AMD SR5650 Product guide

AMD SR5650 Databook
Technical Reference Manual
Rev 2.00
P/N: 47062_sr5650_ds_pub
© 2010 Advanced Micro Devices, Inc.

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© 2010 Advanced Micro Devices, Inc. All rights reserved.

© 2010 Advanced Micro Devices, Inc. 47062 SR5650 Databook 2.00
Proprietary Table of Contents-1
Table of Contents
Chapter 1: Overview
1.1 Introducing the SR5650 ......................................................................................................................................................1-1
1.2 SR5650 Features .................................................................................................................................................................1-1
1.2.1 CPU Interface .......................................................................................................................................................1-1
1.2.2 PCI Express® Interface ........................................................................................................................................1-1
1.2.3 A-Link Express II Interface..................................................................................................................................1-1
1.2.4 Multiple Processor Support ..................................................................................................................................1-2
1.2.5 Multiple Northbridge Support ..............................................................................................................................1-2
1.2.6 Power Management Features ...............................................................................................................................1-2
1.2.7 PC Design Guide Compliance..............................................................................................................................1-2
1.2.8 Test Capability Features .......................................................................................................................................1-2
1.2.9 Packaging .............................................................................................................................................................1-2
1.3 Software Features................................................................................................................................................................1-2
1.4 Device ID ............................................................................................................................................................................1-3
1.5 Branding Diagrams .............................................................................................................................................................1-3
1.6 Conventions and Notations .................................................................................................................................................1-4
1.6.1 Pin Names.............................................................................................................................................................1-4
1.6.2 Pin Types ..............................................................................................................................................................1-4
1.6.3 Numeric Representation .......................................................................................................................................1-4
1.6.4 Hyperlinks ............................................................................................................................................................1-4
1.6.5 Acronyms and Abbreviations ...............................................................................................................................1-4
Chapter 2: Functional Descriptions
2.1 HyperTransport™ Interface ................................................................................................................................................2-1
2.1.1 Overview ..............................................................................................................................................................2-1
2.1.2 HyperTransport™ Flow Control Buffers .............................................................................................................2-3
2.2 IOMMU ..............................................................................................................................................................................2-4
2.3 Multiple Northbridge Support.............................................................................................................................................2-4
2.4 Interrupt Handling...............................................................................................................................................................2-4
2.4.1 Legacy INTx Handling.........................................................................................................................................2-4
2.4.2 Non-SB IOAPIC Support .....................................................................................................................................2-4
2.4.3 Integrated IOAPIC Support..................................................................................................................................2-5
2.4.4 MSI Interrupt Handling and MSI to HT Interrupt Conversion ............................................................................2-5
2.4.5 Internally Generated Interrupts.............................................................................................................................2-5
2.4.6 IOMMU Interrupt Remapping .............................................................................................................................2-5
2.4.7 Interrupt Routing Architecture .............................................................................................................................2-5
2.5 RAS Features ......................................................................................................................................................................2-7
2.5.1 Parity Protection ...................................................................................................................................................2-7
2.5.2 SERR_FATAL# and NON_FATAL_CORR# Pins .............................................................................................2-7
2.5.3 NMI# and SYNCFLOODIN# ..............................................................................................................................2-8
2.5.4 Suggested Platform Level RAS Sideband Signal Connections............................................................................2-8
2.5.5 Error Reporting and Logging ...............................................................................................................................2-9
2.5.6 Interrupt Generation on Errors ........................................................................................................................... 2-11
2.5.7 Poisoned Data Support ....................................................................................................................................... 2-11
2.5.8 PCIe® Link Disable State .................................................................................................................................. 2-11

47062 SR5650 Databook 2.00 © 2010 Advanced Micro Devices, Inc.
Table of Contents-2 Proprietary
2.5.9 HT Syncflood Based on PCIe® Error ............................................................................................................... 2-12
2.6 PCI Express® .................................................................................................................................................................. 2-12
2.6.1 PCIe® Ports ....................................................................................................................................................... 2-12
2.6.2 PCIe® Reset Signals.......................................................................................................................................... 2-12
2.7 External Clock Chip ......................................................................................................................................................... 2-12
Chapter 3: Pin Descriptions and Strap Options
3.1 Pin Assignment Top View ................................................................................................................................................. 3-2
3.2 SR5650 Interface Block Diagram ...................................................................................................................................... 3-4
3.3 CPU HyperTransport™ Interface ...................................................................................................................................... 3-4
3.4 PCI Express® Interfaces .................................................................................................................................................... 3-5
3.4.1 PCI Express® Interface for General Purpose External Devices ......................................................................... 3-5
3.4.2 A-Link Express II Interface to Southbridge ........................................................................................................ 3-5
3.4.3 Miscellaneous PCI Express® Signals ................................................................................................................. 3-6
3.5 Clock Interface ................................................................................................................................................................... 3-6
3.6 Power Management Pins.................................................................................................................................................... 3-6
3.7 Miscellaneous Pins ............................................................................................................................................................. 3-7
3.8 Power Pins.......................................................................................................................................................................... 3-7
3.9 Ground Pins........................................................................................................................................................................ 3-9
3.10 Strapping Options........................................................................................................................................................... 3-10
Chapter 4: Timing Specifications
4.1 HyperTransport™ Bus Timing .......................................................................................................................................... 4-1
4.2 PCI Express® Differential Clock AC Specifications......................................................................................................... 4-1
4.3 HyperTransport™ Reference Clock Timing Parameters ................................................................................................... 4-1
4.4 OSCIN Reference Clock Timing Parameters..................................................................................................................... 4-2
4.5 Power Rail Sequence.......................................................................................................................................................... 4-2
4.5.1 Power Up ............................................................................................................................................................. 4-3
4.5.2 Power Down ........................................................................................................................................................ 4-4
Chapter 5: Electrical Characteristics and Physical Data
5.1 Electrical Characteristics.................................................................................................................................................... 5-1
5.1.1 Maximum and Minimum Ratings........................................................................................................................ 5-1
5.1.2 DC Characteristics............................................................................................................................................... 5-1
5.2 SR5650 Thermal Characteristics........................................................................................................................................ 5-2
5.2.1 SR5650 Thermal Limits ...................................................................................................................................... 5-2
5.2.2 Thermal Diode Characteristics ............................................................................................................................ 5-3
5.3 Package Information .......................................................................................................................................................... 5-4
5.3.1 Pressure Specification.......................................................................................................................................... 5-5
5.3.2 Board Solder Reflow Process Recommendations ............................................................................................... 5-6
Chapter 6: Power Management and ACPI
6.1 ACPI Power Management Implementation ....................................................................................................................... 6-1
Chapter 7: Testability
7.1 Test Capability Features..................................................................................................................................................... 7-1
7.2 Test Interface...................................................................................................................................................................... 7-1
7.3 XOR Tree ........................................................................................................................................................................... 7-1

© 2010 Advanced Micro Devices, Inc. 47062 SR5650 Databook 2.00
Proprietary Table of Contents-3
7.3.1 Brief Description of an XOR Tree .......................................................................................................................7-1
7.3.2 Description of the XOR Tree for the SR5650 ......................................................................................................7-2
7.3.3 XOR Tree Activation ...........................................................................................................................................7-2
7.3.4 XOR Tree for the SR5650....................................................................................................................................7-3
7.4 VOH/VOL Test...................................................................................................................................................................7-4
7.4.1 Brief Description of a VOH/VOL Tree................................................................................................................7-4
7.4.2 VOH/VOL Tree Activation ..................................................................................................................................7-5
7.4.3 VOH/VOL pin list ................................................................................................................................................7-6
Appendix A: Pin Listings
7.5 SR5650 Pin Listing Sorted by Ball Reference................................................................................................................... A-2
A.1 SR5650 Pin Listing Sorted by Pin Name .......................................................................................................................... A-9
Appendix B: Revision History
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