xFusion Digital Technologies FusionServer 2488 V5 User manual

FusionServer 2488 V5 Server
Technical White Paper
Issue 06
Date 2023-12-12
xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of xFusion Digital Technologies Co., Ltd.
Trademarks and Permissions
and other xFusion trademarks are trademarks of xFusion Digital Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description
and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"
mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technologies Co., Ltd. shall not bear any liability resulting from
the use of "xFusion".
The purchased products, services and features are stipulated by the contract made between xFusion and
the customer. All or part of the products, services and features described in this document may not be within
the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
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The information in this document is subject to change without notice. Every effort has been made in the
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xFusion Digital Technologies Co., Ltd.
Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com
Issue 06 (2023-12-12) Copyright © xFusion Digital Technologies Co., Ltd. i

About This Document
Purpose
This document describes the FusionServer 2488 V5 rack server in terms of features,
structure, specifications, and component hardware and software compatibility.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
FusionServer 2488 V5 Server
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Change History
Issue Date Description
06 2023-12-12 ● Updated 10 Certifications.
● Updated A.4 Nameplate .
05 2022-11-11 ● Updated 6.3 Physical Specifications .
● Updated 8.1 Security.
04 2022-08-12 Optimized 6.3 Physical Specifications .
03 2022-06-25 ● Added a figure that shows how to measure
dimensions.
● Updated 6.1 Technical Specifications and
claimed support for U.2 drives.
● Updated CE, UKCA, and CCC certification
standards in 10 Certifications.
● Added A.1 Chassis Label.
02 2022-03-18 Added Certifications [2488 V5-BP].
01 2021-12-20 This issue is the first official release.
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Contents
About This Document.........................................................................................................ii
1 Product Introduction....................................................................................................... 1
2 Features............................................................................................................................ 2
3 Physical Structure........................................................................................................... 5
4 Logical Structure............................................................................................................. 6
5 Hardware Description......................................................................................................8
5.1 Front Panel.................................................................................................................................................. 8
5.1.1 Appearance...............................................................................................................................................8
5.1.2 Indicators and Buttons.............................................................................................................................. 9
5.1.3 Ports........................................................................................................................................................13
5.2 Rear Panel.................................................................................................................................................15
5.2.1 Appearance.............................................................................................................................................15
5.2.2 Indicators ............................................................................................................................................... 16
5.2.3 Ports .......................................................................................................................................................18
5.3 Processor...................................................................................................................................................19
5.4 Memory......................................................................................................................................................20
5.4.1 DDR4 Memory........................................................................................................................................ 20
5.4.1.1 Memory Identifier................................................................................................................................. 20
5.4.1.2 Memory Subsystem Architecture.........................................................................................................21
5.4.1.3 Memory Compatibility.......................................................................................................................... 23
5.4.1.4 DIMM Installation Rules.......................................................................................................................24
5.4.1.5 Memory Installation Positions.............................................................................................................. 25
5.4.1.6 Memory Protection Technologies.........................................................................................................27
5.5 Storage...................................................................................................................................................... 28
5.5.1 Drive Configurations............................................................................................................................... 28
5.5.2 Drive Numbering.....................................................................................................................................29
5.5.3 Drive Indicators.......................................................................................................................................29
5.5.4 RAID Controller Card..............................................................................................................................32
5.6 Network......................................................................................................................................................32
5.6.1 LOMs ..................................................................................................................................................... 32
5.7 I/O Expansion............................................................................................................................................ 35
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5.7.1 PCIe Cards............................................................................................................................................. 35
5.7.2 PCIe Slots...............................................................................................................................................35
5.7.3 PCIe Slot Description..............................................................................................................................36
5.8 PSUs .........................................................................................................................................................37
5.9 Fans...........................................................................................................................................................38
5.10 LCD..........................................................................................................................................................38
5.10.1 LCD Software Environment.................................................................................................................. 40
5.11 Boards......................................................................................................................................................40
5.11.1 Mainboard ............................................................................................................................................ 40
5.11.2 Drive Backplane....................................................................................................................................42
5.11.3 PSU Backplane.....................................................................................................................................44
6 Product Specifications.................................................................................................. 45
6.1 Technical Specifications.............................................................................................................................45
6.2 Environmental Specifications.....................................................................................................................50
6.3 Physical Specifications ............................................................................................................................. 52
7 Software and Hardware Compatibility......................................................................... 54
8 Safety Instructions.........................................................................................................55
8.1 Security......................................................................................................................................................55
8.2 Maintenance and Warranty........................................................................................................................58
9 System Management..................................................................................................... 59
10 Certifications................................................................................................................ 61
11 Waste Product Recycling............................................................................................ 63
A Appendix........................................................................................................................ 64
A.1 Chassis Label............................................................................................................................................64
A.1.1 On the Front Top.....................................................................................................................................64
A.1.1.1 Nameplate........................................................................................................................................... 65
A.1.1.2 Certificate............................................................................................................................................ 66
A.1.1.3 Sample Quick Access Tags.................................................................................................................67
A.1.2 Chassis Tail Label...................................................................................................................................68
A.1.3 Chassis Internal Label............................................................................................................................68
A.2 Product SN................................................................................................................................................ 69
A.3 Operating Temperature Limitations........................................................................................................... 70
A.4 Nameplate ................................................................................................................................................ 71
A.5 RAS Features............................................................................................................................................72
A.6 Sensor List.................................................................................................................................................74
B Glossary......................................................................................................................... 80
B.1 A-E.............................................................................................................................................................80
B.2 F-J............................................................................................................................................................. 80
B.3 K-O............................................................................................................................................................ 81
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B.4 P-T.............................................................................................................................................................81
B.5 U-Z.............................................................................................................................................................82
C Acronyms and Abbreviations...................................................................................... 83
C.1 A-E............................................................................................................................................................ 83
C.2 F-J............................................................................................................................................................. 84
C.3 K-O............................................................................................................................................................86
C.4 P-T.............................................................................................................................................................86
C.5 U-Z............................................................................................................................................................ 88
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1 Product Introduction
FusionServer 2488 V5 (2488 V5) is a 2U 4-socket rack server developed for Internet
data center (IDC), cloud computing, enterprise, and telecom service applications.
The 2488 V5 is ideal for applications such as databases, cloud computing,
virtualization, and in-memory computing.
The 2488 V5 is a secure, highly expandable server delivering high-performance
computing, large storage capacity, and low power consumption. It is easy to deploy
and manage and supports virtualization.
NO TE
For details about the 2488 V5 nameplate information, see A.4 Nameplate .
Figure 1-1 2488 V5
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2 Features
Performance and Scalability
● Powered by Intel® Xeon® Scalable Skylake or Cascade Lake processors, the
server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and
three 10.4 GT/s UPI links between the processors, which deliver supreme
processing performance.
– It supports four processors with 112 cores and 224 threads to maximize the
concurrent execution of multithreaded applications.
– The layered architecture of the processor cache is optimized. The L2 cache
capacity is increased to process memory data directly, which greatly
improves the memory access performance. Each core can exclusively use 1
MB of L2 cache, reducing the load on L3 cache. A single processor can
share a maximum of 38.5 MB L3 cache.
– Intel Turbo Boost Technology 2.0 allows processor cores to run faster than
the frequency specified in the Thermal Design Power (TDP) configuration if
they are operating below power, current, and temperature specification
limits.
– Intel Hyper-Threading Technology enables each processor core to run up to
two threads, improving parallel computation capability.
– The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) vendors to better use hardware to address
virtualization workloads.
– With Intel® Advanced Vector Extensions 512 (AVX-512), applications can
pack 32 double-precision and 64 single-precision floating-point operations
per second in a clock cycle within the 512-bit vectors, as well as eight 64-bit
and sixteen 32-bit integers, with up to two 512-bit fused multiply-add (FMA)
units. Compared with Intel® Advanced Vector Extensions 2.0 (Intel® AVX2),
Intel® AVX-512 doubles the width and number of data registers and the
width of FMA units.
– The Cascade Lake processors support Intel® Deep Learning Boost vector
neural network instructions (VNNI) to improve the performance of deep
learning applications.
● The server supports double data rate 4 (DDR4) registered dual in-line memory
modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error checking
and correcting (ECC). A server fully configured with thirty-two 2933 MT/s
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memory modules (only available with Cascade Lake processors) provides 4096
GB memory space and the maximum theoretical memory bandwidth of 549.9
GB/s.
● Flexible drive configurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● The use of all solid-state drives (SSDs) is supported. An SSD supports up to 100
times more I/O operations per second (IOPS) than a typical hard disk drive
(HDD). The use of all SSDs provides higher I/O performance than the use of all
HDDs or a combination of HDDs and SSDs.
● The use of 12 Gbit/s SCSI (SAS) serial connection for internal storage provides
2x data transmission rate than the use of 6 Gbit/s SAS connection, maximizing
the performance of I/O-intensive applications.
● With Intel integrated I/O, the Intel® Xeon® Scalable processors integrate the
PCIe 3.0 controller to shortens I/O latency and improve overall system
performance.
● The server supports up to nine PCIe 3.0 slots.
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA/NVMe drives. It supports RAID 0, 1,
1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also
uses a supercapacitor to protect the RAID cache data against power failures.
● The server provides simplified O&M and efficient troubleshooting through the
UID/HLY LED indicators on the front panel, fault diagnosis LED, touch LCD
diagnosis panel, and iBMC WebUI.
● The SSDs offer better reliability than HDDs, ensuring continued system
performance.
● The iBMC monitors system parameters in real time, triggers alarms, and
performs recovery actions in case of failures, minimizing system downtime.
● For more information about the warranty in the Chinese market, see Warranty.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
● A password is required for accessing the BIOS, ensuring system boot and
management security.
● The Network Controller Sideband Interface (NC-SI) allows a network port to
serve as a management port and a service port for maximized return on
investment (ROI) for customers. The NC-SI feature is disabled by default and
can be enabled through the iBMC or BIOS.
● The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault handling.
● Lockable server chassis panel ensures security of local data.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buffer overflow attacks when working with a supported OS.
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● Intel Trusted Execution Technology enhances security using hardware-based
defense against malicious software attacks, allowing applications to run
independently.
● The trusted platform module (TPM) and trusted cryptography module (TCM)
provide advanced encryption functions, such as digital signatures and remote
authentication.
NO TE
The service port with NC-SI enabled supports the following configuration:
● Configuring any LOM port of the server as the service port with NC-SI enabled. Host port 1
is configured by default.
● Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The
VLAN ID is 0 and disabled by default.
● Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6
addresses (IPv6 address, prefix length, and gateway) for this port.
Energy Efficiency
● The 80 Plus Platinum power supply units (PSUs) of multiple power ratings
provide 94% power efficiency at 50% load.
● Efficient voltage regulator-down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
● Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation and
reduce overall system power consumption.
● The improved thermal design with energy-efficient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spin-up for drives reduces the server boot power consumption.
● Intel® Intelligent Power Capability allows a processor to be powered on or off
based on requirements.
● Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
● SSDs consume 80% less power than HDDs.
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3 Physical Structure
Figure 3-1 2488H V5 physical structure (example: 8 x 2.5" drives)
1Riser card 2 PCIe card
3 Power supply unit (PSU) 4 PSU backplane
5 Cable organizer 6 Chassis
7 Air duct 8 Drive Backplane
9 Fan module bracket 10 Drive
11 DVD drive (or LCD) 12 Fan module
13 VGA board 14 Processor
15 Mainboard 16 TPM/TCM
17 Memory 18 Heat sink
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4 Logical Structure
Figure 4-1 2488 V5 logical structure
● The server supports two or four Intel® Xeon® Scalable processors.
● The server supports up to 32 memory modules.
● The CPUs (processors) interconnect with each other through three UPI links at a
speed of up to 10.4 GT/s.
● The server provides nine standard PCIe 3.0 slots of various specifications.
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● The server provides low-speed I/O ports, such as the VGA port, USB 3.0 ports,
and serial ports (RJ45).
● The server provides four LOM ports, including two 10GE optical ports and two
GE electrical ports.
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processor
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fans
5.10 LCD
5.11 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" SAS/SATA drive configuration
Figure 5-1 Front view
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1 Drives 2 Built-in DVD drive or
touchable LCD
3 Slide-out label plate (with
an SN label)
- -
● 24 x 2.5" (16 x SAS/SATA + 8 x NVMe) drive configuration
Figure 5-2 Front view
1Drives 2 Slide-out label plate (with an SN
label)
● 25 x 2.5" SAS/SATA drive configuration
Figure 5-3 Front view
1Drives 2 Slide-out label plate (with
an SN label)
5.1.2 Indicators and Buttons
Indicator and Button Positions
● 8 x 2.5" SAS/SATA drive configuration
Figure 5-4 Indicators and buttons on the front panel
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1 Connection status
indicator for 10GE LOM
port 1
2 Connection status
indicator for 10GE LOM
port 2
3 Connection status
indicator for GE LOM port
1
4 Connection status
indicator for GE LOM port
2
5 Non-Maskable Interrupt
(NMI) button
6 Fault diagnosis LED
7 Health status indicator 8 UID button/indicator
9 Power button/indicator - -
● 24 x 2.5" (16 x SAS/SATA + 8 x NVMe) drive configuration
Figure 5-5 Indicators and buttons on the front panel
1Connection status
indicator for 10GE LOM
port 1
2 Connection status
indicator for 10GE LOM
port 2
3 Connection status
indicator for GE LOM port
1
4 Connection status
indicator for GE LOM port
2
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
9 NMI button - -
Note: There are eight NVMe drives (four NVMe drives on each of the left and
right sides).
● 25 x 2.5" SAS/SATA drive configuration
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Figure 5-6 Indicators and buttons on the front panel
1 Connection status
indicator for 10GE LOM
port 1
2 Connection status
indicator for 10GE LOM
port 2
3 Connection status
indicator for GE LOM port
1
4 Connection status
indicator for GE LOM port
2
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
Indicator and Button Descriptions
Table 5-1 Description of indicators and buttons on the front panel
Sign Indicator and
Button
Description
Fault
diagnosis LED
●---: The device is operating properly.
● Error code: A component is faulty.
For details about error codes, see the
FusionServer Rack Server iBMC Alarm
Handling.
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Sign Indicator and
Button
Description
Power button/
indicator
Power indicator:
● Off: The device is not powered on.
● Steady green: The device is powered on.
● Blinking yellow: The iBMC is starting. The
power button is locked and cannot be
pressed. The iBMC is started in about 1
minute, and then the power indicator is
steady yellow.
● Steady yellow: The device is standby.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down the
OS.
NOTE
For different OSs, you may need to shut down the
OS as prompted.
● When the device is powered on, holding
down this button for 6 seconds will forcibly
power off the device.
● When the power indicator is steady yellow,
you can press this button to power on the
device.
UID button/
indicator
The UID button/indicator helps identify and
locate a device.
UID indicator:
● Off: The device is not being located.
● Blinking or steady blue: The device is being
located.
UID button description:
● You can control the UID indicator status by
pressing the UID button or using the iBMC.
● You can press this button to turn on or off the
UID indicator.
● You can press and hold down this button for 4
to 6 seconds to reset the iBMC.
Health status
indicator
● Off: The device is powered off or is faulty.
● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating
properly.
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Sign Indicator and
Button
Description
NMI button A non-maskable interrupt (NMI) is generally
triggered to stop the OS for debugging. To
trigger an NMI, press this button or click the
button on the iBMC WebUI.
NOTICE
● Press the NMI button only when the OS is
abnormal. Do not press this button when the server
is operating properly. An NMI does not gracefully
shut down the OS and causes service interruption
and data loss.
● Before pressing the NMI button, ensure that the
OS has the NMI processing program. Otherwise,
the OS may crash. Exercise caution when pressing
this button.
LOM port
connection
status
indicator
Each indicator shows the connection status of
an Ethernet LOM port.
● Off: The network port is not in use or has
failed.
● Steady green: The network port is properly
connected.
NOTE
● The indicators correspond to two 10GE and two
GE network ports on the mainboard.
● The LOM has a standby power supply and will not
be powered off even if the service system is
powered off. As long as the LOM ports are properly
connected to other working network devices, the
network ports will remain connected and the
indicators are on.
5.1.3 Ports
Port Positions
● 8 x 2.5" SAS/SATA drive configuration
Figure 5-7 Ports on the front panel
1USB 2.0 ports 2 USB 3.0 port
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