2-Turnthepowerswitchon
3-AdjustingtheAir
flow
temperature
controlknob,waitforthe
temperature
Tostabilizefora
short
periodoftime.
Rater
tothe
temperature
distribution
Chart.
Foryourreference,werecommend
you
to
adjust
the
temperature
Around
300Όο
3501.Asforair
flow
incaseofthesmallnozzle,settheKnob1-3,in
another
nozzlesetif
from
4-6.WhenusingthesmallnozzleNeversetthe
temper-nature
controlknobtohigher
than
6.
4-placetheFPPick-UP
under
theIClead.Slipthepick-upwire
under
theilea.IfthewidthoftheICdoesnotmatchthesizeoftheFP
Pick-up,
adjust
thewidthofthewire,bysuppressingthewire.
5.
Meltthesolder
Hold
theironso
that
thenozzleislocateddirectlyover.Butnot-
achingtheIC,andallowthehotairtomeltthesolder.Becarefulnot
totouchtheleadsoftheI withthenozzle.
6.RemovetheIC.
Once
thesolderhasmelted,removetheICbyliftingtheFPPick-up
7.
turn
thepowerswitchoffAfterthepowerswitchis
turned
off,an
automaticblowingfunctionbegins
Cool
airthroughthepipeinorder
to
cool
boththe
heating
elementandtheHandle.Sodonotdies-
connect
theplug
during
this
cooling
process.IncaseyouofSOP,
PLCC,
decoderitbyusingtweezers,etcQFPsoldering
1-Applythesolder
paste
Apply
theproper
quantity
ofsolder
paste
and
install
theSMDon
theΡWB.
2-Preheat
DMD
Refer
tothephototo
preheat
SMD
3-SoIdering
Heat
theleadfarmevenly
4-Washing
When
solderingiscompleted,washawaytheflux.
Note:
while
there
is
merits
tosolderbyhotair,itisalsopossibletocause
Thedefectssuchassolderballs,solderbridges.
We
recommendyoutoexaminetheconditionsofsoldering
sufficiently.