ADLINK Technology MI-110 User manual

Advance Technologies; Automate the World.
Manual Rev.: 2.00
Revision Date: October 2, 2009
Part No: 50-1Z012-1000
MI-110
Mini-ITX Embedded Motherboard with Intel® Atom™
Processor N270 and Intel® 945GSE/ICH7M Chipset
User’s Manual

Revision History
Revision Release Date Description of Change(s)
2.00 2009/10/02 Initial Release

Preface iii
MI-110
Preface
Copyright 2009 ADLINK Technology Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the Euro-
pean Union's Restriction of Hazardous Substances (RoHS) direc-
tive and Waste Electrical and Electronic Equipment (WEEE)
directive. Environmental protection is a top priority for ADLINK.
We have enforced measures to ensure that our products, manu-
facturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their
end of life, our customers are encouraged to dispose of them in
accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.

iv Preface
Using this Manual
Audience and Scope
The MI-110 User’s Manual is intended for hardware technicians
and systems operators with knowledge of installing, configuring
and operating industrial grade computers.
Manual Organization
This manual is organized as follows:
Preface: Presents copyright notifications, disclaimers, trade-
marks, and associated information on the proper usage of this
document and its associated product(s).
Chapter 1, Introduction: Introduces the MI-110, its features,
applications, and specifications, including functional descriptions
and board layout.
Chapter 2, Connectors & Jumpers: Provides technical informa-
tion on connectors, jumpers and pin assignments for configuring
the MI-110.
Chapter 3, Getting Started: Describes how to install components
and drivers on the MI-110.
Chapter 4, BIOS Setup: Presents information and illustrations to
help understand and configure the system BIOS.
Appendix A, Watchdog Timer: Presents information on under-
standing and configuring the watchdog timer.
Appendix B, System Resources: Presents information on I/O
mapping, IRQ routing, and resource allocation.
Important Safety Instructions: Presents safety instructions all
users must follow for the proper setup, installation and usage of
equipment and/or software.
Getting Service: Contact information for ADLINK’s worldwide
offices.

Preface v
MI-110
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.

vi Preface
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Table of Contents vii
MI-110
Table of Contents
Revision History...................................................................... ii
Preface.................................................................................... iii
Table of Contents.................................................................. vii
List of Figures........................................................................ ix
List of Tables.......................................................................... xi
1 Introduction ........................................................................ 1
1.1 Package Contents ............................................................... 1
1.2 Overview.............................................................................. 2
1.3 Features............................................................................... 2
1.4 Specifications....................................................................... 3
1.5 Block Diagram ..................................................................... 5
1.6 Functional Description ......................................................... 6
1.7 Power Consumption ............................................................ 9
1.8 Board Layout ..................................................................... 10
1.9 Mechanical Dimensions..................................................... 12
2 Connectors & Jumpers.................................................... 15
2.1 Rear I/O Connectors.......................................................... 15
2.2 Onboard Connectors ......................................................... 19
2.3 Jumper Settings................................................................. 27
3 Getting Started ................................................................. 31
3.1 System Memory................................................................. 31
3.2 Driver Installation............................................................... 32
4 BIOS Setup........................................................................ 33
4.1 Starting the BIOS............................................................... 33

viii Table of Contents
4.2 Standard CMOS Features ................................................. 35
4.3 Advanced BIOS Features.................................................. 37
4.4 Advanced Chipset Features............................................... 42
4.5 Integrated Peripherals........................................................ 44
4.6 Power Management Setup ................................................ 51
4.7 PnP/PCI Configurations..................................................... 54
4.8 PC Health Status ............................................................... 56
4.9 Frequency/Voltage Control................................................ 57
4.10 Load Optimized Defaults.................................................... 58
4.11 Set Supervisor & User Password....................................... 59
4.12 Save & Exit Setup.............................................................. 60
4.13 Exit Without Saving............................................................ 61
A Appendix: Watchdog Timer..............................................63
A.1 WDT Programming Instructions......................................... 63
B Appendix: System Resources..........................................65
B.1 System Memory Map......................................................... 65
B.2 Direct Memory Access Channels....................................... 66
B.3 Fixed I/O Map .................................................................... 67
B.4 Variable I/O Map................................................................ 68
B.5 Interrupt Request (IRQ) Lines............................................ 69
B.6 PCI Configuration Space Map ........................................... 71
B.7 PCI Interrupt Routing Map................................................. 72
Important Safety Instructions............................................... 73
Getting Service...................................................................... 75

List of Figures ix
MI-110
List of Figures
Figure 1-1: MI-110 Block Diagram.....................................................5
Figure 1-2: MI-110 Board Layout.....................................................10
Figure 1-3: MI-110 Rear I/O Layout.................................................11
Figure 1-4: MI-110 Board Dimensions.............................................12
Figure 1-5: Rear I/O Faceplate Dimensions.....................................13

xListofFigures
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List of Tables xi
MI-110
List of Tables
Table 1-1: MI-110 General Specifications.........................................4
Table 1-2: Intel® Atom™ N270 processor Power Consumption ......9
Table 1-3: MI-110 Board Layout Legend........................................11
Table B-1: System Memory Map.....................................................65
Table B-2: Direct Memory Access Channels...................................66
Table B-3: Fixed I/O Map................................................................67
Table B-4: Variable I/O Map............................................................68
Table B-5: IRQ Lines PIC Mode......................................................69
Table B-6: IRQ Lines APIC Mode ...................................................70
Table B-7: PCI Configuration Space Map.......................................71
Table B-8: PCI Interrupt Routing Map.............................................72

xii List of Tables
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Introduction 1
MI-110
1 Introduction
This chapter will introduce the MI-110, its features, specifications,
functional description, and mechanical layout.
1.1 Package Contents
Please check that your package contains the items below. If
you discover damaged or missing items, please contact your
vendor.
XMI-110 Mini-ITX Embedded Motherboard
XI/O shield
X1x IDE cable
X2x SATA cable
X2x SATA power cable
X2x COM port cable with bracket
XDriver CD
XUser’s Manual
WARNING:
DO NOT install or apply power to equipment that is damaged
or if there is missing/incomplete equipment. Retain the ship-
ping carton and packing materials for inspection. Please con-
tact your ADLINK dealer/vendor immediately for assistance.
Obtain authorization from your dealer before returning any
product to ADLINK.

2Introduction
1.2 Overview
The ADLINK MI-110 is a Mini-ITX embedded motherboard based
on the Intel® Atom™ processor N270 built on 45-nm process
technology in Micro-FCBGA8 package and the Mobile Intel®
945GSE + ICH7M Express Chipset. The MI-110 is ideal for
embedded applications requiring fanless operation and ultra-low
power consumption in a standard small form factor motherboard
with a complete set of I/O functions and high-bandwidth network
connectivity. These features, combined with an SO-DIMM socket
supporting DDR2-533 SDRAM up to 2 GB, IDE/SATA/CF storage
interfaces, PCI and Mini PCIe expansion slots, VGA, DVI-I, dual-
channel 18-bit LVDS, and audio interfaces make the MI-110 suit-
able for medical, transportation, and other applications requiring a
low noise/power, space-saving, multiple display platform.
1.3 Features
XMini-ITX form factor (170 mm x 170 mm)
XIntel® Atom™ processor N270:
Z1.6 GHz core frequency
Z533MHz FSB
Z512KB L2 cache
ZMicro-FCBGA8 package
XDDR2-533 up to 2GB max. (1x 200-pin SODIMM socket)
XIntel® GMA950 integrated in 945GSE supporting dual indepen-
dent display
ZDsub-15 connector up to 2048x1536 @ 75Hz (QXGA)
ZDVI-I via Chrontel 7307C, up to 1600x1200 (UXGA)
ZDual-channel 18-bit LVDS up to 1600x1200 (UXGA)
XPCI and Mini PCIe expansion slots
X2x SATA ports 1.5Gb/s, 4x RS-232 serial ports
X2x GbE, 6x USB 2.0 (4 ext., 2 int.)
X2x Mini-DIN for PS/2 keyboard/mouse
XRoHS compliant

Introduction 3
MI-110
1.4 Specifications
System
CPU Intel® Atom™ processor N270
• 1.6 GHz core frequency
• 512KB L2 cache
• Micro-FCBGA8 package
FSB • 533 MHz
Chipset • Mobile Intel® 945GSE + ICH7M Express Chipset
Memory • DDR2 533 SDRAM (2GB max.)
• 1x 200-pin SO-DIMM slot
BIOS • Award BIOS with 16 Mb Flash ROM
TPM • TPM 1.2 via Infineon SLB 9635 TT 1.2
Audio • Realtek ALC888 HD Audio
• Line-in, line-out and mic-in
Watchdog Timer • 1-255 second/minute programmable
Hardware Monitor • CPU/System temperature, fan speed and onboard DC
voltage
Operating System • Microsoft® Windows® XP/Vista
I/O Interfaces
Serial ATA • 2x Serial ATA ports with 1.5 Gb/s data transfer
Parallel ATA • 1x 40-pin ATA-66/100 IDE port
CompactFlash • 1x Type-II CF socket, shared with IDE port
Onboard I/O • 6x USB 2.0 (4x external, 2x by pin header)
• 4x RS-232 serial ports (2x external, 2x by pin header)
Rear I/O • 2x RJ-45 LAN ports
• 4x USB 2.0 ports
• 2x RS-232 serial ports
• 1x D-Sub VGA connector
• 1x DVI-I connector
• 2x PS2 keyboard/mouse ports
• 3x audio jacks (line-in, line-out and mic-in)
Expansion Slots • 1x Mini PCIe slot
• 1x PCI slot

4Introduction
Table 1-1: MI-110 General Specifications
Display
Graphics
Processor • Intel® GMA950 integrated in 945GSE supporting dual independent display
VRAM • Shared system memory up to 224 MB
CRT • Dsub-15 connector up to 2048x1536 @ 75Hz (QXGA)
DVI • DVI-I via Chrontel 7307C, up to 1600x1200 (UXGA)
LVDS • Dual-channel 18-bit LVDS up to 1600x1200 (UXGA)
Ethernet
Controller • Realtek 8111C GbE controller
Ports • 2x RJ-45 Ethernet port
Mechanical and Environment
Form Factor • Mini-ITX Embedded Motherboard
Dimensions • 170 mm x 170 mm (L x W)
Operating Temp. • 0°C to 60°C
Storage Temp. • -40ºC to 80ºC
Rel. Humidity • 10 - 90% RH
Safety • CE, FCC Class A

Introduction 5
MI-110
1.5 Block Diagram
Figure 1-1: MI-110 Block Diagram
Southbridge
Intel®ICH7M
CPU
Intel®Atom™
N270
1.6GHz 533 MHz FSB
512K L2 Cache
437-pin Micro-FCBGA8
Northbridge
Intel®945GSE GMCH
DMI
Interface
2 GB/s
LPC
USB 2.0
SPI BIOS
KB/Mouse
RS-232x4
CRT
DB-15
Winbond
W83627DHG-A
LPC Super I/O
USB 2.0
(Bracket x4, Internal x2)
533 MHz FSB
DDRII 533MHz
PCIe x1
PCIe
Controller
PCIex1
PCI Bus PCI 32-bit/
33MHz bus
SATA
SATA ports x2
IDE / CF
SO-DIMM up to 2GB
Realtek ALC888
Audio Codec
AC97
Hardware
Monitor
PCI
Controller
RTL8111C
RJ-45
SPI
Dual Channel
18-bit LVDS
DVI Chrontel 7307C
DVI Transmitter
PCIe x1 PCIe Mini slot
IDE
Audio Jacks
Line-in, Line-out, Mic-in
RTL8111C
RJ-45
KB/Mouse

6Introduction
1.6 Functional Description
Processor Support
The MI-110 embedded motherboard is equpped with the Intel®
Atom™ N270 processor in Micro-FCBGA8 package. Implemented
in 45nm process technology, the Intel® Atom™ N270 is power-
optimized to deliver robust performance per watt for cost-effective
embedded applications. Features include:
X1.6 GHz core speed with 533 MHz FSB and 2.5 watts TDP
XHyper-Threading Technology
XEnhanced Intel SpeedStep® Technology
XEnhanced low-power sleep states (C1E, C2E, C4E)
XDynamic L2 cache sizing
Mobile Intel® 945GSE Express Chipset
The MI-110 is based on the Mobile Intel® 945GSE Express
Chipset, consisting of the Intel® 82945GSE Graphics Memory
Controller Hub and Intel® I/O Controller Hub 7-M. The chipset fea-
tures power-efficient graphics with an integrated 32-bit 3D graph-
ics engine based on Intel® Graphics Media Accelerator 950
architecture with SDVO, LVDS, and CRT display ports. It provides
rich I/O capabilities and flexibility via high-bandwidth interfaces
such as PCI Express, PCI, Serial ATA, and Hi-Speed USB 2.0
connectivity. It also includes a single channel for 400/533 MHz
DDR2 system memory, and Intel® High Definition Audio interface.
DDR2 memory
To meet the requirements of memory-intensive applications, the
MI-110 has a single-channel memory architecture supporting a
DDR2 400/533 MHz SO-DIMM. The high-bandwidth memory
specification, meets the requirements of the latest 3D graphics,
multimedia, and network application, and boosts system perfor-
mance by eliminating bottlenecks.

Introduction 7
MI-110
Intel® Graphics Media Accelerator GMA 950
The Intel® Graphics Media Accelerator (GMA) 950 provides an
integrated 3D graphics engine delivering sophisticated graphics
for large display applications. With support for DirectX 9 hardware
acceleration, 400 MHz display clock, and up to 224 MB of video
memory, the Intel GMA 950 provides a cost-effective and high-per-
formance graphics solution. The MI-110 supports dual indepen-
dent display technology, enabling different content to be displayed
on two separate display terminals or a single workspace to be
stretched across two display devices.
Gigabit Ethernet
The MI-110 is equipped with the PCI Express Realtek 8111C GbE
controller.
Serial ATA
Storage is efficient and secure with the Serial ATA interface. Utiliz-
ing the Intel® ICH7M, the MI-110 supports two Serial ATA devices
capable of reading/writing data at up to 1.5 Gb/s. The SATA speci-
fication improves chassis airflow via thinner and more flexible
cables with lower pin count.
USB 2.0
The MI-110 incorporates the Universal Serial Bus (USB) 2.0 spec-
ification that increases peripheral connection speed from 12 Mbps
(USB 1.1) to 480 Mbps. USB 2.0 is backward compatible with
USB 1.1.
Hardware Monitoring
A built-in, proactive hardware monitoring system monitors the
CPU temperature, system fan speeds, and voltage levels to pre-
vent overheating and/or component damage, effect timely failure
detection, and ensure stable supply of current for critical mother-
board components.

8Introduction
Watchdog Timer
The watchdog timer (WDT) monitors system operations based on
user-defined configurations. The WDT can be programmed for dif-
ferent time-out periods, such as from 1 to 255 seconds or from 1 to
255 minutes. The WDT generates a reset signal, then a reset
request, after failure to strobe it within the programmed time
period. A register bit may be enabled to indicate if the watchdog
timer caused the reset event. The WDT register is cleared during
the power-on sequence to enable the operating system to take
appropriate action when the watchdog generates a reboot.