Bailey infi90 IMMFP03 User manual

®
®
Process Control and
Automation Solutions
from Elsag Bailey Group
E96-203
Multi-Function Processor Module
(IMMFP03/IMMFP03B)

WARNING notices as used in this instruction apply to hazards or unsafe practices that could result in
personal injury or death.
CAUTION notices apply to hazards or unsafe practices that could result in property damage.
NOTES highlight procedures and contain information that assists the operator in understanding the
information contained in this instruction.
WARNING
INSTRUCTION MANUALS
DO NOT INSTALL, MAINTAIN, OR OPERATE THIS EQUIPMENT WITHOUT READING, UNDERSTANDING,
AND FOLLOWING THE PROPER Elsag Bailey INSTRUCTIONS AND MANUALS; OTHERWISE, INJURY OR
DAMAGE MAY RESULT.
RADIO FREQUENCY INTERFERENCE
MOST ELECTRONIC EQUIPMENT IS INFLUENCED BY RADIO FREQUENCY INTERFERENCE (RFI). CAU-
TION SHOULD BE EXERCISED WITH REGARD TO THE USE OF PORTABLE COMMUNICATIONS EQUIP-
MENT IN THE AREA AROUND SUCH EQUIPMENT. PRUDENT PRACTICE DICTATES THAT SIGNS
SHOULD BE POSTED IN THE VICINITY OF THE EQUIPMENT CAUTIONING AGAINST THE USE OF POR-
TABLE COMMUNICATIONS EQUIPMENT.
POSSIBLE PROCESS UPSETS
MAINTENANCE MUST BE PERFORMED ONLY BY QUALIFIED PERSONNEL AND ONLY AFTER SECURING
EQUIPMENT CONTROLLED BY THIS PRODUCT. ADJUSTING OR REMOVING THIS PRODUCT WHILE IT IS
IN THE SYSTEM MAY UPSET THE PROCESS BEING CONTROLLED. SOME PROCESS UPSETS MAY
CAUSE INJURY OR DAMAGE.
AVERTISSEMENT
MANUELS D’OPÉRATION
NE PAS METTRE EN PLACE, RÉPARER OU FAIRE FONCTIONNER L’ÉQUIPEMENT SANS AVOIR LU,
COMPRIS ET SUIVI LES INSTRUCTIONS RÉGLEMENTAIRES DE Elsag Bailey. TOUTE NÉGLIGENCE À
CET ÉGARD POURRAIT ÊTRE UNE CAUSE D’ACCIDENT OU DE DÉFAILLANCE DU MATÉRIEL.
PERTURBATIONS PAR FRÉQUENCE RADIO
LA PLUPART DES ÉQUIPEMENTS ÉLECTRONIQUES SONT SENSIBLES AUX PERTURBATIONS PAR
FRÉQUENCE RADIO. DES PRÉCAUTIONS DEVRONT ÊTRE PRISES LORS DE L’UTILISATION DU MATÉ-
RIEL DE COMMUNICATION PORTATIF. LA PRUDENCE EXIGE QUE LES PRÉCAUTIONS À PRENDRE
DANS CE CAS SOIENT SIGNALÉES AUX ENDROITS VOULUS DANS VOTRE USINE.
PERTURBATIONS DU PROCÉDÉ
L’ENTRETIEN DOIT ÊTRE ASSURÉ PAR UNE PERSONNE QUALIFIÉE EN CONSIDÉRANT L’ASPECT
SÉCURITAIRE DES ÉQUIPEMENTS CONTRÔLÉS PAR CE PRODUIT. L’AJUSTEMENT ET/OU L’EXTRAC-
TION DE CE PRODUIT PEUT OCCASIONNER DES À-COUPS AU PROCÉDÉ CONTRÔLE LORSQU’IL EST
INSÉRÉ DANS UNE SYSTÈME ACTIF. CES À-COUPS PEUVENT ÉGALEMENT OCCASIONNER DES
BLESSURES OU DES DOMMAGES MATÉREILS.
NOTICE
The information contained in this document is subject to change without notice.
Elsag Bailey, its affiliates, employees, and agents, and the authors and contributors to this publication specif-
ically disclaim all liabilities and warranties, express and implied (including warranties of merchantability and
fitness for a particular purpose), for the accuracy, currency, completeness, and/or reliability of the information
contained herein and/or for the fitness for any particular use and/or for the performance of any material and/
or equipment selected in whole or part with the user of/or in reliance upon information contained herein.
Selection of materials and/or equipment is at the sole risk of the user of this publication.
This document contains proprietary information of Elsag Bailey, Elsag Bailey Process Automation, and
is issued in strict confidence. Its use, or reproduction for use, for the reverse engineering, development
or manufacture of hardware or software described herein is prohibited. No part of this document may be
photocopied or reproduced without the prior written consent of Elsag Bailey.

I-E96-203C
Preface
The IMMFP03 and IMMFP03B Multi-Function Processor Mod-
ules are powerful stand-alone process controllers for use in
complex control applications. They have the processing speed
and storage capabilities necessary for advanced control appli-
cations. The IMMFP03 module is a user-configurable device
that receives process input and output through a variety of
analog and digital I/O modules. The IMMFP03B module has
the same function as the IMMFP03 module and has more
memory. The IMMPI01 Multi-Function Processor Interface
Module is an I/O module that provides serial channels for the
IMMFP03 and IMMFP03B modules.
This instruction provides information about how the
IMMFP03 and IMMFP03B modules work, and how they are
installed and configured. It also contains operating and trou-
bleshooting procedures. This instruction discusses the
IMMFP03 and IMMFP03B modules together since they are
similar. Differences are noted as they occur. The reader is
presumed to have some process control background.

I-E96-203C
Elsag Ba
i
l
e
y
Process Automa
t
i
o
n
List of Effective Pages
Total number of pages in this instruction is 82, consisting of the following:
Page No. Change Date
Preface Original
List of Effective Pages Original
iii through viii Original
1-1 through 1-6 Original
2-1 through 2-7 Original
3-1 through 3-13 Original
4-1 through 4-5 Original
5-1 through 5-12 Original
6-1 through 6-3 Original
7-1 through 7-2 Original
8-1 Original
A-1 through A-5 Original
B-1 through B-7 Original
C-1 through C-5 Original
D-1 through D-6 Original
Index-1 through Index-2 Original
When an update is received, insert the latest changed pages and dispose of the super-
seded pages.
NOTE: On an update page, the changed text or table is indicated by a vertical bar in the outer
margin of the page adjacent to the changed area. A changed figure is indicated by a vertical bar in
the outer margin next to the figure caption. The date the update was prepared will appear beside
the page number.

I-E96-203C vii
Safety Summary
GENERAL
WARNINGS Equipment Environment
All components, whether in transportation, operation or storage,
must be in a noncorrosive environment.
Electrical Shock Hazard During Maintenance
Disconnect power or take precautions to insure that contact with
energized parts is avoided when servicing.
Special Handling
This module uses electrostatic sensitive devices.
SPECIFIC
WARNINGS Disconnect power before installing dipshunts on the module
mounting unit backplane. Failure to do so will result in contact with
cabinet areas that could cause severe or fatal shock. (p. 3-10)
Wear eye protection whenever working with cleaning solvents.
When removing solvents from printed circuit boards using com-
pressed air, injury to the eyes could result from splashing solvent
as it is removed from the printed circuit board. (p. 6-1)
SPECIFIC
CAUTIONS Never operate the MFP module with the machine fault timer circuit
disabled (jumper pins connected). Unpredictable module outputs
and configuration corruption may result. The unpredictable module
outputs may damage control equipment connected to the MFP
module. (p. 3-12)
To avoid potential module damage, evaluate your system for com-
patibility prior to module installation. This module uses connec-
tions to the module mounting unit backplane that served other
functions in early Network 90 systems. (p. 3-12)

viii I-E96-203C
Sommaire de Sécurité
Elsag Ba
i
l
e
y
Process Automa
t
i
o
n
AVERTISSEMENTS
D’ORDRE
GÉNÉRAL
Environnement de l’équipement
Ne pas soumettre les composants à une atmosphère corrosive
lors du transport, de l’entreposage ou l’utilisation.
Possibilité de chocs électriques durant l’entretien
Débrancher l’alimentation ou prendre les précautions pour éviter
tout contact avec des composants sous tension durant l’entretien.
Precautions de Manutention
Ce module contient des composantes sensibles aux decharges
electro-statiques.
AVERTISSEMENTS
D’ORDRE
SPÉCIFIQUE
Interrompez l'alimentation avant d'installer des dipshunts sur le
fond de panier du châssis de montage des modules. Sinon, tout
contact avec cette zone entraîne des risques d'électrocution
sérieuse ou fatale. (p. 3-10)
Des lunettes de protection devraient être portées lors de travail
avec des solvants nettoyants. Lorsqu'on enlève les solvants des
circuits imprimés à l'aide d'air comprimé, les éclaboussures de
solvant pourraient causer des blessures aux yeux. (p. 6-1)
ATTENTIONS
D’ORDRE
SPÉCIFIQUE
N'utilisez jamais un module MFP sans l'usage de sa minuterie de
détection de défaillance (c'est à dire avec le cavalier en place).
Les sorties du module pourraient prendre des valeurs ou des états
imprévisibles, et la configuration pourrait être corrompue. Le com-
portement imprévisible des sorties pourrait endommager le maté-
riel de commande relié au module MFP. (p. 3-12)
Pour éviter d'endommager des modules, évaluez la compatibilité
de votre système avant de les y brancher. L'uage que fait ce mod-
ule de certianes connexions au fond de panier du châssis de mon-
tage diffère de l'assignation prévue par le système Network 90
original. (p. 3-12)

Table of Contents
Page
I-E96-203C iii
SECTION 1 - INTRODUCTION............................................................................................... 1-1
OVERVIEW ..............................................................................................................1-1
INTENDED USER .....................................................................................................1-1
HARDWARE DESCRIPTION ......................................................................................1-1
Faceplate ...........................................................................................................1-2
Circuit Board .....................................................................................................1-3
HARDWARE APPLICATION .......................................................................................1-3
FEATURES...............................................................................................................1-3
INSTRUCTION CONTENT..........................................................................................1-3
HOW TO USE THIS INSTRUCTION............................................................................1-4
GLOSSARY OF TERMS AND ABBREVIATIONS ..........................................................1-4
REFERENCE DOCUMENTS ......................................................................................1-5
NOMENCLATURE.....................................................................................................1-5
SPECIFICATIONS .....................................................................................................1-6
SECTION 2 - DESCRIPTION AND OPERATION................................................................... 2-1
INTRODUCTION .......................................................................................................2-1
MFP MODULE OPERATION ......................................................................................2-1
MFP MODULE CIRCUITRY........................................................................................2-2
Microprocessor...................................................................................................2-2
Clock and Real Time Clock .................................................................................2-3
Memory..............................................................................................................2-3
Direct Memory Access ........................................................................................2-3
Controlway.........................................................................................................2-4
Redundancy Link ...............................................................................................2-4
I/O Expander Bus ..............................................................................................2-5
I/O Section ........................................................................................................2-5
MPI MODULE OPERATION .......................................................................................2-5
MPI MODULE CIRCUITRY ........................................................................................2-6
Serial Channels (DUART) ....................................................................................2-6
Station Link .......................................................................................................2-7
SECTION 3 - INSTALLATION................................................................................................ 3-1
INTRODUCTION .......................................................................................................3-1
SPECIAL HANDLING ................................................................................................3-1
UNPACKING AND INSPECTION.................................................................................3-2
IMMFP03 DIPSWITCHES AND JUMPERS ..................................................................3-2
Dipswitch UUB0 - Module Address .....................................................................3-3
Dipswitch UMB1 - Module Options and Diagnostics ............................................3-4
Special Operations .............................................................................................3-5
Dipswitch LMB2 - Module Options and SCSI Bus Address ..................................3-6
Dipswitch LLB3 - Module Options.......................................................................3-7
Jumpers J1, J2, J4 and J5 .................................................................................3-7
HW SETUP Socket Jumper .................................................................................3-8
IMMPI01 JUMPER SETTINGS ...................................................................................3-8
PREPARING THE MODULE MOUNTING UNIT ...........................................................3-9
Module Slot Assignments ...................................................................................3-9
Dipshunts........................................................................................................3-10
Controlway Cable .............................................................................................3-10
INSTALLING THE TERMINATION UNIT OR MODULE AND FIELD WIRING ...............3-11
NTMP01 Termination Unit Installation ..............................................................3-11
NIMP01 or NIMP02 Termination Module Installation .........................................3-11
INSTALLING THE MODULES ..................................................................................3-12

iv I-E96-203C
Table of Contents (continued)
Page
Elsag Ba
i
l
e
y
Process Automat
i
o
n
SECTION 4 - OPERATING PROCEDURES ...........................................................................4-1
INTRODUCTION ...................................................................................................... 4-1
MFP MODULE START-UP......................................................................................... 4-1
MFP MODULE LEDs ................................................................................................ 4-1
Front Panel LEDs .............................................................................................. 4-2
Red/Green Status LED ...................................................................................... 4-3
MFP MODULE STOP/RESET SWITCH ...................................................................... 4-3
MFP MODULE MODES OF OPERATION ................................................................... 4-4
Configure Mode ................................................................................................. 4-4
Execute Mode .................................................................................................... 4-4
Error Mode ........................................................................................................ 4-4
MPI MODULE OPERATION....................................................................................... 4-5
MPI MODULE LED................................................................................................... 4-5
SECTION 5 - TROUBLESHOOTING ......................................................................................5-1
INTRODUCTION ...................................................................................................... 5-1
CARD EDGE CONNECTORS .................................................................................... 5-5
DIAGNOSTICS ......................................................................................................... 5-7
Overview............................................................................................................ 5-7
Dipswitch Selection ........................................................................................... 5-8
LED Display .................................................................................................... 5-10
IMMFP03 MODULE STATUS SUMMARY ................................................................. 5-11
SECTION 6 - MAINTENANCE................................................................................................6-1
INTRODUCTION ...................................................................................................... 6-1
PREVENTIVE MAINTENANCE SCHEDULE................................................................ 6-1
EQUIPMENT AND TOOLS REQUIRED ...................................................................... 6-2
PREVENTIVE MAINTENANCE PROCEDURES ........................................................... 6-2
Printed Circuit Board Cleaning .......................................................................... 6-2
General Cleaning and Washing........................................................................ 6-2
Edge Connector Cleaning ................................................................................ 6-3
Checking Connections ....................................................................................... 6-3
SECTION 7 - REPAIR/REPLACEMENT PROCEDURES .......................................................7-1
INTRODUCTION ...................................................................................................... 7-1
MODULE REPLACEMENT PROCEDURE................................................................... 7-1
TERMINATION UNIT OR MODULE REPLACEMENT PROCEDURES ........................... 7-2
SECTION 8 - SUPPORT SERVICES ......................................................................................8-1
INTRODUCTION ...................................................................................................... 8-1
REPLACEMENT PARTS AND ORDERING INFORMATION .......................................... 8-1
TRAINING................................................................................................................ 8-1
TECHNICAL DOCUMENTATION ............................................................................... 8-1
APPENDIX A - QUICK REFERENCE MATERIAL................................................................. A-1
INTRODUCTION ...................................................................................................... A-1
APPENDIX B - ON-LINE CONFIGURATION......................................................................... B-1
INTRODUCTION ......................................................................................................B-1
SETUP.....................................................................................................................B-1

I-E96-203C v
Table of Contents (continued)
Page
APPENDIX B - ON-LINE CONFIGURATION
(continued)
OPERATION ............................................................................................................ B-1
Backup Cycle .................................................................................................... B-3
Primary Cycle.................................................................................................... B-6
APPENDIX C - NTMP01 CONFIGURATION..........................................................................C-1
INTRODUCTION ...................................................................................................... C-1
APPENDIX D - NIMP01 AND NIMP02 CONFIGURATION.....................................................D-1
INTRODUCTION ...................................................................................................... D-1
List of Figures
No. Title Page
1-1. Example IMMFP03 and IMMPI01 Application ......................................................1-2
2-1. MFP Functional Block Diagram ..........................................................................2-2
2-2. MPI Functional Block Diagram ...........................................................................2-6
3-1. Multi-Function Processor Module Layout ............................................................3-3
3-2. IMMPI01 Jumper Locations ................................................................................3-8
3-3. IMMPI01 Jumper J1 Settings..............................................................................3-9
3-4. IMMPI01 Jumper J2 Settings..............................................................................3-9
3-5. Controlway Cable Installation ...........................................................................3-10
4-1. MFP Front Panel ................................................................................................4-2
4-2. MPI Front Panel .................................................................................................4-5
5-1. MFP Troubleshooting Flowchart (Serial Port) .......................................................5-4
5-2. MFP Troubleshooting Flowchart (Status LED) .....................................................5-5
5-3. Diagnostic Dipswitch Positions ...........................................................................5-8
5-4. LEDs - Pass/Fail ..............................................................................................5-10
B-1. Backup MFP Module Operating Cycle ................................................................ B-5
B-2. Primary MFP Module Operating Cycle ................................................................ B-7
C-1. NTMP01 DTE Jumper Configuration .................................................................. C-1
C-2. NTMP01 DCE Jumper Configuration.................................................................. C-2
C-3. NTMP01 Nonhandshake Jumper Configuration .................................................. C-2
C-4. NTMP01 Loopback Jumper Configuration .......................................................... C-3
C-5. NTMP01 Jumpers J3 through J10 Configuration ............................................... C-3
C-6. NTMP01 Jumpers J14 through J17 Configuration.............................................. C-4
C-7. NTMP01 Connector Assignments and Jumper Locations .................................... C-4
C-8. NTMP01 Cable Connections for Redundant IMMFP03 and IMMPI01 Modules ...... C-5
D-1. NIMP01 DTE Jumper Configuration ................................................................... D-2
D-2. NIMP01 DCE Jumper Configuration .................................................................. D-2
D-3. NIMP01 Nonhandshake Jumper Configuration................................................... D-2
D-4. NIMP01 Loopback Jumper Configuration ........................................................... D-3
D-5. NIMP01 Jumpers J5 through J10 Configuration ................................................ D-3
D-6. NIMP01 Jumpers J14 through J17 Configuration .............................................. D-4
D-7. NIMP01 Connector Assignments and Jumper Locations ..................................... D-4
D-8. NIMP01 Cable Connections for Single MFP and MPI Modules ............................. D-5
D-9. NIMP01 and NIMP02 Cable Connections for Redundant MFP and MPI Modules .. D-6

vi I-E96-203C
No. Title Page
List of Tables
Elsag Ba
i
l
e
y
Process Automat
i
o
n
1-1. Glossary of Terms and Abbreviations ..................................................................... 1-4
1-2. Reference Documents ............................................................................................ 1-5
1-3. Nomenclature........................................................................................................ 1-5
1-4. Specifications ........................................................................................................ 1-6
3-1. Dipswitch UUB0 Settings for MFP Operation ......................................................... 3-4
3-2. Dipswitch UUB0 Settings for MFP Address ............................................................ 3-4
3-3. Dipswitch UMB1 Options and Diagnostics ............................................................. 3-4
3-4. Dipswitch UMB1 Special Operation Settings .......................................................... 3-5
3-5. Dipswitch LLB3 Option Settings ............................................................................ 3-7
3-6. Jumpers J1, J2, J4 and J5 Settings ...................................................................... 3-7
3-7. HW SETUP Socket Jumper Settings....................................................................... 3-8
5-1. IMMFP03 Error Codes ........................................................................................... 5-1
5-2. Other MFP Module Conditions............................................................................... 5-3
5-3. MFP Connector P1 Pin Assignments ...................................................................... 5-5
5-4. MFP Connector P2 Pin Assignments ...................................................................... 5-6
5-5. MFP Connector P3 Pin Assignments ...................................................................... 5-6
5-6. MFP Connector P4 Pin Assignments ...................................................................... 5-6
5-7. MPI Connector P1 Pin Assignments ....................................................................... 5-6
5-8. MPI Connector P3 Pin Assignments ....................................................................... 5-7
5-9. DSO and MFP Setup for I/O Expander Bus Test .................................................... 5-8
5-10. Diagnostic Tests .................................................................................................... 5-9
5-11. IMMFP03 Status Report ...................................................................................... 5-11
5-12. Field Descriptions of the MFP Status Report ........................................................ 5-12
6-1. Preventive Maintenance Schedule .......................................................................... 6-2
8-1. Spare Parts List..................................................................................................... 8-1
A-1. Dipswitch UUB0 Settings for MFP Operation .........................................................A-1
A-2. Dipswitch UUB0 Settings for MFP Address ............................................................A-1
A-3. Dipswitch UMB1 Options and Diagnostics .............................................................A-1
A-4. Dipswitch UMB1 Special Operation Settings ..........................................................A-2
A-5. Dipswitch LLB3 Option Settings ............................................................................A-2
A-6. Jumpers J1, J2, J4 and J5 Settings ......................................................................A-3
A-7. HW SETUP Socket Jumper Settings.......................................................................A-3
A-8. Front Panel LED Error Codes ................................................................................A-3
A-9. Other LED Conditions ...........................................................................................A-5
B-1. Legend of Symbols.................................................................................................B-2
B-2. Backup Cycle ........................................................................................................B-3
B-3. Primary Cycle ........................................................................................................B-6