Yaesu Ft-470 Manual

FT·470

TECHNICAL

SUPPLEMENT

YAESU

MUSEN CO

.,

LTD.

C.P.O.

BOX

1500, TOKYO.

JAPAN

YAESU

U.S.

A.

17210 E

dwards

Rd.

Cerritos, California,

90701

U.S.A

.

YAESU

EUROPE

B.V

.

Snipweg

3.

1118AA Schiphol The NETHERLANDS

This

manual

is

intend

ed to

se

rve

as

a supplement

to

the

FT-470

Operating

Manual.

Specifications

and

de

tails

of

operation

and

opt

ions are provided

in

the

Operating

Manual, and

are

not

reprint

ed he

rei

n.

Therefore,

this manual

is

not

int

ended

to

serve

as

an

independent

referenc

e,

but

to

be used

in

conjunction

with

the

information

provided

in

the

Operating

Manual.

Two

layout

diagrams are

provided

for

each double

-s

id

ed glass-epoxy

circuit

board

in

the

FT

-470. Each

side

of

the board is

identified

by the

type

of

the

majority

of

components installed

on

that

side. In

mo

st

cases one side has

only

c

hip

components, and the

other

has

either

a mixture

of

both c

hip

and lead compo-

nents (trimmers, coils,

electrolytic

capacitors, packaged !Cs,

etc.),

or

leaded components

only.

W

hile

we

believe

the

technical

information

in

this manual

is

correct,

Yaesu

assu

m

es

no

liability

for

damage

that

m3y

occur

as

a r

esu

lt

of

typographi

cal

or

other

e

rrors

that

may be present. Yo

ur

coopera

ti

on

in

pointing

out

any incons

ist

e

nci

es

in

the

technical

informa!ion

would be apprec

iat

ed.

Yaesu Musen reserves the

right

to

make changes

in

the c

ircuitry

of

this

tr

ansce

iv

er,

in

the

inter

es

t

of

technological

improvement,

without

notification

of

the owners.

·f""""""'~~~

.....

..:.-~~~.,..~~~"""~"""""'T"..;..~"':"~~~

CONTENTS

":"..;..~"':"...:,..~~"'=""...c,.~"t'·""""""""".,..""".,....;..~

.........

~-.-..,:..~~.,....;..

.........

.,..~>

\ '

t f

~

t

t SPECIFICATIONS ·..·················..··..········

..

··········..·······..···················..·

..

···················

..

·..····· 1 f

t CIRCUIT BOARD ACCESS ·········..·······..·..··········....·········....·····......·····

..

·······

..

·······..·..········ 2 t

o)

) EXPLODED VIEW

......................................

·····

.......................................

··......··...........

......

3

~i

(•

i

CHIP

COMPONENT INFORMATION

................

..·..·

................

·

......

·

......................

··

..........

··

·..

4

~

.

CONTROL UNIT

PARTS

LAYOUT........

.......

...................

........

.......................................

.......

7 i

o)

CONTROL UNIT CIRCUIT DIAGRAM ··················································································· 9 1

•

t

(.

~

CONTROL UNIT

PARTS

LIST

·········

·

············

·······································································

10

i~

t

(.

t t

t

RF

UNIT

PARTS

LAYOUT·..

·······

..··....·..····..·..

··········

..·..····..··....

·······

..

·······

..

····......···

..

········

14

t

~

RF

UNIT CIRCUIT DIAGRAM

........................

·..·..·

......

·

...................

·

....................

·....·

..........

16

~

• •

i~

RF

UNIT

PARTS

LIST ..··········..·....·····..·

..

·············

..

·······..·············

..

······..········

..

·······

..

····..··

17

(.

~. ~.

1 VHF PLL UNIT

PARTS

LAYOUT/CIRCUIT DIAGRAM....·

........

....·......·....

.....................

............

24

~

~·

VHF

PLL UNIT

PARTS

LIST

...................

·..·

..........

·

.............

·....

....................

·

..................

·..

·25

;?

• t

~

UHF

PLL UNIT

PARTS

LAYOUT/CIRCUIT DIAGRAM

...........

.......

...........................................

26

~

• •

j

UHF

PLL UNIT

PARTS

LIST-

...........................................

....

...............................................

27

j

t

(.

o)

(•

(.

o)

ANT SW UNIT

.................................................................................................................

29

IF,

CONNECTOR UNIT PARTS LAYOUT

..............................................................................

30

~.·:

IF,

CONNECTOR UNIT CIRCUIT DIAGRAM·

...............

·

........

·

...............

..

·

..............................

32

(·

~

IF,

CONNECTOR UNIT

PARTS

LIST

....................................................................................

33

i~

~:·:

t~

~

T-BURST UNIT (Version 8, Only)

.......................

·

.....................................................

......

.....

37

i

(.

BLOCK DIAGRAM

.................................................................................................

......

.....

39

~

t •

(.

. ALIGNMENT

..................

·

........

.......

........

·······

........

···

..................

·

...........

······

.........

......

.....

40

;?

?.

<'?

->

ALIGNMENT

(VHF

PLL & Transmitter) ....·....·

..........

·

..................

·....·

..........

·

......

··

........

·.......

·41

·)

~

~:·:.

!<

...

:.·

ALIGNMENT (VHF Receiver)

...................

..........

.....

........

..

......

.

...................

42

ALIGNMENT

(UHF

PLL & Transmitter)·....··......·

........

··..·

..........

·....

................

···....·

.....

........

··

43

o)

j ALIGNMENT

(UHF

Receiver)

..............................................................................................

44

~

"""""'..;..""w~~~..;..~.,..~~~~"':"~~..,...;....,...;...,....;.."':"..;.."':"~~~~~.,....;...,..~..,.w.,..w.,....;..

.....

~-...~~~~~

..........

""'-~..;....,.~~.,....;...,..w~•.,..~~

.....

~~~~~

.....

..,.J

RECEIVER

Circuit

type:

Double-conversion

superhet

Sensitivity

(for

12dB

SINAD):

better

than

0.158uV

(-lOdBu)

Adjacent

channel

selectivity:

better

than

60dB

Intermodulation:

better

than

65dB

Audio

output:

0.5W

@8

ohms

for

5%

THD

(12V)

TRANSMITTER

Power

output:

(see

Rf

Power

Chart)

Frequency

stability:

better

than

±5

ppm

(-5

to

+60°C)

Modulation

system:

variable

reactance

Maximum

deviation:

±5

kHz

FM

Noise:

better

than

-4

0dB

@ 1

kHz

Spurious emissions:

better

than

60dB

below

carrier

Audio

distortion

(@

1

kHz):

less than 5%,

w/3

kHz

deviation

Microphone

type:

2-kilohm

condenser

Burst

tone:

1750

Hz

(except

versions A &

H)

Version

Chart

Version

144-146

VHF:

144

-148

430-440

UHF:

430

-450

UHF Std.

Split

A B

x

x x

x

5 7.6

c H

x x

1.6 5

- 1

GENERAL

Frequency

coverage

(MHz):

see

Version

Chart

Channel

steps:

5, 10, 12.5, 20 & 25

kHz

Standard

repeater

shift:

see

Version

Chart

F.mission

type:

G3E

Supply

voltage:

5.5 to J5.0

VDC

Current

consumption (single band):

Standby

(1 sec. Save)

8mA;

Receive: l 50mA;

Transmit

(SW): 1300/1600

mA

(VHF/UHF);

Auto

Power

Off: 7

mA

Antenna

(

BNC

jack):

YHA-28

rubb

er

flex

antenna

Case

size

(WHO):

55x147x32mm

w/FNB-/FBA-9

55x 164x32mm

w/FNB-/FBA-10

55x213x32mm

w/FNB-11

55x 180x32mm

w/FNB-12/-14

55x152x32mm

w/FNB-/FBA-17

Weight

(approx):

420g

w/FNB-10,

540g

w/FNB-11

RF

Power

Chart

Battery

Type

RFOutput(W)

VHF

UHF

(Dry

Cell

Cases)

FBA-9

(6xAAA

cells)

1.5 I

.O

FBA-10/17

(6xAA

cells)

2.0 1.5

(Ni-Cd

Packs)

FNB-9

(7.2V/200

mAh)

2.0 1.5

FNB-10/17

(7

.2V

/600mAh)

2.3 2.3

FNB-11

(l

2V

/600

mAh)

5.0 5.0

FNB

-

12

(12V/500

mAh)

5.0 5.0

FNB-14

(7.2V/1000mAh)

2.3 2.3

l)

Make

sure the

transceiver

is

off.

Remove

the

hard

or

soft

case,

if

used, and remove the

Qattery

pack.

Also

remove

the

antenna.

2)

Remove the

four

screws

affixing

the

battery

spring

plate

on

the

bottom

of

the

transceiver,

and

carefully

remove

the

plate

and

the

battery

release

button.

3)

Pull

off

the

four

knobs on

the top

panel, and

the

EAR/MIC

gasket

from

the

antenna

jack.

Remove the

four

screws

affixing

the

panel and

carefully

remove

it

and the

rubber

gasket

underneath.

4) Rem

ove

the

thr

ee

screws

affixing

the

front

and

rear

ha

lv

es

of

the case, and

slowly

separate

the halves, using

care

not

to

stress

the

inter-

connect

in

g

cable.

To

separate

the

front

and

rear

halves

of

the

chas-

sis, use a

small

screwdriver

to

pry

up one side

of

the

connector

on the

"rear

panel

end"

of

the

flat

cable

(see

inset

in

diagram

below),

and then

gently

pull

the

cab

le

out

of

the

connector

.

To

remove

the

Control

Unit

from

the

front

half

of

the chassis, loosen

the

ring

nut

around

the

DIAL

shaft,

and then remove the

eleven

screws

indi-

cated

in

the

diagram

above.

To

remove

the

IF

Unit

from

the

rear

half

of

the

chassis, loosen the

ring

nuts around the

VOUBAL

and

SQL

controls,

and

gently

pry

the

board

up so

that

it

unplugs from the

Mother

Board

Unit.

To

remove the

Mother

Board

Unit,

after

removing

the

IF

Unit,

loosen the

ring

nut

around the

ANT

jack

remove the

eight

screws

indicated

below

.

- 2 -

~

R3512340....cJ

StrapRing

~

J

* Charger

~

R3129710

Cut-out

Filler

(rubber)

NC-276/C

(for

FNB·9)

R0129740A

Healsink

B

Vers.

II

7VAC.

50/60Hz

p/n

03000480

C

Vers.

220/234

VAC

.

50160Hz

p/n

03000481

NC-288/C(for

FNB-14)

B

Vers

.

11

TVAC.

60Hz

03000484

C

Vers.

220/234

VAC

.

50/60Hz

p/n

03000485

NC-18BIC

(for

FNB-10

,

17)

B

Vers.

11

TVAC.

60Hz

03000359

c

Vers.

2201234

VAC

.

50/60Hz

p/n

03000360

NC-34BIC

(for

FNB

-

11,

12)

B

VllfS.

117VAC.

60Hz

03000571

C

Vers.

2201234

VAC.

50/60Hz

p/n

03000572

Rear Panel

@ Carrying Case

CSC-35

(for

FNB-9

,

17)

p/n

030006

I4

CSC-36

(for

FNB-10)

p/n

03000615

CSC-37

(for

FNB-12,

14)

03000616

CSC-38

(for

FNB-11)

03000617

"'

Options (may

be

supplied)

R3805171A

3 -

- \

-M4090076

"'

Loudspeaker

---~

'R3129670(2pcs)

Packing

03000068

Antenna

No.

CD

@

®

©

@

®

(j)

®

@

®

SCREW

LIST

Parts

No.

Description

qty

U9900003

P/H

SCREW

Ml

.4X5

8.T

3

U07250001

P/H

SCREW

M2X5

4

1

----

--+-

U9900004

P/H

SCREW

M2X4

8.T

7

-

e-

U9900006

P/H

SCREW

M2X5

8.T

10

U30104001

F/H

SCREW

M2X4

4

U20106007

8/H

SCREW

M2X68

5

U20105007

SCREWM2X58

I

U20118007

8/H

SCREW

M2

x

188

I

F/w

__

w_2_x_s_x_o_.s

__

_.1

3

1 l

NutM7

09

~

U75201650

R6054387

Warranty Registration Card

E2650100

Operating Manual

Quick Reference Card

56000147

V1805440

Packing

V1119020A(FBA

-9,

FNB

-9)

V1119010A(F8A-10,

FNB10J

V1119080(FNB-12)

V1130250(FNB-17)

Chip

Components

The

diagram:;

below

indicate

some

of

che

d1sungu1shing features

of

common

chip

com-

ponents.

Capacitor

(Unit

:

mm)

Type

I L w T

--

3216

3.2

1.6

0.45~0.60

2125

2.0

1.25

0.35~0.50

1608

1.

6 I

0.8

o.s5~o.95

I

-J

Tantalum

Capacitor

-,;

,,.ft

/

G 4

.0

V D 20V

J E 25V

A v 35V

~

Negative~

Examples

: c

·.:1

16V

I

Polarized,

Unmarked

(determine

value

from

layout

and

Parts

List)

Resistors

T

'

Positive

Type

1/10

1/

16

INDICATED

LETTERS

1 2 3 4

5 &' :

' 0 •

.J475

(Unit:

mm)

L w T

2.0

I.

25

0.45

I.

6

0.8

0.45

- 4

6.3V 4.

711F

Type

RMC 1/10W,

l/16W

Marking•

100,222,473

······

___

r

41

P

.__

__

~

Ten

unit

One

unit

0 0

Multiplier

code

10°

I01

2 2

I~

,_

__

:

___

~-~-a

:::

5 5

10)

6

7

8

9

6

7

8

9

Examples:

100

222

473

10'

101

10

1

10

9

lOQ

2

.2

kQ

47kQ

Transistors

COLLEC~BASE

~IT~ER

Mark•d Surface

2SC2714Y(QY)

(02004)

2SC3356(R24)

(

02013,2031,2033)

301,401

2SC3583(R32)

(02014,2032)

2SC4116GR(LG)

(

02011,2023,2027,2028)

3003,3007

,3010

2SC4215Y(QY)

(02003,2015)

2SC4245(HB)

(02002)

OTA

123YU(52)

(

03013,3014,3016)

3019,3020,3022

RN1303(XC)

(

01014,20

07

,2025,2026,2029)

2030,3002,3006,3015,3018

3021,3024,3025,3027

RN2303(YC)

(01005,

1013)

Diodes

<•••oo<~oo<

t

ANODE

Marked

Surface

1SS184(83)

(2003,

1101)

1SS301(B3)

(

1005,2002,2006,2008,2011)

2013,2014,2017

,2018,3003

3004,3005,3007

,3008,3010

3011,3012,3013,3014,3015

1SS321(F9)

(02005,503)

OAN235K(M)

•

........._

BASE

COLLECTOR

EMITTER

Marked

Surface

2SB799(ML)

BASE(Tr,)

EMITTER(Common)

-..,...

BASE(Tr

,)

-..,...~

'

"""-..

COLLECTOR(Tr

2)

COLLECTOR

(Tr,)

•

Marked Surface

FMW1(W1)

(01009,02009,2021)

FMS1(S1)

(02010,2022)

COLLECTOR(Tr,)

...._

BASE(Tr,)~"

EMITTER(Tr.)-..._

'-

"'-EMITTER(

Tr,)

y

BASE(Tr;)

..

COLLECTOR(Tr,)

•

Marked Surface

IM02(02)

(01006,

1012)

BASE(Tr

2)

BASE(Tr,)~

EMITTER(Tr

,)

'

'-

1SS300(A3)

(01012,

1014)

y

'coLLECTOR(Tr.)

-.

EMITTER(Tr,)

t

COLLECTOR(Tr,)

Marked Surface

IMX5(X5)

(02001,302.402)

ANODE

1/CA

THODE

2

~

"

ANOOE2

•

CATHO

DE I

Marked

Surface

1SS302(C3)

(01013,2015,3002,3006)

CATHOOE~

............

ANODE

~NOOE

CATHODE(Oo,)""

CATHODE(Oi,)

'~

'

"""-.

ANODE(01

,)

ANOOE(Oi,)

Mbrked

Surface

HZM11A(28)

(03009)

ANOOE(Oi

.)

•

Marked

Surface

1SS319(A4)

(01006)

ANODE 3

(02009)

CATHOOE~

CATHOOE(Common) "

ANODE(Oi,)"-~,

~<

ANODE(01,)

ANOOE 2 "

ANOOE

I"''-.~

y CATHODE 3

.

'A

NOOE

t

NC

Mark.ed Surtace

1SS153(A9)

(0304,403)

Jt ANODE(Oo

,)

I

M~rked

Surface

FMN1(N1)

(01001,

1007)

- 5 -

.

~

CATHooe:2

• CATHOOE I

Marked

Surface

IMN10(N10)

(01002,

1003,

1004)

Repl

aci

ng

Chip

Co

mp

on

ents

Chip

components

are

111stalled

at

the

factory

by

a

series

of

robots,

which

first

place

a

spot

of

adhesive

resin

at

the

location

where

each

part

is

to

be

installed.

Then

parts

are

handled and

placed

using vacuum

suction.

fo

r

single-sided

boards,

solder

paste is

ap-

plied

and the

board

is

then

baked

to

harden

the

resin

and

flow

the

solder.

For

double-

sided boards, no

solder

paste is

applied,

but

the

board

is

baked

(or

exposed

to

ultrav

i

olet)

to

cure

the

resin

before

dip

soldering.

In

our

lab

oratory

and

service

shop,

chip

parts

111

small

quantities

are

mounted

manually

by

applying

a

spot

of

resin,

placing

with

tweezers, and

then

soldered

by

dual

streams

of

hot

air

(without

physical

contact

during

soldering).

We remove

part

s by

first

removing

solder

using

a

vacuum

suc

tion

iron,

whi

ch

applies

a

light

steady

vacuum

at

the

iron

tip,

and

then

breaking

the

adhesive

with

tweezers.

The

special

vacuum

soldering/deso

l

dering

equipment

is recommended

if

you

expect

to

do a

lot

of

c

hip

replacement

s.

Otherwise,

it

1s

usually

possi

ble

to

r

emove

and

repla

ce

chip

components

with

only

a

tap

e

red,

temper-

ature-control

led

soldering

iron,

a

set

of

tw

eezers

and

braided

copper

so

l

der

wick.

Soldering

iron

temperatur

e s

hould

be less

than 280°C (536°F).

Preca

uti

ons

for

Chip

Repl

ace

ment

(I)

Do

not

disconnect

a

cl11p

forcefully,

or

the

foil

puttern

muy peel

off

the board.

(2)

Never

re

use a

chip

component. Dispose

of

all

removed

chip

components

1mmed

-

1ately

to

avoid

mix

111g

wllh

nc"

parts.

(3)

L1m

1t

solder111g

ti

me

to

3 seconds

or

less

to

avoid

damaging

the

component

and

board.

Removing Ch

ip

Components

(I)

Remove

the

solder

at

eac

h

joint,

one

joint

ut

a

time,

using

solder

wick

wetted

with

non

-

acidic

flux

as

sho

wn

below.

Avoid

apply

111g

pressure, and do

not

at

tempt

to

remove

th

e

tinnin

g from the

chip's

electrode

.

6 -

(2) Grasp the

chip

on

both

s

ide

s

with

twee-

zers, and

gently

twist

the

tweezers

back

and

forth

(to

break

the adhesive bond)

whil

e

alternately

heaung

each

electrode.

Be

ca

re

f

ul

to

avoid

peeling

th

e

foil

traces

from

the

board.

Dispose

of

the

chip

when removed.

(3)

After

removing

the

chip,

use the

copper

braid

and

solde,.ing

iron

to

wick

away

any

excess

solder

and smooth the land

for

installation

of

the

replacement

part.

Insta

lli

ng a Repl

acement

Chip

As

the

value

of

some ch

ip

components is

not

indi

cated

on the body

of

the chip, be

careful

to

get

the

right

part

for

re

placement.

(I)

Apply

a small amount of

solder

to

the

land on one side

where

the

chi

p

1s

to be

installed.

Avoid

too much solder,

which

may

ca

use

bridg111g.

(2)

Hold

the

chip

with

tweezers

1n

the

desired

position,

and apply

the

soldering

iron

with

a

motion

indicated

by

the

arrow

in

the

diagram

below

.

Do

not

apply

heat

for

more than 3 seconds.

(3)

Remove

the

tweezers

and

solder

the

elec

tr

ode on the

other

side

111

the mann

er

just

described.

CONTROL

UNIT

(No.10XX)

obverse

view

of

"component"

side

BASE

(Tr,)

EMITTER(Common)~'

BASE(Tr,)"'

'COLLECTOR(Tr.)

+'

COLLECTOR(Tr,)

FMW1(W1)

(01009}

COLLECTOR(Tr,)

BASE(Tr,)

EMITTER(Tr,)'~

"-..

EMITTER(Tr.)

.,

Y'

BASE(Tr,)

t

COLLECTOR(Tr,)

M41rked

Sud•c•

IM02(02)

(01006,

1012)

7

HD404608-A

1

OH

(0100

1)

"O"",,

' "

•

MX365LH

(01002)

.....

·~

"--~'-...,.,

'"'"''

NJM2902M

(01010)

11PD4013BG

(01011)

µP04094BG

(01015)

~::'

+ Vss

Marked

Surl1ce

SCl7710YBA

(01003)

RH5VA45AA

(01004}

~BASE

~OLLECTOR

4

EMITTER

Marked Surface

2SB799(Ml)

(01008)

COLLECTOR

~BASE

~IT~ER

Marked

Surface

RN1303(XC}

(01014)

RN2303(YC)

(01005,

1013)

obverse

view

of

"display"

side

ANOOE 3

ANODE~

ANOOE I

:.-

'CATHODE

3

CATHODE 2

I CATHODE I

M111k

td

$vfof1ct

IMN10(N10)

(01002,

1003,

1004)

ANODE(Di

,)

CATHODE(Common) '

~

ANODE(Do, )

ANODE

(Di

.

)".~'-.

~

ANODE(D1,)

I

M•d~

td

Surf•Ge

FMN1(N1)

(01001,1007)

8

ANODE~

"-.CATHODE

CATHODE

1SS300(A3)

(0

1012

,

1014)

CATHODE

~ANOO•

~

ANODE

Marked

Surface

1SS301(83)

(01005)

ANODE

I/CATHODE

2

~

"

ANODE2

•

CATHODE

1

Marked

Surface

1SS302(C3)

(01013)

,.,~~

~

~N~E

SLM-13MWS

(01008,

1009,

1010,

1011)

CATHODE~

'ANODE

ANODE

SLM-23VMWS

(01015)

CATHODE(Do,)

"'"0~~,

~~NODE

(Do,)

f ANODE(Do,)

Mark&d Surfac:e

1SS319(A4)

(01006)

Yaesu FT-470 Manual

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