AMD 870 User manual

USER'S MANUAL
Of
AMD 870 & AMD SB850
Based
M/B for Socket AM3
AMD Processor
NO. G03-BA520PRO-F
Rev
： 2.0
Release date: March, 2011
Trademark:
* Specifications and information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION ...........................................................iii
USER’S NOTICE.........................................................................................................iv
MANUAL REVISION INFORMATION.........................................................................iv
COOLING SOLUTIONS ..............................................................................................iv
CHAPTER 1 INTRODUCTION OF AMD 870 MOTHERBOARDS
1-1 FEATURES OF MOTHERBOARD .............................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD...............................................2
1-2 SPECIFICATION.........................................................................................................3
1-3 PERFORMANCE LIST................................................................................................4
1-4 LAYOUT DIAGRAM....................................................................................................5
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS.......................................................................7
2-2 CHECKING MOTHERBOARD'S JUMPER SETTING................................................7
2-3 INSTALL CPU.............................................................................................................8
2-3-1 GLOSSARY...................................................................................................8
2-3-2 ABOUT AMD AM3 CPU INSTALLATION.................................................9
2-4 INSTALL MEMORY ....................................................................................................9
2-5 EXPANSION CARDS..................................................................................................10
2-5-1 PROCEDURE FOR EXPANSION CARD INSTALLATION..........................10
2-5-2 ASSIGNING IRQS FOR EXPANSION CARD ..............................................10
2-5-3 EXPANSION SLOTS.....................................................................................11
2-6 CONNECTORS AND HEADERS ..............................................................................12
2-6-1 CONNECTORS .............................................................................................12
2-6-2 HEADERS .....................................................................................................15
2-7 STARTING UP YOUR COMPUTER ...........................................................................19
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................20
3-2 GETTING HELP ..........................................................................................................20
3-3 THE MAIN MENU........................................................................................................21
3-4 STANDARD BIOS FEATURES ..................................................................................22
3-5 ADVANCED BIOS FEATURES..................................................................................23
3-5-1 CPU CONFIGURATION...................................................................................24
3-6 ADVANCED CHIPSET FEATURES...........................................................................24
3-6-1 PCI EXPRESS CONFIGURATION ............................................................25
3-7 INTEGRATED PERIPHERALS...................................................................................25
3-8 POWER MANAGEMENT FEATURES .......................................................................26
3-9 MISCELLANEOUS CONFIGURATION.....................................................................27
3-10 PC HEALTH...............................................................................................................28
3-11 POWER USER OVERCLOCK SETTING..................................................................29
3-11-1 MEMORY CONFIGURATION ..................................................................31
3-12 BIOS SECURITY ......................................................................................................32
3-13 LOAD OPTIMAL/FAILSAFE DEFAULTS.................................................................33
3-14 SAVE CHANGES AND EXIT/DISCARD CHANGES AND EXIT..............................33
CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION
MAGIC INSTALL SUPPORTS WINDOWS XP/VISTA/7.....................................................35
4-1 ATI INSTALL ATI INTEGRATED DRIVER PACK.................................................36
4-2 SOUND INSTALL ALC HD AUDIO CODEC DRIVER...........................................36
4-3 LAN INSTALL GIGABIT ETHERNET NIC DRIVER ..............................................37
4-4 USB3.0 INSTALL USB3.0 DRIVER..........................................................................38
4-5 RAIDDISK INSTALL ATI SATA DRIVER AND UTILITY ...........................................39
4-6 NORTON INSTALLNORTON 2009 ANTI-VIRUS PROGRAM ............................39
4-7 HOW TO UPDATE BIOS ............................................................................................40
4-8 AMD PLATFORM RAID FUNCTION INSTALLATION...............................................40
4-9 G.P.I FUNCTION LED DISPLAY................................................................................45
APPENDIX .................................................................................................................................46
TABLE OF CONTENT

iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE AMD 870 CHIPSET
MOTHERBOARD AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT
WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS
MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY
INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES
FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF
BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition March, 2011
Item Checklist
5AMD 870 Platform Processor Chipset based motherboard
5User’s Manual
5DVD for motherboard utilities
5Cable Package
5Switch Card
5I/O back panel shield
AMD AM3 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with increasing
operation clock, thermal management becomes increasingly crucial while building computer
systems. Maintaining the proper computing environment without thermal increasing is the key to
reliable, stable, and 24 hours system operation. The overall goal is keeping the processor
below its specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increasing surface area and concentrated airflow from attached active
cooling fans. In addition, interface materials allow effective transfers of heat from the
processor to the heatsink. For optimum heat transfer, AMD recommends the use of thermal
grease and mounting clips to attach the heatsink to the processor.
Please refer to the website below for collection of heatsinks evaluated and recommended for
Socket AM3 processors by AMD. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support Socket-AM3 processors.