xFusion Digital Technologies FusionServer CH242 V5 User manual

FusionServer CH242 V5 Compute Node
Technical White Paper
Issue
04
Date
2022-08-12
xFusion Digital Technologies Co., Ltd.

2022-08-12
ii
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Contents
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Contents
About This Document.....................................................................................................................v
1 Product Introduction ....................................................................................................................7
2 Features ...........................................................................................................................................8
3 Physical Structure .......................................................................................................................10
4 Logical Structure .........................................................................................................................12
5 Hardware Description................................................................................................................13
5.1 Front Panel..................................................................................................................................................................13
5.1.1 Appearance..............................................................................................................................................................13
5.1.2 Indicators and Buttons.............................................................................................................................................14
5.1.3 Ports.........................................................................................................................................................................15
5.1.4 Installation Positions................................................................................................................................................16
5.2 Processor.....................................................................................................................................................................16
5.3 Memory ......................................................................................................................................................................17
5.3.1 DDR4 Memory........................................................................................................................................................17
5.3.1.1 Memory Identifier.................................................................................................................................................17
5.3.1.2 Memory Subsystem Architecture..........................................................................................................................18
5.3.1.3 Memory Compatibility .........................................................................................................................................20
5.3.1.4 DIMM Installation Rules......................................................................................................................................22
5.3.1.5 Memory Installation Positions..............................................................................................................................23
5.3.1.6 Memory Protection Technologies.........................................................................................................................25
5.4 Storage........................................................................................................................................................................26
5.4.1 Drive Configurations ...............................................................................................................................................26
5.4.2 Drive Numbering.....................................................................................................................................................26
5.4.3 Drive Indicators.......................................................................................................................................................27
5.4.4 RAID Controller Card .............................................................................................................................................29
5.5 Network......................................................................................................................................................................29
5.5.1 LOMs.......................................................................................................................................................................29
5.6 I/O Expansion.............................................................................................................................................................31
5.6.1 PCIe Cards...............................................................................................................................................................31
5.6.2 PCIe Slot Description..............................................................................................................................................31
5.7 Boards.........................................................................................................................................................................33

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5.7.1 Mainboard................................................................................................................................................................33
6 Product Specifications................................................................................................................35
6.1 Technical Specifications.............................................................................................................................................35
6.2 Environmental Specifications.....................................................................................................................................37
6.3 Physical Specifications...............................................................................................................................................39
7 Software and Hardware Compatibility ..................................................................................40
8 Safety Instructions ......................................................................................................................41
8.1 Security.......................................................................................................................................................................41
8.2 Maintenance and Warranty .........................................................................................................................................44
9 System Management ..................................................................................................................45
10 Certifications..............................................................................................................................47
A Appendix .....................................................................................................................................49
B Glossary........................................................................................................................................53
C Acronyms and Abbreviations..................................................................................................56

FusionServer CH242 V5 Compute Node
Technical White Paper
About This Document
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About This Document
Purpose
This document describes the appearance, features, specifications, and configurations of the
new-generation CH242 V5 compute node of the E9000 blade server.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol
Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if not
avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to personal
injury.
Supplements the important information in the main text.
NOTE is used to address information not related to personal
injury, equipment damage, and environment deterioration.

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Change History
Issue
Date
Change Description
04
2022-08-12
⚫Optimized 6.3 Physical Specifications .
⚫Added A.1 Node Label.
03
2022-06-25
⚫Added a figure that shows how to measure
dimensions.
⚫Updated 6.1 Technical Specifications and claimed
support for U.2 drives.
⚫Upgrades the standards of CE and UKCA
certifications in the chapter 10 Certifications.
02
2022-03-18
Added10 Certifications.
01
2021-12-20
This issue is the first official release.

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1 Product Introduction
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1 Product Introduction
The CH242 V5 is a full-width compute node powered by Intel®Xeon®Scalable processors. It
provides a unique blend of supreme computing power, large memory, and high flexibility and
expandability.
The CH242 V5 provides dense computing capability and an ultra-large memory. It is
optimized for virtualization, cloud computing, high-performance computing, and
compute-intensive enterprise applications.
The CH242 V5 compute nodes are installed in an E9000 chassis and are centrally managed by
the management module.
Figure 1-1 CH242 V5

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2 Features
Performance and Scalability
⚫Powered by Intel®Xeon®Scalable Skylake or Cascade Lake processors, the server
provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and three 10.4 GT/s
UPI links between the processors, which deliver supreme processing performance.
−It supports four processors with 112 cores and 224 threads to maximize the
concurrent execution of multithreaded applications.
−Intel Turbo Boost Technology 2.0 allows processor cores to run faster than the
frequency specified in the Thermal Design Power (TDP) configuration if they are
operating below power, current, and temperature specification limits.
−Intel Hyper-Threading Technology enables each processor core to run up to two
threads, improving parallel computation capability.
−The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) vendors to better use hardware to address virtualization
workloads.
−Intel®Advanced Vector Extensions 512 (Intel AVX-512) significantly accelerates
floating-point performance for computing-intensive applications.
−The Cascade Lake processors support Intel® Deep Learning Boost vector neural
network instructions (VNNI) to improve the performance of deep learning
applications.
⚫The CH242 V5 fully configured with 48 LRDIMMs provides supreme speed, high
availability, and a maximum memory capacity of 6 TB.
⚫The maximum theoretical memory bandwidth is 550 GB/s (64 bit/8 x 2933 MHz x 6
channels x 4), which is 83.3% higher than that of the previous-generation platform.
⚫The use of all solid-state drives (SSDs) is supported. An SSD supports up to 100 times
more I/O operations per second (IOPS) than a typical hard disk drive (HDD). The use of
all SSDs provides higher I/O performance than the use of all HDDs or a combination of
HDDs and SSDs.
⚫The compute node supports 192-lane PCIe 3.0 (8 GT/s per lane) to provide 20% higher
I/O bandwidth than the previous 160-lane PCIe.
⚫With Intel integrated I/O, the Intel®Xeon®Scalable processors integrate the PCIe 3.0
controller to shortens I/O latency and improve overall system performance.
⚫The compute node supports mezzanine cards with a variety of network ports to meet
requirements for flexible networking.
⚫The compute node supports standard PCIe SSD cards.

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⚫The compute node supports LOM that provides two 10GE ports.
Availability and Serviceability
⚫Memory mirroring and memory module backup prevent system shutdown caused by
uncorrectable memory errors.
⚫Data is protected using hot-swappable drives and RAID properties.
⚫The server provides simplified O&M and efficient troubleshooting through the UID/HLY
LED indicators on the front panel, fault diagnosis LED, and iBMC WebUI.
⚫The SSDs offer better reliability than HDDs, ensuring continued system performance.
⚫The iBMC monitors system parameters in real time, triggers alarms, and performs
recovery actions in case of failures, minimizing system downtime.
⚫For more information about the warranty in the Chinese market, see Warranty.
Manageability and Security
⚫The built-in iBMC monitors server operating status and provides remote management.
⚫The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault handling.
⚫The Advanced Encryption Standard–New Instruction (AES NI) algorithm allows faster
and stronger encryption.
⚫Intel Execute Disable Bit (EDB) function prevents certain types of malicious buffer
overflow attacks when working with a supported OS.
⚫Intel Trusted Execution Technology enhances security using hardware-based defense
against malicious software attacks, allowing applications to run independently.
⚫The trusted platform module (TPM) 2.0 provides advanced encryption functions, such as
digital signatures and remote authentication.
Energy Efficiency
⚫The Intel® Xeon® Scalable processors outperform the previous-generation processors
while fitting into the same TDP.
⚫Intel® Intelligent Power Capability allows a processor to be powered on or off based on
requirements.
⚫Low-voltage Intel®Xeon®Scalable processors consume less energy, ideally suited for
data centers and telecommunications environments constrained by power and thermal
limitations.
⚫The 1.2 V DDR4 RDIMMs consume 20% to 30% less power than 1.35 V DDR3
RDIMMs.
⚫SSDs consume 80% less power than HDDs.
⚫The hexagonal ventilation holes on the compute node provide higher ventilation density
than round holes, increasing system cooling efficiency.
⚫Efficient voltage regulator-down (VRD) power supplies for boards minimize the energy
loss from DC/DC power conversion.
⚫The server is protected with power capping and power control measures.

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3 Physical Structure
Figure 3-1 CH242 V5 physical structure
1
(Optional) HHHL PCIe riser
module
2
(Optional) HHHL PCIe card
3
(Optional) M.2 SSD
4
(Optional) USB flash drive
5
(Optional) TPM
6
RAID controller card
7
(Optional) Supercapacitor
8
Heat sink
9
(Optional) M.2 FRUb
10
(Optional) M.2 adapterb
11
Drivea
12
Drive cage
13
BIOS battery
14
Processor

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15
Mezzanine card
16
Mainboard
17
Memory
-
-
⚫a: The drive slots support 2.5-inch SAS/SATA/NVMe drives and M.2 modules and
mixed configuration of them.
⚫b: An M.2 module is a 2.5-inch drive module that consists of one M.2 adapter and two
M.2 FRUs.

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4 Logical Structure
Figure 4-1 CH242 V5 logical structure
⚫The server supports two or four Intel®Xeon®Scalable processors.
⚫The server supports up to 48 memory modules.
⚫The CPUs (processors) interconnect with each other through three UPI links at a speed
of up to 10.4 GT/s.
⚫The mezzanine cards connect to the processors through PCIe buses to provide service
ports.
⚫The Platform Controller Hub (PCH) has a built-in MAC chip and provides two 10 Gbit/s
ports.
⚫The storage module, consisting of a RAID controller card and a drive backplane,
connects to the CPUs through PCIe buses.
⚫The iBMC provides device management functions, such as compute node power control,
slot number acquisition, PSU detection, and KVM over IP.

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5 Hardware Description
5.1 Front Panel
5.2 Processor
5.3 Memory
5.4 Storage
5.5 Network
5.6 I/O Expansion
5.7 Boards
5.1 Front Panel
5.1.1 Appearance
Figure 5-1 Front view
1
Slide-out label plate (with an SN
label)
2
Ejector levers
3
Ejector release buttons
4
2.5" drivesa
5
Model
6
M.2 FRU
7
M.2 adapter
8
M.2 moduleb
9
PCIe panel
-
-

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⚫a: The drive slots support 2.5-inch SAS/SATA/NVMe drives and M.2 modules and
mixed configuration of them.
⚫b: An M.2 module is a 2.5-inch drive module that consists of one M.2 adapter and two
M.2 FRUs.
5.1.2 Indicators and Buttons
Indicator and Button Positions
Figure 5-2 Indicators and buttons on the front panel
1
Power button/indicator
2
UID button/indicator
3
Health status indicator
-
-
Indicator and Button Descriptions
Table 5-1 Description of indicators and buttons on the front panel
Sign
Indicator and
Button
Description
Power
button/indicator
Power indicator:
⚫Off: The device is not powered on.
⚫Steady green: The device is powered on.
⚫Blinking yellow: The iBMC is starting. The power
button is locked and cannot be pressed. The iBMC
is started in about 1 minute, and then the power
indicator is steady yellow.
⚫Steady yellow: The device is standby.
Power button:
⚫When the device is powered on, you can press this
button to gracefully shut down the OS.
NOTE
For different OSs, you may need to shut down the OS as
prompted.
⚫When the device is powered on, holding down
this button for 6 seconds will forcibly power off

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Sign
Indicator and
Button
Description
the device.
⚫When the power indicator is steady yellow, you
can press this button to power on the device.
UID
UID
button/indicator
The UID button/indicator helps identify and locate a
device.
UID indicator:
⚫Off: The device is not being located.
⚫Blinking or steady blue: The device is being
located.
UID button description:
⚫You can control the UID indicator status by
pressing the UID button or by using the iBMC or
MM910.
⚫You can press this button to turn on or off the
UID indicator.
⚫You can press and hold down this button for 4 to
6 seconds to reset the iBMC.
HLY
Health status
indicator
⚫Off: The device is powered off or is faulty.
⚫Blinking red at 1 Hz: A major alarm has been
generated for the device.
⚫Blinking red at 5 Hz: A critical alarm has been
generated for the device, or the device is not
securely installed.
⚫Steady green: The device is operating properly.
5.1.3 Ports
Port Positions
Figure 5-3 Ports on the front panel
1
USB port
2
-

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Port Description
Port
Type
Quantity
Description
USB port
USB 3.0
2
Used to connect to a USB device.
NOTICE
Before connecting an external USB
device, check that the USB device
functions properly. The server may
operate abnormally if an abnormal
USB device is connected.
5.1.4 Installation Positions
The CH242 V5 is installed in a full-width slot in the front of the E9000 chassis. An E9000
chassis can house a maximum of eight CH242 V5 compute nodes.
Figure 5-4 Installation positions
5.2 Processor
⚫The server supports two or four processors.
⚫If two processors are required, install them in sockets CPU1 and CPU2.
⚫The same model of processors must be used in a server.

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⚫Contact your local sales representative or use the Compatibility Checker to determine the
components to be used.
Figure 5-5 Processor positions
5.3 Memory
5.3.1 DDR4 Memory
5.3.1.1 Memory Identifier
You can determine the memory module properties based on the label attached to the memory
module.

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Figure 5-6 Memory identifier
Callout
Description
Definition
1
Capacity of the memory module
⚫8 GB
⚫16 GB
⚫32 GB
⚫64 GB
⚫128 GB
2
Number of ranks of the memory
module
⚫1R: single-rank
⚫2R: dual-rank
⚫4R: quad-rank
⚫8R: octal-rank
3
Data width on the DRAM
⚫X4: 4-bit
⚫X8: 8-bit
4
Type of the memory interface
⚫PC3: DDR3
⚫PC4: DDR4
5
Maximum memory speed
⚫2133 MT/S
⚫2400 MT/S
⚫2666 MT/S
⚫2933 MT/S
6
Column Access Strobe (CAS)
latency
⚫P: 15
⚫T: 17
7
DIMM type
⚫R: RDIMM
⚫L: LRDIMM
5.3.1.2 Memory Subsystem Architecture
The CH242 V5 provides 48 memory slots. Each processor integrates six memory channels.

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Install the memory modules in the primary memory channels first. If the primary memory
channel is not populated, the memory modules in secondary memory channels cannot be used.
Table 5-2 Memory channels
CPU
Memory Channel
Memory Slot
CPU 1
1A (primary)
DIMM000(1A1)
1A
DIMM001(1A2)
1B (primary)
DIMM010(1B1)
1B
DIMM011(1B2)
1C (primary)
DIMM020(1C1)
1C
DIMM021(1C2)
1D (primary)
DIMM030(1D1)
1D
DIMM031(1D2)
1E (primary)
DIMM040(1E1)
1E
DIMM041(1E2)
1F (primary)
DIMM050(1F1)
1F
DIMM051(1F2)
CPU 2
2A (primary)
DIMM100(2A1)
2A
DIMM101(2A2)
2B (primary)
DIMM110(2B1)
2B
DIMM111(2B2)
2C (primary)
DIMM120(2C1)
2C
DIMM121(2C2)
2D (primary)
DIMM130(2D1)
2D
DIMM131(2D2)
2E (primary)
DIMM140(2E1)
2E
DIMM141(2E2)
2F (primary)
DIMM150(2F1)
2F
DIMM151(2F2)
CPU 3
3A (primary)
DIMM200(3A1)
3A channel
DIMM201(3A2)
3B (primary)
DIMM210(3B1)
3B channel
DIMM211(3B2)

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CPU
Memory Channel
Memory Slot
3C (primary)
DIMM220(3C1)
3C
DIMM221(3C2)
3D (primary)
DIMM230(3D1)
3D
DIMM231(3D2)
3E (primary)
DIMM240(3E1)
3E channel
DIMM241(3E2)
3F (primary)
DIMM250(3F1)
3F channel
DIMM251(3F2)
CPU 4
4A (primary)
DIMM300(4A1)
4A channel
DIMM301(4A2)
4B (primary)
DIMM310(4B1)
4B channel
DIMM311(4B2)
4C (primary)
DIMM320(4C1)
4C
DIMM321(4C2)
4D (primary)
DIMM330(4D1)
4D
DIMM331(4D2)
4E (primary)
DIMM340(4E1)
4E channel
DIMM341(4E2)
4F (primary)
DIMM350(4F1)
4F channel
DIMM351(4F2)
5.3.1.3 Memory Compatibility
Observe the following rules when configuring DDR4 DIMMs: