Yaesu FT-470 Manual

FT·470
TECHNICAL SUPPLEMENT
YAESU MUSEN CO ., LTD.
C.P.O. BOX 1500, TOKYO. JAPAN
YAESU U.S. A.
17210 E dwards Rd. Cerritos, California, 90701 U.S.A .
YAESU EUROPE B.V .
Snipweg 3. 1118AA Schiphol The NETHERLANDS

This manual is intend ed to se rve as a supplement to the FT-470 Operating Manual. Specifications and
de
tails of operation and opt ions are provided in the Operating Manual, and are not reprint ed he rei n.
Therefore, this manual is not int ended to serve as an independent referenc e, but to be used in conjunction
with the information provided in the Operating Manual.
Two layout diagrams are provided for each double -s id ed glass-epoxy circuit board in the FT -470. Each
side
of the board is identified by the type of the majority of components installed on that side. In mo st
cases one side has
only c hip components, and the other has either a mixture of both c hip and lead compo-
nents (trimmers, coils,
electrolytic capacitors, packaged !Cs, etc.), or leaded components only.
W hile we believe the technical information in this manual is correct, Yaesu assu m es no liability for
damage
that m3y occur as a r esu lt of typographi cal or other e rrors that may be present. Yo ur coopera ti on
in pointing out any incons ist e nci es in the technical informa!ion would be apprec iat ed.
Yaesu Musen reserves the
right to make changes in the c ircuitry of this tr ansce iv er, in the inter es t of
technological improvement, without notification of the owners.
·f""""""'~~~ ..... ..:.-~~~.,..~~~"""~"""""'T"..;..~"':"~~~ CONTENTS ":"..;..~"':"...:,..~~"'=""...c,.~"t'·""""""""".,..""".,....;..~ ......... ~-.-..,:..~~.,....;.. ......... .,..~>
\ '
t f
~ t
t SPECIFICATIONS ·..·················..··..········ .. ··········..·······..···················..· .. ··················· .. ·..····· 1 f
t CIRCUIT BOARD ACCESS ·········..·······..·..··········....·········....·····......····· .. ······· .. ·······..·..········ 2 t
o) o)
) EXPLODED VIEW ...................................... ····· ....................................... ··......··........... ...... 3 ~i
(• (•
i CHIP COMPONENT INFORMATION ................ ..·..· ................ · ...... · ...................... ·· .......... ·· ·.. 4 ~
~
. CONTROL UNIT PARTS LAYOUT........ ....... ................... ........ ....................................... ....... 7 i
o)
CONTROL UNIT CIRCUIT DIAGRAM ··················································································· 9 1
•
t (.
~ CONTROL UNIT PARTS LIST ········· · ············ ······································································· 10 i~
t (.
t t
t RF UNIT PARTS LAYOUT·.. ······· ..··....·..····..·.. ·········· ..·..····..··.... ······· .. ······· .. ····......··· .. ········ 14 t
~ RF UNIT CIRCUIT DIAGRAM ........................ ·..·..· ...... · ................... · .................... ·....· .......... 16 ~
• •
i~ RF UNIT PARTS LIST ..··········..·....·····..· .. ············· .. ·······..············· .. ······..········ .. ······· .. ····..·· 17 (.
~. ~.
1 VHF PLL UNIT
PARTS LAYOUT/CIRCUIT DIAGRAM....· ........ ....·......·.... ..................... ............ 24 ~
~·
VHF PLL UNIT PARTS LIST ................... ·..· .......... · ............. ·.... .................... · .................. ·.. ·25 ;?
• t
~ UHF PLL UNIT PARTS LAYOUT/CIRCUIT DIAGRAM ........... ....... ........................................... 26 ~
• •
j UHF PLL UNIT PARTS LIST- ........................................... .... ............................................... 27 j
t
(.
o)
(•
(.
o)
ANT SW UNIT ................................................................................................................. 29
IF, CONNECTOR UNIT PARTS LAYOUT .............................................................................. 30
~.·: IF, CONNECTOR UNIT CIRCUIT DIAGRAM· ............... · ........ · ............... .. · .............................. 32 (·
~ IF, CONNECTOR UNIT PARTS LIST .................................................................................... 33 i~
~:·: t~
~ T-BURST UNIT (Version 8, Only) ....................... · ..................................................... ...... ..... 37 i
(. BLOCK DIAGRAM ................................................................................................. ...... ..... 39 ~
t •
(. . ALIGNMENT .................. · ........ ....... ........ ······· ........ ··· .................. · ........... ······ ......... ...... ..... 40 ;?
?. <'?
-> ALIGNMENT (VHF PLL & Transmitter) ....·....· .......... · .................. ·....· .......... · ...... ·· ........ ·....... ·41 ·)
~
~:·:. !< ... :.·
ALIGNMENT (VHF Receiver) ................... .......... ..... ..... ........ .. ...... . ................... ................... 42
ALIGNMENT (UHF PLL & Transmitter)·....··......· ........ ··..· .......... ·.... ................ ···....· ..... ........ ·· 43
o) o)
j ALIGNMENT (UHF Receiver) .............................................................................................. 44 ~
"""""'..;..""w~~~..;..~.,..~~~~"':"~~..,...;....,...;...,....;.."':"..;.."':"~~~~~.,....;...,..~..,.w.,..w.,....;.. ..... ~-...~~~~~ .......... ""'-~..;....,.~~.,....;...,..w~•.,..~~ ..... ~~~~~ ..... ..,.J

RECEIVER
Circuit type:
Double-conversion superhet
Sensitivity (for 12dB SINAD):
better than 0.158uV (-lOdBu)
Adjacent channel selectivity:
better than 60dB
Intermodulation:
better than 65dB
Audio output:
0.5W @8 ohms for 5% THD (12V)
TRANSMITTER
Power output:
(see Rf Power Chart)
Frequency stability:
better than ±5 ppm (-5 to +60°C)
Modulation system:
variable reactance
Maximum deviation:
±5 kHz
FM Noise:
better than -4 0dB @ 1 kHz
Spurious emissions:
better than 60dB below carrier
Audio distortion (@ 1 kHz):
less than 5%, w/3 kHz deviation
Microphone type:
2-kilohm condenser
Burst tone:
1750
Hz (except versions A & H)
Version Chart
Version
144-146
VHF:
144 -148
430-440
UHF:
430
-450
UHF Std.
Split
A B
x
x x
x
5 7.6
c H
x x
x x
1.6 5
- 1
GENERAL
Frequency coverage (MHz):
see
Version Chart
Channel steps:
5, 10, 12.5, 20 & 25
kHz
Standard repeater shift:
see Version Chart
F.mission type:
G3E
Supply voltage:
5.5 to J5.0 VDC
Current consumption (single band):
Standby (1 sec. Save) 8mA;
Receive: l 50mA;
Transmit (SW): 1300/1600 mA
(VHF/UHF);
Auto Power Off: 7 mA
Antenna ( BNC jack):
YHA-28 rubb er flex antenna
Case size (WHO):
55x147x32mm
w/FNB-/FBA-9
55x 164x32mm w/FNB-/FBA-10
55x213x32mm w/FNB-11
55x 180x32mm w/FNB-12/-14
55x152x32mm w/FNB-/FBA-17
Weight (approx):
420g w/FNB-10, 540g w/FNB-11
RF Power Chart
Battery Type
RFOutput(W)
VHF UHF
(Dry Cell Cases)
FBA-9 (6xAAA cells)
1.5 I
.O
FBA-10/17 (6xAA cells)
2.0 1.5
(Ni-Cd Packs)
FNB-9 (7.2V/200 mAh)
2.0 1.5
FNB-10/17 (7 .2V /600mAh)
2.3 2.3
FNB-11 (l 2V /600 mAh)
5.0 5.0
FNB - 12 (12V/500 mAh)
5.0 5.0
FNB-14 (7.2V/1000mAh)
2.3 2.3

l) Make sure the transceiver is off. Remove the
hard or soft case, if used, and remove the
Qattery pack. Also remove the antenna.
2) Remove the four screws affixing the battery
spring plate on the bottom of the transceiver,
and carefully remove the plate and the battery
release button.
3) Pull off the four knobs on the top panel, and
the
EAR/MIC gasket from the antenna jack.
Remove the four screws affixing the panel and
carefully remove it and the rubber gasket
underneath.
4) Rem ove the thr ee screws affixing the front and
rear ha lv es of the case, and slowly separate
the halves, using care not to stress the inter-
connect in g cable.
To separate the front and rear halves of the chas-
sis, use a
small screwdriver to pry up one side of
the connector on the "rear panel end" of the flat
cable (see inset in diagram below), and then gently
pull the cab le out of the connector .
To remove the Control Unit from the front half of
the chassis, loosen the ring nut around the DIAL
shaft, and then remove the eleven screws indi-
cated in the diagram above.
To remove the IF Unit from the rear half of the
chassis, loosen the
ring nuts around the VOUBAL
and SQL controls, and gently pry the board up so
that it unplugs from the Mother Board Unit.
To remove the Mother Board Unit, after removing
the
IF Unit, loosen the ring nut around the ANT
jack remove the eight screws indicated below .
- 2 -

~
R3512340....cJ
StrapRing ~
J
* Charger
~
R3129710
Cut-out Filler
(rubber)
NC-276/C (for FNB·9)
R0129740A
Healsink
B Vers. II 7VAC. 50/60Hz p/n 03000480
C Vers. 220/234 VAC . 50160Hz p/n 03000481
NC-288/C(for FNB-14)
B Vers . 11 TVAC. 60Hz pin 03000484
C Vers. 220/234 VAC . 50/60Hz p/n 03000485
NC-18BIC (for FNB-10 , 17)
B Vers. 11 TVAC. 60Hz pin 03000359
c Vers. 2201234 VAC . 50/60Hz p/n 03000360
NC-34BIC (for FNB - 11, 12)
B VllfS. 117VAC. 60Hz pin 03000571
C Vers. 2201234 VAC. 50/60Hz p/n 03000572
Rear Panel
@ Carrying Case
CSC-35 (for FNB-9 , 17) p/n 030006 I4
CSC-36 (for FNB-10) p/n 03000615
CSC-37 (for FNB-12, 14) pin 03000616
CSC-38 (for FNB-11) pin 03000617
"' Options (may be supplied)
R3805171A
3 -
- \ -M4090076
"' Loudspeaker
---~
'R3129670(2pcs)
Packing
03000068
Antenna
No.
CD
@
®
©
@
®
(j)
®
@
®
SCREW LIST
Parts No. Description qty
U9900003 P/H SCREW Ml .4X5 8.T 3
U07250001
P/H SCREW M2X5 4
1 ---- --+-
U9900004
P/H
SCREW M2X4 8.T
7
-
e-
U9900006
P/H SCREW M2X5 8.T
10
U30104001 F/H SCREW M2X4
4
U20106007
8/H
8/H
SCREW M2X68
5
U20105007
SCREWM2X58 I
U20118007 8/H SCREW M2 x 188
I
F/w __ w_2_x_s_x_o_.s __ _.1
3
1 l
NutM7 09 ~
U75201650
R6054387
Warranty Registration Card
E2650100
Operating Manual
Quick Reference Card
56000147
V1805440
Packing
V1119020A(FBA -9, FNB -9)
V1119010A(F8A-10, FNB10J
V1119080(FNB-12)
V1130250(FNB-17)

Chip Components
The diagram:; below indicate some of che
d1sungu1shing features of common chip com-
ponents.
Capacitor
(Unit : mm)
Type
I L w T
--
3216 3.2
1.6 0.45~0.60
2125 2.0 1.25 0.35~0.50
1608 1. 6 I 0.8
o.s5~o.95 I
-J
Tantalum Capacitor
-,; ,,.ft
/
G 4 .0 V D 20V
J E 25V
A v 35V
~
Negative~
Examples : c
·.:1
16V
I
Polarized, Unmarked
(determine value from layout
and Parts List)
Resistors
T
'
Positive
Type
1/10
1/ 16
INDICATED LETTERS
1 2 3 4
5 &' :
' 0 •
.J475
(Unit: mm)
L w T
2.0 I. 25 0.45
I. 6 0.8
0.45
- 4
6.3V 4. 711F
Type RMC 1/10W, l/16W
Marking• 100,222,473 ······
___ r 41 P .__ __ ~
Ten unit One unit
0 0
Multiplier code
10°
I01
2 2 I~
,_ __ : ___ ~-~-a :::
5 5 10)
6
7
8
9
6
7
8
9
Examples:
100
222
473
10'
101
10
1
10
9
lOQ
2 .2 kQ
47kQ

Transistors
COLLEC~BASE
~IT~ER
Mark•d Surface
2SC2714Y(QY)
(02004)
2SC3356(R24)
(
02013,2031,2033)
301,401
2SC3583(R32)
(02014,2032)
2SC4116GR(LG)
(
02011,2023,2027,2028)
3003,3007 ,3010
2SC4215Y(QY)
(02003,2015)
2SC4245(HB)
(02002)
OTA 123YU(52)
(
03013,3014,3016)
3019,3020,3022
RN1303(XC)
(
01014,20 07 ,2025,2026,2029)
2030,3002,3006,3015,3018
3021,3024,3025,3027
RN2303(YC)
(01005, 1013)
Diodes
<•••oo<~oo<
t ANODE
Marked Surface
1SS184(83)
(2003, 1101)
1SS301(B3)
(
1005,2002,2006,2008,2011)
2013,2014,2017 ,2018,3003
3004,3005,3007 ,3008,3010
3011,3012,3013,3014,3015
1SS321(F9)
(02005,503)
OAN235K(M)
•
........._ BASE
COLLECTOR
EMITTER
Marked Surface
2SB799(ML)
BASE(Tr,)
EMITTER(Common) -..,...
BASE(Tr ,) -..,...~
' """-.. COLLECTOR(Tr 2)
COLLECTOR (Tr,)
•
Marked Surface
FMW1(W1)
(01009,02009,2021)
FMS1(S1)
(02010,2022)
COLLECTOR(Tr,) ...._
BASE(Tr,)~"
EMITTER(Tr.)-..._ '-
"'-EMITTER( Tr,)
y BASE(Tr;)
.. COLLECTOR(Tr,)
•
Marked Surface
IM02(02)
(01006, 1012)
BASE(Tr
2)
BASE(Tr,)~
EMITTER(Tr ,) ' '-
1SS300(A3)
(01012, 1014)
y 'coLLECTOR(Tr.)
-. EMITTER(Tr,)
t COLLECTOR(Tr,)
Marked Surface
IMX5(X5)
(02001,302.402)
ANODE 1/CA THODE 2
~
"
ANOOE2
• CATHO DE I
Marked Surface
1SS302(C3)
(01013,2015,3002,3006)
CATHOOE~ ............ ANODE
~NOOE
CATHODE(Oo,)""
CATHODE(Oi,) '~
' """-. ANODE(01 ,)
ANOOE(Oi,)
Mbrked Surface
HZM11A(28)
(03009)
ANOOE(Oi .)
•
Marked Surface
1SS319(A4)
(01006)
ANODE 3
(02009)
CATHOOE~
CATHOOE(Common) "
ANODE(Oi,)"-~,
~< ANODE(01,)
ANOOE 2 "
ANOOE
I"''-.~
y CATHODE 3
. 'A NOOE
t NC
Mark.ed Surtace
1SS153(A9)
(0304,403)
Jt ANODE(Oo ,)
I
M~rked Surface
FMN1(N1)
(01001, 1007)
- 5 -
. ~ CATHooe:2
• CATHOOE I
Marked Surface
IMN10(N10)
(01002, 1003, 1004)

Repl aci ng Chip Co mp on ents
Chip components are 111stalled at the factory
by a series of robots, which first place a
spot
of adhesive resin at the location where
each part is to be installed. Then parts are
handled and placed using vacuum suction.
fo r single-sided boards, solder paste is ap-
plied and the board is then baked to harden
the resin and flow the solder. For double-
sided boards, no solder paste is applied, but
the board is baked (or exposed to ultrav i olet)
to cure the resin before dip soldering.
In our lab oratory and service shop, chip
parts 111 small quantities are mounted manually
by applying a spot of resin, placing with
tweezers, and then soldered by dual streams
of hot air (without physical contact during
soldering). We remove part s by first removing
solder using a vacuum suc tion iron, whi ch
applies a light steady vacuum at the iron
tip, and then breaking the adhesive with
tweezers.
The special vacuum soldering/deso l dering
equipment is recommended if you expect to
do a
lot of c hip replacement s. Otherwise, it
1s usually possi ble to r emove and repla ce
chip components with only a tap e red, temper-
ature-control led soldering iron, a set of
tw eezers and braided copper so l der wick.
Soldering iron temperatur e s hould be less
than 280°C (536°F).
Preca uti ons for Chip Repl ace ment
(I) Do not disconnect a cl11p forcefully, or
the foil puttern muy peel off the board.
(2)
Never re use a chip component. Dispose
of all removed chip components 1mmed -
1ately
to avoid mix 111g wllh nc" parts.
(3)
L1m 1t solder111g ti me to 3 seconds or less
to avoid damaging the component and
board.
Removing Ch ip Components
(I) Remove the solder at eac h joint, one
joint ut a time, using solder wick wetted
with non - acidic flux as sho wn below.
Avoid apply 111g pressure, and do not at
tempt to remove th e tinnin g from the
chip's electrode .
6 -
(2) Grasp the chip on both s ide s with twee-
zers, and gently twist the tweezers back
and forth (to break the adhesive bond)
whil e alternately heaung each electrode.
Be ca re f ul to avoid peeling th e foil
traces from the board. Dispose of the
chip when removed.
(3)
After removing the chip, use the copper
braid and solde,.ing iron to wick away
any excess solder and smooth the land
for installation of the replacement part.
Insta lli ng a Repl acement Chip
As the value of some ch ip components is not
indi cated on the body of the chip, be careful
to get the right part for re placement.
(I) Apply a small amount of solder to the
land on one side where the chi p 1s to be
installed. Avoid too much solder, which
may ca use bridg111g.
(2) Hold the chip with tweezers 1n the
desired position, and apply the soldering
iron with a motion indicated by the
arrow in the diagram below . Do not
apply heat for more than 3 seconds.
(3)
Remove the tweezers and solder the
elec tr ode on the other side 111 the mann er
just described.

CONTROL UNIT (No.10XX)
obverse view of "component" side
BASE (Tr,)
EMITTER(Common)~'
BASE(Tr,)"'
'COLLECTOR(Tr.)
+' COLLECTOR(Tr,)
FMW1(W1) (01009}
COLLECTOR(Tr,)
BASE(Tr,)
EMITTER(Tr,)'~
"-.. EMITTER(Tr.)
., Y' BASE(Tr,)
t COLLECTOR(Tr,)
M41rked Sud•c•
IM02(02) (01006, 1012)
7
HD404608-A 1 OH (0100 1)
"O"",,
' "
•
MX365LH (01002)
..... ·~
"--~'-...,.,
'"'"''
NJM2902M (01010)
11PD4013BG (01011)
µP04094BG (01015)
~::'
+ Vss
Marked Surl1ce
SCl7710YBA (01003)
RH5VA45AA (01004}
~BASE
~OLLECTOR
4 EMITTER
Marked Surface
2SB799(Ml) (01008)
COLLECTOR ~BASE
~IT~ER
Marked Surface
RN1303(XC} (01014)
RN2303(YC) (01005, 1013)

obverse view of "display" side
ANOOE 3
ANODE~ ANOOE I
:.- 'CATHODE 3
CATHODE 2
I CATHODE I
M111k td $vfof1ct
IMN10(N10)
(01002, 1003, 1004)
ANODE(Di ,)
CATHODE(Common) '
~
ANODE(Do, )
ANODE (Di . )".~'-.
~ ANODE(D1,)
I
M•d~ td Surf•Ge
FMN1(N1) (01001,1007)
8
ANODE~
"-.CATHODE
CATHODE
1SS300(A3) (0 1012 , 1014)
CATHODE
~ANOO•
~ ANODE
Marked Surface
1SS301(83) (01005)
ANODE I/CATHODE 2
~
"
ANODE2
• CATHODE 1
Marked Surface
1SS302(C3) (01013)
,.,~~ ~
~N~E
SLM-13MWS
(01008, 1009, 1010, 1011)
CATHODE~
'ANODE
ANODE
SLM-23VMWS (01015)
CATHODE(Do,)
"'"0~~,
~~NODE (Do,)
f ANODE(Do,)
Mark&d Surfac:e
1SS319(A4) (01006)

1 1- ----- -- -- - -
_r- 11
,..~ I
11 . ~ ~I
~ -.,~ I
I
_ ___ _ ...J
9
>
<XI
<XI
0
<O
z
a:
>
l.O
iri
>
N
,....
0
1~
>
l.O
n

ADD
CODE No.
DESCRIPTION
CS033000I PCB with Components W/ Sub-uni ls
VE> r.
Al
CS0330002 PCB wi
th Components W/ Sub-unils Ver. A2
cso 33 000:1 PCB wi th
Components W /S ub-units Ver.
Bl
CS0330001 PCB
with Components W /S ub-units V er . Cl
CS0330005 PCB
wi th Components W/Sub-uni ts
Ver.
Hl
F30391013 Printed
Circuit Board
BTlOOl Q9000446
LITHIUM BATTERY CR2025-TS1 CR2025-TS1
c 1001 K22174809
CHIP CAP. GRM39Bl02M50PT 0.001
c 1002
K22174809
CHIP CAP. GRM39B102M50PT 0.001
c 1003
K22174809
CHIP CAP.
GRM39Bl02M50PT 0.001
c 1004
K78080017
CHIP TA. CAP. TEMSVAOJ475M-8R 4.7 6.3V
c 1005
K22174817
CHIP CAP. GRM39B472M50PT 0.0047
c 1006
K22174809
CHIP CAP.
GRM39Bl02M50PT 0.001
c 1007 K22120805
CHIP CAP. GRM40R683M16PT 0 . 068 16V
c 1008
K22120805
CHIP CAP. GRM40R683M16PT 0.068 16V
c 1009
K22120805
CHIP CAP. GRM40R683Ml6PT 0.068 16V
c 1010
K22144802
CHIP CAP. GRM39Bl03M25PT 0.01 25V
c 1011 K22174809
CHIP CAP.
GRM39Bl02M50PT 0.001
c 1012
K78080017
CHIP TA. CAP. TEMSVAOJ475M-8R 4.7
6.3V
c 1013
K22144802
C HIP CAP. GRM39B103M25PT 0 .01
25V
c 1014 K22174809
CHIP CAP. GRM39B102M50PT
0.001
c 1015 K22174809
CHIP CAP. GRM39B102M50PT 0.001
c 1016 K22120805
CHIP CAP. GRM40R683M16PT 0.068 16V
c 1018
K22170805
CHIP CAP. GRM40B102M50PT 0.001
c 1019
c 1020 K22120805
CHIP CAP . GRM40R683M16PT 0 . 068 16V
c 1021 K22174809
CHIP CAP. GRM39B102M50PT 0.001
c 1022
K22174809
CHIP CAP. GRM39B102M50PT 0.001
c 1023
K22174809
CHIP CAP. GRM39Bl02M50PT 0.001
c 1024 K78120009
CHIP TA. CAP. TESVA1Cl05Ml-8R 1 16V
c 1025 K78140009
CHIP
TA. CAP. TESVA1E474Ml-8R 0.47
25V
c 1026
K78080019
CHIP TA. CAP . TEMSVB20J106M-8R 10
6.3V
c 1027
K78080012
CHIP TA.
CAP. TESVDOJ476Ml2R 47 6.3V
c 1028 K22174809
CHIP
CAP.
GRM39B102M50PT 0.001
c 1029
K78160028
CHIP
TA. CAP. TESVA1V334Ml-8R 0.33
35V
c 1030 K78080017
CHIP TA.
CAP. TEMSVAOJ475M-8R 4.7
6.3V
c 1031 K22174809
CHIP CAP. GRM39B102M50PT
0.001
c 1032 K22170805
CHIP CAP . GRM40B102M50PT 0.001
c 1033 K22174809
CHIP CAP. GRM39B102M50PT
0.001
c 1034
K22170223
CHIP CAP.
GRM40CH330J50PT 33p
c 1035 K22170223
CHIP
CAP. GRM40CH330J50PT
33p
c 1036
K22141809
CHIP
CAP. GRM42-6Bl04M25PT 0. 1 25V
c 1037 K22141809
CHIP CAP. GRM42-6Bl04M25PT
0 .1
25V
c 1038 K78140009
CHIP TA. CAP.
TESVA1E474Ml-8R 0.47
25V
c 1039
K78120009
CHIP TA. CAP. TESVA1Cl05Ml-8R 1 16V
c 1040 K22144802
CHIP
CAP. GRM39l:H 03M25PT 0.01
25V
c 1041 K22144802
CHIP CAP. GRM39Bl03M25PT 0.01
25V
c 1043
K22174235
CHIP
CAP. GRM39CH101J50PT
lOOp
c 1044
K22174235
CHIP CAP. GRM39CH101J50PT
lOOp
c 1046 K22170235
C HIP CAP.
GRM40CH101J50PT
lOOp
c \()5() K2217()S()5
Ctt\P C~P. GRM40Bl02M50PT
0.001
c 1051
K22170227
CHIP CAP.
GRM40CH470J50PT
47p
c 1052 K22170227
CHIP CAP.
GRM40CH470J50PT
47p
c 1054 K22170235
CHIP CAP. GRM40CH101J50PT
lOOp
c 1055 K22170227
CHIP CAP.
GRM40CH470J50PT
47p
10 -

ADD CODE No .
DESCRIPTION
I ~
1056
K22170805 CHIP CAP. GRM40Bl02M50PT 0.001
10 57
K22170805
CHIP
CAP. GRM40B102M50PT 0.001
c 1060
K22174809
CHIP
CAP.
GRM39Bl02M50PT 0.00 1
c
1061
K22170805
CHIP CAP. GRM40B102M50PT 0.001
c 1062
K22170805
CHIP CAP. GRM40BJ02M50PT 0.00 1
c 1063
K22170817
CHIP CAP. GRM40B103M50PT 0.01
c 1064
K22170805
CHIP
CAP. GRM40Bl02M50PT 0 .001
c 1065
K22170227
CHIP
CAP. GRM40CH470J50PT 47p
c 1066
K22170805
CHIP CAP. GRM40Bl02M50PT 0.001
COlOOl
H7900530
CERAMIC OSC CSBSOOJT CSB800JT
D 1001
G2070068
DIODE FMNl T99 FMNl
D 1002
G2070078
DIODE IMNlO Tl08
£MN10
D 1003
G2070078
DIODE IMNlO T108
JMNlO
D 1004
G2070078
DIODE IMNlO T108 IMNlO
D 1005
02070086
DIODE 1SS301 TE85R 1SS301
D 1006
G2070080
DIODE 1SS319 TE85R 1SS319
D 1007
G2070078
DIODE JMNlO T108
IMNlO
D 1008
02070098
LED SLM-13MWS T-97B
SLM-13MWS
D 1009
G2070098
LED SLM-13MWS T-97B
SLM-13MWS
D 1010
02070098
LED SLM-13MWS T-978 SLM-13MWS
D 1011
G2070098
LED SLM-13MWS T-978 SLM-13MWS
D 1012
G2070084
DIODE 1SS300 TE85R
1SS300
D 1013
G2070088
DIODE 1SS302 TE85R
1SS302
D 1 014
G2070084
DIODE 1SS300 TE85R
1SS300
D 1015
02070096
LED SLM-23VMWS T-978
SLM-23VMWS
DSlOOl
G6090072
LCD FTD-8973 FTD-8973
J 1001
P1090617
CONNECTOR HSJ1102-0l-540
J 1002
P1090370
CONNECTOR HSJ0836-01 -010
J 1003
Pl090622
CONNECTOR 00 6200 207 032 800
PLlOOl
Q1000060
LAMP KD-0001-01 6V 40MA
6V
Q 1001
Gl090960
IC HD404608AlOH
HD404608AlOH
Q 1002
G1090897
IC MX365LH MX365LH
Q
1003
G1090926
IC SCI7710YBA
SC17710YBA
Q 1004
Gl090922
IC RH5VA45AA-T2 RH5VA45AA
Q
1005
G3070036
TRANSISTOR RN2303 TE85R RN2303
Q 1006
03070026
TTANSISTOR IMD2 T108 IMD2
Q 1007
G3070026
TTANSISTOR IMD2 T108 lMD2
Q 1008
03207997L
TRANSISTOR 2SB799-T2ML
2SB799 ML
Q 1009
G3070009
TRANSISTOR FMWl T98 FMWl
Q 1010
G1090908
IC NJM2902M NJM2902M
Q 1011
Q 1012
G3070026
TTANSISTOR IMD2 Tl08 IMD2
Q 1013
0307 0036
TRANSISTOR R N2303
TE85R RN2303
Q 1014
03070037
TRANSISTOR RN1303
TE85R RN1303
Q 10 15
Gl090696
IC UPD4094BG
uPD4094BG
R 1001
J24185222
CHIP RES. RMCl / 16
222 JATP 2.2K
R 1002
J24185152
CHIP RES. RM CJ / 16 152JATP
1. SK
R 1003
J24185471
CHIP RES.
RMCl/16 471JATP 470
IR
1004
J24185562
CHIP RES .
RMCl/16 562JATP 5.6K
R 1 005
J24185223
CHIP RES.
RMCl /16 223JATP 22K
R 1006
J24185472
CHIP RES.
RMCl/ 16 472JATP 4.7K
IR
1007
J24185563
CHIP RES. RMCl/16
563JATP 56K
R 10 08
J24185474
CHIP RES. RMCl/16 474JATP 470K
R 1009
J24185103
CHIP RES . RMCl/16 103.JATP lOK
R 1010 J24185103
CHIP RES. RMCl/16 103JATP lOK
R 1011
J24185225
CHIP RES. RMCl/16 225JATP 2.2M
11

ADD CODE No. DESCRIPTION
R 1012 J24185334
CHIP RES . RMCl/16 334JATP
330K
R 1013 J24185272
CHIP RES. RMCl / 16 272JATP 2.7K
R 1014 J24185332
CHIP RES. RMCl/16 332JATP 3.3K
R 1015 J24185333
CHIP RES. RM Cl / 16 33 3JATP 33K
R 1016 J24185682
CHIP RES. RMCl/16 682JATP 6.8K
R 1017
J24185333
CHIP RES. RMCl / 16 33 3JATP 33K
R 1018
J24185682
CHIP RES. RMCl/16 682JATP 6.8K
R 1019
J24185225
CHIP RES. RMCl / 16 22 5 JATP 2.2M
R
1020
J24185472
CHIP RES. RMCl/16 472JATP 4.7K
R
1021 J24185472
CHIP
RES. RMCl/16 472JATP 4.7K
R 1022 J24185104
CHIP RES. RMCl /16 10 4JATP lOOK
R 1023 J24205224
CHIP
RES.RMCl/lOT
224J 220K
R 1024 J24205154
CHIP
RES.RMCl/ lOT
154J 150K
R
1025 J24205154
CHIP RES.RMCl/lOT 154J 150K
R 1026
J24185225
CHIP RES. RMCl / 16 225JATP
2.2M
R 1027 J24185333
CHIP RES. RMCl/16 333JATP 33K
R 1028 J24185103
CHIP RES. RMCl/16 103JATP !OK
R 1029 J24185472
CHIP RES.
RMCl/16 472JATP 4.7K
R 1030 J24185333
CHIP RES. RMCl /16 333JATP 33K
R 1031 J24185563
CHIP RES.
RMCl / 16
563JATP 56K
R
1032 J24185103
CHIP
RES. RMCI/16
103JATP
lOK
R 1033 J24185222
CHIP RES.
RMCl / 16
222JATP
2.2K
R 1034 J24185472
CHIP
RES. RMCl/16 472JATP 4.7K
R 1035 J24185102
CHIP RES. RMCl/16 102JATP lK
R
1036 1 J24185471
CHIP RES. RMCl/16 471JATP 470
R
1037 J24185471
CHIP RES.
RMCl/16 471JATP 470
R
1038 1 J24185471 I CHIP
RES.
RMCl/16 471JATP 470
R 1039 J24185471 CHIP
RES.
RMCl/16 471JATP 470
R
1040 I J24205390 l CHIP
RES.RMCl/lOT 390J 39
R 1041 J24185472 CHIP
RES. RMCl/16 472JATP
4.7K
R
1042 I J24185104 1 CHIP
RES . RMCI / 16 104JATP IOOK
R
104 3 J24185472 CHIP
RES. RMCJ / 16 472JATP
4.7K
R
1044 I J24185104 1 CHIP
RES . RMCl/16 104JATP
lOOK
R 104 5 J 241 85332 CH IP
RES. RMCl / 16 332JATP 3.3K
R
1046 J24185471 CHIP
RES. RMCl/16 471JATP
470
R 1047 J24185102
CHIP RES. RMCl / 16 10 2JATP lK
R 1048
J24185105
CHIP
RES. RMCl/16 l05JATP lM
I
R
1049 J24185225
CHIP
RES. RMCl / 16 225JATP
2.2M
R 105 0
J24185334
CHIP
RES. RMCl/ 16 334JATP 330K
I
R 1051
.J24185273
CHIP
RES. RMCl / 16 273JATP
27K
R
1052 J24185104
CHIP
RES. RMCl/16 104JATP
lOOK I
R
1053
J24185103
CHIP RES. RMCl/16 10 3JATP
lOK
R
1054
J24185223
CHIP RES . RMCl/16
22 3JATP 22K l
R
1055
J24185103
CHIP
RES. RMCl/16 103JATP
lOK
R
1056
J24185223 I CHIP
RES.
RMCl/16 223JATP 22K
R
1057 J24185102 CHIP
RES.
RMCl/16
102JATP
lK
R 1058 J24185684 I CHIP
RES. RMCl / 16
684JATP 680K
R 1059 J 241 85222 CH I P RES.
RMCl/16
222JATP
2.2K
R 1060
J24185105
CHIP
RES. RMCl/16 105JATP
lM
R 1061
J24185223
CHIP RES. RMCl /16 223JATP 22K
R
1062
J24185223
CHIP RES.
RMCl/16
223JATP 22K
R 1063
J24185000
CHIP
RES.
RMCl / 16 OOOJATP 0
R
1066 J24185000 CHIP RES.
RMCl/16 OOOJATP 0
R 1067
J24185000
CHIP RES.
RMCl/16 OOOJATP 0
R 1068
J24185000
CHIP
RES. RMCl/16 OOOJATP 0
R 1069
J24185000
CHIP RES. RMCl/16 OOOJATP 0
R 1070
J24185000
CHIP RES.
RMCl / 16
OOOJATP 0
-
--
- 12 -

ADD
CODE No. DESCRIPTION
R
1071 J24185000
CHIP RES. RMCl/16 OOOJATP 0
R 1072 J24185000
CHIP
RES. RMCl/16 OOOJATP 0
R 1074 J24205000
CHIP
RES.RMCl/lOT OOOJ
0
R 1075 J24185103
CHIP RES.
RMCl/16 103JATP
lOK
R 1076 J24205473
C HIP
RES.RMCl/10 473J
47K
R
1077
J24205104
CHIP
RES.RMC1/10T 104J lOOK
R 1078 J24205104
CHIP
RES.RMCl/lOT 104J
lOOK
s 1001
N5090037
TACT SWITCH JPM0300-0101R
s 1004 Q9000442 ROTARY CODE SWITCH EC09P20-04
x 1001 H0102904
XTAL UM-1 1.0MHZ 1.00MHZ

RF UNIT (No.2XXX)
obverse view of "component" side
BASE(Tr,}
BASE(Tr,) '- ,
EMITTER(Tr,)
"'-~~
'r y '- COLLECTOR(Tr,)
, I EMITTER(Tr,)
t COLLECTOR(Tr,)
Marked Surf.tee
OUTPUT
M57796MA (02006)
M57797MA (02018)
"-.. BASE
COLLECTOR
• EMITTER
Ma rked Surface
2SB799(ML)
(02008,2012,2020,2024)
2SC2954(0K) (02005,2017)
COLLECTOR ~BASE
~IT~ER
Marked Surloce
2SC2714Y(QY) ( 02004 )
2SC3356(R24)
(02013,2031,2033)
2SC3583(R32) (02014,2032)
2SC4116GR (LG)
(02011,2023,2027 ,2028)
2SC4215Y(QY) (02003,2015)
2SC4245(H B) (02002)
RN1303(XC)
(
02007 ,2025, 2026 ,2029)
2030
BASE(Tr,)
EMITTER( Common)~"'""
BASE(Tr ,) "'""
'COLLECTOR(Tr ,)
+' COLLECTO R(Tr ,)
M•r~ed Surf•c•
IMX5(X5) (02001) FMS1(S1) (02010,2022). FMW1(W1) (02009,2021)
14

obverse view of "chip-on ly" side
15
CATHODE
~
NOOE
ANO OE
t
Mark&d Surface
1SS184(83) (02003)
1SS301 (83)
(
02002,2006,2008)
2011,2013,2014
2017,2018
1SS321(F9) (02005)
DAN235K(M) (02009)
ANODE 1/CATHOOE 2
~
'
ANODE 2
+ ATHOOE 1
Marked Surface
1SS302(C3) (02015)

CD
0
!~
I lL
I
I t:
I Z
I
:::>
I
I
.._
I :X
I
I
I
------· --------
- 16
SEMICONDUCTORS
SUB - UNITS

ADD
CODE No. OESCRJ PT,
1J
ON
CP1102002 PCB wi th
Components W/Sub-un i ts Ver.
Al
< VHF PLL,
UHF PLL, ANT
sw.
Uni ts)
CP1102003
PCB wi th Compone nts W/Sub-units Ver.
A2
<VHF PLL, UHF PLL,
ANT
SW,
Uui ts)
£<30381 0 18 Printed Ci r cuit Board
c 2001 K22174805
CHIP
CAP. GRM39B4.71M50PT
470p
c 2002 K22170215 CHIP CAP. GRM40CH15 0 J50PT 15p
c 2003 K22170221 CHIP CAP. GRM40CH270J50PT 27p
c 2004 K22170221
CHIP
CAP. GRM40 CH2 70J50PT 27p
c 2005 K22170202 CHJP CAP. GRM40CK010C50PT Ip
c 2006 K22170211 CHIP CAP. GRM40CHIOOD50PT lOp
c 2008 K22174809 CHIP CAP. GRM39Bl02M50PT 0.001
c 2009 K22170213
CHIP
CAP . GRM40CH120J50PT 12p
c 2011
K22170251 CHIP CAP. GRM40CH471J50PT 470p
c 2012
K22170217 CHIP CAP. GRM40CH180 J50PT l8p
c 2013 K22170219 CHIP CAP. GRM40CH220J50PT 22p
c 2014 K22170208 CHIP CAP. GRM40CH070D50PT
7p
c 2015
K22170217
CHIP
CAP. GRM40CH180JSOPT 18p
c 2016 K22174235 CHIP CAP. GRM39CH101JSOPT lOOp
c 2017
K22174809 CHIP CAP. GRM39Bl02M50PT 0.001
c 2018 K22174809 CHIP CAP. GRM39Bl02M50PT 0.001
c 2019 K22170210
CHIP CAP. GRM40CH090D50PT
9p
c 2020 K22174809
CHIP CAP. GRM39Bl02M50PT 0.001
c 2022 K22170209 CHIP CAP. GRM40CH080D50PT
Sp
c 2023 K22170219 CHIP CAP. GRM40CH220JSOPT
22p
c 2024
K22170215 CHIP CAP. GRM40CH150JSOPT
15p
c 2025
K22144802 CHIP
CAP. GRM39B103M25PT 0.01 25V
c 2026 K22174809
CHIP
CAP. GRM39B102M50PT 0.001
c 2027
K22170215 CHIP CAP. GRM40CH150JSOPT
15p
c 2028
K22170817 CHIP CAP. GRM40Bl03MSOPT 0.01
c 2029
K22170817 CHIP CAP. GRM40B103MSOPT 0.01
c 2030 K22170219 CHIP CAP. GRM40CH220JSOPT
22p
c 2031 K22170211 CHIP CAP. GRM40CH100D50PT
lOp
c 2032 K22174809 CHIP CAP. GRM39B102MSOPT
0.001
c 2033 K22174809 CHIP
CAP. GRM39B102M50PT 0.001
c 2034 K22174809 CHJP CAP. GRM39B102MSOPT 0.001
c 2035 K22174809 CHIP CAP. GRM39B102M50PT 0.001
c 2036
K22170217 CHIP CAP. GRM40CH180JSOPT
18p
c 2037
K22174809 CHIP
CAP. GRM39B102M50PT 0.001
c 2038
K22174809 CHIP CAP. GRM39B102M50PT 0.001
c 2039 K22174809
CHIP CAP. GRM39B102M50PT 0.001
c 2040 K22174204 CHIP CAP. GRM39CJ030C50PT
3p
c 2041
K22170223 CHJP CAP. GRM40CH330J50PT
33p
c 2042
K22170202 CHIP CAP. GRM40CK010C50PT
lp
c 2043
K22174809
CHIP
CAP. GRM39Bl02M50PT 0.001
c 2044 K22174809 CHIP CAP. GRM39B102M50PT
0.001
c 2045 K22174809 CHIP
CAP. GRM39Bl02M50PT 0.001
c 2046 K22174809 CHIP CAP. GRM39B102MSOPT
0.001
c 2047
K22174809 CHIP CAP. GRM39Bl02M50PT
0.001
c 2050 K78100010 CHIP TA.
CAP. TESVB21A475M8R 4.7
1 OV
c 2051 K22174809 CHIP
CAP. GRM39Bl02M50PT 0.001
c 2052 K78080010 CHIP TA. CAP. TESVB20.J685M8R
6.8
6.3V
c 2053
K22174809 CHIP
CAP. GRM39Bl02M50PT 0.001
c 2054
K22174809 CHIP CAP. GRM39B102MSOPT
0.001
c 2055 K22174809 CHIP
CAP. GRM39B102M50PT 0:001
- 17

ADD
CODE No. DESCRIPTION
c 2056 K22174809 CHIP CAP . GRM398102M50PT 0.001
c 2057 K7814001 0 CHIP TA. CAP . TESVB21El55M8R 1 . 5 25V
c 2058 K22170215 C HIP CAP. GRM40 CH150 J50PT 15p
c 2059 K22170206 CHIP CAP . GRM40CH050C50PT 5p
c 2060 K22170205 CHIP CAP. GRM40CH040C50PT
4p
c 2061 K22170204 CHIP CAP. GRM40CJ030C50PT
3p
c 2062 K22170211 CHIP CAP. GRM40CH100D50PT
lOp
c 2063 K22174809 C HI P CAP. GRM39Bl02M50PT 0.001
c 2064 K22174809 C HIP CA P. GRM 3 98102M50PT 0.001
c 2065 K22174809 CHIP CAP. GRM39B102M50PT 0.00 1
c 2066 K22170223 CHIP
CAP. GRM40CH330J50PT 33p
c 2067 K22170219 CHIP
CAP. GRM40CH220J50PT 22p
c 2068 K22144802 CHIP CAP. GRM39B103M25PT
0.01 25V
c 2069 K22170211 CHIP
CAP. GRM40Clll OOD50PT lOp
c 2070 K22144802 CHIP CAP. GRM39Bl03M25PT 0.01
25V
c
2071
K221448 02
CHIP CAP. GRM39B103M25PT 0.0 1 25V
c
2073 K22174207 C HIP CAP. GRM39CH060D50PT
6p
c
2074
K22174809 CHIP
CAP. GRM39B102M50PT 0.001
c 2075 K22174809 CHIP
CAP. GRM39B102M50PT 0.001
c 2076 K22174809 CHIP
CAP. GRM39B102M50PT 0.001
c 2077 K22174809 CHIP CAP. GRM39B102M50PT 0 .
001
c
2078 K22170206 CHIP CAP . GRM40CH050C50PT
Sp
c 2079 K22174809
C HIP CAP. GRM398102M50PT 0.001
c 2080
K22174809 CHIP CAP. GRM39B102M50PT
0.00 1
c 2081 K22174809
CHIP CAP. GRM39B102M50PT 0.001
c
2082 K22170203 CHIP CAP. GRM40CK020C50PT
2p
c 2084 K22170202
CHIP CAP. GRM40CK010C50PT
lp
c 2086 K22174809 CHIP CAP. GRM39Bl.02M50PT
0.001
c 2088 K22174809 CHIP
CAP .
GRM 39B102 M50PT
0.001
c 2089 K22174809 CHIP CAP. GRM39B102M50PT
0.001
c 2092 K22174809 CHIP CAP . GRM39B102M50PT
0.001
c
2093
K22174809 CHIP C AP . GRM39Bl02M50PT
0.001
c 2094 K78130010 CHIP
TA. CAP. TESVB21D225M8R 2. 2 20V
c 2095 K22174809
CHIP CAP. GRM39B102M50PT 0.001
c 2097 K22174809 CHIP
CAP. GRM39Bl02M50PT 0.001
c 2099 K22174809 CHIP
CAP. GRM39B102M50PT 0.001
c 2100 K78120010
CHIP TA . CAP. TESVB21C335 M8R
3.3 16V
c 2101 K22170211 CHIP CAP. GRM40CH100D50PT
lOp
c 2102 K22174809 CHIP
CAP. GRM39Bl02M50PT 0.001
c 2103 K22174809 CHTP CAP. GRM39B102M50PT
0.001
c
2104 K22120805 CHIP CAP. GRM40R683Ml6PT
0.068
16V
c 2106 K22174809 CHIP CAP. GRM39B102M50PT
0.001
c 2107 K22120805 CHIP
CAP. GRM40R683M16PT 0.068
l6V
c 2108 K22174805 CHIP CAP. GRM39B471M50PT
470p
c 2109 K22170219
CHIP
CAP. GRM40CH220J50PT
22p
c 2110 K22170239 CHIP CAP. GRM40CH151J50PT
150p
c 2111 K22170239 CHIP
CAP. GRM40CH151J50PT
150p
c 2112 K22170221
CHIP CAP . GRM40CH270J50PT
27p
c 2113
K22170221 CHIP CAP. GRM40CH270J50PT
27p
c 2114
K22170221 CHIP
CAP. GRM40CH270J50PT
27p
c 2115
K22171008 CHIP
CAP. GRM40F473Z50PT
0.047
18 -