Yuga CLM920_AC3 Parts list manual

Product name
CLM920_AC3 Module Hardware Usage Guide
Number of pages
59
Version
V1.0
Date
2019/3/21
CLM920_AC3
Module Hardware Usage Guide
V1.0
Shanghai Yuge Information Technology co., LTD
All rights reserved

CLM920_AC3 Module Hardware Usage Guide
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Revise history
Version
Date
Description
Author
V1.0
20190321
Initialized version
David

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Contents
Chapter 1. Introduction...........................................................................................................- 9 -
Chapter 2. Module Overview................................................................................................. - 3 -
2.1 Module introduction......................................................................................................- 3 -
2.2 Module characteristics.................................................................................................. - 3 -
2.3 Module function............................................................................................................- 5 -
Chapter 3. Interface Application Description.........................................................................- 7 -
3.1 Chapter overview.......................................................................................................... - 7 -
3.2 Module interface........................................................................................................... - 8 -
3.2.1 Module pin distribution.......................................................................................... - 8 -
3.2.2 Pin definition.......................................................................................................... - 9 -
3.3 Power interface........................................................................................................... - 16 -
3.3.1 Power supply design.............................................................................................- 16 -
3.3.2 Power reference circuit.........................................................................................- 17 -
3.3.3 VDD_EXT Voltage output................................................................................... - 19 -
3.4 Switching machine reset mode................................................................................... - 19 -
3.4.1 Module boot......................................................................................................... - 19 -
3.4.2 Boot timing...........................................................................................................- 20 -
3.4.3 Module shutdown................................................................................................. - 21 -
3.4.4 Reset control.........................................................................................................- 22 -
3.5 USB interface..............................................................................................................- 24 -
3.6 UART interface........................................................................................................... - 25 -
3.6.1 Main serial port.....................................................................................................- 25 -
3.6.2 Debug serial port.................................................................................................. - 27 -
3.6.3 RI Signal interface................................................................................................- 27 -
3.7 USIM interface............................................................................................................- 28 -
3.7.1 USIM card reference circuit................................................................................. - 29 -
3.7.2 USIM_ PRESENCE Hot Swap Reference Design...............................................- 30 -
3.8 General purpose GPIO interface.................................................................................- 31 -
3.9 Status indication interface...........................................................................................- 32 -
3.10 PCM digital voice interface (under developing).......................................................- 33 -
3.11 I2C bus (under developing).......................................................................................- 35 -

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3.12 WLAN interface (under developing)........................................................................ - 35 -
3.13 ADC interface........................................................................................................... - 36 -
3.14 RF interface...............................................................................................................- 37 -
3.14.1 Antenna matching circuit....................................................................................- 37 -
3.14.2 RF trace reference...............................................................................................- 39 -
Chapter 4. Overall Technical Indicators............................................................................... - 41 -
4.1 Chapter overview........................................................................................................ - 41 -
4.2 Working frequency......................................................................................................- 41 -
4.3 Conducted radio frequency measurement...................................................................- 41 -
4.3.1 Test environment.................................................................................................. - 41 -
4.3.2 Standard test......................................................................................................... - 42 -
4.4 Conducted receiving sensitivity and transmit power.................................................. - 42 -
4.5 Antenna requirements................................................................................................. - 43 -
4.6 Power consumption characteristics.............................................................................- 44 -
Chapter 5. Interface Electrical Characteristics..................................................................... - 46 -
5.1 Chapter overview........................................................................................................ - 46 -
5.2 Working storage temperature...................................................................................... - 46 -
5.3 Module IO level.......................................................................................................... - 46 -
5.4 Voltage........................................................................................................................ - 46 -
5.5 Electrostatic property.................................................................................................. - 47 -
5.6 Reliability index..........................................................................................................- 47 -
Chapter 6.Structural and mechanical properties...................................................................- 50 -
6.1 Chapter overview........................................................................................................ - 50 -
6.2 Exterior....................................................................................................................... - 50 -
6.3 Mechanical Dimensions..............................................................................................- 50 -
Chapter 7. Packaging and Production.................................................................................. - 53 -
7.1 Chapter overview........................................................................................................ - 53 -
7.2 Module packaging and storage................................................................................... - 53 -
7.3 Production welding..................................................................................................... - 53 -
Chapter 8. Appendix.............................................................................................................- 55 -
8.1 Chapter overview........................................................................................................ - 55 -

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8.2 Abbreviations.............................................................................................................. - 55 -
8.3 Encoding..................................................................................................................... - 56 -
8.4 Safety and precautions................................................................................................ - 58 -
Image index
Figure 2-1 Functional block diagram of the CLM920 AC3 LCC module............................. - 6 -
Figure 3-1 CLM920_AC3 module pin distribution diagram (TOP surface perspective).......- 8 -
Figure 3-2 Power supply design...........................................................................................- 17 -
Figure 3-3 LDO linear power supply reference circuit........................................................ - 17 -
Figure 3-4 DC switching power supply reference circuit.................................................... - 18 -
Figure 3-5 PMOS tube control power switch reference circuit............................................- 18 -
Figure 3-6 Startup timing diagram....................................................................................... - 20 -
Figure 3-7 Open set drive start reference circuit.................................................................. - 21 -
Figure 3-8 Button start reference circuit.............................................................................. - 21 -
Figure 3-9 Shutdown timing diagram...................................................................................- 22 -
Figure 3-10 Reset Reference Circuit.................................................................................... - 23 -
Figure 3-11 Reset timing diagram........................................................................................ - 23 -
Figure 3-12 USB connection design circuit diagram........................................................... - 24 -
Figure 3-13 Four-wire serial port design..............................................................................- 26 -
Figure 3-14 Two-wire serial port design.............................................................................. - 26 -
Figure 3-15 Level conversion chip circuit............................................................................- 27 -
Figure 3-16 RI pin signal waveform.................................................................................... - 28 -
Figure 3-17 USIM design circuit diagram............................................................................- 29 -
Figure 3-18 Hot swap detection of the USIM card.............................................................. - 30 -
Figure 3-19 Network indicator circuit diagram....................................................................- 32 -
Figure 3-20 PCM short frame mode timing diagram........................................................... - 34 -
Figure 3-21 PCM to analog voice map.................................................................................- 34 -

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Figure 3-22 I2C interface reference circuit diagram............................................................ - 35 -
Figure 3-23 Antenna matching circuit..................................................................................- 38 -
Figure 3-24 Comparison of received signal strengths with and without diversity antennas- 38 -
Figure 3-25 Complete structure of the microstrip line......................................................... - 39 -
Figure 3-26 Complete structure of the strip line.................................................................. - 40 -
Figure 3-27 Reference ground is the third layer PCB microstrip transmission line structure- 40 -
Figure 6-1 Appearance of the CLM920 AC3....................................................................... - 50 -
Figure 6-2 Front view and side view of the module (unit: mm).......................................... - 50 -
Figure 6-3 Bottom view of the module (unit: mm).............................................................. - 51 -
Figure 6-4 Recommended module package (unit: mm)....................................................... - 52 -
Figure 7-1 Reflow soldering temperature graph.................................................................. - 54 -
Table index
Table 2-1 Key Features...........................................................................................................- 3 -
Table 3-1 Pin definitions........................................................................................................ - 9 -
Table 3-2 IO parameter definition........................................................................................ - 11 -
Table 3-3 Pin description...................................................................................................... - 11 -
Table 3-4 Power pin definitions........................................................................................... - 16 -
Table 3-5 Switching machine pin definition........................................................................ - 19 -
Table 3-6 Boot timing parameters........................................................................................ - 20 -
Table 3-7 Module shutdown mode....................................................................................... - 21 -
Table 3-8 Reset foot definition............................................................................................. - 22 -
Table 3-9 RESET pin parameters......................................................................................... - 23 -
Table 3-10 USB interface pin definition.............................................................................. - 24 -
Table 3-11 Main serial port signal definition....................................................................... - 25 -
Table 3-12 Debugging serial port pin definitions.................................................................- 27 -
Table 3-13 SIM card signal definition..................................................................................- 28 -

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Table 3-14 SIM card hot swap detection pin definition....................................................... - 30 -
Table 3-15 General GPIO Pin Definitions............................................................................- 31 -
Table 3-16 Network indication pin definition...................................................................... - 32 -
Table 3-17 Network operation status indication...................................................................- 32 -
Table 3-18 Module status indication.................................................................................... - 32 -
Table 3-19 PCM pin definition.............................................................................................- 33 -
Table 3-20 PCM specific parameters................................................................................... - 33 -
Table 3-21 I2C pin definition............................................................................................... - 35 -
Table 3-22 Wireless connection pin definition.....................................................................- 36 -
Table 3-23 ADC Pin Definitions.......................................................................................... - 36 -
Table 3-24 Antenna interface pin definition.........................................................................- 37 -
Table 4-1 RF frequency table............................................................................................... - 41 -
Table 4-2 Test instruments....................................................................................................- 41 -
Table 4-3 3G RF Specifications........................................................................................... - 42 -
Table 4-4 4G RF sensitivity indicators.................................................................................- 42 -
Table 4-5 4G RF transmit power specifications................................................................... - 43 -
Table 4-6 Antenna indicator requirements........................................................................... - 43 -
Table 4-7 Sleep and idle power consumption of the three major operators......................... - 44 -
Table 4-8 WCDMA call power consumption....................................................................... - 44 -
Table 4-9 HSDPA data transmission power consumption....................................................- 44 -
Table 4-10 LTE data transmission power consumption....................................................... - 44 -
Table 5-1 CLM920 AC3 module working storage temperature........................................... - 46 -
Table 5-2 Electrical Characteristics of CLM920 AC3 Module............................................ - 46 -
Table 5-3 Working voltage of CLM920 AC3 module..........................................................- 46 -
Table 5-4 CLM920 AC3 ESD Features................................................................................- 47 -
Table 5-5 CLM920 AC3 Reliability Test............................................................................. - 47 -
Table 7-1 Reflow process parameter table........................................................................... - 54 -

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Table 8-1 Abbreviations....................................................................................................... - 55 -
Table 8-2 Maximum HSDPA rate.........................................................................................- 56 -
Table 8-3 Maximum HSUPA rate.........................................................................................- 57 -
Table 8-4 LTE-FDD DL maximum rate............................................................................... - 57 -
Table 8-5 LTE-FDD UL maximum rate............................................................................... - 58 -

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Chapter 1. Introduction
This document is a hardware solution manual for the wireless solution product CLM920
AC3 module. It is intended to describe the hardware components and functional
characteristics of the module solution, application interface definition and usage instructions,
electrical performance and mechanical characteristics. Combined with this and other
application documents, users can quickly use this module to design wireless products.

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Chapter 2. Module Overview
2.1 Module introduction
The CLM920_AC3 module is a wireless communication module that integrates various
network standards such as FDD-LTE/TDD-LTE/WCDMA, and supports a maximum
downlink rate of 150 Mbps and a maximum uplink rate of 50 Mbps. The module is based on
ASR's ASR1802SL platform. It has built-in multiple network protocols (PAP, PPP, CHAP,
TCP, UDP, etc.) and supports multiple functions (WAKEUP, W_DISABLE, AP_READY,
etc.), and supports Windows 7/Windows 8/Windows 10/. Embedded operating system such as
Android 4.0 or higher.
The CLM920 AC3 module can be used in the following applications:
Car Equipment
Wireless POS machine
Wireless advertising, multimedia
Remote monitoring
Smart meter reading
Mobile broadband
automated industry
Other wireless terminals, etc.
2.2 Module characteristics
Table 2-1 Key Features
Characteristic
Description
Physical characteristics
32mm x 29mm x 2.4mm
Fixed way
LCC package, patch mount
Operating Voltage
3.3V - 4.2V Typical Voltage 3.7V
Energy saving current
Standby current < 5mA
USIM card interface
Support 3.0V/1.8V, support hot swap function
USB interface
USB2.0 (High-Speed) (only supports slave mode),
data transfer rate up to 480Mbps
For AT commands, data transfer, software debugging
and software upgrades

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应用
接口
USB driver: Supports Windows XP, Windows 7,
Windows 10, Windows CE 5.0/6.0/7.0, Linux 2.6 or
higher
Android 2.3/4.0/4.2/4.4/5.0/6.0/7.1, etc.
UART interface
Main serial port (4 lines):
Support RTS and CTS hardware flow control
For AT commands and data transfer
The baud rate is up to 921600bps and the default is
115200bps.
Debug serial port (2 lines):
Used for debugging information output, printing
module logs
The default baud rate is 115200bps
PCM interface
For audio, external codec chip
Supports 8-bit A-law, U-law and 16-bit linear
encoding formats
Support short frame mode
Support main mode
SDIO interface
External WLAN chip, interface voltage 1.8V.
Compliant with SDIO 3.0 protocol
Comply with IEEE 802.11 standard
I2C interface
Compliant with I2C bus protocol
High speed mode supports 3.3Mbps rate
ADC interface
Supports two 12-bit sampling ADCs,
Voltage input range 0~1.3V
Network indication
NET_STATUS network status indication
NET_MODE network registration status indication
STATUS module operating status indication
General purpose
GPIO
WAKEUP_IN sleep mode control, low level wake-up
module
AP_READY sleep state detection
W_DISABLE# flight mode control
Frequency band
LTE-TDD:B34/B38/B39/B40/B41
LTE-FDD:B1/B3/B5/B8

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WCDMA:B1/B5/B8
Transmit power
LTE: Class 3(23dBm±2dB)
UMTS: Class 3(24dBm+1/-3dB)
Data service
WCDMA(3GPP R8)
UMTS R99: DL 384kbps/UL 384kbps
DC-HSPA+: DL 42Mbps/UL 5.76Mbps
LTE(non-CA Cat4)
LTE FDD:DL 150Mbps/UL 50Mbps@20M BW cat4
LTE TDD:DL 130Mbps/UL 35Mbps@20M BW cat4
AT command
Support for standard AT instruction sets (Hayes 3GPP
TS 27.007 and 27.005)
Specific AT query CLM920 AC3 AT command set
Network protocol
Support TCP/UDP/PPP/HTTP/NITZ/CMUX/NDIS/NTP/
HTTPS/PING protocol
Antenna interface
MAIN×1，DIV×1
Characteristic impedance 50 Ω
Virtual network card
Support USB virtual network card
Temperature range
Normal operating temperature -30 °C to +75 °C
Extreme operating temperature -40°C to +85°C
Storage temperature
-40°C to +85°C
Humidity
RH5%～RH95%
Module function distinction
M on the label paper represents the main set, D-band
table diversity
When the temperature is in the range of –40°C to –30°C or +75°C to +85°C,
some RF indicators of the CLM920 AC3 module may exceed the 3GPP standard by the 3GPP
standard.
2.3 Module function
The CLM920 AC3 LCC module mainly consists of the following circuit units:
Baseband processing unit
Power management unit

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Memory unit
RF transceiver unit
Module interface unit
The functional block diagram of the CLM920 AC3 LCC module is shown below：
Figure 2-1 Functional block diagram of the CLM920 AC3 LCC module

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Chapter 3. Interface Application Description
3.1 Chapter overview
This chapter mainly describes the interface definition and application of this module.
Contains the following sections:
144 pin pin distribution map
Interface definition
Power interface
USB interface
USIM interface
UART interface
ADC interface
Status indication interface
PCM digital voice interface
GPIO interface
WLAN interface
RF antenna interface

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3.2 Module interface
3.2.1 Module pin distribution
Figure 3-1 CLM920_AC3 module pin distribution diagram (TOP surface perspective)
The modules Pin85~Pin112 are heat-dissipating pads. It is recommended to ground the
design during design.
All RESERVED and unused Pin feet need to be left floating.
Modules Pin28~Pin34 and Pin37~Pin40 are WLAN function pins. This function is
currently under development.

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3.2.2 Pin definition
The CLM920_AC3 module is an LCC interface module. Its pin definitions are shown in
the following table：
Table 3-1 Pin definitions
Pin
Pin name
Pin
Pin name
1
WAKEUP_IN
2
AP_READY
3
RESERVED
4
W_DISABLE#
5
NET_MODE
6
NET_STATUS
7
VDD_EXT
8
GND
9
GND
10
GND
11
DBG_RXD
12
DBG_TXD
13
SIM_PRESENCE
14
USIM_VDD
15
USIM_DATA
16
USIM_CLK
17
USIM_RST
18
RESERVED
19
GND
20
RESET_N
21
PWRKEY
22
GND
23
RESERVED
24
PCM_IN
25
PCM_OUT
26
PCM_SYNC
27
PCM_CLK
28
WLAN_WAKE_HOST
29
WLAN_CLK
30
WLAN_CMD
31
SDC_DATA0
32
SDC_DATA1
33
SDC_DATA2
34
SDC_DATA3
35
ANT_DIV
36
GND
37
WLAN_CLK_EN
38
WLAN_CLK_26M
39
WLAN_PDN
40
WLAN_DCEN
41
I2C_SCL
42
I2C_SDA
43
CLK_32K
44
ADC1
45
ADC0
46
GND
47
RESERVED
48
GND
49
ANT_MAIN
50
GND
51
GND
52
GND

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53
GND
54
GND
55
RESERVED
56
GND
57
VBAT_RF
58
VBAT_RF
59
VBAT_BB
60
VBAT_BB
61
STATUS
62
RI
63
DCD
64
CTS
65
RTS
66
RESERVED
67
TXD
68
RXD
69
USB_DP
70
USB_DM
71
USB_VBUS
72
GND
73
RESERVED
74
RESERVED
75
RESERVED
76
RESERVED
77
RESERVED
78
RESERVED
79
RESERVED
80
RESERVED
81
RESERVED
82
RESERVED
83
RESERVED
84
RESERVED
85
GND
86
GND
87
GND
88
GND
89
GND
90
GND
91
GND
92
GND
93
GND
94
GND
95
GND
96
GND
97
GND
98
GND
99
GND
100
GND
101
GND
102
GND
103
GND
104
GND
105
GND
106
GND
107
GND
108
GND
109
GND
110
GND
111
GND
112
GND
113
RESERVED
114
RESERVED
115
RESERVED
116
RESERVED

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Table 3-2 IO parameter definition
Table 3-3 Pin description
Power supply
Pin
Definition
IO
Functional description
Remarks
57
VBAT_RF
PI
Module RF power input
Power supply
needs to guarantee
2A current
58
VBAT_RF
PI
Module RF power input
59
VBAT_BB
PI
Module baseband power input
117
RESERVED
118
RESERVED
119
RESERVED
120
RESERVED
121
RESERVED
122
RESERVED
123
RESERVED
124
RESERVED
125
RESERVED
126
RESERVED
127
RESERVED
128
RESERVED
129
RESERVED
130
RESERVED
131
RESERVED
132
RESERVED
133
RESERVED
134
RESERVED
135
RESERVED
136
RESERVED
137
RESERVED
138
RESERVED
139
RESERVED
140
RESERVED
141
RESERVED
142
RESERVED
143
RESERVED
144
RESERVED
Symbol sign
Description
IO
Two-way input and output
PI
Power input
PO
Power Output
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
OD
Leaky open circuit

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60
VBAT_BB
PI
Module baseband power input
7
VDD_EXT
PO
1.8V voltage output
Can provide
pull-up for external
GPIO (maximum
50MA), please
keep left floating
8~10,19,22,
36,46,48,50
~54,56,72
GND
Ground
85~112
GND
Heat sink pad
Module switch machine and reset
Pin
Definition
IO
Functional description
Remarks
21
PWRKEY
DI
Switching machine pin
Default low active
20
RESET_N
DI
Module reset pin, internally
pulled up to VDD_EXT
Low level reset
module
USB interface
Pin
Definition
IO
Functional description
Remarks
71
USB_VBUS
PI
USB insertion detection
69
USB_D+
IO
USB bus differential positive
signal
90 Ωdifferential
impedance
70
USB_D-
IO
USB bus differential negative
signal
90 Ωdifferential
impedance
Main serial port
Pin
Definition
IO
Functional description
Remarks
62
RI
DO
Ringing prompt
Wake up the host,
please keep it
floating when not in
use
63
DCD
DO
Carrier detection
1.8V, please hang
when not in use
64
CTS
DO
Clear send
1.8V, please hang
when not in use

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65
RTS
DI
Request to send
1.8V, please hang
when not in use
67
TXD
DO
Main serial port data
transmission
1.8V, please hang
when not in use
68
RXD
DI
Main serial data reception
1.8V, please hang
when not in use
Debug serial port
Pin
Definition
IO
Functional description
Remarks
11
DBG_RXD
DI
Debug serial port data
reception
1.8V, please hang
when not in use
12
DBG_TXD
DO
Debug serial port data
transmission
1.8V, please hang
when not in use
USIM interface
Pin
Definition
IO
Functional description
Remarks
13
SIM_PRESEN
CE
DI
USIM card hot plug detection
please hang when
not in use
14
USIM_VDD
PO
USIM card power supply
Automatically
recognize 1.8V or
3V USIM cards
15
USIM_DATA
IO
USIM card data signal line
16
USIM_CLK
DO
USIM card clock signal line
17
USIM_RST
DO
USIM card reset signal line
GPIO pin
Pin
Definition
IO
Functional description
Remarks
1
WAKEUP_IN
DI
External device wake-up
module
1.8V voltage
domain
2
AP_READY
DO
Wake up external devices
Reserved
4
W_DISABLE#
DI
Flight mode control
Pin function is
under development
(floating when not
in use)
Module status indication interface