AIC Lepus User manual

UM_Lepus_v2.2_112618
Lepus
Server Motherboard
User's Manual

Contents
Table of Contents
Preface������������������������������������������������������������������������������������������������� i
Safety Instructions ������������������������������������������������������������������������������ ii
About This Manual������������������������������������������������������������������������������ iii
Chapter 1� Product Features ��������������������������������������������������������������1
1.1 Components.............................................................................................1
1.2 Specications ..........................................................................................2
1.3 Feature .....................................................................................................3
Chapter 2� Hardware Setup ����������������������������������������������������������������4
2.1 Central Processing Unit (CPU)................................................................ 4
2.1.1 Processor Support..............................................................................................4
2.1.2 Installing the CPU ...............................................................................................4
2.1.3 CPU Heatsink Installation ..................................................................................7
2.2 System Memory Setup ............................................................................ 8
2.2.1 DIMM Installation ...............................................................................................8
2.2.2 DIMM Location ...................................................................................................9
2.2.3 Dimm Slot Installation Order..............................................................................9
Chapter 3� Motherboard Settings ����������������������������������������������������� 10
3.1 Block Diagram........................................................................................10
3.2 Content List............................................................................................11
3.3 Layout.....................................................................................................13
3.4 Connector and Jumper..........................................................................14
Chapter 4. BIOS Conguration Settings ������������������������������������������� 16
4.1 Navigation Keys.....................................................................................16
4.2 BIOS Menu .............................................................................................17
4.3 Main........................................................................................................18
4.3.1 Main.................................................................................................................. 18
4.4 Advanced................................................................................................19
4.4.1 Trusted Computing.......................................................................................... 19
4.4.2 APCI Settings ................................................................................................... 19
4.4.3 Onboard Device Conguration........................................................................ 20

4.4.4 Hardware Health Conguration ...................................................................... 20
4.4.5 Super IO Conguration .................................................................................... 20
4.4.6 S5 RTC Wake Settings ..................................................................................... 21
4.4.7 Serial Port Console Redirection ...................................................................... 21
4.4.8 CPU Conguration ........................................................................................... 22
4.4.9 SATA Congurations........................................................................................ 22
4.4.10 PCI Subsystem Settings................................................................................ 23
4.4.11 CSM Conguration ....................................................................................... 23
4.4.12 USB Conguration ........................................................................................ 23
4.5 Chipset ...................................................................................................24
4.5.1 Intel Server Platform Services Conguration................................................. 24
4.5.2 North Bridge Conguration ............................................................................. 24
4.5.3 South Bridge Conguration............................................................................. 25
4.6 Security ..................................................................................................26
4.6.1 Security ............................................................................................................ 26
4.7 Server Management ..............................................................................27
4.7.1 FRB-2 Timer..................................................................................................... 27
4.7.2 OS Watchdog Timer......................................................................................... 27
4.7.3 System Event Log............................................................................................ 28
4.7.4 BMC Network Conguration ........................................................................... 28
4.8 Boot ........................................................................................................29
4.8.1 Boot .................................................................................................................. 29
4.9 Save and Exit..........................................................................................30
4.9.1 Save and Exit.................................................................................................... 30
Chapter 5. BMC Conguration Settings�������������������������������������������� 31
5.1 Login.......................................................................................................31
5.2 Web GUI ................................................................................................32
5.2.1 Menu Bar.......................................................................................................... 32
5.2.2 User Information and Quick Button ............................................................... 33
5.2.3 Dashboard........................................................................................................ 34
5.2.4 Sensor .............................................................................................................. 34
5.2.5 System Inventory............................................................................................. 35
5.2.6 FRU Information............................................................................................... 35
5.2.7 Logs and Reports ............................................................................................ 36
5.2.8 Settings ............................................................................................................ 37
Contents

5.2.9 Remote Control................................................................................................ 39
5.2.10 Power Control ................................................................................................ 44
5.2.11 Chassis Identify Control................................................................................ 45
5.2.12 Set Front Panel Enables ................................................................................ 45
5.2.13 Maintenance .................................................................................................. 46
5.2.14 Sign out .......................................................................................................... 48
Chapter 6� Technical Support����������������������������������������������������������� 49
Contents

Document Release History
Release Date Version Update Content
April
2018 1User's Manual release to public.
September
2018 2
1. New cover
2. Correct grammar error
3. Connector and jumper update
Novemer
2018 2.2 1. Motherboard settings update
2. Datasheet
Contents

Copyright © 2018 AIC, Inc� All Rights Reserved�
This document contains proprietary information about
AIC products and is not to be disclosed or used except in
accordance with applicable agreements.

Copyright
No part of this publication may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means, electronic, mechanical, photo-static, recording
or otherwise, without the prior written consent of the manufacturer.
Trademarks
All products and trade names used in this document are trademarks or registered
trademarks of their respective holders.
Changes
The material in this document is for information purposes only and is subject to change
without notice.
Warning
1. A shielded-type power cord is required in order to meet FCC emission limits and also
to prevent interference to the nearby radio and television reception. It is essential
that only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. You are cautioned that changes or modifications not expressly approved by the
party responsible for compliance could void your authority to operate the equipment.
Disclaimer
AIC shall not be liable for technical or editorial errors or omissions contained herein.
The information provided is provided "as is" without warranty of any kind. To the
extent permitted by law, neither AIC or its afliates, subcontractors or suppliers will be
liable for incidental, special or consequential damages including downtime cost; lost
profits; damages relating to the procurement of substitute products or services; or
damages for loss of data, or software restoration. The information in this document
is subject to change without notice.
Preface
i

ii
Safety Instructions
When installing, operating, or performing maintenance on this equipment, the following
safety precautions should always be taken into account in order to reduce the risk of re,
electric shock, and personal injury.
Carefully read the safety instructions below before using this product.
• Observe all of the warning and instruction signs distinctively marked on the product.
• Before performing system installations, please consult the User’s Manual provided
with this product.
• Do not place this product on an uneven or weak surface (unstable cart, stand, table,
ect.) that might induce the product to fall and sustain serious damage.
• Install only the equipment or device identied in the User’s Manual. Deploying other
equipment or device with this motherboard could invoke improper connection of
circuitry that leads to re or personal injury.
• This product should only be operated with the type of power source indicated on the
marked label. If you are questionable about which type of power supply is used in your
area, consult your dealer or local Power Company.
• Disconnect the power supply module before removing power from the system.
• Unplug this product from the wall outlet before cleaning. Use a damp cloth for
cleaning. Do not use liquid cleaners or aerosol cleaners.
• Do not use this product near a water source, including faucet and lavatory.
• Never spill liquids of any kind on this product.
• Never shove objects of any kind into this product’s open slots, as they may touch
dangerous voltage points or short out parts and could result in re or electric shock.
• Do not block or cover slots and openings in this unit, as they were made for ventilation
and prevent this unit from overheating. Do not place this product in a built-in
installation unless proper ventilation is available.
• Do not disassemble this product. This product should only be taken apart by trained
personnel. Opening or removing covers and circuit boards may expose you to electric
shock or other risks. Incorrect reassembly can also cause electric shock when the
unit is subsequently used.
• Risk of explosion is possible if battery is replaced with an incompatible type. Dispose
of used batteries accordingly.
• This product is equipped with a three-wire grounding type plug, a plug with a third
(grounding) pin. As a safety feature, this plug is intended to t only into a grounding
type power outlet. If you are unable to insert the plug into the outlet, contact your
electrician to replace the outlet. Do not remove the grounding type plug or use a
3-Prong To 2-Prong Adapter to circumvent the safety feature; doing so may result in
electric shock and/or damage to this product.

About This Manual
Thank you for selecting and purchasing the Lepus Server board.
This user's manual is provided for professional technicians to perform easy hardware
setup, basic system congurations, and quick software startup. This document pellucidly
presents a brief overview of the product design, device installation, and rmware settings
for the Lepus motherboard. For the latest version of this user's manual, please refer to the
AIC website: http://www.aicipc.com/rus/productdetail/50982.
Chapter 1 Product Features
This chapter delivers the overall layout of the product, including the fundamental
components on the motherboard, design specications, and noteworthy features. Lepus
is an ideal server grade motherboard that is specifically designed to accommodate
diverse enterprises for managing heavy workloads, databases, nearline applications, and
cloud deployments. This product supports the Intel® Xeon® processor E3-1200 v5/v6
family and H3 socket type (LGA-1151) with a memory support 4 DDR4 2133/2400 MHz of
up to 64 GB.
Chapter 2 Hardware Setup
This chapter displays an easy installation guide for assembling the CPU (Central
Processing Unit) and memory module. Utmost caution for proceeding to set up the
hardware is highly advised. The components on the motherboard are highly fragile and
vulnerable to exterior influence. Do not attempt to endanger the device by placing the
device in a potentially unstable or hazardous surroundings, including positioning the
device on an uneven grounds or humid environments.
Chapter 3 Motherboard Settings
This chapter elaborates the overall layout of the server motherboard, including
multifarious connectors, jumpers, and LED descriptions. These descriptions assist users
to congure different settings and functions of the motherboard, as well as to conrm the
location of each connector and jumper.
Chapter 4 BIOS Conguration Settings
This chapter introduces the key features of BIOS, including the descriptions and option
keys for diverse functions. These details provide users to effortlessly navigate and
congure the input/output devices.
Chapter 5 BMC Conguration Settings
This chapter illustrates the diverse functions of IPMI BMC, including the details on logging
into the web page and assorted denitions. These descriptions are helpful in conguring
various functions through Web GUI without entering the BIOS setup. For more information
of BMC congurations, please refer to IPMI BMC (Aspeed2400) User's Manual for a more
detailed description.
Chapter 6 Technical Support
For more information or suggestion, please contact the nearest AIC corporation
representative in your district or visit the AIC website: http://www.aicipc.com/en. It is our
greatest honor to provide the best service for our customers.
iii

Chapter 1. Product FeaturesLepus User Manual
1
Ursa User Manual Chapter 1. Product Features
Chapter 1� Product Features
This section describes the hardware specications and features of the Lepus motherboard.
The fundamental components of the Lepus severboard are provided below.
1�1 Components
Lepus Serverboard
Product specications and features are subject to change without prior notice.

2
Chapter 1. Product FeaturesLepus User Manual
1.2 Specications
System
Processor
Support
Socket
Type Socket H3 (LGA-1151)
System
Chipset PCH
System
MemoryUnbuffered ECC UDIMM
Expansion
Slots 2 x PCIe x1 (PCH)
System
BIOS
BIOS Type
BIOS
Features
On-board
Devices
SATABuilt-in SATA controller with RAID support
PCH
SASOptional Broadcom/LSI SAS 3008 IOC
On-board
Devices
IPMI
Aspeed AST2400 Advanced PCIe Graphics &
Remote Management Processor
Serial over LAN
Networkfor quad port GbE (BTO)
management port
Graphics
Aspeed AST2400 Advanced PCIe Graphics &
Remote Management Processor
Input/
Output
Serial ATA6 x SATA 6.0Gb/s
SAS
(Option) 8 x SAS 12Gb/s(by 2x MiniSAS HD/SFF8643)
LAN GbE (BTO)
USB
VGA 1 x external VGA port
Serial Port
Others Debug display pin-header, GPIO port,
IPMB pin-header, Chassis intrusion,
PSMI pin-header
support dual port GbE
CPU TDP 80W

3
Chapter 1. Product FeaturesLepus User Manual
Lepus, implementing the next generation 14nm Intel® Xeon® processor E3-1200 v5/v6
series with benefits of Skylake and Kaby Lake processor, Gen3 PCI Express and more
memory support in standard ATX form factor, offers compelling performance and
improved power efficiency for optimized and efficient performance platforms (storage,
security and communications infrastructure).
The Lepus series server board delivers unmatched performance, providing support
with two channels of DDR4 2400/2133 Unbuffered ECC UDIMM, Up to 4x1GBase-T,
and optional Broadcom/LSI SAS 3008 IOC onboard. Lepus series server board enables
next generation server solutions with an incredible leap in performance in a standard
ATX form factor platform.
• Supports one Intel® Xeon® Processors E3-1200 v5/v6 product family, 6th
generation Intel® Core™ i3 processor, Intel® Pentium® processor or Celeron®
processor
• An optimal number of PCIe slots with one x16 (x8 lanes)and one x8
• Comes with Intel® Ethernet Controller I210 to support up to 4GbE ports
• Onboard Baseboard Management Controller for system management and IPMI
control
1�3 Feature

4
Chapter 2. Hardware Setup
Lepus User Manual
2.1 Central Processing Unit (CPU)
2�1�1 Processor Support
The server board includes one processor socket H3 (LGA1151) that provides support
for more than two CPU types and a Thermal Design Power(TDP) of up to 80W on
selected models.
CAUTION
When unpacking a processor, hold the processor only by the edge to avoid touching the
contacts.
2�1�2 Installing the CPU
Step 1 Push the lever handle down and toward the CPU socket.
Rotate the lever handle up.
Chapter 2� Hardware Setup
Load lever

5
Chapter 2. Hardware SetupLepus User Manual
Step 2 While holding down the lever handle, with your other hand, lift open the
Load Plate.
Step 3 Remove the protective cover from the CPU socket. Do not throw away the
protective cover. It may be further used for RMA purposes.
Step 4 Orient the processor with the socket so that the processor cutouts match
the four orientation posts on the socket. Note the location of a gold key
at the corner of the processor. Carefully place (Do NOT drop) the CPU
into the socket.
Load plate
Processor protective cover
Cutouts

6
Chapter 2. Hardware Setup
Lepus User Manual
Step 5 Close the loading plate by pushing down the locking lever on the side.
Slide the tip of the lever under the notch on the loading plate. Make sure
the loading plate tab engages under the socket lever when fully closed.
Press to close

7
Chapter 2. Hardware SetupLepus User Manual
2�1�3 CPU Heatsink Installation
Step 1 Apply thermal grease onto the heatsink and position the heatsink onto
the CPU socket. Make certain that the heatsink is accurately positioned.
Step 2 Tighten the four screws in a diagonal sequence. Secure the screws a
couple of turns until the screws are tightly secured and the heatsink is
fastened onto the server board.

8
Chapter 2. Hardware Setup
Lepus User Manual
This server board supports 4 DIMM memory slots with 2 channel per CPU.
2�2�1 DIMM Installation
Step 1 Unlock the dimm socket by pressing the retaining clips outward.
Step 2 Insert the memory module into the slot. Make sure that the DIMM notch is
accurately positioned.
Step 3 Close the retaining clips to complete installation.
DIMM n
otch
2�2 System Memory Setup

9
Chapter 2. Hardware SetupLepus User Manual
2�2�2 DIMM Location
2�2�3 Dimm Slot Installation Order
Populate the DIMM slots in the following order.
JDIMMB1
JDIMMB0
JDIMMA1
JDIMMA0
CPU1
JDIMM_A0
JDIMM_B0
CPU0
DIMM NUMBER DIMM ARRANGEMENT
2 DIMMs
JDIMM_A0
JDIMM_B0
JDIMM_A1
JDIMM_B1
CPU0
DIMM NUMBER DIMM ARRANGEMENT
4 DIMMs
JDIMMB1
JDIMMB0
JDIMMA1
JDIMMA0
CPU1

10
Chapter 3. Motherboard SettingsLepus User Manual
This section provides illustrations that display the internal jumpers, connectors, and
system LED indicators on the Lepus motherboard. The motherboard layout and essential
connectors are listed below for your reference.
3�1 Block Diagram
Chapter 3� Motherboard Settings
Intel Skylake-H PCH
Aspeed IBMC
AST2400
Intel Skylake-S
LGA 11551
(Socket H4)
Intel I210
GbE Controller
Intel I210
GbE Controller
Intel I210
GbE Controller
Intel I210
GbE Controller
PCI Express x1 Slot
PCI Express x1 Slot
TPM/80 Port Module
BCM5221 Gb PHY
Smart Fan Controller
COM1
COM2
SPI Flash ROM
SPI Flash ROM
Voltage and Thermal Monior
D-Sub VGA Output
SATA4
SATA5
SATA6
SATA1
SATA2
SATA3
RJ45
Jack
RJ45
Jack
RJ45
Jack
RJ45
Jack
RJ45
Jack
USB3.0 USB3.0
USB3.0 USB3.0 USB3.0 USB3.0 USB2.0
PCI Express x16 Slot
PCI Express x8
PTN3355
Display Port to VGA
LSISAS3008
12Gb/s SAS+SATA Controller
0 ohn Resistor
BOM opon
Mini-SAS HD Conn.
Mini-SAS HD Conn.
USB2.0 USB2.0
DDR4
DDR4
DDR4
DDR4
VCCcore = PXC1410A + TDA2132 x4
VCCsa
VCCgt = PXC1410A + TDA2132 x3
TDA2132 x1
VDDQ = ISL95870B + FDPC8016S x1
VPP = IR3898 x1
VTT = TpS51200 x1
PCIE#1
PCIE#2
System BIOS
BMC Firmware
PCIE#3
PCIE#5
PCIE Gen3 x1
PCIE Gen3 x1 PCIE Gen3 x1
PCIE Gen3 x1
PCIE Gen3 x1
PCIE Gen3 x1
SATA Gen3 (6.0Gb/s)
PCIE Gen3 x8
PCIE Gen3 x8 PCIE Gen3 x8
USB3.0 x7
USB2.0 x2
PCIE Gen3 x8
MDI
MDI
MDI
MDI
UART1
UART2
SPI Interface
SPI Interface
MDI
RMII Interface
Network Controller Sideband Interface
Analog Display Interface
LPC Interface
SPI Interface
PCIE Gen3 x1
Rear
Pin Header
Rear
Pin Header
Pin Header
Type A
Embedded Display Port Interface
Channel B
Channel A
DMI Gen3 x4
Analog Display Interface

11
Chapter 3. Motherboard SettingsLepus User Manual
Connector/Jumper/Header Location Connector/Jumper/Header Location
1DIMM_A0 (DDR4,
Blue, Address:0xA0) J8C1 20 SATA Port (SATA 3.0, 6 Gbit/s) SATA3, J43
2CPU Fan, PIN Header J14 21 SATA Port (SATA 3.0, 6
Gbit/s) SATA4, J42
3System FAN5 Pin
Header J15 22 SATA Port (SATA 3.0, 6 Gbit/s) SATA5, J41
4PSMI Pin Header J16 23 SATA SGPIO Pin Header
(HBA) J34
5ATX 24-Pin Power
Supply Connector J32, PW1 24 USB Header (USB 3.0, ,5G/s)* 2 J35
6IPMB Pin Header J51 25 USB Port (USB2.0,
Type-A, 480M/s) J33
7DIMM_B1 (DDR4,
Black, Address:0xA6) J8C4 26 USB Header (USB 2.0,
480M/s)* 2 FP_USB_1
8DIMM_B0 (DDR4,
Blue, Address:0xA4) J8C3 27
SAS Port (LSI SAS3008,
MINI SAS, 2 Port, 12
Gbit/s) OPTIONAL
WITH BTO
J29
9DIMM_A1 (DDR4,
Black, Address:0xA2) J8C2 28
SAS Port (LSI SAS3008,
MINI SAS, 2 Port, 12
Gbit/s)OPTIONAL WITH
BTO
J28
10 System FAN1 Pin
Header J50 29 CMOS Clear Jumper J26
11 System FAN2 Pin
Header J49 30 ME Firmware Update
Jumper J256
12 System FAN3 Pin
Header J48 31 LAN3 LED J24
13 System FAN4 Pin
Header J47 32 LAN2 LED J23
14 Power button J37 33 SSI FP I/O PIN Header J20
15 Reset button J36 34 System FAN Board Pin
Header J19
16 BMC Caterr Error LED LED5 35 TPM & debug header J13
17 SATA Port (SATA 3.0,
6 Gbit/s) SATA0, J46 36 RS-232_DB-9_COM-
Port_2 Pin Header J9
18 SATA Port (SATA 3.0,
6 Gbit/s) SATA1, J45 37 PCI Express Slot (x1
Slot, w/x1 link) J17
19 SATA Port (SATA 3.0,
6 Gbit/s) SATA2, J44 38 BMC Heart Beat LED,
Green LED2
3�2 Content List