xFusion Digital Technologies FusionServer 2488H V7 User manual

FusionServer 2488H V7 Server
Technical White Paper
Issue 01
Date 2023-09-01
xFusion Digital Technologies Co., Ltd.

Copyright © xFusion Digital Technologies Co., Ltd. 2023. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
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and other xFusion trademarks are trademarks of xFusion Digital Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description
and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"
mentioned or described hereof may not be understood as any meaning other than "xFusion Digital
Technologies Co., Ltd.", and xFusion Digital Technologies Co., Ltd. shall not bear any liability resulting from
the use of "xFusion".
The purchased products, services and features are stipulated by the contract made between xFusion and
the customer. All or part of the products, services and features described in this document may not be within
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xFusion Digital Technologies Co., Ltd.
Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island
Zhengdong New District 450046
Zhengzhou, Henan Province
People's Republic of China
Website: https://www.xfusion.com
Issue 01 (2023-09-01) Copyright © xFusion Digital Technologies Co., Ltd. i

About This Document
Purpose
This document describes the appearance, features, performance parameters, and
hardware and software compatibility of FusionServer 2488H V7, so that users can
have an in-depth and detailed understanding of FusionServer 2488H V7.
Intended Audience
This document is intended for pre-sales engineers.
Symbolic Conventions
The symbols that may be found in this document are defined as follows:
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, could result in death or serious injury.
Indicates a hazard with a medium risk which, if not
avoided, could result in death or serious injury.
Indicates a low-level hazard which, if not avoided, could
result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in device damage, data loss, device
performance degradation, or other unpredictable results.
NOTICE is used to address practices not related to
personal injury.
Supplements the important information in the main text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
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Change History
Issue Date Description
01 2023-09-01 This issue is the first official release.
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Contents
About This Document.........................................................................................................ii
1 Overview........................................................................................................................... 1
2 Features............................................................................................................................ 2
3 Physical Structure........................................................................................................... 5
4 Logical Structure............................................................................................................. 7
5 Hardware Description......................................................................................................9
5.1 Front Panel.................................................................................................................................................. 9
5.1.1 Appearance...............................................................................................................................................9
5.1.2 Indicators and Buttons............................................................................................................................ 10
5.1.3 Ports........................................................................................................................................................13
5.2 Rear Panel.................................................................................................................................................15
5.2.1 Appearance.............................................................................................................................................15
5.2.2 Indicators................................................................................................................................................ 16
5.2.3 Ports........................................................................................................................................................18
5.3 Processors.................................................................................................................................................20
5.4 Memory......................................................................................................................................................20
5.4.1 DDR5 Memory........................................................................................................................................ 20
5.4.1.1 Memory Identifier................................................................................................................................. 20
5.4.1.2 Memory Subsystem Architecture.........................................................................................................22
5.4.1.3 Memory Compatibility.......................................................................................................................... 24
5.4.1.4 Memory Module Installation Rules.......................................................................................................25
5.4.1.5 Positions of the Memory Modules........................................................................................................26
5.4.1.6 Memory Protection Technologies.........................................................................................................29
5.5 Storage...................................................................................................................................................... 29
5.5.1 Drive Configurations and Drive Numbering............................................................................................ 29
5.5.1.1 8 x 2.5" Drive Pass-Through Configuration......................................................................................... 29
5.5.1.2 12 x 2.5" Drive Pass-Through Configuration....................................................................................... 32
5.5.1.3 25 x 2.5" Drive EXP Configuration.......................................................................................................35
5.5.2 Drive Indicators.......................................................................................................................................37
5.5.3 RAID Controller Card..............................................................................................................................39
5.6 Network......................................................................................................................................................39
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5.6.1 OCP 3.0 NICs......................................................................................................................................... 39
5.7 I/O Expansion............................................................................................................................................ 40
5.7.1 PCIe Cards............................................................................................................................................. 40
5.7.2 PCIe Slots...............................................................................................................................................40
5.7.3 PCIe Slot Description..............................................................................................................................41
5.8 PSUs..........................................................................................................................................................42
5.9 Fan Modules.............................................................................................................................................. 43
5.10 LCD..........................................................................................................................................................44
5.11 Boards......................................................................................................................................................46
5.11.1 Mainboard............................................................................................................................................. 47
5.11.2 Drive Backplane....................................................................................................................................49
5.11.3 PSU Backplane.....................................................................................................................................52
5.11.4 Fan Board............................................................................................................................................. 52
5.11.5 Built-in M.2 Adapter Board....................................................................................................................53
6 Product Specifications.................................................................................................. 54
6.1 Technical Specifications.............................................................................................................................54
6.2 Environmental Specifications.....................................................................................................................59
6.3 Physical Specifications.............................................................................................................................. 61
7 Software and Hardware Compatibility......................................................................... 62
8 Safety Instructions.........................................................................................................63
8.1 Security......................................................................................................................................................63
8.2 Maintenance and Warranty........................................................................................................................66
9 System Management..................................................................................................... 68
10 Certifications................................................................................................................ 70
A Appendix........................................................................................................................ 71
A.1 Chassis Label Information.........................................................................................................................71
A.1.1 Chassis Head Label............................................................................................................................... 71
A.1.1.1 Nameplate........................................................................................................................................... 72
A.1.1.2 Certificate............................................................................................................................................ 72
A.1.1.3 Quick Access Label.............................................................................................................................74
A.1.2 Chassis Internal Label............................................................................................................................75
A.1.3 Chassis Tail Label...................................................................................................................................75
A.2 Product SN................................................................................................................................................ 76
A.3 Operating Temperature Limitations........................................................................................................... 78
A.4 Nameplate................................................................................................................................................. 81
A.5 RAS Features............................................................................................................................................81
A.6 Sensor List.................................................................................................................................................81
B Glossary......................................................................................................................... 87
B.1 A-E.............................................................................................................................................................87
B.2 F-J............................................................................................................................................................. 88
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B.3 K-O............................................................................................................................................................ 88
B.4 P-T.............................................................................................................................................................88
B.5 U-Z.............................................................................................................................................................89
C Acronyms and Abbreviations...................................................................................... 90
C.1 A-E............................................................................................................................................................ 90
C.2 F-J............................................................................................................................................................. 91
C.3 K-O............................................................................................................................................................92
C.4 P-T.............................................................................................................................................................93
C.5 U-Z............................................................................................................................................................ 95
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1 Overview
FusionServer 2488H V7 (2488H V7) is a 2U 4-socket rack server designed for the
Internet Data Center (IDC), cloud computing, enterprise business, and telecom.
The 2488H V7 is ideal for various applications, such as databases, cloud computing,
virtualization, and in-memory computing.
The 2488H V7 features high-performance computing, large-capacity storage, low
power consumption, high scalability, high reliability, and easy management and
deployment, and high virtualization application density.
NO TE
For details about the 2488H V7 nameplate, see A.4 Nameplate.
Figure 1-1 2488H V7 with 8 x 2.5" drive (example)
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2 Features
Performance
● The server supports the new generation of Intel® Xeon® Scalable processors
(Sapphire Rapids). A processor provides up to 60 cores and 120 threads, up to
350 W TDP, a maximum of 4.2 GHz turbo frequency, 2 MB L2 cache and 1.875
MB L3 cache, and three groups of 16 GT/s UPI links between the processors,
which deliver supreme processing performance.
● The server supports a maximum of 64 DDR5 4800 MT/s registered dual-inline
memory modules (RDIMMs), delivering up to 16 TB total memory capacity
(calculated using the maximum capacity of a single memory module: 256 GB).
The memory modules feature high speed and availability.
Scalability
● Flexible drive configurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● Up to 25 x 2.5" front drives.
● Up to 8 x 2.5" NVMe U.2 drives, improving storage density and I/O performance.
● The server supports a maximum of 9 standard PCIe slots. Among these slots, a
maximum of six can be PCIe x16 slots, two of which support PCIe 5.0.
● Supports one GE/10GE/25GE/100GE OCP 3.0 NIC that supports orderly hot
swap.
NO TE
A hot swap of an OCP NIC requires support of related OS drivers. Ensure that the OS is
started and the OCP hot swap-related drivers have been loaded before performing a hot
swap of an OCP NIC.
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA/NVMe drives. It supports RAID 0, 1,
1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also
uses a supercapacitor to protect the RAID cache data against power failures.
● The panel provides a UID/Healthy LED indicator, fault diagnosis LCD, and fault
diagnosis LCD touch panel. The iBMC Web management interface provides key
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component status indications. The iBMC web management interface helps
technical personnel quickly find faulty components or the components with risk
of faults, simplifying maintenance, speeding up troubleshooting, and improving
system availability.
● The mounting ear provides the iBMC direct connect management port to support
local iBMC O&M, improving O&M efficiency.
● A server provides two hot-swappable PSUs in 1+1 redundancy mode and six
hot-swappable fan modules in N+1 redundancy mode, improving system
availability.
● The onboard Intelligent Baseboard Management Controller (iBMC) can
continuously monitor system parameters, trigger alarms, and take recovery
measures to minimize shutdown.
● For details on warranty, see Warranty.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
● Supports BIOS menu passwords to ensure the security of system startup and
system management.
● Supports the Network Controller Sideband Interface (NC-SI) feature that allows
a network port to provide functions of both a management network port and a
service network port. The NC-SI feature can be enabled or disabled through the
iBMC or BIOS. The NC-SI feature is disabled by default.
NO TE
The service network port of the NC-SI feature supports the following configurations:
● It can be bound to any network port of the server's OCP 3.0 NIC or other standard
PCIe NICs that support the NC-SI function.
● It allows users to enable or disable the virtual local area network ID (VLAN ID) and
configure the VLAN ID. The VLAN ID is 0 and disabled by default.
● It supports IPv4 and IPv6 addresses, and allows users to configure the IP address,
subnet mask, default gateway, or prefix length of an IPv6 address.
● The integrated Unified Extensible Firmware Interface (UEFI) improves setup,
configuration, and update efficiency and simplifies fault clearance.
● Supports the lockable server front bezel to ensure local data security.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buffer overflow attacks when working with a supported OS.
● Intel® Converged Boot Guard & Trusted Execution Technology defends against
malicious software attacks based on hardware, prevents device firmware from
being maliciously modified, and prevents unauthorized boot block execution. The
technology allows applications to run in their own independent space, freeing
them from other software running in the system and enhancing security.
● Supports the trusted platform module (TPM) and trusted password module
(TCM) to provide advanced encryption functions, such as digital signature and
remote authentication.
● Meets the following requirements in NIST SP 800-147B:
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– The BIOS firmware digital signature update mechanism is supported. During
the upgrade, the digital signature is verified to prevent unauthorized BIOS
firmware upgrade.
– The flash security protection mechanism is supported to prevent
unauthorized modification of the flash in the OS.
Energy Efficiency
● Provides 80 Plus Platinum/Titanium PSUs with different energy efficiency levels.
The efficiency of the PSUs reaches 96% when the load is 50%.
● Efficient Voltage Regulator Down (VRD) power supplies for boards minimize the
energy loss from DC/DC power conversion.
● Area-based Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation and
reduce overall system power consumption.
● The improved thermal design with energy-efficient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spinup of drives reduces the server boot power consumption.
● Intel Intelligent Power Capability allows a processor to be powered on or off
based on service requirements.
● Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
● The power consumption of SSDs is 80% lower than that of traditional HDDs. You
are advised to use SSDs.
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3 Physical Structure
Figure 3-1 2488H V7 with 8 x 2.5" drive (example)
1I/O module 1 2 PCIe cards
3 I/O module 2 4 Chassis
5 PSU 6 Power shelf
7 PSU backplane 8 Mezzanine RAID controller
card or M.2 SSD
9 Air duct 10 Supercapacitor
11 Intrusion sensor 12 Fan board
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13 Fan module bracket 14 Fan modules
15 Left mounting ear plate 16 Drives
17 Drive backplane 18 Right mounting ear plate
19 Heat sinks 20 Remote heat sinks
21 Processors 22 Cable management arms
(CMAs)
23 Mainboard 24 Memory modules
25 OCP 3.0 NIC 26 PCIe expansion board
27 BMC card - -
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4 Logical Structure
Figure 4-1 Logical structure of the 2488H V7
● The server supports two or four new-generation Intel® Xeon® Scalable
processors (Sapphire Rapids).
● It supports 64 DDR5 DIMMs.
● The processors interconnect with each other through three UltraPath
Interconnect (UPI) links at a speed of up to 16 GT/s.
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● Supports 9 standard PCIe slots of various specifications.
● Supports one OCP 3.0 NIC.
● Supports low-speed I/O ports, such as VGA, USB 3.0, and serial port (RJ45).
● The BMC management chip integrated on the mainboard supports ports such as
a video graphic array (VGA) port, a management network port, and a serial port.
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processors
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Modules
5.10 LCD
5.11 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" drive pass-through configuration (8 x SAS/SATA)
Figure 5-1 Front view
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1 SAS/SATA drive 2 (Optional) LCD
3 Slide-out label plate (with
an SN label)
- -
● 12 x 2.5" drive pass-through configuration (4 x SAS/SATA + 8 x NVMe)
Figure 5-2 Front view
1SAS/SATA drive 2 SAS/SATA/NVMe drive
3 NVMe drive 4 Slide-out label plate (with
an SN label)
● 25 x 2.5" drive EXP configuration (25 x SAS/SATA)
Figure 5-3 Front view
1SAS/SATA drive 2 Slide-out label plate (with
an SN label)
5.1.2 Indicators and Buttons
Indicator and Button Positions
● 8 x 2.5" drive pass-through configuration (8 x SAS/SATA)
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Figure 5-4 Indicators and buttons on the front panel
1 UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
● 12 x 2.5" drive pass-through configuration (4 x SAS/SATA + 8 x NVMe)
Figure 5-5 Indicators and buttons on the front panel
1UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
● 25 x 2.5" drive EXP configuration (25 x SAS/SATA)
Figure 5-6 Indicators and buttons on the front panel
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1 UID button/indicator 2 Health status indicator
3 Power button/indicator 4 Fault diagnosis LED
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
Indicator and Button Descriptions
Table 5-1 Description of indicators and buttons on the front panel
Silkscr
een
Indicator/
Button
Description
Fault
diagnosis LED
● ---: The device is operating properly.
● Error code: A component is faulty.
For details about error codes, see the
FusionServer Rack Server iBMC Alarm
Handling.
Power button/
indicator
Power indicator:
● Off: The device is powered off.
● Steady green: The device is powered on.
● Blinking yellow: The iBMC is starting. The power
button is locked and cannot be pressed. The iBMC
is started in about 1 minute, and then the power
indicator is steady yellow.
● Steady yellow: The device is in the standby state.
Power button:
● When the device is powered on, you can press this
button to gracefully shut down the OS.
NOTE
For different OSs, you may need to shut down the OS as
prompted.
● When the device is powered on, you can hold down
this button for 6 seconds to forcibly power off the
device.
● When the power indicator is steady yellow, you can
press this button to power on the device.
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Silkscr
een
Indicator/
Button
Description
UID button/
indicator
The UID button/indicator helps identify and locate a
device.
UID indicator:
● Off: The device is not being located.
● Blinking or steady blue: The device is being
located.
UID button:
● You can control the UID indicator status by pressing
the UID button or using the iBMC.
● You can press this button to turn on or off the UID
indicator.
● You can press and hold down this button for 4 to 6
seconds to reset the iBMC.
Health status
indicator
● Off: The device is powered off or faulty.
● Blinking red at 1 Hz: A major alarm has been
generated on the system.
● Blinking red at 5 Hz: A critical alarm has been
generated on the system.
● Steady green: The device is operating properly.
FlexIO card
presence
indicator
● Off: The FlexIO card is not detected.
● Blinking green at 0.5 Hz: The FlexIO card is
detected but is not powered on.
● Blinking green at 2 Hz: The FlexIO card is detected
and has just been inserted.
● Steady green: The FlexIO card is detected and the
power supply is normal.
iBMC direct
connect
management
port indicator
Indicates the status when the iBMC direct connect
management port connects to a terminal (local PC):
● Off: No terminal is connected.
● Blinking green at short intervals for 3 seconds and
then off: The port is disabled.
● Steady green: The terminal is connected.
5.1.3 Ports
Port Positions
● 8 x 2.5" drive pass-through configuration (8 x SAS/SATA)
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