Xsens MTi 1 Series Use and care manual

Xsens Technologies B.V.
Xsens North America, Inc.
Pantheon 6a
P.O. Box 559
7500 AN Enschede
The Netherlands
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internet www.xsens.com
Document MT1503P, Revision A, 5 Apr 2018
MTi 1-series
Hardware Integration Manual

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Hardware Integration Manual MTi 1-series
Revisions
Revision
Date
By
Changes
A
05 Apr 2018
RGI
Initial release
© 2005-2018, Xsens Technologies B.V. All rights reserved. Information in this document is subject to
change without notice. Xsens, MVN, MotionGrid, MTi, MTx and Awinda are registered trademarks or
trademarks of Xsens Technologies B.V. and/or its parent, subsidiaries and/or affiliates in The
Netherlands, the USA and/or other countries. All other trademarks are the property of their respective
owners.

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Hardware Integration Manual MTi 1-series
Table of Contents
1GENERAL INFORMATION ................................................................................................................... 1
2POWER SUPPLY ................................................................................................................................ 2
2.1 MAIN SUPPLY VOLTAGE (VDDIO) .......................................................................................................... 2
2.2 ANALOG SUPPLY VOLTAGE (VDDA) ........................................................................................................ 2
2.3 SINGLE POWER SUPPLY CONFIGURATION ................................................................................................... 2
2.4 POWER SUPPLY SPECIFICATIONS ............................................................................................................. 3
3INTERFACES ...................................................................................................................................... 4
3.1 PIN CONFIGURATION .......................................................................................................................... 4
3.2 COMMUNICATION TO HOST .................................................................................................................. 4
3.2.1 PSEL serial host communication interface selection ................................................................. 5
3.2.2 I2C....................................................................................................................................... 6
3.2.3 SPI....................................................................................................................................... 7
3.2.4 UART ................................................................................................................................... 7
3.3 GNSS RECEIVER AND BAROMETER INTERFACE............................................................................................. 8
3.4 I/O PINS ......................................................................................................................................... 9
3.4.1 Reset ................................................................................................................................... 9
3.4.2 SYNC_IN .............................................................................................................................. 9
3.5 DNC/RESERVED PINS....................................................................................................................... 9
4DESIGN........................................................................................................................................... 10
4.1 PCB LAYOUT.................................................................................................................................. 10
4.1.1 Frames of reference used in MTi 1-series .............................................................................. 10
4.1.2 Origin of measurements...................................................................................................... 11
4.2 MECHANICAL STRESS ........................................................................................................................ 11
4.2.1 Pushbutton contacts ........................................................................................................... 11
4.2.2 Anchor points..................................................................................................................... 12
4.2.3 Vibrations .......................................................................................................................... 13
4.2.4 Heat .................................................................................................................................. 13
4.2.5 Sockets .............................................................................................................................. 13
4.3 MAGNETOMETER ............................................................................................................................ 13
4.3.1 Ferromagnetic materials ..................................................................................................... 13
4.3.2 High currents ..................................................................................................................... 13
4.4 FOOTPRINT.................................................................................................................................... 14
5PACKAGING .................................................................................................................................... 15
5.1 TRAY PACKAGING INFORMATION .......................................................................................................... 15
5.2 REEL PACKAGING INFORMATION........................................................................................................... 16
5.3 PACKAGE DRAWING.......................................................................................................................... 17
6HANDLING...................................................................................................................................... 18
6.1 REFLOW SPECIFICATION ..................................................................................................................... 18
6.2 ULTRASONIC PROCESSES .................................................................................................................... 18
6.3 ELECTROSTATIC DISCHARGE (ESD)........................................................................................................ 19

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Hardware Integration Manual MTi 1-series
List of Tables
Table 1: MTi 1-series latest generation ........................................................................................................ 1
Table 2: MTi 1-series previous generation .................................................................................................... 1
Table 3: Maximum operating voltage ratings................................................................................................ 3
Table 4: Host communication interfaces specifications.................................................................................. 4
Table 5: Serial host interface selection ......................................................................................................... 5
Table 6: List of I2C addresses ....................................................................................................................... 6
Table 7: GNSS receiver interface specifications............................................................................................. 8
Table 8: I/O interface specifications............................................................................................................. 9
Table 9: MTi 1-series module generations .................................................................................................. 17
List of Figures
Figure 1: External components single supply (I2C interface) ........................................................................... 2
Figure 2: Pin configuration of the MTi 1-series module (top view).................................................................. 4
Figure 3: External components (I2C interface)............................................................................................... 6
Figure 4: Connections (SPI interface) ........................................................................................................... 7
Figure 5: Connections (UART interface full-duplex) ....................................................................................... 7
Figure 6: Connections (GNSS interface) ........................................................................................................ 8
Figure 7: Layout example .......................................................................................................................... 10
Figure 8: Default sensor fixed coordinate system for the MTi 1-series module .............................................. 10
Figure 9: Location origin of measurements................................................................................................. 11
Figure 10: High mechanical stress in diagonal crossover between anchor points ........................................... 12
Figure 11: Reducing anchor points to reduce overall stress in the PCB.......................................................... 12
Figure 12: Keeping the MTi 1-series module away from high mechanical stress areas.................................... 12
Figure 13: Recommended MTi 1-series module footprint ............................................................................ 14
Figure 14: MTi 1-series v1.1 dimensions and sensor locations...................................................................... 17
Figure 15: MTi 1-series v2.0 dimensions and sensor locations...................................................................... 17
Figure 16: Location PCB number on MTi 1-series module (bottom view) ...................................................... 17
Figure 17: Reflow classification profile (not to scale) ................................................................................... 18

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Hardware Integration Manual MTi 1-series
1 General information
This document provides hardware design instructions for the MTi 1-series module. The MTi 1-series
module is a fully functional, self-contained module that is easy to design-in with limited external hardware
components to be added. The MTi 1-series module can be connected to a host through I2C, SPI or
UART interfaces.
Section 2 shows recommendations for power supplies for the 1-series. Section 3 provides information
about the different communication protocols that can be used, and section 4 describes some general
layout considerations. The last two sections provide information about packaging and handling.
The following symbols are used in this document to highlight important information:
A warning symbol indicates actions that could damage the module.
This document applies to the following products:
Table 1: MTi 1-series latest generation
Product name
Type number
Hardware version1
PCB number2
MTi-1
MTi-1T/R
≥ 2.0
≥ SM171223
MTi-2
MTi-2T/R
≥ 2.0
≥ SM171223
MTi-3
MTi-3T/R
≥ 2.0
≥ SM171223
MTi-7
MTi-7T/R
≥ 2.0
≥ SM171223
This document also applies for previous generations, unless noted otherwise.
Table 2: MTi 1-series previous generation
Product name
Type number
Hardware version
PCB number
MTi-1-8A7G6
MTi-1-8A7G6T/R
≤ 1.1
≤ SM141111
MTi-2-8A7G6
MTi-2-8A7G6T/R
≤ 1.1
≤ SM141111
MTi-3-8A7G6
MTi-3-8A7G6T/R
≤ 1.1
≤ SM141111
1
This number can be found on the packaging label (see Sections 5.1 and 5.2).
2
This number can be found on the bottom side of the MTi 1-series module (see Section 5.3).

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2 Power supply
The MTi 1-series module has two supply pins: VDDA and VDDIO. They can be supplied
independently or tied together to adapt various concepts, depending on the intended application. The
different supply voltages are explained in the following subsections.
2.1 Main supply voltage (VDDIO)
The VDDIO pin is the main supply of the MTi 1-series module. This pin is connected to all the digital
IO’s, and powers the processor on the MTi 1-series module. Section 2.4 shows the acceptable range of
VDDIO. For the most power efficient implementation, the VDDIO pin should be connected to a 1.8 V
power supply.
2.2 Analog supply voltage (VDDA)
The VDDA pin of the MTi 1-series module is connected to all the power supply pins of the sensing
elements that are on the MTi 1-series module. There is no low-dropout regulator (LDO) on the
MTi 1-series. Section 2.4 shows the acceptable range of VDDA. To get the best sensor performance, it
is important that the VDDA pin is supplied by a power supply with a maximum ripple of 50 mVpp.
2.3 Single power supply configuration
The MTi 1-series VDDA and VDDIO supply pins can be connected to the same power supply. When the
MTi 1-series is supplied with a single power supply source, it is strongly recommended to decouple the
VDDA and VDDIO supply pins, for example with a resistor, for the best sensor performance (see Figure
1). This way the digital circuitry will not influence the analogue sensing part. Considering the minimum
operating voltage for VDDA, the single supply voltage VDD should be at least 2.2 V, due to the voltage
drop over R1.
Figure 1: External components single supply (I2C interface)

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2.4 Power supply specifications
Table 3 shows the maximum operating voltage ratings of the MTi 1-series. Exposure to any voltage
beyond maximum operating voltage rating condition for extended periods may affect device reliability
and lifetime.
Table 3: Maximum operating voltage ratings
Min
Max
Unit
VDDA
2.16
3.63
V
VDDA ripple
50
mVpp
VDDIO
1.8
VDDA + 0.1
V
3
Previous generation version ≤1.1, VDDA max: 3.45V

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3 Interfaces
3.1 Pin Configuration
Figure 2 shows the pin configuration of the MTi 1-series module. Pin 18, 19 and 20 are only used on the
MTi-7, for MTi-1/2/3 these pins need not be connected (DNC).
Figure 2: Pin configuration of the MTi 1-series module (top view)
3.2 Communication to host
The MTi 1-series modules are designed to be used as peripheral devices in embedded systems. The
MTi 1-series modules support inter-integrated circuit (I2C), serial peripheral interface (SPI) and universal
asynchronous receiver/transmitter (UART) protocols for the communication between the MTi 1-series
module and host CPU. The I2C and SPI protocols are well suited for communication between integrated
circuits and on-board peripherals. To select the correct communication interface, PSEL1 and PSEL0
should be configured accordingly (see section 3.2.1). For interface specifications, see Table 4.
Table 4: Host communication interfaces specifications
Interface
Min
Typ
Max
Units
I2C
Host I2C Interface Speed
400
kHz
SPI
Host SPI Interface Speed
2
MHz
Clock Duty Cycle
30
50
70
%
UART
Baud Rates
921.6
4000
kbps

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3.2.1 PSEL serial host communication interface selection
The MTi 1-series modules has four modes of peripheral interfacing. Only one mode can be used at a
time and this is determined by the state of peripheral selection pins PSEL0 and PSEL1 at start up. Table
5 specifies how the PSEL lines select the peripheral interface. Note that the module has internal pull-ups
(30 kΩ – 50 kΩ). Not connecting PSEL results in a value of 1, connecting PSEL to GND results in a
value of 0.
Table 5: Serial host interface selection
Interface
PSEL1
PSEL0
I2C
1
1
SPI
1
0
UART half-duplex
0
1
UART full-duplex
0
0

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3.2.2 I2C
I2C is the default interface (when PSEL1 and PSEL0 pins are floating or connected to VDDIO). The I2C
SCL and SDA pins are open drain and therefore they need pull-up resistors to VDDIO (R2 and R3 in
Figure 3; typical value: 2.7 kΩ).
Figure 3: External components (I2C interface)
The MTi 1-series module acts as an I2CSlave. The I2C slave address is determined by the ADD0, ADD1
and ADD2 pins. These pins are pulled-up internally so when left unconnected the address selection
defaults to ADD[0..2] = 111. Table 6 shows a list of all possible I2C addresses.
Table 6: List of I2C addresses
I2C address
ADD2
ADD1
ADD0
0x1D
0
0
0
0x1E
0
0
1
0x28
0
1
0
0x29
0
1
1
0x68
1
0
0
0x69
1
0
1
0x6A
1
1
0
0x6B (default)
1
1
1