ADLINK Technology CoreModule 745 User manual

CoreModule®745
Single Board Computer
Reference Manual
P/N 50-1Z054-1020

Notice Page
DISCLAIMER
ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of
this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
ADLINK at the address shown at the bottom of this page.
Audience
This manual provides reference only for computer design engineers, including but not limited to hardware
and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to
design and implement prototype computer equipment.
ii Reference Manual CoreModule 745
TRADEMARKS
CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,
MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel,
ReadySystem, and RuffSystem are trademarks of ADLINK Technology, Inc. All other marks are the
property of their respective companies.
REVISION HISTORY
ADLINK Technology, Incorporated
5215 Hellyer Avenue, #110
San Jose, CA 95138-1007
Tel. [phone]
Fax [phone]
www.adlinktech.com
© Copyright 2010, 2011, 2012, 2013 ADLINK Technology, Incorporated
Revision Reason for Change Date
1000 Initial Release Nov/10
1010 Replaced N450, D410, and D510 CPUs with N455 and D525; added
JP3 and JP4 to Table 2-3 and removed JP1 (CMOS reset); changed
J10 to J19 in Table 3-10 caption; revised Table 3-9 caption to J10;
revised voltage of battery in Table 3-17 from 5V to 3.3V; changed
width in Table 2-4 from 3.76" to 3.8"; added heatsink dwg and table;
changed pitch in Table 3-15 to 0.079"; revised Ethernet Interface
description on page 27; added Gb Ethernet controller to table
Table 3-14; revised Appendix A address information
Mar/12
1020 Added airflow diagrams to “Thermal/Cooling Requirements” on
page 16; added details to descriptions of Copper and Aluminum
heatsink qualifications in Table 2-7; changed Serial Console to
Remote Access in Chapter 3; changed voltage of battery header to
+3.0; updated contact addresses in Appendix A
Oct/13

CoreModule 745 Reference Manual iii
Contents
Chapter 1 About This Manual ....................................................................................................1
Purpose of this Manual ....................................................................................................................1
References ......................................................................................................................................1
Chapter 2 Product Overview......................................................................................................3
PC/104 Architecture ........................................................................................................................3
Product Description..........................................................................................................................4
Module Features ........................................................................................................................5
Block Diagram ............................................................................................................................7
Major Component (ICs) Definitions..................................................................................................8
Header, Connector, and Socket Definitions...................................................................................10
Jumper Header Definitions ............................................................................................................13
Specifications.................................................................................................................................14
Physical Specifications .............................................................................................................14
Mechanical Specifications ........................................................................................................15
Power Specifications ................................................................................................................16
Environmental Specifications....................................................................................................16
Thermal/Cooling Requirements ................................................................................................16
Chapter 3 Hardware .................................................................................................................19
Overview ........................................................................................................................................19
CPU ...............................................................................................................................................20
Graphics.........................................................................................................................................20
Memory .........................................................................................................................................20
Interrupt Channel Assignments .....................................................................................................21
Memory Map .................................................................................................................................21
I/O Address Map ...........................................................................................................................22
Serial Interfaces .............................................................................................................................23
USB Interface.................................................................................................................................25
Keyboard/Mouse Interface.............................................................................................................26
Ethernet Interface .........................................................................................................................27
Video (VGA/LVDS) Interface ........................................................................................................28
Power Interface .............................................................................................................................29
User GPIO Interface ......................................................................................................................30
Utility Interface ...............................................................................................................................30
Power Button ............................................................................................................................30
Reset Switch.............................................................................................................................30
Speaker ....................................................................................................................................30
System Management Bus (SMBus)...............................................................................................31
System Fan....................................................................................................................................31
Battery............................................................................................................................................32
Ethernet External LED ...................................................................................................................32
Miscellaneous ................................................................................................................................32
SSD (Solid State Drive) ............................................................................................................32
Real Time Clock (RTC) ............................................................................................................32
Oops! Jumper (BIOS Recovery) ...............................................................................................33
Remote Access ........................................................................................................................33
Remote Access Setup .........................................................................................................33
Hot (Serial) Cable ...............................................................................................................33

Contents
iv Reference Manual CoreModule 745
Watchdog Timer....................................................................................................................... 34
Chapter 4 BIOS Setup .............................................................................................................. 35
Introduction.................................................................................................................................... 35
Entering BIOS Setup (Local Video Display)............................................................................. 35
Entering BIOS Setup (Remote Access) ................................................................................... 35
PCI-ISA Bridge Mapping ............................................................................................................... 36
OEM Logo Utility .......................................................................................................................... 36
Logo Image Requirements....................................................................................................... 36
BIOS Setup Menus........................................................................................................................ 37
BIOS Main Setup Screen ......................................................................................................... 37
BIOS Advanced Setup Screen................................................................................................. 38
BIOS Power Management Setup Screen................................................................................. 41
BIOS Boot Setup Screen ......................................................................................................... 42
BIOS Security Setup Screen .................................................................................................... 43
BIOS Exit Setup Screen........................................................................................................... 44
Appendix A Technical Support .................................................................................................. 45
Index .................................................................................................................................................. 49
List of Figures
Figure 2-1. Stacking PC/104-Plus Modules with the CoreModule 745 ...................................... 4
Figure 2-2. Functional Block Diagram ....................................................................................... 7
Figure 2-3. Component Locations (Top Side)............................................................................ 9
Figure 2-4. Component Locations (Bottom Side) .................................................................... 10
Figure 2-5. Connector Pin Sequences..................................................................................... 11
Figure 2-6. Header, Connector, and Socket Locations (Top Side).......................................... 12
Figure 2-7. Jumper Header Locations (Top Side) ................................................................... 13
Figure 2-8. Mechanical Overview (Top Side) .......................................................................... 15
Figure 2-9. Stack Height of Cooling Assembly ....................................................................... 17
Figure 2-10. Airflow Requirements ............................................................................................ 18
Figure 3-1. RS485 Serial Port Implementation ........................................................................ 23
Figure 3-2. Oops! Jumper Serial Port (DB9)............................................................................ 33
Figure 3-3. Remote Access Jumper ........................................................................................ 33
Figure 4-1. BIOS Main Setup Screen ...................................................................................... 37
Figure 4-2. BIOS Advanced Setup Screen .............................................................................. 38
Figure 4-3. Power Management Setup Screen ....................................................................... 41
Figure 4-4. BIOS Boot Setup Screen....................................................................................... 42
Figure 4-5. BIOS Security Setup Screen ................................................................................. 43
Figure 4-6. BIOS Exit Setup Screen ........................................................................................ 44
List of Tables
Table 2-1. Major Component Descriptions and Functions ....................................................... 8
Table 2-2. Module Header, Connector, and Socket Descriptions .......................................... 10
Table 2-3. Jumper Settings .................................................................................................... 13
Table 2-4. Weight and Footprint Dimensions ......................................................................... 14
Table 2-5. Power Supply Requirements ................................................................................. 16
Table 2-6. Environmental Requirements ................................................................................ 16
Table 2-7. ADLINK Optional Cooling Solutions ...................................................................... 17
Table 3-1. Interrupt Channel Assignments ............................................................................. 21
Table 3-2. Memory Map ......................................................................................................... 21

Contents
CoreModule 745 Reference Manual v
Table 3-3. I/O Address Map ....................................................................................................22
Table 3-4. Serial Ports 1 & 2 Interface Pin Signal Descriptions (J3 and J4) ...........................24
Table 3-5. Serial Port 3 Interface Pin Signal Descriptions (J5) ...............................................25
Table 3-6. USB0 and USB1 Interface Pin Signals (J16) .........................................................25
Table 3-7. USB2 and USB3 Interface Pin Signals (J17) .........................................................26
Table 3-8. Keyboard/Mouse Interface Pin/Signal Definitions (J15).........................................26
Table 3-9. Ethernet Interface Pin Signal Descriptions (J10) ...................................................27
Table 3-10. Video Interface Pin Signals (J19)...........................................................................28
Table 3-11. Power Interface Pin Signals (J7)............................................................................29
Table 3-12. User GPIO Interface Pin Signal Descriptions (J18) ...............................................30
Table 3-13. Utility Interface Pin Signals (J23) ...........................................................................31
Table 3-14. SMBus Reserved Addresses .................................................................................31
Table 3-15. SMBus Pin Signals (J20) .......................................................................................31
Table 3-16. Optional System Fan Pin Signals (J22) ................................................................31
Table 3-17. External Battery Input Header (J6) .......................................................................32
Table 3-18. Ethernet External LED Pin Signals (J11) ...............................................................32
Table 4-1. BIOS Setup Menus ................................................................................................37
Table A-1. Technical Support Contact Information..................................................................45

Contents
vi Reference Manual CoreModule 745

CoreModule 745 Reference Manual 1
Chapter 1 About This Manual
Purpose of this Manual
This manual is for designers of systems based on the CoreModule®745 Single Board Computer (SBC). This
manual contains information that permits designers to create an embedded system based on specific design
requirements.
Information provided in this reference manual includes:
•Product Overview
•Hardware Specifications
•BIOS Setup information
•Technical Support Contact Information
Information not provided in this reference manual includes:
•Detailed chip specifications
•Internal component operation
•Internal registers or signal operations
•Bus or signal timing for industry standard busses and signals
•Pinout definitions for industry standard interfaces
References
The following list of references may help you successfully complete your custom design.
Specifications
•PC/104 Specification, Revision 2.5, November, 2003
•PC/104-Plus Specification, Revision 2.0, November, 2003
For latest revision of the PC/104 specifications, contact the PC/104 Consortium, at:
Web site: http://www.pc104.org
•PCI 2.3 Compliant Specifications, Revision 2.3, March 29, 2002
For latest revision of the PCI specifications, contact the PCI Special Interest Group at:
Web site: http://www.pcisig.com
•AMI BIOS Core 8 User’s Guide
Web site: http://www.ami.com/support/doc/MAN-EZP-80.pdf
Chip Specifications
The following integrated circuits (ICs) are used in the CoreModule 745 single board computer:
•IntelCorporation and the Atom™ N400 and D500 series processors
Web site: http://www.intel.com/p/en_US/embedded/hwsw/hardware/atom-400-500/hardware
•Intel Corporation and the ICH8-M chip, used for the I/O Hub (Southbridge)
Data sheet: http://www.intel.com/assets/pdf/datasheet/313056.pdf
•SMSC and the Super I/O SCH3112I-NU chip used for the Super I/O controller
Data sheet: http://www.smsc.com/media/Downloads_Public/Data_Briefs/311xdb.pdf

Chapter 1 About This Manual
2 Reference Manual CoreModule 745
•Intel Corporation and the 82574IT chip used for the Gigabit Ethernet controller
Datasheet: http://download.intel.com/design/network/datashts/82574.pdf
•Linear Technology and the LTC1334CG, RS-232/422/485 Serial Port transceiver
Web site: http://www.linear.com/products/rs485%7C422_transceivers
•Analog devices and the ADM213EARSZ, RS-232 Serial Port transceiver
Web site: http://www.analog.com/en/interface/rs-232/adm213e/products/product.html
•Greenliant and the GLS85LP1004P Solid State Drive (SSD)
Web site: http://www.greenliant.com/products/?inode=46780
•Integrated Technology Express, Inc. and the PCI-to-ISA bridge, IT8888G-L
Web site: http://www.iteusa.com or http://www.ite.com.tw
NOTE If you are unable to locate the datasheets using the links provided, go to the
manufacturer’s web site where you can perform a search using the chip datasheet
number or name listed.

CoreModule 745 Reference Manual 3
Chapter 2 Product Overview
This introduction presents general information about the PC/104 architecture and the CoreModule 745
Single Board Computer (SBC). After reading this chapter you should understand:
•PC/104 architecture
•Product description
•CoreModule 745 features
•Major components (ICs)
•Headers and Connectors
•Specifications
PC/104 Architecture
The PC/104 architecture affords a great deal of flexibility in system design. You can build a simple system
using only a CoreModule 745 SBC, input/output devices connected to the serial, USB, or SATA ports, and
the on-board Solid State Disk storage device. To expand a simple CoreModule system, simply add self-
stacking PC/104 and PC/104-Plus expansion boards to provide additional capabilities, such as:
•Additional serial and parallel ports
•Analog or high-speed digital I/O
 Data Acquisition (Analog In/Out)
 USB 2.0 expansion modules
 IEEE 1394 (FireWire) expansion modules
 Standard VGA video output
PC/104 or PC/104-Plus expansion modules can be stacked with the CoreModule 745 avoiding the need for
large, expensive card cages and backplanes. The PC/104-Plus expansion modules can be mounted directly to
the PC/104 and PC/104-Plus connectors of the CoreModule 745. PC/104-compliant modules can be stacked
with an inter-board spacing of ~0.6 inches, so that a 3-module system fits in a 3.6" x 3.8" x 2.4" space. See
Figure 2-1.
One or more MiniModule products or other PC/104 modules can be installed on the CoreModule expansion
connectors, so that the expansion modules fit within the CoreModule outline dimensions. Most MiniModule
products have stackthrough connectors compatible with the PC/104-Plus Version 2.0 specification. Several
modules can be stacked on the CoreModule headers. Each additional module increases the thickness of the
package by ~17mm (0.66"). See Figure 2-1.

Chapter 2 Product Overview
4 Reference Manual CoreModule 745
Figure 2-1. Stacking PC/104-Plus Modules with the CoreModule 745
Product Description
The CoreModule 745 SBC is an exceptionally high integration, high performance, IntelAtom™ N455 or
D525 processor based system, compatible with the PC/104 standard. This rugged and high quality single-
board system contains all the component subsystems of an ATX motherboard plus the equivalent of several
PCI expansion boards.
The Intel Atom N400 and D500 series CPUs integrate processor cores with Graphics and Memory Hubs
(GMHs), providing low-power, high-performance processors, memory controllers for up to 2GB DDR3
memory, and graphics controllers which provide LVDS and VGA signals for most LCD video panels and
CRT monitors.
The ICH8-M chipset provides controllers for the I/O Hub (Southbridge) featuring four USB ports, two
SATA ports, one Ultra DMA 33/66/100 IDE port supporting two IDE devices, one SMBus port, one SPI
port, one GPIO port, one PCIe bus for Gigabit Ethernet, and one PCI bus for PC/104 and PC/104-plus
devices. The CoreModule 745 provides legacy interfaces through the SMSC SCH3112I-NU Super I/O
featuring three serial ports and a PS/2 keyboard and mouse port.
The CoreModule 745 can be expanded through the PCI expansion bus using the PC/104 and PC/104-Plus
connectors for additional system functions. This bus offers compact, self-stacking, modular expandability.
The PC/104 bus is an embedded system version of the signal set provided on a desktop PC’s ISA bus. The
PC/104-Plus bus includes this signal set plus additional signals implementing a PCI bus, available on a
120-pin (4 rows of 30 pins) PCI expansion bus connector. This PCI bus operates at a clock speed of 33MHz.
The CoreModule 745 is particularly well suited to either embedded or portable applications and meets the
size, power consumption, temperature range, quality, and reliability demands of embedded system
applications. It can be stacked with ADLINK MiniModules™ or other PC/104-compliant expansion
modules, or it can be used as a powerful computing engine. The CoreModule 745 requires a single +5V AT
power source.
CM745stackthru
Nuts (4)
or Chassis Standoffs
ISABus
Stackthrough
Connectors
Expansion
0.6 inch Spacers (4)
PCI Stack
Connectors
through
Screws (4)
0.6 inch Spacers (4)
PC/104 Module
0.6 inch Spacers (4)
PCI Stack
Connectors
through
PC/104-Plus Module
CoreModule 745

Chapter 2 Product Overview
CoreModule 745 Reference Manual 5
Module Features
•CPU
 Provides an Intel Atom 1.67GHz N455 or 1.83GHz D525 processor core
 DMI (Direct Media Interface) with 1 GB/s of bandwidth in each direction
 Enhanced SpeedStep® technology
 On die 512-kB, 8-way L2 cache
•Memory
 Single standard 204-pin DDR3 SODIMM socket
 Supports +1.5V DDR3, 800MHz RAM up to 2GB
 Supports non-ECC, unbuffered memory
•Interface Buses
 PC/104 and PC/104-Plus Interfaces
 PC/104 bus speeds up to 8MHz (16-bit ISA Bus)
 PC/104-Plus bus speed at 33MHz (32-bit PCI Bus)
 PCI 2.2 compliant
•IDE Channel
 Supports one enhanced IDE controller
 Supports on-board Solid State Drive (SSD) with default 4GB capacity
•SATA
 Supports two SATA ports from the ICH8-M I/O Hub
 Provides two standard SATA connectors
•Serial Ports
 Provide three buffered serial ports with full handshaking
 Provide 16550-equivalent controllers, each with a built-in 16-byte FIFO buffer
 Support full modem capability
 Support RS-232 operation
 Support RS-232, RS-485, or RS-422 operation on two ports (COM1 and COM2)
 Support programmable word length, stop bits, and parity
 Support 16-bit programmable baud-rate generator and an interrupt generator
•USB Interface
 Provides two root USB hubs
 Provides up to four USB ports
 Supports USB boot devices
 Supports USB v2.0 EHCI and v1.1 UHCI
 Supports over-current detection status
•Keyboard/Mouse Interface
 Provides PS/2 keyboard interface
 Provides PS/2 mouse interface

Chapter 2 Product Overview
6 Reference Manual CoreModule 745
•Ethernet Interface
 Provides one fully independent Ethernet port
 Provides integrated LEDs (Link/Activity and Speed)
 Provides one Intel 82574IT controller chips
 Provides header for LAN LED signals (gigabit only)
 Supports IEEE 802.3 10/100BaseT and 10/100/1000BaseT compatible physical layers
 Supports Auto-negotiation for speed, duplex mode, and flow control
 Supports full duplex or half-duplex mode
• Full-duplex mode supports transmit and receive frames simultaneously
• Supports IEEE 802.3x Flow control in full duplex mode
• Half-duplex mode supports enhanced proprietary collision reduction mode
•Video Interfaces (VGA and LVDS)
 Provide VGA outputs (resolutions up to 1400x1050 @ 60Hz for the N455 CPU and 2048x1536 @
60Hz for the D525 CPU)
 Provide LVDS flat panel outputs (resolutions up to 1280x800 for the N455 CPU and 1366x768 for
the D525 CPU) [single channel, three differential signals]
•Utility Interface
 Power Button
 Reset Switch
 Speaker
•Miscellaneous
 Battery-less boot
 Oops! Jumper support
 Remote Access support
 Watchdog Timer
 Logo Screen (Splash)

Chapter 2 Product Overview
CoreModule 745 Reference Manual 7
Block Diagram
Figure 2-2 shows the functional components of the CoreModule 745.
Figure 2-2. Functional Block Diagram
CM745BlkDiag_b
PC/104
PCI to ISA
Connector
Bridge
IT8888G-L
CPU
Intel Atom 1.67GHz
N455 or 1.83GHz D525
(with integrated
Northbridge)
PC/104-Plus
Connector
I/O Hub
Intel
ICH8-M
(Southbridge)
PS/2
Keyboard/
Mouse
Header
Super I/O
SCH3112I-NU
DDR3
SODIMM
Video Header VGA
LVDS Memory Bus
ISA Bus
LPC Bus
COM2
Header
(RS-232/485/422)
COM1
Header
(RS-232/485/422)
RS-232
Transceiver
(COM1
and COM2)
RS-485/422
Transceiver
(COM1
and COM2)
PCI Bus
DMI
USB
Header
USB
Header
USB (2)
USB (2)
Serial 1
Serial 2
Serial 3
PS/2
SPI Flash
GPIO
Header
SATA
SATA
IDE
SMBus
SPI
GPIO
SMBus
Header
Utility Header
Solid State
Drive
SATA0
Connector
SATA1
Connector
RS-232
Transceiver
(COM3)
COM3
Header
(RS-232)
Magnetics
Gigabit Ethernet
Controller
82574IT
Gigabit Ethernet
Header
MDI
PCIe Bus

Chapter 2 Product Overview
8 Reference Manual CoreModule 745
Major Component (ICs) Definitions
Table 2-1 lists the major ICs, including a brief description of each, on the CoreModule 745. Figures 2-3 and
2-4 show the locations of the major ICs.
Table 2-1. Major Component Descriptions and Functions
Chip Type Mfg. Model Description Function
CPU (U1) Intel Atom N455 or D525 1.67GHz or 1.83GHz
processor with 8-way
L2 cache
Integrates
Processor core
and Graphics
Memory
Controller Hub
I/O Hub (U2) Intel 82801HBM
(ICH8-M)
I/O Hub for some
common user
interfaces
Provides
Southbridge
interfaces and
off loads some
Northbridge
functions from
the CPU
Gigabit Ethernet
Controller (U4)
Intel 82574IT Gigabit Ethernet
controller
Generates PCIe
10T/100TX/
1000T Ethernet
signals
PCI-to-ISA Bridge
(U8)
ITE ITE8888G-L Interface between PCI
bus and ISA bus
Migrates legacy
ISA bus
Super I/O Hub
(U9)
SMSC SCH3114I-NU Super I/O controller Provides
complete legacy
Super I/O
functionality
RS-232 Transceiver
(U11 - on bottom
side) [see Figure 2-4]
Analog
Devices
ADM213EARSZ Transceiver for Serial 1
and Serial 2 RS-232
signals
Transmits and
receives RS-232
signals for
COM1 and
COM2
RS-422/485
Transceiver (U12 -
on bottom side) [see
Figure 2-4]
Linear
Technology
LTC1334CG Transceiver for Serial 1
and Serial 2 RS-485/
422 signals
Transmits and
receives RS-
485/422 signals
for COM1 and
COM2
CPLD (U17 - on
bottom side) [see
Figure 2-4]
Xilinx XC9536XL Complex
Programmable Logic
Device (not user
programmable)
Provides control
for Power
Sequencing
SPI Flash (U32) - on
bottom side [see
Figure 2-4]
Winbond W25Q64BVSSIG Serial Peripheral
Interface Flash
Memory chip (for
firmware)
Stores BIOS in
Flash Memory
SSD (Solid State
Drive, U33 - on
bottom side [see
Figure 2-4])
Greenliant GLS85LP1004P Industrial-grade,
soldered solid-state
storage module
Provides solid
state storage
through the IDE
channel

Chapter 2 Product Overview
CoreModule 745 Reference Manual 9
Figure 2-3. Component Locations (Top Side)
RS-232 Transceiver
(U38 - on bottom
side) [see Figure 2-4]
Analog
Devices
ADM213EARSZ Transceiver for Serial 3
RS-232 signals
Transmits and
receives RS-232
signals for
COM3
Ethernet Transformer
(T1)
Wurth
Elektronik
7490200110 Gigabit Ethernet
Magnetics
Provides
electrical
isolation for
Gigabit Ethernet
controller
Table 2-1. Major Component Descriptions and Functions (Continued)
CM745_Top_Comp_b
Key:
U1 - CPU
U2 - ICH8-M (Southbridge)
U4 - Gigabit Ethernet Controller
U8 - PCI-to-ISA Bridge
U9 - Super I/O
U33 - SSD (Solid State Drive)
T1 - Gigabit Ethernet Transformer
U1
U2
U4
T1
U8
U9
U33

Chapter 2 Product Overview
10 Reference Manual CoreModule 745
Figure 2-4. Component Locations (Bottom Side)
Header, Connector, and Socket Definitions
Table 2-2 describes the headers and connectors of the CoreModule 745 shown in Figure 2-6.
Table 2-2. Module Header, Connector, and Socket Descriptions
Header # Board
Access
Description
J1 A, B, C, D –
PC/104-Plus
Top/Bottom 120-pin, 0.079" (2mm) connector used for PC/104-Plus signals
J2 A, B, C, D –
PC/104
Top/Bottom 104-pin, connector used for PC/104 signals
J3 – COM1 Serial Top 10-pin, 0.079" (2mm) shrouded header used for COM1 signals
J4 – COM2 Serial Top 10-pin, 0.079" (2mm) shrouded header used for COM2 signals
J5 – COM3 Serial Top 10-pin, 0.079" (2mm) shrouded header used for COM3 signals
J6 – Battery Top 2-pin, 0.049" (1.25mm) shrouded header for power from external
battery
CM745_Bottom_Comp_b
Key:
U11 - RS-232 Transceiver (COM1 and COM2)
U12 - RS-422/485 Transceiver (COM1 and COM2)
U17 - CPLD (Complex Programmable Logic Device)
U32 - SPI Flash
U38 - RS-232 Transceiver (COM3)
U17
U32
U12 U11
U38

Chapter 2 Product Overview
CoreModule 745 Reference Manual 11
Figure 2-5. Connector Pin Sequences
J7 – Power Top 10-pin, 0.100" (2.54mm), right-angle, shrouded header used for
external power connection
J8 – SATA0 Top 7-pin, 0.050" (1.27mm) standard connector used for SATA devices
J9 – SATA1 Top 7-pin, 0.050" (1.27mm) standard connector used for SATA devices
J10 – Ethernet Top 10-pin, 0.079" (2mm) shrouded header used for Gigabit Ethernet
signals
J11 – Ethernet LED Top 4-pin, 0.049" (1.25mm) shrouded header used for Gigabit Ethernet
LED signals
J12 – NS Bottom Not Supported
J14 – DNP Top Do Not Populate
J15 – Keyboard/Mouse Top 10-pin, 0.079" (2mm), shrouded header for PS/2 keyboard and
mouse signals
J16 – USB0 and USB1 Top 10-pin, 0.079" (2mm), shrouded header for USB0 and USB1
signals
J17 – USB2 and USB3 Top 10-pin, 0.079" (2mm), shrouded header for USB2 and USB3
signals
J18 – GPIO Top 10-pin, 0.079" (2mm) header for General Purpose IO signals
J19 – Video Top 30-pin, 0.079" (2mm), shrouded header for LVDS and VGA video
signals
J20 – SMBUS Top 5-pin, 0.079" (2mm), single-row header for SMBus signals
J22 – Fan Top 3-pin, 0.079" (2mm), shrouded header for System Fan signals
J23 – Utility Top 5-pin, 0.100" (2.54mm), single-row header for Power Button,
Reset Switch, and Speaker signals
J24 – DDR3 SODIMM Top 204-pin, standard socket for DDR3 SODIMM
NOTE The pinout tables in Chapter 3 of this manual identify pin sequence using the
following method: A 30-pin header with two rows of pins, using odd/even
numbering, where pin 2 is directly across from pin 1, is noted as 30-pin, 2 rows, odd/
even (1, 2) sequence. The second number in the parenthesis is always directly across
from pin 1. See Figure 2-5.
Table 2-2. Module Header, Connector, and Socket Descriptions (Continued)
1
2
3
4
5
6
7
8
9
10
2030
1929
30-pin, two rows,
Odd/Even, (1, 2)
CM745_ConNum_b

Chapter 2 Product Overview
12 Reference Manual CoreModule 745
Figure 2-6. Header, Connector, and Socket Locations (Top Side)
CM745_Top_Conn_b
Key:
J1 - PC/104 Plus
J2 - PC/104
J3 - Serial COM1
J4 - Serial COM2
J5 - Serial COM3
J6 - Battery
J7 - Power
J8 - SATA0
J9 - SATA1
J10 - Gigabit Ethernet
J11 - Gigabit Ethernet LED
J12 - Not supported (On bottom side)
J14 - Do Not Populate
J15 - Keyboard and Mouse
J16 - USB0 and USB1
J17 - USB2 and USB3
J18 - GPIO
J19 - Video (LVDS and VGA)
J20 - SMBus
J22 - Fan
J23 - Utility
J24 - DDR3 SODIMM
JP2 - LVDS Voltage Select (See jumper table)
JP3 - Serial 2 RS-485/422 Termination (See jumper table)
JP4 - Serial 1 RS-485/422 Termination (See jumper table)
J20
J11
J14
JP2
J23
J22
J7
J9 J8
J18J6
JP3
JP4
J4 J3 J15J19
J5
J10
J16 J17
J1 J2
J24
DCBA
BA
CD

Chapter 2 Product Overview
CoreModule 745 Reference Manual 13
Jumper Header Definitions
Table 2-3 describes the jumper headers shown in Figure 2-7. All jumper headers provide 0.079" (2mm)
pitch.
Figure 2-7. Jumper Header Locations (Top Side)
Table 2-3. Jumper Settings
Jumper Header Installed Removed/Installed
JP2 – LVDS Voltage Selection Enable +3.3V (Pins 1-2)
[Default]
Enable +5V (Pins 2-3)
JP3 – Serial 2 RS-485/422
Termination
Enable Termination
(Pins 1-2)
Disable Termination (Removed)
[Default]
JP4 – Serial 1 RS-485/422
Termination
Enable Termination
(Pins 1-2)
Disable Termination (Removed)
[Default]
CM745_Top_Jmpr_b
Key:
JP2 - LVDS Voltage Select
JP3 - Serial 2 RS-485/422 Termination
JP4 - Serial 1 RS-485/422 Termination
JP2
JP3
JP4

Chapter 2 Product Overview
14 Reference Manual CoreModule 745
Specifications
Physical Specifications
Table 2-4 provides the physical dimensions of the CoreModule 745.
Table 2-4. Weight and Footprint Dimensions
Item Dimension NOTE Overall height is measured from the
upper board surface to the highest
permanent component (PC/104 bus
connector) on the upper board surface.
This measurement does not include the
heatsink, which can vary. The heatsink
could increase this dimension.
Component height should not exceed
0.345" (8.763mm) from the upper
surface of the board and 0.190"
(4.826mm) from the lower surface of the
board. See Figure 2-9 for the stack
heights of the heatsinks on the board.
Weight 0.12 kg (0.25 lbs)
Height (overall) 11.05 mm (0.435 inches)
Board thickness 2.362 mm (0.093 inches)
Width 96.01 mm (3.78 inches)
Length 115.57 mm (4.55 inches)