ZiLOG System 8000 Quick user guide

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System 8000™
Bardware Reference Manual
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Zilog
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63-3237-04
December 1982
Copyright 1982 by Zilog, Inc. All rights reserved. No part of
this publication may be reproduced, stored in a retrieval system,
or transmitted, in any form or by any means, electronic, mechani-
cal, photocopying, recording, or otherwise, without the prior
written permission of Zilog.
The information in this publication is subject to change without
notice.
Zilog assumes no responsibility for the use of any circuitry
other than circuitry embodied in a Zilog product. No other cir-
cuit patent licenses are implied.
ZILOG

[NOTICE TO OWNER
FEDERAl, COMMUNICATIONS COMMISSION
RADIO FREQUENCY INTERFERENCE
STATEMENT
Warning: This equipment generates, uses, and can radiate radio frequency energy and if not install-
ed and used in accordance with the instructions manual, may cause interference to radio communica-
tions.
As temporarily permitted by regulation it has not been tested for compliance with the limits for
Class Acomputing devices pursuant to Subpart J
of Part 15 of FCC Rules, which are designed to
provide reasonable protection against such interference. Operation
of this equipment in aresidential
area
is likely to cause interference in which case the user at his own expense will be required to take
whatever measures may be required to correct the interference.

SYSTEM 8000 HARDWARE REFERENCE MANUAL
03-3237-011

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Zilog
Preface
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This manual contains the inform$tion necessary to install,
operate, and maintain Zilog's System 8000 Model 21, Model 31
microcomputer. This manual addresses field engineers (FE),
service technicians, and all others who require knowledge of
the hardware aspects of the system.
This manual and the related manuals listed below provide the
technical documentation of the System 8000.
Title
ZEUS System Administrator Manual
ZEUS Utilities Manual
ZEUS Reference Manual
CPU Hardware Reference Manual
Zilog Number
03-3246
03-3196
03-3195
03-3200
System 8000 is a registered trademark of Zilog, Inc.
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Table of Contents
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SECTION 1 OVERVIEW............ . . . . . . . . . . . . . . . . . . . . . . . . 1 -1
1.1. System Description 1-1
1.2. Functional Relationships 1-2
1.2.1. CPU Board (CPU) 1-2
1.2.2. Winchester Disk Controller (WDC) 1-3
1.2.3. Storage Module Device Controller (SMDC) .. 1-4
1.2.4. Tape Cartridge Controller (TCC) 1-4
1.2.5. Memory Subsystem 1-4
1. 2. 6. Sec0n dar ySe ria 1 Bo ar ds (SSB) 1- 12
1.3. System Expansion .....•........................ 1-12
SECTION 2 SYSTEM SPECIFICATIONS 2-1
2.1. Introductiorl 2-1
2.2. Electrical Specifications ................•.... 2-1
2.3. Performance Specifications 2-1
2.4. Modules .... '. '. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.4.1. I/O Connectors 2-8
2.5. Backplane (ZBI) Pin Assignments : 2-11
SECTION 3
INSTALLATION
3-1
3.1. Introductiofl ........•...••••.•................. 3-1
3.2. Unpacking, Inspection, Reship~ent Procedures .. 3-1
3.2.1. Shipping Container .....•.......•........• 3-1
3.2.2. Unpacking and Inspection Procedures 3-1
3.2.3. Internal Inspection 3-2
3.2.4. Reshipment Procedures ...............•.... 3-6
3.3. Installation Procedures ....•......•........... 3-7
3.3.1. Site preparation .............•........... 3-7
3.3.2. System Interconnection ....•.............• 3-8
3.4. 32 MB Winchester Disk Drive Configurations 3-14
3.4.1. Drive Cabling 3-14
3.4.2. Drive Configuration Procedures .....•..... 3-15
3.4.3. Initial Checkout and Startup Procedure 3-17
3.5. SMD Winchester Drive Configuration 3-18
3.5.1. SMD Disk Addressing ...••....•.•..••....•. 3-18
3.5.2. SMD Disk Status Indicators •.....••.•..... 3-21
3.5.3. SMD Configuration ......•....•............ 3-23
3.5.4. SMD Cabling ....................••.......• 3-25
3.5.5. Head Lock Actuator ...•.•...... ; .........• 3-26
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3. 5.6. Cable Termination ' 3-27
3.6. Line Printer Installation Procedures 3-28
3.7. System power-Up Diagnostics (SPUD) 3-30
3.8. System Expansion ". 3-35
3.8.1. Installing Additional Terminal Ports 3-35
3.8.2. Adding A Disk Module 3-37
3.8.3. Adding SMD Disk Module #1 to Model 31 3-40
3.8.4. 1Mbyte Memory Array Board
Segment Setting 3-42
SECTION 11 THEORY OF OPERATION 4-1
4 • 1. Ge n era 1 ".... 4-1
L~.2. System Bus.................................... 4-1
4.3. Bus Conventions 4-1
L~ • 4. Bu s Signa1s 4- 2
4.5. Bus Modules oJ............................. 4-9
4.5.1. CPU Module 4-9
4.5.2. Winchester Disk Controller 4-16
4.5.3. Storage Module Device Controller 4-26
4.5.4. Cartridge Tape Controller 4-43
4.5.5. Tape Controller Operation 4-54
4.5.6. Memory Subsystem Controller 4-57
4 • 6. Sy stem Reset It •• , •• 4- 58
4.7. Non-Maskable Interrupts (NMI) 4-58
4 •7 . 1. Ma nua1 NM I4- 62
4. 7 . 2. Po we r- Fa iI NM I .........•............. :..... 4- 62
4.7.3. ECC Memory Error NMI 4-63
4.7.4. 'NMI Identifier 4-63
4~8·. Vectored Inter~upts i. 4-63
4.9. Memory Management Unit (MMU) ....•............. 4-66
4.9.1. MMU Operation (Non-Segmented) 4-66
4.9.2. MMU Operation (Segmented) 4-67
4.9.3. MMU Configurations ....•.............•.•.. 4-67
4.9.4. Break Registers ....................•..... 4-68
4 •9• 5. S ys t em Acce sst 0UserSpace 4- 69
4.9.6. System Segments and Protection 4-70
Sl':C~ION 5 MAINTENANCE................................ 5-1
.. '5.1. Introduction 5-1
5.2. Preventive Maintenance ; 5-1
5 . 3. Ta pe Dr i ve Per i0di c Ma in ten ance ...............' 5- 1
5.3~1. Magnetic Head Cleaning .•...... ~ 5-1
5.3.2. Tape Cleaner Cleaning ......•... ~ ....•.... 5-2
5.3.3. Motor Capstan Cleaning ...•...•.•......... 5-2
5.3.4. Heat Sink, Circuit Board,
Sensor Hole Cleaning ..........••..•......•...... 5-4
5.4. Disk Drive Assembly Cleaning.................. 5-4
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5.5. Disk Drive Mounting .
5 . 6. Dr i ve Ca b1in, g •••••••••••••••••••••••••••••••••
5.7. Disk Power ON Procedure .
5.8. Power Supply Voltages .....•...................
5. 8 . 1. AC In put Vol tag e Ch eck ...........•........
5.8.2. CPU Module' DC Voltage Test .
5.8.3. Disk/Tape Module DC Voltage Test .
5.8.4. Disk/Tape Module (Module 31)
DC Vol tage Test ...........• .- •....................
5.9. System 8000 Monitor , ..........•
5.9.1. Monitor Program Debug Environment .
5 . 9 . 2. Mo nit 0r pr 0gram ..........................•
5.9.3. Monitor Mode Commands .
5.9.4. Download Mode Commands .....•.............
5.9.5. System Parameters ........•...............
5.10. Monitor I/O Procedures .
5.10.1. I/O Pr'ocedures .
5.11. SADIE .. It •••••••••••• ·., ••••••••••••••••••••••••
5. 11. 1. Pu rpo se0f SAD IE .
5.11.2. Organization and principles
of Operation ..•...................................
5.12. SADIE Tape Organization .
5.13. SADIE Program Initialization .
5.14. SADIE Diagnostic Functions .
5.14.1. Console Interactions ••..... 0 •••••••••••••
5.14.2. START and RESET Interactions .
5.15. Command Level Test Functions .
5.15.1. Command Level T:
Choose and run a single TEST . .... A ••••••••••••••
5.15.2. Command Level R:
REPEAT previously loaded test ...•......•.•.... :.' ...
5.15.3. Command Level'L:
Run current tE~st LIST ......••.....•.............
5.15.4. Command Level C:
CHOOSE and run a test list •...•.......••..........
5~15.5. Command Level E:
ED ITt est 1is t~ • -. • '.' • • • • e, • • • • • -. • • .' • ':' '. ~. ~ .• '. • • +' -. ._ i: .•.' •
5.15.6. Command Level D:
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5-9
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5-10
5-11
5-13
5-14
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5-16.
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5-34
5-38
5-41
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5-45
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5-46
5-47
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5-50
5-51
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5-55
5-55
5-56
5-57
DISPLAY error log .••...•.....•.......•....•..... 5-61
5.15.7. Command Level A:
Cum ul at i veer r~or log ........•.•.... ~ ". , .. ',~ '. ; .... " ... '~ .. ~.. S~:6·l'·.
5.15.8. Command Level M:
Do Ta pe Ma in ten ance ..•..........•.... ,:. .. . . •. . . . . . "5- 62
5.15.9. Command Level Q:QUIT ..... ~ •.. ~! ••••••••• 5-62
5.16. SADIE Test Line. and Control statem~nts ,. 5-62
5.16.1. SADIE Test List ...••.•...... 'i '., .. e •••••• ,.~ 5-62
5.16.2. Control Statements •.... ~.~ ... ~ .. ~ ..•• ~ .. 5-62
5.17. Using SAD+~ •••••••••• ,_ •••••• '" •••••••••••• ~. '"' 5-64
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