Yamaha PDM-1 User manual

100818
SERVICE MANUAL
PDM-1
IMPORTANT NOTICE
This manual has been provided for the use of authorized YAMAHA Retailers and their service personnel.
It has been assumed that basic service procedures inherant to the industry, and more specifically YAMAHA Products, are already
known and understood by the users, and have therefore not been restated.
WARNING: Failure to follow appropriate service and safety procedures when servicing this product may result in personal
injury, destruction of expensive components and failure of the product to perform as specified. For these reasons,
we advise all YAMAHA product owners that all service required should be performed by an authorized
YAMAHA Retailer or the appointed service representative.
IMPORTANT: The presentation or sale of this manual to any individual or firm does not constitute authorization, certification or
recognition of any applicable technical capabilities, or establish a principle-agent relationship of any form.
The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research, engineering, and
service departments of YAMAHA are continually striving to improve YAMAHA products. Modifications are, therefore, inevitable
and specifications are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist, please contact
the distributor's Service Division.
WARNING: Static discharges can destroy expensive components. Discharge any static electricity your body may have accumu-
lated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect to this buss).
IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to the unit.
HIGH DEFINITION PLASMA MONITOR
PDM-1

1 YAMAHA PDM-1 Series Overall View 4
2 Specifications 5
3 Applicable signals 6
4 Safety Precautions 7
4.1. General Guidelines 7
5 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 8
6 About lead free solder (PbF) 9
7 PCB Structure sheet of GPH5D2 chassis 10
8 Service Hint 11
9 Location of Lead Wiring 12
10 Adjustment Procedure 13
10.1. +B Set-up 13
10.2. Driver Set-up 13
10.3. Initialization Pulse Adjust 14
10.4. P.C.B. (Printed Circuit Board) exchange 15
10.5. Adjustment Volume Location 15
10.6. Test Point Location 15
11 Service mode 16
11.1. CAT (computer Aided Test) mode 16
11.2. IIC mode structure (The following data is only one
example.) 18
12 Alignment 19
12.1. Pedestal setting 19
12.2. NTSC panel white balance 20
12.3. PAL/SECAM panel white balance 21
12.4. PC/RGB panel white balance 23
12.5. HD/ 525i /525p panel white balance 25
12.6. 625i panel balance 27
12.7. Sub brightness setting 28
13 Trouble shooting guide 30
13.1. Self Check 30
13.2. No Power 31
13.3. No Picture 32
13.4. Local screen failure 32
14 Option Setting 33
15 Conductor Views 35
15.1. F-Board 35
15.2. P1-Board 36
15.3. P3, P5, P6, P7 and P8-Board 39
15.4. HX-Board 41
15.5. HZ-Board 42
15.6. D1-Board 44
15.7. D2-Board 46
15.8. C1-Board 49
15.9. C2-Board 50
15.10. C3-Board 51
15.11. C4-Board 52
15.12. C5-Board 53
15.13. C6-Board 54
15.14. C9-Board 55
15.15. SC-Board 56
15.16. SU-Board 59
15.17. SD-Board 60
15.18. SS-Board 61
15.19. SS2 and SS3-Board 64
15.20. Z-Board 65
15.21. H3, S1 and V1-Board 66
16 Block and Schematic Diagrams 67
16.1. Schematic Diagram Notes 67
16.2. Main Block Diagram 68
16.3. Power Block Diagram 69
16.4. P1-Board Schematic Diagram 70
16.5. F, P3, P5, P6, P7 and P8-Board Schematic Diagram 71
16.6. HX-Board Block Diagram 72
16.7. HX-Board Schematic Diagram 73
16.8. HZ-Board Block Diagram 74
16.9. HZ-Board (1 of 2) Schematic Diagram 75
16.10. HZ-Board (2 of 2) Schematic Diagram 76
16.11. D1-Board Block Diagram 77
16.12. D1-Board (1 of 6) Schematic Diagram 78
16.13. D1-Board (2 of 6) Schematic Diagram 79
16.14. D1-Board (3 of 6) Schematic Diagram 80
16.15. D1-Board (4 of 6) Schematic Diagram 81
16.16. D1-Board (5 of 6) Schematic Diagram 82
16.17. D1-Board (6 of 6) Schematic Diagram 83
16.18. D2-Board Block Diagram 84
16.19. D2-Board (1 of 8) Schematic Diagram 85
16.20. D2-Board (2 of 8) Schematic Diagram 86
16.21. D2-Board (3 of 8) Schematic Diagram 87
16.22. D2-Board (4 of 8) Schematic Diagram 88
16.23. D2-Board (5 of 8) Schematic Diagram 89
16.24. D2-Board (6 of 8) Schematic Diagram 90
16.25. D2-Board (7 of 8) Schematic Diagram 91
16.26. D2-Board (8 of 8) Schematic Diagram 92
16.27. C1, C2, C3, C4, C5, C6 and C9-Board (1 of 2) Block
Diagram 93
16.28. C1, C2, C3, C4, C5, C6 and C9-Board (2 of 2) Block
Diagram 94
16.29. C1-Board Schematic Diagram 95
16.30. C2-Board Schematic Diagram 96
16.31. C3-Board Schematic Diagram 97
CONTENTS Page Page
2
PDM-1U/G/R/

16.32. C4-Board Schematic Diagram 98
16.33. C5-Board Schematic Diagram 99
16.34. C6-Board Schematic Diagram 100
16.35. C9-Board Schematic Diagram 101
16.36. SC-Board Block Diagram 102
16.37. SC-Board (1 of 2) Schematic Diagram 103
16.38. SC-Board (2 of 2) Schematic Diagram 104
16.39. SU-Board Block Diagram 105
16.40. SU-Board (1 of 2) Schematic Diagram 106
16.41. SU-Board (2 of 2) Schematic Diagram 107
16.42. SD-Board Block Diagram 108
16.43. SD-Board (1 of 2) Schematic Diagram 109
16.44. SD-Board (2 of 2) Schematic Diagram 110
16.45. SS-Board Block Diagram 111
16.46. SS, SS2, SS3 and S1-Board Schematic Diagram 112
16.47. Z-Board Block Diagram 113
16.48. H3 and Z-Board Schematic Diagram 114
17 Parts Location 115
17.1. Parts Location1 115
17.2. Parts Location2 116
17.3. Parts Location3 117
18 Replacement Parts List 118
3
PDM-1U/G/R/

1 YAMAHA PDM-1 Series Overall View
R - ST
ANDBY
G POWER ON
INPUT
–
VOL
+
POWER /
INPUT
SURROUND
VOL
PICTURE SOUND SET UP
ASPECT
PICTURE
POS. /SIZE
OFF TIMER
PC
HIGH DEFINITION PLASMA MONITOR
REMOTE CONTROL
PDM-1U/G/R/
4

Power Source
120 V AC, 50/ 60 Hz .................U
220-240 V AC, 50/ 60 Hz ..........G/R
Power Consumption UG/R
Maximum (Normal use) 5.5 A (495 W)
STAND-BY condition 2.4 W 3.0 W
Power off condition 0.9 W 1.7 W
plasma display panel
Drive method AC type
50-inch, 16:9 aspect ratio
Contrast Ratio 3000:1
Screen size
1,106 mm (W) × 622 mm (H) × 1,269 mm (diagonal)
No. of pixels
1,049,088 (1,366 (W) × 768 (H)) [4.098 × 768 dots]
Operating condition
Temperature 34 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
Applicable signals
Color System NTSC, PAL, PAL60, SECAM,
Modified NTSC
Scanning format 525i (480i), 625i (575i), 525p
(480p), 625p (575p), 750p (720p),
1,125/ 60i, 50i, 24p, 24sF (1,080/
60i, 50i 24p, 24sF).....SMPTE
274M
PC signals XGA display
VGA, SVGA, XGA
SXGA, UXGA (compressed)
Horizontal scanning frequency 15.6
- 110 kHz
Vertical scanning frequency 48 -
120 Hz
Connection terminals
AV ..........U/R
Video IN (RCA) 1.0 Vp-p (75-ohm)
S VIDEO IN
(MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
AUDIO IN
(RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT/ RGB ..........U/R
Y/G(RCA) 1.0 Vp-p/ composite (75-ohm)
0.7 Vp-p/ non-composite (75-ohm)
PB/ B (RCA) 0.7 Vp-p (75-ohm)
PR/ R (RCA) 0.7 Vp-p (75-ohm)
HD (RCA) 1.0 - 5.0 Vp-p (high impedance)
VD (RCA) 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC (HIGH-DENSITY D-SUB
15PIN) R, G, B/ 0.7 Vp-p (75-ohm) HD, VD/ 1.0 - 5.0 Vp-p
(high impedance)
AUDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMANAL (D-SUB9PIN) RS-232C COMPATIBLE
SPEAKERS (69)
16 W [8 W + 8 W] (10 % THD)
For SP-PDM1
Accessories Supplied
Remote Control Transmitter EUR646528
Batteries 2 × AA Size (2 × R6 Size)
Ferrite core (small size) × 1, (large size) × 2
Fixing bands 2pcs
Ferrite core Speaker cables 2 pcs ..........U
Optional Supplied
Speakers SP-PDM1
Pedestal PDS-150
Wall Mounting Unit PWK-150
Plasma Display RTM-RCA1 ..........G
RCA Terminal Board
Dimensions (W × H × D)
47.6” (1,210 mm) × 28.5” (724 mm) × 3.9” (98 mm)
Mass (Weight)
approx. 94.8 lbs (main unit only) ...............U
approx. 42.5 kg net (main unit only) ..........G
approx. 43.0 kg net (main unit only) ..........R
Note:
Design and specifications are subject to change without notice.
Weight and dimensions shown are approximate.
Destination
U ..........U.S.A. model
G ..........European model
R ..........General model
2 Specifications
5
PDM-1U/G/R/

3 Applicable signals
6
PDM-1U/G/R/

4.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
4.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
4 Safety Precautions
4.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
7
PDM-1U/G/R/

5 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
8
PDM-1U/G/R/

6 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution


·

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).


·

Pb free solder will tend to splash when heated too high (about 1100 °F or 600°C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.


·

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
9
PDM-1U/G/R/

7 PCB Structure sheet of GPH5D2 chassis
Board Name Function Remarks
D1 Format Converter 1
D2 Plasma AI & Sub-Field Processor 1
ZAudio out
SS Sustain out 1
SC Scan out 1
SU Scan connection (Upper) 1
SD Scan connection (Lower) 1
C1 Data Drive (Upper Left)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Right)
C4 Data Drive (Lower Right)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Left)
C9 Energy recovery circuit
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
FFuse & Line Filter
PPower supply 1
P3 Drive voltage control
P5 Process Voltage control
P6 PFC control
P7 Drive voltage protection
P8 Process voltage protection
HX PC_type_Input terminal
HZ RCA type_Input terminal 2
Remarks
1.Recommend PCB´s for initial service for GPH5D2 chassis.
2.For U/G Version.
10
PDM-1U/G/R/