that the system enters
the OS state and the OCP hot swap-related drivers have been loaded.
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA drives. SAS/SATA drives support
RAID 0, 1, 1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used.
It also uses a supercapacitor to protect the RAID cache data against power
failures.
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● The panel provides a UID/Healthy LED indicator and a fault diagnosis LED. The
iBMC Web management interface provides key component status. The iBMC
web management interface helps technical personnel quickly find faulty
components or the components with risk of faults, simplifying maintenance,
speeding up troubleshooting, and improving system availability.
● The panel provides the iBMC direct connect management port to support local
iBMC O&M, improving O&M efficiency.
● A server provides two hot-swappable PSUs in 1+1 redundancy mode and eight
hot-swappable fan modules in N+1 redundancy mode, improving system
availability.
● The onboard Intelligent Baseboard Management Controller (iBMC) can
continuously monitor system parameters, trigger alarms, and take recovery
measures to minimize shutdown.
● For details on warranty, see Warranty.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
● Supports BIOS menu passwords to ensure the security of system startup and
system management.
● Supports the Network Controller Sideband Interface (NC-SI) feature that allows
a network port to provide functions of both a management network port and a
service network port. The NC-SI feature can be enabled or disabled through the
iBMC or BIOS. The NC-SI feature is disabled by default.
NO TE
The service network port of the NC-SI feature supports the following configurations:
● It can be bound to any network port of the server's OCP 3.0 NIC or other standard
PCIe NICs that support the NC-SI function.
● It allows users to enable or disable the virtual local area network ID (VLAN ID) and
configure the VLAN ID. The VLAN ID is 0 and disabled by default.
● It supports IPv4 and IPv6 addresses, and allows users to configure the IP address,
subnet mask, default gateway, or prefix length of an IPv6 address.
● The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault clearance.
● Supports the lockable server front bezel to ensure local data security.
● Supports chassis cover opening detection to enhance physical security.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buffer overflow attacks when working with a supported OS.
● Intel® Trusted Execution Technology defends against malicious software attacks
based on hardware, prevents the firmware on the device from being maliciously
modified, and prevents unauthorized boot block execution.
● Intel® Software Guard Extensions (SGX) technology allows applications to run in
their own independent space without being affected by other software running in
the system, thereby enhancing security.
● Supports secure boot based on the chip-level Root of Trust (RoT) and provides
the level-by-level verification function starting from the hardware trusted root,
building a complete secure boot chain.
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● Supports the trusted platform module (TPM) and trusted password module
(TCM) to provide advanced encryption functions, such as digital signature and
remote authentication.
● Meets the following requirements in NIST SP 800-147B:
– The BIOS firmware digital signature update mechanism is supported. During
the upgrade, the digital signature is verified to prevent unauthorized BIOS
firmware upgrade.
– The flash security protection mechanism is supported to prevent
unauthorized modification of the flash in the OS.
Energy Efficiency
● Provides 80 PLUS Platinum/Titanium PSUs with different energy efficiency
levels. The efficiency of the PSUs reaches 96% when the load is 50%.
● Supports active/standby power supply and high-voltage DC power supply to
improve the efficiency of the power supply system.
● Efficient Voltage Regulator Down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
● Area-based Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation and
reduce overall system power consumption.
● The improved thermal design with energy-efficient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spinup of drives reduces the server boot power consumption.
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3 Physical Structure
Figure 3-1 Physical structure of a server with 8 x 2.5" drives (example)
1I/O module 1 2 I/O module 2
3 PSU 4 Chassis
5 Air duct 6 Intrusion sensor
7 Front-drive backplane 8 Front drives
9 Indicator board module 10 Fan modules
11 Fan module bracket 12 Cable management arm
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13 Fan board 14 Processor heat sinks
15 Processors 16 Mainboard
17 Memory modules 18 TPM/TCM
19 OCP 3.0 NICs 20 BMC card
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4 Logic Structure
Figure 4-1 Logic structure
● The server supports one or two new-generation Intel® Xeon® Scalable
processors (Sapphire Rapids). It supports 32 DDR5 DIMMs. The processors
interconnect with each other through four UltraPath Interconnect (UPI) links at a
speed of up to 16 GT/s.
● The PCIe bus resources of the processor are connected to the PCIe riser card
through PCBs or cables. Different PCIe riser cards support PCIe slots of different
specifications. CPU 1 and CPU 2 each support one OCP 3.0 NIC. The PCIe slot
bandwidth is scalable to x16.
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● The BMC management chip integrated on the mainboard supports ports such as
a video graphic array (VGA) port, a management network port, and a serial port.
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processors
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Module
5.10 Board
5.1 Front Panel
5.1.1 Appearance
● 4 x 3.5" drive configuration
Figure 5-1 Front view
1Drive 2 Slide-out label plate (with
an SN label)
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● 8 x 2.5" drive configuration
Figure 5-2 Front view
1 Drive 2 Slide-out label plate (with
an SN label)
● 10 x 2.5" drive configuration
Figure 5-3 Front view
1Drive 2 Slide-out label plate (with
an SN label)
5.1.2 Indicators and Buttons
Indicator and Button Positions
● 4 x 3.5" drive configuration
Figure 5-4 Indicators and buttons on the front panel
1Fault diagnosis LED 2 Health status indicator
3 FlexIO card 1 presence
indicator
4 FlexIO card 2 presence
indicator
5 Power button/indicator 6 UID button/indicator
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7 iBMC direct connect
management port
indicator
- -
● 8 x 2.5" drive configuration
Figure 5-5 Indicators and buttons on the front panel
1Fault diagnosis LED 2 Health status indicator
3 FlexIO card 1 presence
indicator
4 FlexIO card 2 presence
indicator
5 UID button/indicator 6 iBMC direct connect
management port
indicator
7 Power button/indicator - -
● 10 x 2.5" drive configuration
Figure 5-6 Indicators and buttons on the front panel
1Fault diagnosis LED 2 Health status indicator
3 FlexIO card 1 presence
indicator
4 FlexIO card 2 presence
indicator
5 UID button/indicator 6 iBMC direct connect
management port
indicator
7 Power button/indicator - -
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Indicator and Button Descriptions
Table 5-1 Description of indicators and buttons on the front panel
Sign Indicator and
Button
Description
Fault
diagnosis LED
● ---: The device is operating properly.
● Error code: A component is faulty.
For details about error codes, see the
FusionServer Rack Server iBMC Alarm
Handling.
Health status
indicator
● Off: The device is powered off or faulty.
● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating
properly.
FlexIO card
presence
indicator
Indicates whether the FlexIO card is detected.
● Off: The FlexIO card is not detected.
● Blinking green at 0.5 Hz: The FlexIO card is
detected but is not powered on.
● Blinking green at 2 Hz: The FlexIO card is
detected and has just been inserted.
● Steady green: The FlexIO card is detected
and the power supply is normal.
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Sign Indicator and
Button
Description
Power button/
indicator
Power indicator:
● Off: The device is powered off.
● Steady green: The device is powered on.
● Blinking yellow: The iBMC is starting. The
power button is locked and cannot be
pressed. The iBMC is started in about 1
minute, and then the power indicator is
steady yellow.
● Steady yellow: The device is in the standby
state.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down the
OS.
NOTE
For different OSs, you may need to shut down the
OS as prompted.
● When the device is powered on, you can hold
down this button for 6 seconds to forcibly
power off the device.
● When the power indicator is steady yellow,
you can press this button to power on the
device.
UID button/
indicator
The UID button/indicator helps identify and
locate a device.
UID indicator:
● Off: The device is not being located.
● Blinking or steady blue: The device is being
located.
UID button:
● You can control the UID indicator status by
pressing the UID button or using the iBMC.
● You can press this button to turn on or off the
UID indicator.
● You can press and hold down this button for 4
to 6 seconds to reset the iBMC.
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