Yamaha i88x User manual

SY 011724 HAMAMATSU, JAPAN
Copyright (c)Yamaha Corporation. All rights reserved. PDF-K8291
MI
’04.04
20040325-128000
SERVICE MANUAL
AUDIO / MIDI INTERFACE
■ CONTENTS （目次）
SPECIFICATIONS ............................................................................................ 3
総合仕様............................................................................................................ 5
PANEL LAYOUT （パネルレイアウト）............................................................ 7
CIRCUIT BOARD LAYOUT （ユニットレイアウト）........................................ 8
DISASSEMBLY PROCEDURE （分解手順）.................................................... 9
LSI PIN DESCRIPTION （LSI端子機能表）.................................................... 14
IC BLOCK DIAGRAM （ICブロック図）......................................................... 24
CIRCUIT BOARDS （シート基板図）............................................................. 27
SOFTWARE ONLY FOR THE mLAN INSPECTION.................................. 42/46
（mLAN検査専用ソフト）
INSPECTION （検査）................................................................................ 50/57
SYSTEM FLOW CHART [After turning on the Power]............................... 64/65
（電源立ち上げシーケンス）
PARTS LIST
BLOCK DIAGRAM （ブロックダイアグラム）
WIRING （基板結線図）
OVERALL CIRCUIT DIAGRAM （総回路図）
i88X

i88X
2
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those originally installed.
印の商品は、安全を維持するために重要な部品です。交換する場合は、安全のため必ず指定の部品をご使用下さい。
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical / electronic and / or plastic (where
applicable) components may also contain traces of chemicals found by the California Health and WelfareAgency (and possibly other
entities) to cause cancer and / or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL / ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY
REASON WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to
solder / flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling food.
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and under-
stood by the users, and have therefore not been restated.
WARNING: Failure to follow appropriate service and safety procedures when servicing this product may result in
personal injury, destruction of expensive components and failure of the product to perform as speci-
fied. For these reasons, we advise all Yamaha product owners that all service required should be
performed by an authorized Yamaha Retailer or the appointed service representative.
IMPORTANT:
This presentation or sale of this manual to any individual or firm does not constitute authorization, certifica-
tion, recognition of any applicable technical capabilities, or establish a principal-agent relationship of any
form.
The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research engineering,
and service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevi-
table and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy
appear to exist, please contact the distributor's Service Division.
WARNING:
Static discharges can destroy expensive components. Discharge any static electricity your body may have
accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to this bus).
IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power
to the unit.

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SPECIFICATIONS
■General Specifications
■Input/Output Specifications
Sampling Frequency Internal, External Normal Rate Fs 44.1kHz(–10%) to 48kHz(+6%)
*1
Double Rate Fs 88.2kHz(–10%) to 96kHz(+6%)
Frequency
Response Fs 44.1kHz, 48kHz 20Hz to 20kHz 0+1/–3dB, Input to Master Output L/R (Fs 48kHz, MIC/LINE)
Fs 88.2kHz, 96kHz 20Hz to 40kHz 0+1/–3dB, Input to Master Output L/R (Fs 96kHz, MIC/LINE)
Total Harmonic Distortion Less than 0.01% 1kHz, Line Input to Master Output L/R (Input Gain = Min,
Output Vol = Max)
Dynamic Range 110dB Line Input to Master Output L/R (1/2ch)
Noise level –100dBu (1/2ch)
Crosstalk 75dB 1kHz
AD converter 24bit Linear, 128times over sampling (Fs 44.1,48kHz) / 64time over sampling
(Fs 88.2,96kHz)
DA converter 24bit Linear, 128times over sampling (Fs 44.1,48kHz) / 64time over sampling
(Fs 88.2,96kHz)
Interface Functions
Compatible mLAN transfer rate S400 (400Mbps) / S200 (200Mbps)
mLAN Audio I/F
18ch Input / 18ch Output (Fs 44.1kHz, 48kHz)
Type: Input (Analog) 8ch, Digital Input 2ch, ADAT Input 8ch
14ch Input / 14ch Output (Fs 88.2kHz, 96kHz)
Type: Input (Analog) 8ch, Digital Input 2ch, ADAT Input 4ch
MIDI I/F 1 Input port / 1 Output port
Analog Input Connector Input level
Nominal Max. before clip Input Impedance
INPUT 1,2 XLR/TRS Phone Combo
*2
,
Balanced, +48V ±3V Phantom,
Mic/Line/Hi-Z
–60dBu to –16dBu (Mic) –2dBu 3kΩ
–34dBu to +10dBu (Line) +24dBu
–56dBu to –12dBu (Hi-Z) +2dBu 500kΩ
INPUT 3-8 TRS Phone
*3
, Balanced, Line –20dBu to +10dBu +24dBu 10kΩ
INSERT IN 1-2 TRS Phone
*4
, UnBalanced –2dBu +12dBu 10kΩ
Analog Output Connector Output level
Nominal Max. before clip Actual Load Impedance
(Rated Load Impedance)
OUTPUT 1-8
(MASTER OUT L/R)
TRS Phone, Balanced
*3
+4dBu +18dBu 2kΩ(10kΩ)
INSERT OUT 1-2 TRS Phone
*4
, UnBalanced –2dBu +12dBu 600Ω(10kΩ)
PHONES TRS Phone, UnBalanced — 100mW+100mW 33Ω(33Ω)
Digital Input/
Output Connector Format Recommended output level Other details
ADAT/DIGITAL
OPTICAL IN, OUT OPTICAL ADAT
*5
—Supports DOUBLE
(up to 96 kHz).
IEC-60958 Consumer use
(DIGITAL) —
DIGITAL STEREO
IN, OUT RCA PIN
IEC-60958 Consumer use 0.5Vpp/75ΩThe IN jack features an internal
sampling rate converter.
MIDI IN, OUT A/B DIN 5pin MIDI —
mLAN 1/2 IEEE1394 6pin mLAN — Compatible with S400 and S200

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■Control
*6: Phantom power (+48 V) is not supplied when the TRS phone is used. If the [HI-Z/LINE/MIC] switch is set to HI-Z, phantom
power is not supplied to INPUT jack 1.
■Others
Input Gain Gain Knob 1, 2, 3, 4, 5/6, 7/8
Phantom Switch Phantom (+48V) On/Off for Input1,2 channel with LED *6
Gain Select Switch (PAD Switch) Input Ch 1 : Mic/Line/Hi-Z, Input Ch 2 : Mic/Line
Peak LED Input 1, 2 channel
Monitor Select Switch (Fs Indicator) Direct Monitoring Channel Selector : 1/2, 3/4, 5/6, 7/8, Digital In / Fs Indicator
(holding down a while)
Monitor LED (Fs Indicator) Direct Monitoring Channel Selector : 1/2, 3/4, 5/6, 7/8, Digital In / Fs Indicator :
44.1, 48, 88.2, 96kHz
Monitor Volume Direct Monitoring Volume for selected channel by monitor switch
Master Volume Output Level of Master Output L/R and Phones
Optical Select Switch Digital / ADAT Normal / ADAT Double
Master Clock LED mLAN / ADAT / Internal
mLAN Active LED For Information of mLAN s situation
Power Switch Stand by/On switch
Supplied Accessories Power Adaptor (PA-5D), Owner s Manual set, CD-ROM x 2, mLAN (IEEE1394)
cable
Power Consumption 16W
Dimensions 480(W) x 372.7(D) x 44(H)
Weight 3.9kg
*1: Signal input fromADAT-compatible device:Normal Rate Fs 44.1KHz(—6%) to 48KHz(+6%)
Double Rate Fs 88.2KHz(—6%) to 96KHz(+6%)
*2: Always balanced, regardless of whether a XLR-3-31 orTRS phone is used. (1=GND, 2=HOT, 3=COLD/Tip=HOT, Ring=COLD,
Sleeve=GND)
*3: Balanced Phone (Tip=HOT, Ring=COLD, Sleeve=GND)
*4: INSERT IN & OUT feature unbalanced phone jacks. (Tip = OUTPUT, Ring=INPUT, Sleeve=GND)
*5: ALESIS proprietary multi-channel optical digital interface format
In these specifications, when dBu represents a specific voltage, 0 dBu is referenced to 0.775Vrms.
(fixed at 44.1kHz)

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総合仕様
■ 一般仕様
■ 入出力仕様
*1 : ADAT 対応機器からの入力信号時：Normal Rate Fs 44.1KHz(-6%) 〜48KHz(+6%)
Double Rate Fs 88.2KHz(-6%) 〜96KHz(+6%)
サンプリング周波数 Internal,
External Normal Rate：Fs 44.1kHz( −10%) 〜48kHz(+6%)*1
Double Rate：Fs 88.2kHz( −10%) 〜96kHz(+6%)
周波数特性 Fs 44.1kHz, 48kHz 20Hz〜20kHz 0+1/−3dB、Input to Master Output L/R (Fs 48kHz, MIC/LINE)
Fs 88.2kHz, 96kHz 20Hz〜40kHz 0+1/−3dB、Input to Master Output L/R (Fs 96kHz, MIC/LINE)
全高調波歪 0.01% 以下 1kHz, Line Input to Master Output L/R (Input Gain = Min, Output
Vol = Max)
ダイナミックレンジ 110dB Line Input to Master Output L/R (1/2ch)
ノイズレベル −100dBu (1/2ch)
クロストーク 70dB 1kHz
AD コンバーター 24bit Linear, 128times over sampling (Fs 44.1,48kHz) / 64time over sampling
(Fs 88.2,96kHz)
DA コンバーター 24bit Linear, 128times over sampling (Fs 44.1,48kHz) / 64time over sampling
(Fs 88.2,96kHz)
インターフェース機能
mLAN 対応転送レート S400 (400Mbps) / S200 (200Mbps)
mLAN Audio I/F
18ch Input / 18ch Output (Fs 44.1kHz, 48kHz)
内訳：Input (Analog) 8ch,Digital Input 2ch, ADAT Input 8ch
14ch Input / 14ch Output (Fs 88.2kHz, 96kHz)
内訳：Input (Analog) 8ch,Digital Input 2ch, ADAT Input 4ch
MIDI I/F 1 Input port / 1 Output port
アナログ入力 形状, 平衡 定格入力レベル 最大入力レベル 入力インピーダンス

INPUT 1,2
XLR/TRS Phone Combo*2,
Balanced,
+48V±3VPhantom,
Mic/Line/Hi-Z
−60dBu 〜−16dBu
(Mic) −2dBu 3kΩ
−34dBu 〜+10dBu
(Line) +24dBu
−56dBu 〜−12dBu
(Hi-Z) +2dBu 500kΩ
INPUT 3 〜8 TRS Phone*3, Balanced, Line −20dBu 〜+10dBu +24dBu 10kΩ
INSERT IN 1 〜2 TRS Phone*4, UnBalanced −2dBu +12dBu 10kΩ
アナログ出力 形状, 平衡 定格出力レベル 最大出力レベル 出力インピーダンス
( 定格負荷インピーダンス)
OUTPUT 1 〜8
(MASTER OUT L/R) TRS Phone, Balanced*3 +4dBu +18dBu 2kΩ(10kΩ)
INSERT OUT 1 〜2 TRS Phone*4, UnBalanced −2dBu +12dBu 600Ω(10kΩ)
PHONES TRS Phone, UnBalanced ― 100mW+100mW 33Ω(33Ω)
デジタル入出力 形状 フォーマット 規定出力レベル 補足
ADAT/DIGITAL OPTICAL IN,
OUT OPTICAL ADAT*5 ― Double Ch. ( 〜96kHz) 対応

IEC-60958 民生
(DIGITAL) ―
DIGITAL STEREO IN, OUT RCA PIN IEC-60958 民生 0.5Vpp/75Ω IN側はSRC 内蔵
MIDI IN, OUT A/B DIN 5pin MIDI ―
mLAN 1/2 IEEE1394 6pin mLAN ― S400/S200対応

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*2 : XLR-3-31 使用時でも、TRS Phone 使用時でも、Balanced 仕様(1=GND,2=HOT,3=COLD / Tip=HOT, Ring=COLD, Sleeve=GND
)
*3 : Blanced Phone (Tip=HOT, Ring=COLD, Sleeve=GND)
*4 : Insert In/Out はUnBalanced Phone (Tip=OUTPUT, Ring=INPUT, Sleeve=GND)
*5 : ALESIS proprietary multi-channel optical digital interface format
0dBu=0.775Vrms.
■ 操作子
*6:TRSPhone使用時には、Phantom(+48V)供給されない。
［Hi-Z/LINE/MIC］スイッチをHi-Zにした時、Ch.1にはPHONTOM電源は供給されない。
■ その他
Input Gain Gain Knob 1, 2,3, 4, 5/6, 7/8
Phantom Switch Phantom (+48V) On/Off for Input1,2 channel with LED *5
Gain Select Switch (PAD Switch) Input Ch 1 : Mic/Line/Hi-Z, Input Ch 2 : Mic/Line
Peak LED Input 1, 2 channel
Monitor Select Switch (Fs Indicator) Direct Monitoring Channel Selector : 1/2, 3/4, 5/6, 7/8, Digital In / Fs
Indicator (holding down a while)
Monitor LED (Fs Indicator) Direct Monitoring Channel Selector : 1/2, 3/4, 5/6, 7/8, Digital In / Fs
Indicator : 44.1, 48, 88.2, 96kHz
Monitor Volume Direct Monitoring Volume for selected channel by monitor switch
Master Volume Output Level of Master Output L/R and Phones
Optical Select Switch Digital / ADAT Normal / ADAT Double
Master Clock LED mLAN / ADAT / Internal (fixed at 44.1kHz)
mLAN Active LED For Information of mLAN's situation
Power Switch Stand by/On switch
Supplied Accessories Power Adaptor (PA-5D), Owner's Manual set, CD-ROM ×2, mLAN
(IEEE1394) cable
Power Consumption 14W
Demensions 480(W) ×372.7(D)×44(H) mm
Weight 3.9kg

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21
DC IN
OUT
MIDI
OUTIN IN
DIGITAL
STEREO
OPTICAL DIGITAL STEREO
COAXIAL 876543
876543
21
INPUT
(BAL) INSERT I/O
2/ R1/ LOUTPUT / MASTER
+4dB(BAL)
23 2122
16 15
17
18
1920
Front Panel（フロントパネル）
q[PHONTOM +48V] switch q[PHANTOM+48V]ボタン
w[(HI-Z)/LINE/MIC] switch w [(HI-Z)/LINE/MIC] （（HI-Z)／ライン／マイク）スイッチ
e[XLR/TRS Phone Compatible INPUT 1 and 2] jacks eINPUT1/2（XLR/TRSフォーン共用）端子
r[PEAK] indicators rPEAK（ピーク）ランプ
t[GAIN] controls t[GAIN]（ゲイン）ノブ
yMONITOR [1/2 (44k)] - [7/8 (96k)] indicators yMONITOR（モニター）／サンプリング周波数ランプ
u[SELECT] switch u[SELECT]（セレクト）ボタン
i[MONITOR VOLUME] control i[MONITORVOLUME]（モニターボリューム）ノブ
o[MASTER PHONES] jack oMASTERPHONES（マスターフォン）端子
!0 [MASTER VOLUME] control !0 [MASTERVOLUME]（マスターボリューム）ノブ
!1 [OPTICAL SELECT] switch !1 [OPTICALSELECT]（オプティカルセレクト）スイッチ
!2 [MASTER CLOCK] indicators !2 MASTERCLOCK（マスタークロック）ランプ
!3 [mLAN ACTIVE] indicator !3 ACTIVE（アクティブ）ランプ
!4 [STANDBY/ON] switch !4  [POWERON/STANDBY]（電源オン／スタンバイ）ボタン
PANEL LAYOUT （パネルレイアウト）
• Front Panel
• Rear Panel
1 2 3 45 345 6 7 8 9 10 11 12 13 14
Rear Panel（リアパネル）
!5 [INSERT I/O 1 & 2 (TRS phone)] jacks !5 INSERTI/O1/2(TRSフォーン)端子
!6 [INPUT 3-8 (TRS phone)] jacks !6 INPUT3〜8(TRSフォーン)端子
!7 [OUTPUT 1 & 2 / MASTER OUT L & R (TRS phone)] jacks !7 OUTPUT1/2MASTEROUTL/R(TRSフォーン)端子
!8 [OUTPUT 3-8 (TRS phone)] jacks !8 OUTPUT3〜8(TRSフォーン)端子
!9 [DIGITAL STEREO COAXIAL IN & OUT] jacks !9 DIGITALSTEREOCOAXIALIN/OUT端子
@0 [OPTICAL IN & OUT] jacks @0 OPTICALIN/OUT端子
@1 [MIDI IN & OUT] ports @1 MIDIIN/OUT端子
@2 [DC IN] terminal @2 DCIN端子
@3 [mLAN 1 & 2] connectors @3 mLAN1/2端子

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A
BB
B
B
BBB
B
BBB
JK2
MLN2
DMSUB
DM
JK1
JK3
CIRCUIT BOARD LAYOUT （ユニットレイアウト）
• Top View
• Front View

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DISASSEMBLY PROCEDURE （分解手順）
*分解のためにフィラメントテープを剥がした場合
は、再度取り付けるとき必ず元どおりに貼ってく
ださい。
1. トップカバー（所要時間：約 3分）
1-1. [290]のネジ8本（左、右）を外し、左右のラック
アングルLを外します（Fig.1）。
1-2. [250]のネジ9本を外し、トップカバー（印刷品）
を外します(Fig.1)。
後方を持ち上げながら後ろへ引いて取り外します。
*If you remove filament tapes for disassembling, make
sure to apply them again on the occasion of reassem-
bling.
1. Top Cover (Time required: about 3 min.)
1-1. Remove the eight (8) screws marked [290]. The Rack
Angle L for each side can then be removed. (Fig.1)
1-2. Remove the nine (9) screws marked [250]. The Top
Cover can then be removed. (Fig.1)
While lifting the rear part of top cover slightly, slide it
straight back and remove the top cover.
2. MLN2 Circuit Board & DMSUB Circuit Board
(Time required:about 4 min.)
2-1. Remove the top cover. (See procedure 1.)
2-2. Remove the two (2) screws marked [160]. (Fig.2)
2-3. Remove the four (4) screws marked [150]. The MLN2
circuit board and the DMSUB circuit board can then
be removed. (Fig.3)
2-4. Each circuit board can be removed by detaching the
connector of the MLN2 circuit board and the DMSUB
circuit board.
*When reinstalling MLN2 circuit board, it installs in the
back with the screw of marked [160] after connecting
the connector of the DMSUB circuit board and it in-
stalls in the base last with the screw of marked [150].
2. MLN2シート、DMSUBシート（所要時間：約4分）
2-1. トップカバー（印刷品）を外します。（1項参照）
2-2. [160]のネジ2本を外します。（Fig.2）
2-3. [150]のネジ4本を外すと、MLN2シートとDMSUB
シートが外れます。（Fig.3）
2-4. MLN2シートとDMSUBシートのコネクタの接続
を外すことで、それぞれのシートが外せます。
＊MLN2シートを再度取り付ける時はDMSUBシー
トのコネクタを接続してから[160]のネジで背面に
取り付け[150]のネジで底面に取り付けます。
BB
BBB
1
2
B
BB
B
B
B
1
2
B
BB
B
B
B
[250]
[250]
（トップカバー印刷品）
[290] [290]
[250] [250]
Top Cover
Rack Angle L
（ラックアングルＬ塗装品） Rack Angle L
（ラックアングルＬ塗装品
）
(Fig. 1)
[250]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190) ＋バインドＢタイト
[290]: Bind Head Tapping Screw-B 3.0X10 MFZN2BL (EP600140) ＋バインドＢタイト

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10
[100]
[50]
（絶縁シート）
Insulation Sheet
[150]
Front Panel Assembly
JK2
MLN2
DMSUB
DM
JK3
JK1
（フロントパネルAss'y）
BBB
BB BB
B
B
B
B
B
B
B
B
[315][310] [90] [300]
[160]
[120]
(Fig. 2)
[90]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190) ＋バインドＢタイト
[120]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190) ＋バインドＢタイト
[160]: Bind Head Screw 4.0X6 MFZN2BL (EG340340) ＋バインド小ネジ
[300]: Cord Column WT11 (VG016600) DCコードコラム
[310]: Bind Head Tapping Screw-B 3.0X8 MFZN2BL (EP600190) ＋バインドＢタイト
[315]: Jack Plate ジャック補強板
3. Front Panel Assembly
(Time required:about 6 min.)
3-1. Remove the top cover. (See procedure 1.)
3-2. Turn the unit upside down. Remove the three (3) screws
marked [40]. (Fig.4)
3-3. Return the unit. Remove the four (4) screws marked
[50]. (Fig.3)
3-4. Remove the two (2) cap screws marked [30]. The front
panel assembly can then be removed. (Fig.5)
*When reinstalling a front panel, it does by the follow-
ing order.
•It inserts a putting-in ‘a’ part and ‘b’ part in the slit to
bottom assembly from the vertical direction. (Fig.4)
•It fixes a front part with the screws marked [30]. (Fig.5)
• Turn the unit upside down. It fixes a bottom part by
the positioning order with the screws marked [40].
(Fig.4)
•Return the unit. It fixes the DM circuit board with the
screws marked [50]. (Fig.3)
3. フロントパネルAss'y（所要時間：6 分）
3-1. トップカバー（印刷品）を外します。（1項参照）
3-2. 本体を裏向きにし、[40]のネジ3 本を外します。
（Fig.4）
3-3. 本体を表向きに戻し、[50]のネジ4本を外します。
（Fig.3)
3-4. [30]の六角穴付ボルト2本を外し、フロントパネ
ルAss'yを外します。（Fig.5）
フロントパネルAss'yは前面を持ち上げて外しま
す。
＊フロントパネルを再度取り付ける時は下記の順序
で行います。
・ボトムAss'yに対して垂直方向から嵌め込みa部
とb部をスリットに挿入します。（Fig.4)
・[30]のネジでフロント部を固定します。(Fig.5)
・本体を裏向きにし、[40]のネジでボトム部を位置
決め順序により固定します。(Fig.4)
・本体を表向きに戻し、[50]のネジでDMシートを
固定します。(Fig.3)
(Fig. 3)
[50]: Bind Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230) ＋バインドＢタイト
[100]: Bind Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230) ＋バインドＢタイト
[150]: Bind Head Tapping Screw-B 3.0X6 MFZN2BL (EP600230) ＋バインドＢタイト
(Movie. 1)
Front panel remove
（フロントパネル取り外し）