AMD 770 User manual

U
S ER'S MANUAL
Of
AMD 770 & AMD SB710 Chipset
Based
M/B For AMD Socket AM3 Processor
NO. G03-HA10DELUXE-F
Rev
： 1.0
Release date: March, 2010
Trademark:
* Specifications and information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION ................................................................iii
USER’S NOTICE ...........................................................................................................................iv
MANUAL REVISION INFORMATION ........................................................................................iv
COOLING SOLUTIONS................................................................................................................iv
CHAPTER 1 INTRODUCTIONOFAMD 770 MOTHERBOARDS
1-1 FEATURES OF MOTHERBOARD .............................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD...............................................2
1-2 SPECIFICATION.........................................................................................................4
1-3 PERFORMANCE LIST................................................................................................5
1-4 LAYOUT DIAGRAM....................................................................................................6
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS.......................................................................8
2-2 CHECKING MOTHERBOARD'S JUMPER SETTING................................................8
2-3 INSTALL CPU.............................................................................................................9
2-3-1 GLOSSARY...................................................................................................9
2-3-2 ABOUT AMD AM3 CPU INSTALLATION.................................................10
2-4 INSTALL MEMORY ....................................................................................................11
2-5 EXPANSION CARDS..................................................................................................12
2-5-1 PROCEDURE FOR EXPANSION CARD INSTALLATION..........................12
2-5-2 ASSIGNING IRQS FOR EXPANSION CARD ..............................................12
2-5-3 PCI-EXPRESS 2.0 SLOT..............................................................................13
2-6 CONNECTORS, HEADERS......................................................................................13
2-6-1 CONNECTORS .............................................................................................13
2-6-2 HEADERS .....................................................................................................16
2-7 STARTING UP YOUR COMPUTER ...........................................................................20
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................21
3-2 GETTING HELP ..........................................................................................................21
3-3 THE MAIN MENU........................................................................................................22
3-4 STANDARD BIOS FEATURES ..................................................................................23
3-5 ADVANCED BIOS FEATURES..................................................................................24
3-6 ADVANCED CHIPSET FEATURES...........................................................................25
3-6-1 PCI EXPRESS CONFIGURATION ............................................................25
3-7 INTEGRATED PERIPHERALS.................................................................................26
3-8 POWER MANAGEMENT FEATURES......................................................................27
3-9 MISCELLANEOUS CONTROL .................................................................................28
3-10 PC HEALTH STATUS ...............................................................................................29
3-11 NETBAR USER SETTING.........................................................................................29
3-12 USER OVERCLOCK SETTINGS..............................................................................30
3-12-1 CPU CONFIGURATION ...........................................................................31
3-13 BIOS SECURITY FEATURES .................................................................................31
3-14 LOAD OPTIMAL/ STANDARD DEFAULTS..............................................................33
3-15 SAVE CHANGES AND EXIT/DISCARD CHANGES AND EXIT..............................33
CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION
MAGIC INSTALL SUPPORTS WINDOWS 2000/XP/VISTA/7............................................34
4-1 ATI INSTALL ATI SOUTH BRIDGE DRIVER PACK.............................................35
4-2 SOUND INSTALL ALC HD AUDIO CODEC DRIVER...........................................35
4-3 LAN INSTALL GIGABIT ETHERNET NIC DRIVER ..............................................37
4-4 RAIDDISK INSTALL ATI SATA DRIVER AND UTILITY ...........................................37
4-5 NORTON INSTALLNORTON 2010 ANTI-VIRUS PROGRAM............................38
4-6 PC-HEALTH INSTALL MYGUARD HARDWARE MONITOR UTILITY..................38
4-7 HOW TO UPDATE BIOS ............................................................................................39
4-8 AMD PLATFORM RAID FUNCTION INSTALLATION ..............................................39
4-9 PRO MAGIC PLUS FUNCTION INTRODUCTION.....................................................43
4-10 G.P.I FUNCTION LED DISPLAY ...............................................................................45
APPENDIX1…………………………………………………………………………………………...51
TABLE OF CONTENT

iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE AMD 770 MOTHERBOARD
AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE,
CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 FirstEdition March, 2010
Item Checklist
5AMD770 Platform Processor Chipset based motherboard
5User’s Manual
5CD for motherboard utilities
5I/O back panel shield
AMD AM3 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with
increasing operation clock, thermal management becomes increasingly crucial while
building computer systems. Maintaining the proper computing environment without
thermal increasing is the key to reliable, stable, and 24 hours system operation. The
overall goal is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increasing surface
area and concentrated airflow from attached active cooling fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For
optimum heat transfer, AMD recommends the use of thermal grease and mounting
clips to attach the heatsink to the processor.
Please refer to AMD official website for collection of heatsinks evaluated and
recommended for Socket AM3 processors by AMD. In addition, this collection is not
intended to be a comprehensive listing of all heatsinks that support Socket-AM3
processors.

1
Chapter 1
Introduction of AMD770 Motherboards
1-1 Features of motherboard
The AMD770 chipset motherboard series are based on the latest AMD770 Chipset
and the SB710 chipset which supports the following AM3 CPU in the 125W range:
Phenom II x 4; Phenom II x 3; Phenom II x2; Athlon II x4; Athlon II x3; Athlon II x2;
Sempron. With an integrated low-latency high-bandwidth DDRIII memory controller
and a highly-scalable Hyper Transport technology-based system bus up to HT 3.0.
AMD770 Platform Processor Chipset motherboard series deliver the outstanding
system performance and professional desktop platform solution.
The AMD770 Series motherboards support new generation Socket AM3 processors
with an integrated DDRIII memory controller for Dual channel DDRIII 800/DDRIII1066
/DDRIII 1333 Module up to 16 GB. The motherboard is embedded with SB710 chipset
of providing ULTRA ATA 133 connectors and Serial ATA2 with RAID 0, 1, 10, JBOD
functions which support up to two IDE and four Serial ATA2 devices to accelerate
hard disk drives and guarantee the data security without failure in advanced
computing performance.
The AMD770 motherboards provide 10/100/1000 LAN functions with Gigabit LAN
chip which supports 10/100/1000Mbps data transfer rate. And the embedded
8-channel HD Audio CODEC is fully compatible with Sound Blaster Pro standards
that offer you with the home cinema quality and satisfying software compatibility.
The AMD770 Series motherboards deliver outstanding value and performance for
gamers, with a true bandwidth design for Multi-GPU configurations. This high
bandwidth architecture in the AMD 770 chipset is with the flexibility for single or dual
card configurations. The AMD 770 chipset provides one PCI Express 2.0 x16 by 16
lanes and one PCI Express 2.0 x16 by 4 lane slot to support simultaneous operation
of graphics cards for astonishing performance with brilliant and intense 3D graphics.
AMD770 motherboard series offer one PCI-Express2.0x16 by16-lane graphics slot
and one PCI Express 2.0 x 16 by 4-lane slot. One PCI Express2.0 x1 I/O slot tackling
the most demanding multimedia tasks nowadays. The AMD770 motherboards also
carry two 32-bit PCI slots guarantee the rich connectivity for the I/O peripheral
devices.
Embedded USB controllers as well as capability of expanding to 12 of USB2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity, these
motherboards meet the future USB demands which are also equipped with hardware
monitor function on system to monitor and protect your system and maintain your
non-stop business computing.

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Some special features--- AAA AMD Netbar Recommended Configuration/
Military-industrial-class Environment for Simulation Test/Thunder-lighting
Protection/ESD Protection/Ultra-low Running Temperature/North and South
Bridge Conjoined Cooling Design/Memory Anti-theft Lock/Double Copper
Function/3D Audio/G.P.I Function/OC-CON/ DIY Clear/Power On Button/Reset
Button/CPU Vcore 7-shift /CPU Smart Fan in this motherboard are designed for
power user to use the over-clocking function in more flexible ways. But please be
caution that the over-clocking maybe causes the fails in system reliabilities. This
motherboard provides the guaranteed performance and meets the demands of the
next generation computing. But if you insist to gain more system performance with
variety possibilities of the components you choose, please be careful and make sure
to read the detailed descriptions of these value added product features, please get
them in the coming section.
1-1.1 Special Features of Motherboard
AAA AMD Netbar Recommended Configuration
AMD Company is in order to be able to better help Netbar users to provide a
comprehensive and overall solution; to solve the problems that Netbar users
encounter in pre-sale, sale and after-sale problems. Meanwhile to increase the AMD
products awareness at the Netbar and enhance the Netbar users’ satisfaction to AMD
products.
Military-industrial-class Environment for Simulation Test
Under Minus 10 degrees temperature or 50 degrees high temperature harsh
environments, there is no trouble when burning-in testing for 3x24 hours.
Thunder-lightning Protection
Under up to 9000v, Thunder-lightning protection can effectively ensure PC security in
the thundering and rainy season. Please note that do not use PC when it is
thundering and lightning.
ESD Protection--- (Electro-Static Discharge Protection)
Electro-Static Discharge Protection, if joined the anti-static technology in each USB
port, it is effective to prevent peripheral devices from impacting pc boards. USB
Interface ESD Protection: In the signal line coupled with anti-EMI of choke and
special anti- Electro-Static Discharge DIODE (2 tubes), plugging USB devices can be
effective measures for preventing ESD damage.
Ultra-low Running Temperature
The double copper function plus North and South Bridge Conjoined Cooling design,
CPU fan vertical design. This optimizes the motherboard to run at lower
temperatures.
North and South Bridge Conjoined Cooling Design
North and South Bridge Conjoined Cooling Design, large heat sinks perpendicular to
CPU FAN can effectively make the most of CPU FAN wind to cool, and effectively
lower the temperature of Northbridge and Southbridge.
Memory Anti-theft Lock
The board has memory anti-theft lock and can lock the memory by using some screw
holes from ATX itself. Using Memory anti-theft lock, Internet cafe owners no longer
have to worry about PC's memory had been quietly taken away.
Double Copper Function
Double Copper is with 2 ounces of copper lines, thereby reducing resistance and heat,

3
thereby enhancing the computer's performance and extending the life of the
motherboard.
3D Audio—(3D Audio Sound Effect)
OP with two-stage Butterworth filter and quadruple noninverting amplifier enhances
bass effect under the 100MHz range to perfect audio effect, brings you stunning
shock experience in video game, true-to-life simulated feeling when watching films
and the greatest touch as that in the concert. There is a 3D Audio button integrated on
the board. Press down the button to enable 3D audio effect or press again to disabled
it.
G.P.I. Function—(Green power indicator function)
The full name of G.P.I technology is Green Power Indicator technology, obviously
technology utilized to low power consumption. G.P.I is a technology with remarkable
power saving function.
OC-CON ---（High-polymer Solid Electrolysis Aluminum Capacitors）
The working temperature is from 55 degrees Centigrade below zero to 125 degrees
Centigrade, OC-CON capacitors possess superior physical characteristics that can
be while reducing the working temperature between 20 degrees Centigrade each time,
intact extension 10 times of effective product operation lives, at not rising degrees
Centigrade of working temperatures each time a relative one, life of product decline
10% only too.
DIY Clear---CMOS/ CMOS1 Button
The CMOS button is to facilitate the clear CMOS process for power user overclocking
function. The user can easily clear or restore CMOS setting by pressing the button
without tacking trouble to remove the case and locate the jumper for clear CMOS.
Power On Button
You can easily start the computer by pressing down this button for a few seconds,
without troubling yourself to locate the front panel jumpers to find the Power on
jumper.
Reset Button
You can easily restart the computer by pressing down this button for a few seconds,
without troubling yourself to locate the front panel jumpers to find the reset jumper.
CPU Vcore7 Shift--- (Shift to Higher Performance)
The CPU voltage can be adjusted up by 7 steps for the precisely over-clocking of
extra demanding computing performance.
CPU Smart Fan--- (The Noise Management System)
It’s never been a good idea to gain the performance of your system by sacrificing its
acoustics. CPU Smart Fan Noise Management System is the answer to control the
noise level needed for now-a-day’s high performance computing system. The system
will automatically increase the fan speed when CPU operating loading is high, after
the CPU is in normal operating condition, the system will low down the fan speed for
the silent operating environment. The system can provide the much longer life cycle
for both CPU and the system fans for game use and business requirements.

4
1-2 Specification
Spec Description
Design zATX form factor，size: 29.5cm x23.0cm
Chipset zAMD770 North Bridge Chipset
zAMD SB710 South Bridge Chipset
CPU Socket AM3
zSupport Phenom II x 4; Phenom II x 3; Phenom II x2;
Athlon II x4; Athlon II x3; Athlon II x2; Sempron series AM3
CPU in the 125W range
zSupport HT 3.0
Memory Socket
z240-pin DDRIII Module socket x 4
zSupport 4pcs DDRIII 800 DDRIII 1066 /DDRIII 1333
Modules Expandable to 16GB
zDual channel supported
Expansion Slot
z1pcs PCI-Express 2.0x16 by 16lane
z1pcs PCI-Express 2.0x16 by 4 lane
z1pcs PCI-Express 2.0 x1 slot
z2pcs 32-bit PCI slot
Integrate IDE and
Serial ATA2 RAID
zOne IDE controllers support PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 33/66/100/133 functions
that deliver the data transfer rate up to 133 MB/s for 2 IDE
Devices and for 4 Serial ATA 3Gb/s connectors with RAID
0, 1, 10,JBOD functions
Gigabit LAN
zIntegrated Realtek RTL 8111DL PCI Express Gigabit LAN
chip.
zSupport Fast Ethernet LAN function of
providing10Mb/100Mb/1000 Mb/s data transfer rate
8 CH-Audio
zRealtek ALC883 Azalia 8-channel Audio Codec integrated
zSupport 8-channel 3D surround & Positioning Audio
zAudio driver and utility included
BIOS zAMI 8MB DIP Flash ROM BIOS
Multi I/O
zPS/2 keyboard x1
zPS/2 mouse connector x1
zSPDIF＿OUT1 connector x1
zSerial port connector x1
zRJ-45 Connector x1
zUSB 2.0 port x 4 and headers x 4
zAudio connector x1 (8CH Audio)
zHard Disk Drive Connector x1
zSATA II connector x4
zFront panel audio header x1
zHDMI-SPDIF header x1
zIR1 header x1
zCDIN1 header x1
zParallel1 header x1

5
1-3 Performance List
The following performance data list is the testing result of some popular benchmark
testing programs. These data are just referred by users, and there is no responsibility
for different testing data values gotten by users (the different Hardware & Software
configuration will result in different benchmark testing results.)
Performance Test Report
Performance Test Report
CPU: AM3 955
VGA: HD3850X2
Hard Disk Driver: MAXTOR 80G SATA
BIOS: T01
MEMORY: APACER 1333 1G X2
3D Mark VANTAGE 17215
3D Mark 2006 9461
3D Mark 2005 15134
AQUAMRK3
PCMark2005
System / CPU / Memory 8405
/
9665
/
5864
Graph / HDD 8092
/
6147
Content Creation Winstone 2004 39.5
Business Winstone 2004 36.2
Winbench 99 V2.0:
Business/Hi-end Disk Winmark99 34300
Business/Hi-end Graphic Winmark
SYSMark 2004: SISMark Rating(Internet Content Creation / Office Productivity )
SYSMark 2004 349
3D Creation/2D Creation 222
/
681
/Web publication 497
Communication/Document Creation 198
/
375
/DaTa Analysis 322
SISOFT Sandra 2005 : 1.CPU Arithmetic Benchmark 2.Memory bandwidth Benchmark 3.CPU
Multi-Media Benchmark
1. Dhrystone ALU MIPS 62646
Whetstone FPU iSSE2 FLOPS 20071
/
26742
2.Int/Float Buffered iSSE2 MB/S 10796
/
10822
3.Integer/Floating-Point IT/S 171082
/
159074
UT2003 Benchmark 538.099
/
169.749
Quake3 DEMO1 / DEMO2 624.6/600.9
Return to Castle Wolfenstein FPS
Super Pi (1M) Second 21.438
CPUZ System / CPU Clock 200*16 3.2G/ HT 2000