xFusion Digital Technologies FusionServer 2488H V6 User manual

FusionServer 2488H V6 Server
Technical White Paper
Issue
04
Date
2022-08-12
xFusion Digital Technologies Co., Ltd.

2022-08-12
ii
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xFusion Digital Technologies Co., Ltd.
Address:
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Website:
https://www.xfusion.com

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Contents
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Contents
About This Document.....................................................................................................................v
1 Overview.........................................................................................................................................7
2 Features ...........................................................................................................................................8
3 Physical Structure .......................................................................................................................11
4 Logical Structure .........................................................................................................................13
5 Hardware Description................................................................................................................14
5.1 Front Panel..................................................................................................................................................................14
5.1.1 Appearance..............................................................................................................................................................14
5.1.2 Indicators and Buttons .............................................................................................................................................17
5.1.3 Ports.........................................................................................................................................................................20
5.2 Rear Panel...................................................................................................................................................................23
5.2.1 Appearance..............................................................................................................................................................23
5.2.2 Indicators and Buttons .............................................................................................................................................24
5.2.3 Ports.........................................................................................................................................................................26
5.3 Processors...................................................................................................................................................................28
5.4 Memory ......................................................................................................................................................................28
5.4.1 DDR4 Memory........................................................................................................................................................28
5.4.1.1 Memory Identifier.................................................................................................................................................28
5.4.1.2 Memory Subsystem Architecture..........................................................................................................................29
5.4.1.3 Memory Compatibility .........................................................................................................................................31
5.4.1.4 Memory Installation Guidelines ...........................................................................................................................33
5.4.1.5 Memory Installation Positions..............................................................................................................................34
5.4.1.6 Memory Protection Technologies .........................................................................................................................36
5.4.1.7 Memory Protection Technologies.........................................................................................................................37
5.4.2 PMem.......................................................................................................................................................................38
5.4.2.1 Memory Identifier.................................................................................................................................................38
5.4.2.2 Memory Subsystem Architecture..........................................................................................................................38
5.4.2.3 Memory Compatibility .........................................................................................................................................40
5.4.2.4 Memory Installation Guidelines ...........................................................................................................................41
5.4.2.5 Memory Installation Positions..............................................................................................................................42
5.4.2.6 Memory Protection Technologies.........................................................................................................................45

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5.5 Storage........................................................................................................................................................................46
5.5.1 Drive Configurations ...............................................................................................................................................46
5.5.2 Drive Numbering.....................................................................................................................................................52
5.5.3 Drive Indicators .......................................................................................................................................................57
5.5.4 RAID Controller Card .............................................................................................................................................59
5.6 Network ......................................................................................................................................................................60
5.6.1 OCP 3.0 Network Adapter .......................................................................................................................................60
5.7 I/O Expansion.............................................................................................................................................................60
5.7.1 PCIe Cards...............................................................................................................................................................60
5.7.2 PCIe Slots ................................................................................................................................................................61
5.7.3 PCIe Slot Description ..............................................................................................................................................64
5.8 PSUs ...........................................................................................................................................................................65
5.9 Fan Modules ...............................................................................................................................................................66
5.10 LCD..........................................................................................................................................................................67
5.11 Boards.......................................................................................................................................................................70
5.11.1 Mainboard..............................................................................................................................................................70
5.11.2 Drive Backplane.....................................................................................................................................................72
5.11.3 PSU Backplane ......................................................................................................................................................75
6 Product Specifications................................................................................................................76
6.1 Technical Specifications .............................................................................................................................................76
6.2 Environmental Specifications.....................................................................................................................................79
6.3 Physical Specifications ...............................................................................................................................................81
7 Software and Hardware Compatibility ..................................................................................84
8 Safety Instructions ......................................................................................................................85
8.1 Security.......................................................................................................................................................................85
8.2 Maintenance and Warranty .........................................................................................................................................88
9 System Management ..................................................................................................................89
10 Certifications..............................................................................................................................91
A Appendix .....................................................................................................................................93
B Glossary......................................................................................................................................108
C Acronyms and Abbreviations................................................................................................111

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Technical White Paper
About This Document
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About This Document
Purpose
This document describes the FusionServer 2488H V6 rack server in terms of features,
structure, specifications, and component hardware and software compatibility.
Intended Audience
This document is intended for pre-sales engineers.
Symbol Conventions
The symbols that may be found in this document are defined as follows.
Symbol
Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if not
avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to personal
injury.
Supplements the important information in the main text.
NOTE is used to address information not related to personal
injury, equipment damage, and environment deterioration.

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Change History
Issue
Release Date
Change Description
04
2022-08-12
Optimized 6.3 Physical Specifications .
03
2022-06-25
⚫Added a figure that shows how to measure
dimensions.
⚫Added A.1 Chassis Label.
⚫Upgrades the standards of CE, UKCA, and CCC
certifications in the chapter 10 Certifications.
02
2022-03-18
⚫Added 10 Certifications.
⚫Updated 5.4.1.7 Memory Protection Technologies
⚫Updated 6.1 Technical Specifications and claimed
support for U.2 drives.
01
2021-12-24
This issue is the first official release.

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1 Overview
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1 Overview
FusionServer 2488H V6 (2488H V6) is a 2U 4-socket rack server developed for Internet data
center (IDC), cloud computing, enterprise, and telecom service applications.
The 2488H V6 is ideal for applications such as databases, cloud computing, virtualization,
in-memory computing, and deep learning.
The secure, compact 2488H V6 is a highly expandable server delivering high-performance
computing, large storage capacity and low power consumption. It is easy to deploy and
manage and supports virtualization.
For details about the 2488H V6 nameplate information, see A.4 Nameplate.
Figure 1-1 Physical structure of a 2488HV6 with 8 x 2.5" drives (example)

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2 Features
Performance and Scalability
⚫Powered by the third-generation Intel®Xeon®Scalable Cooper Lake processors, the
server provides up to 28 physical cores, 3.9 GHz frequency, a 38.5 MB L3 cache, and six
10.4 GT/s UPI links between the processors, which deliver supreme processing
performance.
−It supports four processors with 112 cores and 224 threads to maximize the
concurrent execution of multithreaded applications.
−The layered architecture of the processor cache is optimized. The L2 cache capacity
is increased to process memory data directly, which greatly improves the memory
access performance. Each core can exclusively use 1 MB of L2 cache, reducing the
load on L3 cache. A single processor can share a maximum of 38.5 MB L3 cache.
−Intel Turbo Boost Technology 2.0 allows processor cores to run faster than the
frequency specified in the Thermal Design Power (TDP) configuration if they are
operating below power, current, and temperature specification limits.
−Intel Hyper-Threading Technology enables each processor core to run up to two
threads, improving parallel computation capability.
−The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) to better use hardware to address virtualization workloads.
−Intel Deep Learning Boost (Intel DL Boost) works with the latest bfloat16
instruction set and Vector Neural Network Instructions (VNNI) to accelerate AI
training and inference performance of the CPU.
−With Intel® Advanced Vector Extensions 512 (AVX-512), applications can pack 32
double-precision and 64 single-precision floating-point operations per second in a
clock cycle within the 512-bit vectors, as well as eight 64-bit and sixteen 32-bit
integers, with up to two 512-bit fused multiply-add (FMA) units. Compared with
Intel®Advanced Vector Extensions 2.0 (Intel®AVX2), Intel®AVX-512 doubles the
width and number of data registers and the width of FMA units.
⚫The server supports a maximum of 48 DDR4 ECC 3200 MT/s DIMMs. The DDR4 ECC
DIMMs support registered DIMMs (RDIMM) and load-reduced DIMMs (LRDIMMs),
which provide high speed and availability.
⚫The server supports a maximum of 24 Intel®OptaneTM Persistent Memory Module 200
series (PMem modules for short). When the DDR4 memory modules are used together,
the server supports a maximum of 18 TB memory capacity (calculated based on a
maximum of 256 GB capacity per DDR4 memory module and a maximum of 512 GB
capacity per PMem module).

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⚫Flexible drive configurations meet a variety of business requirements and ensure high
elasticity and scalability of storage resources.
⚫The use of all solid-state drives (SSDs) is supported. An SSD supports up to 100 times
more I/O operations per second (IOPS) than a typical hard disk drive (HDD). The use of
all SSDs provides higher I/O performance than the use of all HDDs or a combination of
HDDs and SSDs.
⚫The use of 12 Gbit/s SCSI (SAS) serial connection for internal storage provides 2x data
transmission rate than the use of 6 Gbit/s SAS connection, maximizing the performance
of I/O-intensive applications.
⚫With Intel integrated I/O, the third-generation Intel®Xeon®Scalable processors integrate
the PCIe 3.0 controller to shorten I/O latency and improve overall system performance.
⚫The server supports a maximum of 11 PCIe 3.0 expansion slots, including one FlexIO
card slot dedicated for the OCP 3.0 network adapter.
⚫The server supports one FlexIO card (applicable only to the OCP 3.0 network adapter)
with flexible configuration of GE/10GE/25GE/100GE network adapters, which are hot
swappable and support network controller sideband interface (NC-SI), HTTPS boot,
preboot execution environment (PXE), and Wake on LAN (WoL).
Availability and Serviceability
⚫Carrier-class components with process expertise ensure high system reliability and
availability.
⚫The server supports hot-swappable SAS/SATA/NVMe drives. SAS/SATAdrives support
RAID 0, 1, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also uses
a supercapacitor to protect the RAID cache data against power failures.
⚫SSDs offer better reliability than HDDs, prolonging system uptime.
⚫The server provides simplified O&M and efficient troubleshooting through the UID/HLY
indicators on the front panel, fault diagnosis LED, touch LCD diagnosis panel, and
iBMC web interface.
⚫The mounting ears provide iBMC direct connect management ports to support local
iBMC O&M, improving O&M efficiency.
⚫A server provides two hot-swappable PSUs in 1+1 redundancy mode and six
hot-swappable fan modules in N+1 redundancy mode, improving system availability.
⚫The built-in iBMC monitors system parameters in real time, triggers alarms, and
performs recovery actions to minimize the system downtime.
⚫For details about the warranty policy, visit Warranty.
Manageability and Security
⚫The built-in iBMC monitors server operating status and provides remote management.
⚫A password is required for accessing the BIOS, ensuring system boot and management
security.
⚫The NC-SI feature allows a network port to serve as a management port and a service
port. The NC-SI feature is disabled by default and can be enabled through the iBMC or
BIOS.
⚫The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault handling.
⚫Lockable server chassis panel ensures security of local data.
⚫Chassis cover opening detection is supported to enhance security.

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⚫Intel Execute Disable Bit (EDB) function prevents certain types of malicious buffer
overflow attacks when working with a supported OS.
⚫The Intel Converged Boot Guard & Trusted Execution Technology (Intel CBnT)
prevents malicious software attacks based on hardware, prevents the firmware from
being maliciously modified, and prevents the execution of unauthorized boot blocks. It
also allows applications to run in their own independent space without being affected by
other software running in the system, thereby enhancing security.
⚫The trusted platform module (TPM) and trusted cryptography module (TCM) provide
advanced encryption functions, such as digital signatures and remote authentication.
⚫The secure boot based on the BMC chip RoT implements level-by-level firmware
verification and builds a secure boot chain, ensuring system security.
⚫The following requirements in NIST SP 800-147B are met:
−The BIOS firmware digital signature update mechanism is supported. During the
upgrade, the digital signature is verified to prevent unauthorized BIOS firmware
upgrade.
−The flash security protection mechanism is supported to prevent unauthorized
modification of the flash memory in the OS.
The service port with NC-SI enabled supports the following configuration:
⚫Configuring any port on the OCP 3.0 network adapter or other network adapters that support the
NC-SI feature as the service port with NC-SI enabled.
⚫Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The VLAN ID
is 0and disabled by default.
⚫Configuring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6 addresses (IPv6
address, prefix length, and gateway) for this port.
Energy Efficiency
⚫The server supports 80 Plus Platinum/Titanium PSUs of different energy efficiency
levels. The PSU efficiency reaches 96% at 50% load.
⚫Efficient voltage regulator-down (VRD) power supplies for boards minimize the energy
loss from DC/DC power conversion.
⚫Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed adjustment and
intelligent CPU frequency scaling optimize heat dissipation and reduce overall system
power consumption.
⚫The improved thermal design with energy-efficient fans ensures optimal heat dissipation
and reduces system power consumption.
⚫The server is protected with power capping and power control measures.
⚫Staggered spin-up of drives reduces the server boot power consumption.
⚫Intel Intelligent Power Capability allows the processor logic unit to be powered on or off
based on requirements.
⚫The low-voltage third-generation Intel®Xeon®Scalable Cooper Lake processors
consume less energy, ideally suited for data centers and telecommunications
environments constrained by power and thermal limitations.
⚫SSDs consume 80% less power than HDDs.

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3 Physical Structure
Figure 3-1 Physical structure of a server with 8 x 2.5"drives (example)
1
PCIe riser module 1
2
PCIe card
3
PCIe riser module 2
4
Power supply unit (PSU)

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5
PSU backplane
6
Chassis
7
Supercapacitora
8
Intrusion sensor
9
Primary air duct
10
Secondary air ductsb
11
Drive backplane
12
Left mounting ear plate
13
Drive
14
Fan module bracket
15
Fan module
16
Right mounting ear plate
17
Processor
18
Processor heat sink
19
Cable organizer
20
M.2 SSDc
21
Mainboard
22
OCP 3.0 Network Adapters
23
DIMM
-
-
a: The server supports only PCIe RAID controller cards, which can be configured with a
supercapacitor. For details about the slots for installing PCIe RAID controller cards, see
5.5.1 Drive Configurations .
b: Secondary air ducts are not required when full-length PCIe cards are configured.
c: If an M.2 SSD adapter card is configured, two M.2 SSDs can be configured in slot 10. If
an Avago SAS3004iMR RAID controller card is configured, two M.2 FRUs can be
configured in slot 1. For details, see 5.5.1 Drive Configurations .

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4 Logical Structure
Figure 4-1 2488H V6 logical structure
⚫The server supports two or four third-generation Intel®Xeon®Scalable processors.
⚫The server supports up to 48 memory modules.
⚫The CPUs (processors) interconnect with each other through six UPI links at a speed of
up to 10.4 GT/s.
⚫The server supports a maximum of 11 PCIe 3.0 expansion slots, including one slot
dedicated for the OCP 3.0 network adapter.
⚫The LBG-R Platform Controller Hub (PCH) is integrated on the mainboard to support
five USB 3.0 ports and two SATA 3.0 ports.
⚫The BMC management chip integrated on the mainboard supports a video graphics array
(VGA) port, a management network port, and a serial port.

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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processors
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Modules
5.10 LCD
5.11 Boards
5.1 Front Panel
5.1.1 Appearance
⚫8 x 2.5" drive pass-through configuration (8 x SAS/SATA)

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Figure 5-1 Front view
1
SAS/SATA drive
2
(Optional) Built-in DVD
drive (or LCD module)
3
Slide-out label plate (with an
SN label)
-
-
⚫12 x 2.5" drive pass-through configuration (4 x SAS/SATA + 8 x NVMe)
Figure 5-2 Front view
1
SAS/SATA drive
2
NVMe SSDs
3
Slide-out label plate (with an
SN label)
-
-
⚫20 x 2.5" drive pass-through configuration (4 x SAS/SATA + 16 x NVMe)

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Figure 5-3 Front view
1
SAS/SATA drive
2
NVMe SSDs
3
Filler panel in drive slot
NOTE
The slot cannot hold drives.
4
Slide-out label plate (with an
SN label)
⚫24 x 2.5" drive pass-through configuration (24 x SAS/SATA)
Figure 5-4 Front view
1
SAS/SATA drive
2
Filler panel in drive slot
NOTE
The slot cannot hold drives.
3
Slide-out label plate (with an
SN label)
-
-
⚫25 x 2.5" drive EXP configuration (25 x SAS/SATA)

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Figure 5-5 Front view
1
SAS/SATA drive
2
Slide-out label plate (with an
SN label)
5.1.2 Indicators and Buttons
⚫8 x 2.5" drive pass-through configuration (8 x SAS/SATA)
Figure 5-6 Indicators and buttons on the front panel
1
Fault diagnosis LED
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
FlexIO card presence
indicator
6
iBMC direct connect
management port indicator
⚫12 x 2.5" drive pass-through configuration (4 x SAS/SATA + 8 x NVMe)
Figure 5-7 Indicators and buttons on the front panel

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1
Fault diagnosis LED
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
FlexIO card presence
indicator
6
iBMC direct connect
management port indicator
⚫20 x 2.5" drive pass-through configuration (4 x SAS/SATA + 16 x NVMe)
Figure 5-8 Indicators and buttons on the front panel
1
Fault diagnosis LED
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
FlexIO card presence
indicator
6
iBMC direct connect
management port indicator
⚫24 x 2.5" drive pass-through configuration (24 x SAS/SATA)
Figure 5-9 Indicators and buttons on the front panel
1
Fault diagnosis LED
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
FlexIO card presence
indicator
6
iBMC direct connect
management port indicator
⚫25 x 2.5" drive EXP configuration (25 x SAS/SATA)

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Figure 5-10 Indicators and buttons on the front panel
1
Fault diagnosis LED
2
Power button/indicator
3
Health status indicator
4
UID button/indicator
5
FlexIO card presence
indicator
6
iBMC direct connect
management port indicator
Indicator and Button Descriptions
Table 5-1 Description of indicators and buttonson the front panel
Silkscreen
Indicator and
Button
Description
Fault diagnosis
LED
⚫---: The device is operating properly.
⚫Error code: A component is faulty.
For details about error codes, see the
FusionServer Rack Server iBMC Alarm Handling.
Power
button/indicator
Power indicator:
⚫Off: The device is not powered on.
⚫Steady green: The device is powered on.
⚫Blinking yellow: The iBMC is starting. The
power button is locked and cannot be pressed. The
iBMC is started in about 1 minute, and then the
power indicator is steady yellow.
⚫Steady yellow: The device is standby.
Power button:
⚫When the device is powered on, you can press this
button to gracefully shut down the OS.
NOTE
For different OSs, you may need to shut down the OS as
prompted.
⚫When the device is powered on, you can hold
down this button for 6 seconds to forcibly power
off the device.
⚫When the power indicator is steady yellow, you
can press this button to power on the device.

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Silkscreen
Indicator and
Button
Description
Health status
indicator
⚫Off: The device is powered off or is faulty.
⚫Blinking red at 1 Hz: A major alarm has been
generated on the system.
⚫Blinking red at 5 Hz: A critical alarm has been
generated on the system.
⚫Steady green: The device is operating properly.
UID
button/indicator
The UID button/indicator helps identify and locate a
device.
UID indicator:
⚫Off: The device is not being located.
⚫Blinking or steady blue: The device is being
located.
UID button:
⚫You can control the UID indicator status by
pressing the UID button or using the iBMC.
⚫You can press this button to turn on or off the
UID indicator.
⚫You can press and hold down this button for 4 to
6 seconds to reset the iBMC.
FlexIO card
presence
indicator
⚫Off: The FlexIO card is not detected.
⚫Blinking green at 0.5 Hz: The FlexIO card is
detected but is not powered on.
⚫Blinking green at 2 Hz: The FlexIO card is
detected and has just been inserted.
⚫Steady green: The FlexIO card is detected and the
power supply is normal.
iBMC direct
connect
management
port indicator
Indicates the status when the iBMC direct connect
management port connects to a terminal (local PC or
Android mobile phone):
⚫Off: No terminal is connected.
⚫Blinking green at short intervals for 3 seconds and
then off: The port is disabled.
⚫Steady green: The terminal is connected.
5.1.3 Ports
⚫8 x 2.5" drive pass-through configuration (8 x SAS/SATA)