xFusion Digital Technologies FusionServer 2288H V7 User manual

FusionServer 2288H V7 Server
Technical White Paper
Issue 02
Date 2023-05-25
xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
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Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description
and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"
mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
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xFusion Digital Technologies Co., Ltd.
Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com
Issue 02 (2023-05-25) Copyright © xFusion Digital Technologies Co., Ltd. i

About This Document
Purpose
This document describes the appearance, features, performance parameters, and
hardware and software compatibility of FusionServer 2288H V7, so that users can
have an in-depth and detailed understanding of FusionServer 2288H V7.
Intended Audience
This document is intended for pre-sales engineers.
Symbolic Conventions
The symbols that may be found in this document are defined as follows:
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, could result in death or serious injury.
Indicates a hazard with a medium risk which, if not
avoided, could result in death or serious injury.
Indicates a low-level hazard which, if not avoided, could
result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in device damage, data loss, device
performance degradation, or other unpredictable results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
FusionServer 2288H V7 Server
Technical White Paper About This Document
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Change History
Issue Release Date Change Description
01 2021-06-21 This issue is the first official release.
FusionServer 2288H V7 Server
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Contents
About This Document.........................................................................................................ii
1 Overview........................................................................................................................... 1
2 Features............................................................................................................................ 2
3 Physical Structure........................................................................................................... 5
4 Logical Structure............................................................................................................. 7
5 Hardware Description......................................................................................................8
5.1 Front Panel.................................................................................................................................................. 8
5.1.1 Appearance...............................................................................................................................................8
5.1.2 Indicators and Buttons............................................................................................................................ 10
5.1.3 Ports........................................................................................................................................................15
5.2 Rear Panel.................................................................................................................................................18
5.2.1 Appearance.............................................................................................................................................18
5.2.2 Indicators and Buttons............................................................................................................................ 20
5.2.3 Ports........................................................................................................................................................22
5.3 Processors.................................................................................................................................................24
5.4 Memory......................................................................................................................................................24
5.4.1 DDR5 Memory........................................................................................................................................ 25
5.4.1.1 Memory Identifier................................................................................................................................. 25
5.4.1.2 Memory Subsystem Architecture.........................................................................................................26
5.4.1.3 Memory Compatibility.......................................................................................................................... 27
5.4.1.4 DIMM Installation Rules.......................................................................................................................28
5.4.1.5 Memory Installation Positions.............................................................................................................. 29
5.4.1.6 Memory Protection Technologies.........................................................................................................32
5.5 Storage...................................................................................................................................................... 32
5.5.1 Drive Configurations and Drive Numbering............................................................................................ 32
5.5.1.1 8 x 2.5" Drive Pass-Through Configurations........................................................................................32
5.5.1.2 12 x 2.5" Drive Pass-Through Configurations......................................................................................39
5.5.1.3 12 x 3.5" Drive Pass-Through Configurations......................................................................................43
5.5.1.4 12 x 3.5" Drive EXP Configurations..................................................................................................... 53
5.5.1.5 24 x 2.5" Drive Pass-Through Configurations......................................................................................58
5.5.1.6 24 x 2.5" Drive NVMe Configurations.................................................................................................. 61
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5.5.1.7 25 x 2.5" Drive EXP Configurations..................................................................................................... 73
5.5.2 Drive Indicators.......................................................................................................................................76
5.5.3 RAID Controller Card..............................................................................................................................78
5.6 Network......................................................................................................................................................78
5.6.1 OCP 3.0 NIC...........................................................................................................................................78
5.7 I/O Expansion............................................................................................................................................ 78
5.7.1 PCIe Cards............................................................................................................................................. 78
5.7.2 PCIe Slots...............................................................................................................................................79
5.7.3 PCIe Slot Description..............................................................................................................................84
5.8 PSUs..........................................................................................................................................................89
5.9 Fan Modules.............................................................................................................................................. 90
5.10 LCD..........................................................................................................................................................90
5.11 Boards......................................................................................................................................................92
5.11.1 Mainboard............................................................................................................................................. 93
5.11.2 Drive Backplane....................................................................................................................................95
5.11.3 Fan Board........................................................................................................................................... 107
5.11.4 Adapter Board.....................................................................................................................................107
6 Product Specifications................................................................................................ 110
6.1 Technical Specifications...........................................................................................................................110
6.2 Environmental Specifications...................................................................................................................114
6.3 Physical Specifications.............................................................................................................................116
7 Software and Hardware Compatibility....................................................................... 118
8 Safety Instructions.......................................................................................................119
8.1 Security.................................................................................................................................................... 119
8.2 Maintenance and Warranty......................................................................................................................122
9 System Management................................................................................................... 124
10 Certifications ............................................................................................................. 126
A Appendix...................................................................................................................... 128
A.1 Chassis Label Information.......................................................................................................................128
A.1.1 Chassis Head Label............................................................................................................................. 128
A.1.1.1 Nameplate......................................................................................................................................... 129
A.1.1.2 Certificate.......................................................................................................................................... 129
A.1.1.3 Quick Access Label...........................................................................................................................131
A.1.2 Chassis Internal Label..........................................................................................................................132
A.1.3 Chassis Tail Label.................................................................................................................................132
A.2 Product SN.............................................................................................................................................. 133
A.3 Operating Temperature Limitations......................................................................................................... 135
A.4 Nameplate............................................................................................................................................... 149
A.5 RAS Features..........................................................................................................................................149
A.6 Sensor List...............................................................................................................................................150
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B Glossary....................................................................................................................... 157
B.1 A-E...........................................................................................................................................................157
B.2 F-J........................................................................................................................................................... 158
B.3 K-O.......................................................................................................................................................... 158
B.4 P-T...........................................................................................................................................................158
B.5 U-Z...........................................................................................................................................................159
C Acronyms and Abbreviations.................................................................................... 160
C.1 A-E.......................................................................................................................................................... 160
C.2 F-J........................................................................................................................................................... 161
C.3 K-O..........................................................................................................................................................162
C.4 P-T...........................................................................................................................................................163
C.5 U-Z.......................................................................................................................................................... 165
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1 Overview
FusionServer 2288H V7 (2288H V7) is a new-generation 2U 2-socket rack server
designed for the Internet, Internet Data Center (IDC), cloud computing, enterprise
business, and telecom.
The 2288H V7 server is ideal for IT core services, cloud computing, virtualization,
high-performance computing, distributed storage, big data processing, enterprise or
telecom applications, and other complex workloads.
The 2288H V7 features low power consumption, high scalability, high reliability, and
easy management and deployment.
NO TE
For details about the 2288H V7 nameplate, see A.4 Nameplate.
Figure 1-1 2288H V7 with 12 x 3.5" drives (example)
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2 Features
Performance
● The server supports the new generation of Intel® Xeon® Scalable processors
(Sapphire Rapids), A processor provides up to 60 cores and 120 threads, up to
350 W TDP, a maximum of 4.2 GHz turbo frequency, 2 MB L2 cache and 1.875
MB L3 cache, and four groups of 16 GT/s xGMI links between the processors,
which deliver supreme processing performance.
● The server supports a maximum of 32 DDR5 4800 MT/s registered dual-inline
memory modules (RDIMMs), delivering up to 8192 GB total memory capacity
(calculated using the maximum capacity of a single memory module: 256 GB).
The memory modules feature high speed and availability.
Scalability
● Flexible drive configurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● Supports up to 12 x 3.5" or 24 x 2.5" front drives + 4 x 3.5" built-in drives.
● Supports up to 24 x 2.5" NVMe U.2 drives, improving storage density and I/O
performance.
● The server supports a maximum of 14 standard slots (including four built-in
slots). Among the 14 slots, up to six can be PCIe x16 slots and up to eight
(including four built-in slots) support PCIe 5.0.
● Supports two GE/10GE/25GE/100GE OCP 3.0 NICs with bandwidth scalable to
PCIe 4.0 x16 and orderly hot swap.
NO TE
The hot swap of the OCP NIC depends on the OS driver. Ensure that the system enters
the OS state and the OCP hot swap-related drivers have been loaded.
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA drives. SAS/SATA drives support
RAID 0, 1, 1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used.
It also uses a supercapacitor to protect the RAID cache data against power
failures.
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● The panel provides a UID/Healthy LED indicator, fault diagnosis LCD, and fault
diagnosis LCD touch panel. The iBMC Web management interface provides key
component status indications. The iBMC web management interface helps
technical personnel quickly find faulty components or the components with risk
of faults, simplifying maintenance, speeding up troubleshooting, and improving
system availability.
● The mounting ear provides the iBMC direct connect management port to support
local iBMC O&M, improving O&M efficiency.
● A server provides two hot-swappable PSUs in 1+1 redundancy mode and four
hot-swappable fan modules in N+1 redundancy mode, improving system
availability.
● The onboard Intelligent Baseboard Management Controller (iBMC) can
continuously monitor system parameters, trigger alarms, and take recovery
measures to minimize shutdown.
● For details on warranty, see Warranty.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
● Supports BIOS menu passwords to ensure the security of system startup and
system management.
● Supports the Network Controller Sideband Interface (NC-SI) feature that allows
a network port to provide functions of both a management network port and a
service network port. The NC-SI feature can be enabled or disabled through the
iBMC or BIOS. The NC-SI feature is disabled by default.
NO TE
The service network port of the NC-SI feature supports the following configurations:
● It can be bound to any network port of the server's OCP 3.0 NIC or other standard
PCIe NICs that support the NC-SI function.
● It allows users to enable or disable the virtual local area network ID (VLAN ID) and
configure the VLAN ID. The VLAN ID is 0 and disabled by default.
● It supports IPv4 and IPv6 addresses, and allows users to configure the IP address,
subnet mask, default gateway, or prefix length of an IPv6 address.
● The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault clearance.
● Supports the lockable server front bezel to ensure local data security.
● Supports chassis cover opening detection to enhance physical security.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buffer overflow attacks when working with a supported OS.
● Intel® Trusted Execution Technology defends against malicious software attacks
based on hardware, prevents the firmware on the device from being maliciously
modified, and prevents unauthorized boot block execution.
● Intel® Software Guard Extensions (SGX) technology allows applications to run in
their own independent space without being affected by other software running in
the system, thereby enhancing security.
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● Supports secure boot based on the chip-level Root of Trust (RoT) and provides
the level-by-level verification function starting from the hardware trusted root,
building a complete secure boot chain.
● Supports the trusted platform module (TPM) and trusted password module
(TCM) to provide advanced encryption functions, such as digital signature and
remote authentication.
● Meets the following requirements in NIST SP 800-147B:
– The BIOS firmware digital signature update mechanism is supported. During
the upgrade, the digital signature is verified to prevent unauthorized BIOS
firmware upgrade.
– The flash security protection mechanism is supported to prevent
unauthorized modification of the flash in the OS.
Energy Efficiency
● Provides 80 PLUS Platinum/Titanium PSUs with different energy efficiency
levels. The efficiency of the PSUs reaches 96% when the load is 50%.
● Supports active/standby power supply and high-voltage DC power supply to
improve the efficiency of the power supply system.
● Efficient Voltage Regulator Down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
● Area-based Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation and
reduce overall system power consumption.
● The improved thermal design with energy-efficient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spinup of drives reduces the server boot power consumption.
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3 Physical Structure
Figure 3-1 Physical structure of a server with 12 x 3.5" drives (example)
1I/O module 1 2 I/O module 2
3 PSU 4 Chassis
5 I/O module 3 6 Supercapacitor holder
7 Air duct
NOTE
The air duct cannot be
installed on a server
configured with built-in drives
or built-in cards.
8 Intrusion sensor
9 Front-drive backplane 10 Left mounting ear plate
11 Front drives 12 Right mounting ear plate
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13 Fan modules 14 Fan module brackets
15 Fan board 16 Processor heat sink
17 Processor 18 Cable organizer
19 Mainboard 20 Memory modules
21 TPM/TCM 22 OCP 3.0 NIC
23 BMC card - -
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4 Logical Structure
Figure 4-1 Logical structure
● The server supports one or two new-generation Intel® Xeon® Scalable
processors (Sapphire Rapids). It supports 32 DDR5 DIMMs. The processors
interconnect with each other through four UltraPath Interconnect (UPI) links at a
speed of up to 16 GT/s.
● The PCIe bus resources of the processor are connected to the PCIe riser card
through PCBs or cables. Different PCIe riser cards support PCIe slots of different
specifications. CPU 1 and CPU 2 each support one OCP 3.0 NIC. The PCIe slot
bandwidth is scalable to x16.
● The BMC management chip integrated on the mainboard supports ports such as
a video graphic array (VGA) port, a management network port, and a serial port.
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processors
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Modules
5.10 LCD
5.11 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" drive configuration
Figure 5-1 Front view
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1 Drive 2 (Optional) LCD module
3 Slide-out label plate (with
an SN label)
- -
● 12 x 2.5" drive configuration (4 x SAS/SATA + 8 x NVMe)
Figure 5-2 Front view
1Drive 2 Slide-out label plate (with
an SN label)
● 12 x 3.5" drive configuration
Figure 5-3 Front view
1Drive 2 Slide-out label plate (with
an SN label)
● 24 x 2.5" drive configuration:
Figure 5-4 Front view
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1 Drive 2 Slide-out label plate (with
an SN label)
● 25 x 2.5" drive configuration
Figure 5-5 Front view
1Drive 2 Slide-out label plate (with
an SN label)
5.1.2 Indicators and Buttons
Indicator and Button Positions
● 8 x 2.5" drive configuration
Figure 5-6 Indicators and buttons on the front panel
1UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card 1 presence
indicator
6 FlexIO card 2 presence
indicator
7 iBMC direct connect
management port
indicator
- -
● 12 x 2.5" drive configuration (4 x SAS/SATA + 8 x NVMe)
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Figure 5-7 Indicators and buttons on the front panel
1 UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card 1 presence
indicator
6 FlexIO card 2 presence
indicator
7 iBMC direct connect
management port
indicator
- -
● 12 x 3.5" drive configuration
Figure 5-8 Indicators and buttons on the front panel
1UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card 1 presence
indicator
6 FlexIO card 2 presence
indicator
7 iBMC direct connect
management port
indicator
- -
● 24 x 2.5" drive configuration:
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Figure 5-9 Indicators and buttons on the front panel
1 UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card 1 presence
indicator
6 FlexIO card 2 presence
indicator
7 iBMC direct connect
management port
indicator
- -
● 25 x 2.5" drive configuration
Figure 5-10 Indicators and buttons on the front panel
1UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card 1 presence
indicator
6 FlexIO card 2 presence
indicator
7 iBMC direct connect
management port
indicator
- -
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Indicator and Button Description
Table 5-1 Indicators and buttons on the front panel
Silkscreen Indicator/
Button
Description
Fault
diagnosis LED
● ---: The device is operating properly.
● Error code: A component is faulty.
For details about error codes, see the
FusionServer Rack Server iBMC Alarm
Handling.
Health status
indicator
● Off: The device is powered off or faulty.
● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating
properly.
FlexIO card
presence
indicator
Indicates whether the FlexIO card is detected.
● Off: The FlexIO card is not detected.
● Blinking green at 0.5 Hz: The FlexIO card is
detected but is not powered on.
● Blinking green at 2 Hz: The FlexIO card is
detected and has just been inserted.
● Steady green: The FlexIO card is detected
and the power supply is normal.
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