xFusion Digital Technologies FusionServer 2288H V6 User manual

FusionServer 2288H V6 Server
Technical White Paper
Issue
04
Date
2022-06-25
xFusion Digital Technologies Co., Ltd.

2022-06-25
ii
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Website:
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Contents
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Contents
About This Document..................................................................................................................vii
1 Overview.........................................................................................................................................9
2 Features .........................................................................................................................................11
3 Physical Structure .......................................................................................................................14
3.1 2288H V6-32DIMM...................................................................................................................................................14
3.2 2288H V6-16DIMM...................................................................................................................................................15
4 Logical Structure .........................................................................................................................17
4.1 2288H V6-32DIMM...................................................................................................................................................17
4.2 2288H V6-16DIMM...................................................................................................................................................18
5 Hardware Description................................................................................................................20
5.1 2288H V6-32DIMM...................................................................................................................................................20
5.1.1 Front Panel...............................................................................................................................................................20
5.1.1.1 Appearance ...........................................................................................................................................................20
5.1.1.2 Indicators and Buttons ..........................................................................................................................................22
5.1.1.3 Ports......................................................................................................................................................................27
5.1.2 Rear Panel................................................................................................................................................................30
5.1.2.1 Appearance ...........................................................................................................................................................30
5.1.2.2 Indicators and Buttons ..........................................................................................................................................33
5.1.2.3 Interface................................................................................................................................................................35
5.1.3 Processors ................................................................................................................................................................38
5.1.4 Memory ...................................................................................................................................................................38
5.1.4.1 DDR4 Memory.....................................................................................................................................................38
5.1.4.1.1 Memory ID ........................................................................................................................................................38
5.1.4.1.2 Memory Subsystem Architecture.......................................................................................................................39
5.1.4.1.3 Memory Compatibility ......................................................................................................................................41
5.1.4.1.4 DIMM Installation Rules...................................................................................................................................42
5.1.4.1.5 Memory Installation Positions...........................................................................................................................43
5.1.4.1.6 Memory Protection Technologies ......................................................................................................................46
5.1.4.2 PMem....................................................................................................................................................................46
5.1.4.2.1 Memory Identifier..............................................................................................................................................46
5.1.4.2.2 Memory Subsystem Architecture.......................................................................................................................47

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5.1.4.2.3 Memory Compatibility ......................................................................................................................................48
5.1.4.2.4 DIMM Installation Rules...................................................................................................................................49
5.1.4.2.5 Memory Installation Positions...........................................................................................................................50
5.1.4.2.6 Memory Protection Technologies ......................................................................................................................51
5.1.5 Storage.....................................................................................................................................................................52
5.1.5.1 Drive Configurations ............................................................................................................................................52
5.1.5.1.1 8 x 2.5" Drive Pass-through configuration.........................................................................................................52
5.1.5.1.2 12 x 2.5" Drive Pass-Through Configuration ....................................................................................................57
5.1.5.1.3 12 x 3.5" Drive Pass-through configuration.......................................................................................................60
5.1.5.1.4 12 x 3.5" Drive EXP configuration....................................................................................................................73
5.1.5.1.5 20 x 2.5" Drive Pass-Through Configuration ....................................................................................................84
5.1.5.1.6 24 x 2.5" Drive Pass-through configuration.......................................................................................................87
5.1.5.1.7 25 x 2.5" Drive EXP configuration....................................................................................................................93
5.1.5.2 Drive Indicators ..................................................................................................................................................101
5.1.5.3 RAID Controller Card ........................................................................................................................................104
5.1.6 Network .................................................................................................................................................................104
5.1.6.1 OCP 3.0 Network Adapters.................................................................................................................................104
5.1.7 I/O Expansion........................................................................................................................................................104
5.1.7.1 PCIe Cards..........................................................................................................................................................104
5.1.7.2 PCIe Slots ...........................................................................................................................................................104
5.1.7.3 PCIe Slot Description ......................................................................................................................................... 117
5.1.8 PSUs ......................................................................................................................................................................124
5.1.9 Fan Modules ..........................................................................................................................................................125
5.1.10 LCD.....................................................................................................................................................................126
5.1.11 Boards..................................................................................................................................................................129
5.1.11.1 Mainboard.........................................................................................................................................................129
5.1.11.2 Drive Backplane................................................................................................................................................131
5.2 2288H V6-16DIMM.................................................................................................................................................140
5.2.1 Front Panel.............................................................................................................................................................140
5.2.1.1 Appearance .........................................................................................................................................................140
5.2.1.2 Indicators and Buttons ........................................................................................................................................141
5.2.2 Rear Panel..............................................................................................................................................................144
5.2.2.1 Appearance .........................................................................................................................................................144
5.2.2.2 Indicators and Buttons ........................................................................................................................................145
5.2.2.3 Interface..............................................................................................................................................................146
5.2.3 Processor................................................................................................................................................................148
5.2.4 Memory .................................................................................................................................................................148
5.2.4.1 DDR4 Memory...................................................................................................................................................148
5.2.4.1.1 Memory ID ......................................................................................................................................................148
5.2.4.1.2 Memory Subsystem Architecture.....................................................................................................................149
5.2.4.1.3 Memory Compatibility ....................................................................................................................................150
5.2.4.1.4 DIMM Installation Rules.................................................................................................................................151

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5.2.4.1.5 Memory Installation Positions.........................................................................................................................152
5.2.4.1.6 Memory Protection Technologies ....................................................................................................................153
5.2.5 Storage...................................................................................................................................................................154
5.2.5.1 Drive Configurations ..........................................................................................................................................154
5.2.5.1.1 8 x 2.5" drive pass-through configuration........................................................................................................154
5.2.5.1.2 12 x 3.5" drive pass-through configuration......................................................................................................157
5.2.5.1.3 12 x 3.5" drive EXP configuration...................................................................................................................163
5.2.5.1.4 25 x 2.5" drive EXP configuration...................................................................................................................170
5.2.5.2 Drive Indicators ..................................................................................................................................................177
5.2.5.3 RAID Controller Card ........................................................................................................................................179
5.2.6 Network .................................................................................................................................................................180
5.2.6.1 OCP 3.0 Network Adapters.................................................................................................................................180
5.2.7 I/O Expansion........................................................................................................................................................180
5.2.7.1 PCIe Card ...........................................................................................................................................................180
5.2.7.2 PCIe Slots ...........................................................................................................................................................181
5.2.7.3 PCIe Slot Description .........................................................................................................................................183
5.2.8 PSUs ......................................................................................................................................................................184
5.2.9 Fan Modules ..........................................................................................................................................................185
5.2.10 LCD.....................................................................................................................................................................186
5.2.11 Board....................................................................................................................................................................188
5.2.11.1 Mainboard.........................................................................................................................................................188
5.2.11.2 Drive Backplane................................................................................................................................................190
6 Product Specifications..............................................................................................................195
6.1 2288H V6-32DIMM.................................................................................................................................................195
6.1.1 Technical Specifications ........................................................................................................................................195
6.1.2 Environmental Specifications................................................................................................................................199
6.1.3 Physical Specifications ..........................................................................................................................................200
6.2 2288H V6-16DIMM.................................................................................................................................................202
6.2.1 Technical Specifications ........................................................................................................................................202
6.2.2 Environmental Specifications................................................................................................................................205
6.2.3 Physical Specifications ..........................................................................................................................................207
7 Software and Hardware Compatibility ................................................................................209
8 Safety Instructions ....................................................................................................................210
8.1 Security.....................................................................................................................................................................210
8.2 Maintenance and Warranty .......................................................................................................................................213
9 System Management ................................................................................................................214
10 Certifications............................................................................................................................216
A Appendix ...................................................................................................................................218
B Glossary......................................................................................................................................254

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C Acronyms and Abbreviations................................................................................................257

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About This Document
Purpose
This document describes the FusionServer 2288H V6 rack server in terms of features,
structure, specifications, and component hardware and software compatibility.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol
Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if not
avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to personal
injury.
Supplements the important information in the main text.
NOTE is used to address information not related to personal
injury, equipment damage, and environment deterioration.

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Change History
Issue
Release Date
Change Description
04
2022-06-25
⚫Added a figure that shows how to measure
dimensions.
⚫Upgrades the standards of CE, UKCA, and CCC
certifications in the chapter 10 Certifications.
⚫Added A.1 Chassis Label.
⚫Updated A.3 Operating Temperature Limitations.
03
2022-05-18
Updated A.3 Operating Temperature Limitations.
02
2022-03-18
⚫Added 12 x 3.5-inch drive pass-through
configuration 4.
⚫Updated 5.1.4.1.6 Memory Protection
Technologies.
⚫Added 5.1.4.2 PMem.
⚫Updated 6.1.1 Technical Specifications and 6.2.1
Technical Specifications, and claimed support for
U.2 drives.
⚫Added 10 Certifications.
⚫Updated A.3 Operating Temperature Limitations.
⚫Optimized 12 x 3.5-inch drive pass-through
configuration 2, 12 x 3.5-inch drive pass-through
configuration 2 (4xNVMe), and 12 x 3.5-inch
drive EXP configuration 1.
01
2021-12-24
This issue is the first official release.

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1 Overview
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1 Overview
FusionServer 2288H V6 (2288H V6) is a new-generation 2U 2-socket rack server designed
for Internet, Internet Data Center (IDC), cloud computing, enterprise, and telecom
applications.
The 2288H V6 is ideal for IT core services, cloud computing, virtualization,
high-performance computing, distributed storage, big data processing, enterprise or telecom
service applications, and other complex workloads.
The reliable 2288H V6 features low power consumption, high scalability, easy deployment,
and simplified management.
For details about the 2288H V6 nameplate information, see A.4 Nameplate.
Figure 1-1 2288HV6-32DIMM with 12 x 3.5" drives (example)

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Figure 1-2 2288HV6-16DIMM with 12 x 3.5" drives (example)

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2 Features
Performance and Scalability
⚫Powered by the third-generation Intel®Xeon®Scalable Ice Lake processors, the server
provides up to 40 cores, 3.6 GHz frequency, a 60 MB L3 cache, and up to three 11.2
GT/s UPI links between the processors, which deliver supreme processing performance.
−It supports up to two processors with 80 cores and 160 threads to maximize the
concurrent execution of multithreaded applications.
−The L2 cache capacity is increased. Each core exclusively occupies 1.25 MB L2
cache, and at least 1.5 MB L3 cache.
−Intel Turbo Boost Technology 2.0 allows processor cores to run faster than the
frequency specified in the Thermal Design Power (TDP) configuration if they are
operating below power, current, and temperature specification limits.
−Intel Hyper-Threading Technology enables each processor core to run up to two
threads, improving parallel computation capability.
−The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) to better use hardware to address virtualization workloads.
−Intel® Advanced Vector Extensions 512 (IntelAVX-512) significantly accelerates
floating-point performance for computing-intensive applications.
−Intel DL Boost (VNNI) is supported to improve the performance of deep learning
applications.
−The Intel®SGX and Intel®TME security features provide fine-grained data
protection through application isolation in the memory, and defend against physical
attacks through full memory encryption.
⚫2288H V6-32DIMM supports a maximum of 32 memory modules in the following
memory forms:
−The server supports a maximum of 32 DDR4 ECC 3200 MT/s DIMMs. The DDR4
ECC DIMMs support registered DIMMs (RDIMM) and load-reduced DIMMs
(LRDIMMs), which provide high speed and availability. A server supports a
maximum memory capacity of 8192 GB and a maximum memory bandwidth of
400 GB/s in theory.
−The server supports a maximum of 16 Intel®OptaneTM Persistent Memory Module
200 series (PMem modules for short), which must be used with the DDR4 memory
modules. When the DDR4 memory modules are used together, the server supports a
maximum of 12 TB memory capacity (calculated based on a maximum of 256 GB
capacity per DDR4 memory module and a maximum of 512 GB capacity per PMem
module).

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⚫2288H V6-16DIMM servers support a maximum of 16 DDR4 ECC 3200 MT/s DIMMs.
The DDR4 ECC DIMMs support registered DIMMs (RDIMM) and load-reduced
DIMMs (LRDIMMs), which provide high speed and availability. A server supports a
maximum memory capacity of 2048 GB and a maximum memory bandwidth of 400
GB/s in theory.
⚫Flexible drive configurations meet a variety of business requirements and ensure high
elasticity and scalability of storage resources.
⚫The use of all solid-state drives (SSDs) is supported. An SSD supports up to 100 times
more I/O operations per second (IOPS) than a typical hard disk drive (HDD). The use of
all SSDs provides higher I/O performance than the use of all HDDs or a combination of
HDDs and SSDs.
⚫The use of 12 Gbit/s SCSI (SAS) serial connection for internal storage provides 2x data
transmission rate than the use of 6 Gbit/s SAS connection, maximizing the performance
of I/O-intensive applications.
⚫With Intel integrated I/O, the third-generation Intel®Xeon®Scalable processors integrate
the PCIe 4.0 controller to shorten I/O latency and improve overall system performance.
⚫2288H V6-32DIMM supports a maximum of eleven standard PCIe 4.0 expansion slots.
2288H V6-16DIMM supports a maximum of two standard PCIe 4.0 expansion slots and
five standard PCIe 3.0 expansion slots.
⚫2288H V6-32DIMM supports two FlexIO cards (adapting to the OCP 3.0 network
adapter). 2288H V6-16DIMM supports one FlexIO card (adapting to the OCP 3.0
network adapter) with flexible configuration of GE/10GE/25GE/100GE network
adapters which are hot swappable.
Availability and Serviceability
⚫Carrier-class components with process expertise ensure high system reliability and
availability.
⚫The server supports hot-swappable SAS/SATA/NVMe drives. SAS/SATA drives support
RAID 0, 1, 1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also
uses a supercapacitor to protect the RAID cache data against power failures.
⚫SSDs offer better reliability than HDDs, prolonging system uptime.
⚫The server provides simplified O&M and efficient troubleshooting through the UID/HLY
indicators on the front panel, fault diagnosis LED, touch LCD diagnosis panel, and
iBMC web interface.
⚫The mounting ears of 2288H V6-32DIMM provide iBMC direct connect management
ports to support local iBMC O&M, improving O&M efficiency.
⚫A server provides two hot-swappable PSUs in 1+1 redundancy mode and four
hot-swappable fan modules in N+1 redundancy mode, improving system availability.
⚫The built-in iBMC monitors system parameters in real time, triggers alarms, and
performs recovery actions to minimize the system downtime.
⚫For details about the warranty policy, visit Warranty.
Manageability and Security
⚫The built-in iBMC monitors server operating status and provides remote management.
⚫A password is required for accessing the BIOS, ensuring system boot and management
security.

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⚫The NC-SI feature allows a network port to serve as a management port and a service
port. The NC-SI feature is disabled by default and can be enabled through the iBMC or
BIOS.
⚫The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault handling.
⚫The server chassis panel ensures security of local data.
⚫Chassis cover opening detection is supported to enhance security.
⚫Intel Execute Disable Bit (EDB) function prevents certain types of malicious buffer
overflow attacks when working with a supported OS.
⚫The Intel Converged Boot Guard & Trusted Execution Technology (Intel CBnT)
prevents malicious software attacks based on hardware, prevents the firmware from
being maliciously modified, and prevents the execution of unauthorized boot blocks. It
also allows applications to run in their own independent space without being affected by
other software running in the system, thereby enhancing security.
⚫The secure boot based on the chip RoT implements level-by-level firmware verification
starting from the hardware RoT and builds a complete secure boot chain.
⚫The trusted platform module (TPM) and trusted cryptography module (TCM) provide
advanced encryption functions, such as digital signatures and remote authentication.
⚫The following requirements in NIST SP 800-147B are met:
−The BIOS firmware digital signature update mechanism is supported. During the
upgrade, the digital signature is verified to prevent unauthorized BIOS firmware
upgrade.
−The flash security protection mechanism is supported to prevent unauthorized
modification of the flash memory in the OS.
The service port with NC-SI enabled supports the following configuration:
⚫Configuring any network port on the FlexIO card or PCIe NIC (with NC-SI enabled).
⚫Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The VLAN ID
is 0and disabled by default.
⚫Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6 addresses (IPv6
address, prefix length, and gateway) for this port.
Energy Efficiency
⚫The server supports 80 Plus Platinum/Titanium PSUs of different energy efficiency
levels. The PSU efficiency reaches 96% at 50% load.
⚫Active/standby power supply and HVDC power supply are supported, improving the
efficiency of the power supply system.
⚫Efficient voltage regulator-down (VRD) power supplies for boards minimize the energy
loss from DC/DC power conversion.
⚫Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed adjustment and
intelligent CPU frequency scaling optimize heat dissipation and reduce overall system
power consumption.
⚫The improved thermal design with energy-efficient fans ensures optimal heat dissipation
and reduces system power consumption.
⚫The server is protected with power capping and power control measures.
⚫Staggered spin-up of drives reduces the server boot power consumption.

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3 Physical Structure
3.1 2288H V6-32DIMM
3.2 2288H V6-16DIMM
3.1 2288H V6-32DIMM
Figure 3-1 Physical structure of a server with 12 x 3.5" drives (example)
1
I/O module 1
2
I/O module 2
3
PSU
4
Chassis
5
I/O module 3
6
Supercapacitor holder

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7
Air duct
NOTE
The air duct cannot be installed
on a server with built-in drives.
8
Intrusion sensor
9
Front-drive backplane
10
Left mounting ear plate
11
Fan module brackets
12
Fan module
13
Front drive
14
Right mounting ear plate
15
Processor heat sink
16
Processor
17
Cable organizer
18
Mainboard
19
BMC card
20
OCP 3.0 network adapter
21
Screw-in RAID controller
card
22
TPM/TCM
23
Memory
-
-
3.2 2288H V6-16DIMM
Figure 3-2 Physical structure of a server with 12 x 3.5" drives (example)
1
I/O module 1
2
PCIe Card

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3
PSU
4
Chassis
5
I/O module 3
6
Supercapacitor holder
7
Air duct
NOTE
The air duct cannot be installed
on a server with built-in drives.
8
Intrusion sensor
9
Front-drive backplane
10
Left mounting ear plate
11
Fan module brackets
12
Fan module
13
Front drive
14
Mainboard
15
Processor
16
Processor heat sink
17
Built-in PCIe card
18
Install the guide trough for the
built-in standard card
19
Memory
20
TPM/TCM
21
Screw-in RAID controller
card
22
OCP 3.0 network adapter

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4 Logical Structure
4.1 2288H V6-32DIMM
4.2 2288H V6-16DIMM
4.1 2288H V6-32DIMM
Figure 4-1 Logical Structure
⚫The server supports one or two third-generation Intel®Xeon®Scalable Ice Lake
processors.
⚫The server supports up to 32 memory modules.

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⚫The CPUs (processors) interconnect with each other through three UPI links at a speed
of up to 11.2 GT/s.
⚫The PCIe riser card connects to the processors through PCIe buses to provide ease of
expandability and connection.
⚫CPU1 and CPU2 each support one OCP 3.0 network adapter.
⚫The screw-in RAID controller card on the mainboard connects to CPU 1 through PCIe
buses, and connects to the drive backplane through SAS signal cables.A variety of drive
backplanes are provided to support different local storage configurations.
⚫The LBG-R Platform Controller Hub (PCH) is integrated on the mainboard to support
five USB 3.0 ports.
⚫The BMC management chip integrated on the mainboard supports a video graphic array
(VGA) port, a management network port, and a serial port.
4.2 2288H V6-16DIMM
Figure 4-2 Logical Structure
⚫The server supports one or two third-generation Intel®Xeon®Scalable Ice Lake
processors.
⚫The server supports up to 16 memory modules.
⚫The CPUs (processors) interconnect with each other through three UPI links at a speed
of up to 11.2 GT/s.
⚫CPU1 supports one OCP 3.0 network adapter.

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⚫The screw-in RAID controller card on the mainboard connects to CPU 1 through PCIe
buses, and connects to the drive backplane through SAS signal cables. A variety of drive
backplanes are provided to support different local storage configurations.
⚫The LBG-R Platform Controller Hub (PCH) is integrated on the mainboard to support
three USB 3.0 ports.
⚫The BMC management chip integrated on the mainboard supports a video graphic array
(VGA) port, a management network port, and a serial port.

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5 Hardware Description
5.1 2288H V6-32DIMM
5.2 2288H V6-16DIMM
5.1 2288H V6-32DIMM
5.1.1 Front Panel
5.1.1.1 Appearance
⚫8 x 2.5" Drive Configuration
Figure 5-1 Front view
1
Drive
2
(Optional) Built-in DVD
drive (or LCD module)
3
Slide-out label plate (with an
SN label)
-
-
⚫12 x 2.5" drive configuration (4 x SAS/SATA + 8 x NVMe)