Bailey infi90 IMMFP11 User manual



Process Control and
Automation Solutions
from Elsag Bailey Group
IMMFP11
Multi-Function Processor Module

WARNING notices as used in this instruction apply to hazards or unsafe practices that could result in
personal injury or death.
CAUTION notices apply to hazards or unsafe practices that could result in property damage.
NOTES highlight procedures and contain information that assists the operator in understanding the
information contained in this instruction.
WARNING
INSTRUCTION MANUALS
DO NOT INSTALL, MAINTAIN, OR OPERATE THIS EQUIPMENT WITHOUT READING, UNDERSTANDING,
AND FOLLOWING THE PROPER Elsag Bailey INSTRUCTIONS AND MANUALS; OTHERWISE, INJURY OR
DAMAGE MAY RESULT.
RADIO FREQUENCY INTERFERENCE
MOST ELECTRONIC EQUIPMENT IS INFLUENCED BY RADIO FREQUENCY INTERFERENCE (RFI). CAU-
TION SHOULD BE EXERCISED WITH REGARD TO THE USE OF PORTABLE COMMUNICATIONS EQUIP-
MENT IN THE AREA AROUND SUCH EQUIPMENT. PRUDENT PRACTICE DICTATES THAT SIGNS
SHOULD BE POSTED IN THE VICINITY OF THE EQUIPMENT CAUTIONING AGAINST THE USE OF POR-
TABLE COMMUNICATIONS EQUIPMENT.
POSSIBLE PROCESS UPSETS
MAINTENANCE MUST BE PERFORMED ONLY BY QUALIFIED PERSONNEL AND ONLY AFTER SECURING
EQUIPMENT CONTROLLED BY THIS PRODUCT. ADJUSTING OR REMOVING THIS PRODUCT WHILE IT IS
IN THE SYSTEM MAY UPSET THE PROCESS BEING CONTROLLED. SOME PROCESS UPSETS MAY
CAUSE INJURY OR DAMAGE.
NOTICE
The information contained in this document is subject to change without notice.
Elsag Bailey, its affiliates, employees, and agents, and the authors and contributors to this publication specif-
ically disclaim all liabilities and warranties, express and implied (including warranties of merchantability and
fitness for a particular purpose), for the accuracy, currency, completeness, and/or reliability of the information
contained herein and/or for the fitness for any particular use and/or for the performance of any material and/
or equipment selected in whole or part with the user of/or in reliance upon information contained herein.
Selection of materials and/or equipment is at the sole risk of the user of this publication.
This document contains proprietary information of Elsag Bailey, Elsag Bailey Process Automation, and
is issued in strict confidence. Its use, or reproduction for use, for the reverse engineering, development
or manufacture of hardware or software described herein is prohibited. No part of this document may be
photocopied or reproduced without the prior written consent of Elsag Bailey.

WBPEEUI230018A0
Preface
The IMMFP11 Multi-Function Processor Module is a powerful
stand-alone controller for use in complex control applications.
It has the processing speeds and storage capabilities necessary
for advanced control applications. The IMMFP11 module is a
user-configurable device that receives process input and out-
put through a variety of analog and digital I/O modules.
This instruction manual provides information about how the
IMMFP11 module works and how to install, configure, operate,
and troubleshoot the module.

WBPEEUI230018A0
®
List of Effective Pages
Total number of pages in this instruction is 73, consisting of the following:
Page No. Change Date
Preface Original
List of Effective Pages Original
iii through viii Original
1-1 through 1-7 Original
2-1 through 2-4 Original
3-1 through 3-10 Original
4-1 through 4-4 Original
5-1 through 5-12 Original
6-1 through 6-4 Original
7-1 Original
8-1 Original
A-1 through A-4 Original
B-1 through B-6 Original
C-1 through C-5 Original
D-1 through D-5 Original
Index-1 through Index-2 Original
When an update is received, insert the latest changed pages and dispose of the super-
seded pages.
NOTE: On an update page, the changed text or table is indicated by a vertical bar in the outer mar-
gin of the page adjacent to the changed area. A changed figure is indicated by a vertical bar in the
outer margin next to the figure caption. The date the update was prepared will appear beside the
page number.

Table of Contents
Page
WBPEEUI230018A0 iii
SECTION 1 - INTRODUCTION....................................................................................................1-1
OVERVIEW ..................................................................................................................1-1
INTENDED USER .........................................................................................................1-1
HARDWARE DESCRIPTION..........................................................................................1-1
Faceplate ...............................................................................................................1-2
Circuit Board .........................................................................................................1-3
HARDWARE APPLICATION...........................................................................................1-3
FEATURES...................................................................................................................1-3
INSTRUCTION CONTENT .............................................................................................1-3
HOW TO USE THIS MANUAL ........................................................................................1-4
REFERENCE DOCUMENTS..........................................................................................1-4
NOMENCLATURE ........................................................................................................1-5
DOCUMENT CONVENTIONS ........................................................................................1-5
GLOSSARY OF TERMS AND ABBREVIATIONS .............................................................1-5
SPECIFICATIONS .........................................................................................................1-6
SECTION 2 - DESCRIPTION AND OPERATION........................................................................2-1
INTRODUCTION...........................................................................................................2-1
MICROPROCESSOR.....................................................................................................2-1
CLOCK AND TIMER .....................................................................................................2-2
MEMORY .....................................................................................................................2-2
I/O EXPANDER BUS ....................................................................................................2-2
I/O SECTION ...............................................................................................................2-2
SERIAL CHANNELS......................................................................................................2-3
DMA SECTION .............................................................................................................2-3
CONTROLWAY .............................................................................................................2-3
REDUNDANCY LINK ....................................................................................................2-4
STATION LINK..............................................................................................................2-4
SECTION 3 - INSTALLATION.....................................................................................................3-1
INTRODUCTION...........................................................................................................3-1
SPECIAL HANDLING ....................................................................................................3-1
UNPACKING AND INSPECTION ....................................................................................3-2
SETUP AND PHYSICAL INSTALLATION ........................................................................3-2
Dipswitch SW3 Settings .........................................................................................3-3
Dipswitch SW4 Settings .........................................................................................3-3
Special Operations .................................................................................................3-5
Jumpers J1 through J5 .........................................................................................3-6
PREPARING THE MODULE MOUNTING UNIT ...............................................................3-7
Dipshunts..............................................................................................................3-7
Controlway Cable...................................................................................................3-8
INSTALLING THE TERMINATION UNIT OR MODULE ....................................................3-8
NTMP01 Termination Unit Installation ...................................................................3-8
NIMP01 or NIMP02 Termination Module Installation ..............................................3-9
INSTALLING THE MODULE ..........................................................................................3-9
SECTION 4 - OPERATING PROCEDURES................................................................................4-1
INTRODUCTION...........................................................................................................4-1
START-UP ....................................................................................................................4-1
LED INDICATORS ........................................................................................................4-1
Front Panel LEDs One through Eight .....................................................................4-2

iv WBPEEUI230018A0
Table of Contents (continued)
Page
®
SECTION 4 - OPERATING PROCEDURES
(continued)
Red/Green Status LED .......................................................................................... 4-2
STOP/RESET SWITCH................................................................................................. 4-3
MODES OF OPERATION .............................................................................................. 4-4
Configure Mode ..................................................................................................... 4-4
Execute Mode ........................................................................................................ 4-4
Error Mode ............................................................................................................ 4-4
SECTION 5 - TROUBLESHOOTING...........................................................................................5-1
INTRODUCTION .......................................................................................................... 5-1
CARD EDGE CONNECTORS ........................................................................................ 5-5
DIAGNOSTICS ............................................................................................................. 5-6
Overview ............................................................................................................... 5-6
Dipswitch Selection ............................................................................................... 5-7
LED Display .......................................................................................................... 5-9
MODULE STATUS SUMMARY .................................................................................... 5-10
SECTION 6 - MAINTENANCE.....................................................................................................6-1
INTRODUCTION .......................................................................................................... 6-1
PREVENTIVE MAINTENANCE SCHEDULE ................................................................... 6-1
EQUIPMENT AND TOOLS REQUIRED .......................................................................... 6-2
PREVENTIVE MAINTENANCE PROCEDURES .............................................................. 6-2
Printed Circuit Board Cleaning .............................................................................. 6-2
GENERAL CLEANING AND WASHING ............................................................. 6-3
EDGE CONNECTOR CLEANING ...................................................................... 6-3
Checking Connections ........................................................................................... 6-3
SECTION 7 - REPAIR/REPLACEMENT PROCEDURES...........................................................7-1
INTRODUCTION .......................................................................................................... 7-1
MODULE REPLACEMENT PROCEDURE ...................................................................... 7-1
TERMINATION UNIT OR MODULE REPLACEMENT PROCEDURES .............................. 7-1
SECTION 8 - SUPPORT SERVICES...........................................................................................8-1
INTRODUCTION .......................................................................................................... 8-1
REPLACEMENT PARTS AND ORDERING INFORMATION.............................................. 8-1
TRAINING.................................................................................................................... 8-1
TECHNICAL DOCUMENTATION................................................................................... 8-1
APPENDIX A - QUICK REFERENCE MATERIAL.....................................................................A-1
INTRODUCTION ..........................................................................................................A-1
APPENDIX B - ON-LINE CONFIGURATION .............................................................................B-1
INTRODUCTION ..........................................................................................................B-1
SETUP.........................................................................................................................B-1
OPERATION.................................................................................................................B-1
Backup Cycle ........................................................................................................B-3
Primary Cycle ........................................................................................................B-4
APPENDIX C - NTMP01 TERMINATION UNIT CONFIGURATION ..........................................C-1
INTRODUCTION ..........................................................................................................C-1

WBPEEUI230018A0 v
Table of Contents (continued)
Page
APPENDIX D - NIMP01 AND NIMP02 TERMINATION MODULE CONFIGURATION..............D-1
INTRODUCTION.......................................................................................................... D-1
List of Figures
No. Title Page
1-1. Example IMMFP11 Module Applications .................................................................1-2
2-1. IMMFP11 Module Functional Block Diagram ..........................................................2-1
3-1. IMMFP11 Module Layout .......................................................................................3-3
3-2. Controlway Cable Installation ................................................................................3-8
4-1. IMMFP11 Front Panel LEDs and Controls ..............................................................4-2
5-1. IMMFP11 Troubleshooting Flowchart (Serial Port) ..................................................5-4
5-2. IMMFP11 Troubleshooting Flowchart (Status LED) .................................................5-5
5-3. Diagnostic Dipswitch Settings ................................................................................5-8
5-4. LEDs - Pass/Fail..................................................................................................5-10
B-1. Backup MFP Module Operating Cycle .................................................................... B-5
B-2. Primary MFP Module Operating Cycle ................................................................... B-6
C-1. DTE Jumper Configuration for NTMP01 Termination Unit ..................................... C-1
C-2. DCE Jumper Configuration for NTMP01 Termination Unit ..................................... C-2
C-3. NTMP01 Nonhandshake Jumper Configuration ..................................................... C-2
C-4. NTMP01 Loopback Jumper Configuration ............................................................. C-3
C-5. NTMP01 Jumpers J3 through J10 Configuration ................................................... C-3
C-6. NTMP01 Jumpers J14 through J17 Configuration ................................................. C-4
C-7. NTMP01 Connector Assignments and Jumper Locations ....................................... C-4
C-8. NTMP01 Cable Connections for Redundant MFP Modules ...................................... C-5
C-9. NTMP01 Cable Connections for a Single MFP Module ............................................ C-5
D-1. DTE Jumper Configuration for NIMP01 Termination Module ................................. D-2
D-2. DCE Jumper Configuration for NIMP01 Termination Module ................................. D-2
D-3. NIMP01 Nonhandshake Jumper Configuration ...................................................... D-3
D-4. NIMP01 Loopback Jumper Configuration .............................................................. D-3
D-5. NIMP01 Jumpers J5 through J10 Configuration.................................................... D-3
D-6. NIMP01 Jumpers J14 through J17 Configuration .................................................. D-4
D-7. NIMP01 Connector Assignments and Jumper Locations ........................................ D-4
D-8. NIMP01 and NIMP02 Cable Connections for Redundant MFP Modules ................... D-5
D-9. NIMP01 Cable Connections for a Single MFP Module ............................................. D-5
List of Tables
No. Title Page
1-1. Reference Documents ............................................................................................1-4
1-2. Nomenclature ........................................................................................................1-5
1-3. Glossary of Terms and Abbreviations ......................................................................1-5
1-4. Specifications.........................................................................................................1-6

List of Tables (continued)
No. Title Page
vi WBPEEUI230018A0vi WBPEEUI230018A0
®
3-1. IMMFP11 Dipswitch SW3 Settings ......................................................................... 3-4
3-2. Example IMMFP11 Module Address Settings.......................................................... 3-4
3-3. IMMFP11 Dipswitch SW4 Normal Operation Settings ............................................. 3-4
3-4. IMMFP11 Dipswitch SW4 Special Operation Settings ............................................. 3-5
3-5. IMMFP11 Jumper J1 through J5 Settings .............................................................. 3-7
5-1. IMMFP11 Module Error Codes ............................................................................... 5-1
5-2. IMMFP11 Module Error Codes ............................................................................... 5-3
5-3. IMMFP11 Connector P1 Pin Assignments ............................................................... 5-5
5-4. IMMFP11 Connector P2 Pin Assignments ............................................................... 5-6
5-5. IMMFP11 Connector P3 Pin Assignments ............................................................... 5-6
5-6. IMDSM05 Module Setup for IMMFP11 Tests .......................................................... 5-7
5-7. IMDSM05 Jumper Settings for IMMFP02 Tests ...................................................... 5-7
5-8. Diagnostic Tests .................................................................................................... 5-8
5-9. IMMFP11 Module Status Report .......................................................................... 5-11
5-10. Field Descriptions of the IMMFP11 Module Status Report .................................... 5-11
6-1. Preventive Maintenance Schedule .......................................................................... 6-2
8-1. Spare Parts List ..................................................................................................... 8-1
A-1. IMMFP11 Dipswitch SW3 Settings .........................................................................A-1
A-2. IMMFP11 Dipswitch SW4 Settings .........................................................................A-1
A-3. IMMFP11 Jumper J5 Settings ................................................................................A-2
A-4. IMMFP11 Module Error Codes ...............................................................................A-2
A-5. Other IMMFP11 Module LED Conditions ................................................................ A-4
B-1. Legend of Symbols .................................................................................................B-2
B-2. Backup Cycle ........................................................................................................B-3
B-3. Primary Cycle ........................................................................................................B-5

WBPEEUI230018A0 vii
Safety Summary
GENERAL
WARNINGS Equipment Environment
All components, whether in transportation, operation or storage,
must be in a noncorrosive environment.
Electrical Shock Hazard During Maintenance
Disconnect power or take precautions to insure that contact with
energized parts is avoided when servicing.
Special Handling
This module uses electrostatic sensitive devices.
SPECIFIC
WARNINGS Disconnect power before installing dipshunts on the module mount-
ing unit backplane. Failure to do so will result in contact with cabinet
areas that could cause severe or fatal shock. (p. 3-7)
Wear eye protection whenever working with cleaning solvents.
When removing solvents from printed circuit boards using com-
pressed air, injury to the eyes could result from splashing solvent as
it is blown off the printed circuit board. (p. 6-1)
SPECIFIC
CAUTIONS Never operate the MFP module with the machine fault timer circuit
disabled. Unpredictable module outputs and configuration corrup-
tion may result. The unpredictable module outputs may damage
control equipment connected to the MFP module. (p. 3-9)
To avoid potential module damage, evaluate your system for com-
patibility prior to module installation. This module uses connections
to the module mounting unit backplane that served other functions
in early Network 90 systems. (p. 3-10)

viii WBPEEUI230018A0
®
Trademarks and Registrations
Registrations and trademarks used in this document include:
® INFI 90 Registered trademark of Elsag Bailey Process Automation
® INFI-NET Registered trademark of Elsag Bailey Process Automation
® Network 90 Registered trademark of Elsag Bailey Process Automation

OVERVIEW
WBPEEUI230018A0 1 - 1
SECTION 1 - INTRODUCTION
OVERVIEW
The IMMFP11 Multi-Function Processor Module (MFP) is one of
the workhorses of the INFI 90® OPEN control module line. It is
a multiple loop analog, sequential, batch and advanced con-
troller that provides powerful solutions to process control
problems. It also handles data acquisition and information
processing requirements providing true peer-to-peer commu-
nications. The comprehensive set of function codes supported
by this module handles even the most complex control strate-
gies. The INFI 90 OPEN system uses a variety of analog and
digital I/O modules to communicate with and control the pro-
cess. The MFP module communicates with a maximum of 64 I/
O modules in any combination (refer to Figure 1-1).
The MFP module has three operating modes: execute, configure
and error. In the execute mode, the MFP module executes con-
trol algorithms while constantly checking itself for errors. When
an error is found, the front panel LEDs display an error code
corresponding to the type of error found. In the configure mode,
it is possible to edit existing or add new control algorithms. In
this mode, the MFP module does not execute control algo-
rithms. If the MFP module finds an error while in execute mode,
it automatically goes into error mode. Refer to Section 4 of this
manual for operating mode details.
A one-megabaud CPU to CPU communication link allows the
MFP module to accommodate redundant processors. This link
enables a backup MFP module to wait in a hot standby mode
while the primary MFP module executes the control algorithms.
If the primary MFP module goes off-line for any reason, a
bumpless transfer of control to the backup MFP module occurs.
INTENDED USER
Personnel installing, operating, or maintaining the MFP mod-
ule should read this manual before performing any installa-
tion, operation, or maintenance procedures. Installation
requires an engineer or technician with experience handling
electronic circuitry. Formal training in INFI 90 OPEN systems
and configuration (especially function codes) would help when
configuring the MFP module.
HARDWARE DESCRIPTION
The multifunction processor module consists of a faceplate and
circuit board.

INTRODUCTION
HARDWARE DESCRIPTION
1 - 2 WBPEEUI230018A0
®
Faceplate
The MFP faceplate measures 35.56 millimeters wide by 177.80
millimeters high (1.4 inches wide by seven inches high). Two
latching screws, one at the top, the other at the bottom, lock
the module assembly into the module mounting unit. A trans-
parent window on the faceplate permits viewing of LEDs one
through eight and the status LED. These LEDs display operat-
ing information. A small hole directly below the window pro-
vides access to the combination stop/reset pushbutton.
Besides locking the module in place, the faceplate also protects
the circuit components and promotes proper air flow within the
cabinet.
Figure 1-1. Example IMMFP11 Module Applications
T01697A
INFI-NET OR PLANT LOOP
®
NIS NIS NPM NPM
PROCESS
CONTROL
UNIT
INTERFACE
PROCESS
CONTROL
UNIT
INTERFACE
CONTROLWAY
I/O EXPANDER BUSI/O EXPANDER BUS
TMP IMP
ICS
IDSTCS
RS-232-C
PORTS
SAC
STATION SAC STATION SAC STATION
CIS CIS
IMPI/O
MODULE
UP TO 64 MODULES
I/O
MODULE
CONTROLWAY
MFP PRIMARY
MFP SECONDARY MFP

INTRODUCTION
HARDWARE APPLICATION
WBPEEUI230018A0 1 - 3
Circuit Board
The circuit board features state-of-the-art circuitry. On-board
circuitry consists of nonvolatile random access memory
(NVRAM), random access memory (RAM), read only memory
(ROM), a microprocessor running at 16 megahertz, direct
memory access (DMA) circuits, Bailey custom bus circuits and
various support circuitry. The board attaches to the faceplate
with two screws. The module assembly occupies one slot in a
module mounting unit.
HARDWARE APPLICATION
The multifunction processor module is ideally suited for appli-
cations requiring multiple loop control and module I/O. Since
it handles both analog and digital signals, the MFP module fits
into virtually any control scheme.
FEATURES
The MFP module has the following features:
•A high speed redundancy link.
•A serial communication port for station support.
•Two general purpose serial channels.
•Direct memory access circuitry.
•256 kilobytes of RAM memory.
•64 kilobytes of NVRAM memory.
INSTRUCTION CONTENT
This manual consists of eight sections and four appendices:
Introduction This section provides an overview of the module, a description
of the hardware, a glossary of unique terms, and a table of
physical, electrical, and environmental specifications.
Description and
Operation How the key circuits function is explained in this section.
Installation The handling, inspection, hardware configuration, and instal-
lation aspects of the module are described in this section.
Operating Procedures Front panel indicators and controls, and everyday operations
are discussed in this section.
Troubleshooting This section features detailed flow charts and tables that
enable quick diagnosis of error conditions and provide correc-
tive actions.

INTRODUCTION
HOW TO USE THIS MANUAL
1 - 4 WBPEEUI230018A0
®
Maintenance Scheduled module maintenance is covered by this section.
Repair/Replacement
Procedures This section describes how to replace the module.
Support Services A list of the replacement parts and an explanation of the war-
ranty policy are contained in this section.
Appendices These appendices provide quick reference information for the
hardware configuration of the IMMFP11 module and associ-
ated termination units and modules and step by step instruc-
tions for performing on-line configuration.
HOW TO USE THIS MANUAL
Read this instruction in sequence. Read Section 3 thoroughly.
It is important to become familiar with the entire contents of
this instruction before using the MFP module. Refer to the
table of contents or index to find specific information after the
module is operating.
1. Complete all steps in Section 3.
2. Thoroughly read Section 4 before applying power to the
module.
3. Refer to Section 5 if a problem occurs. This section will help
to diagnose and correct a problem.
4. Refer to Section 6 for scheduled maintenance require-
ments.
5. Go to Section 7 to find instructions on how to replace the
module.
6. Refer to Section 8 for replacement part and warranty infor-
mation.
REFERENCE DOCUMENTS
Table 1-1 lists the documents that provide additional informa-
tion for related equipment. Refer to them as needed.
Table 1-1. Reference Documents
Number Document
I-E96-200 Function Code Application Manual
I-E96-401 NIMP01/02 Multifunction Processor Termination Module
I-E96-428 NTMP01 Multifunction Processor Termination Unit

INTRODUCTION
NOMENCLATURE
WBPEEUI230018A0 1 - 5
NOMENCLATURE
Table 1-2 lists the nomenclature of related hardware.
DOCUMENT CONVENTIONS
The ? in a nomenclature or a part number indicates a variable
for that position (e.g., IMMFP1?)
GLOSSARY OF TERMS AND ABBREVIATIONS
Table 1-3 lists the definitions of terms and abbreviations used
in this instruction that are unique to Elsag Bailey Process Auto-
mation.
Table 1-2. Nomenclature
Nomenclature Hardware/Description
IMMFP11 Multifunction processor module
NIMP01/02 Multifunction processor termination module
NKSE01 Serial extension cable (PVC)
NKSE11 Serial extension cable (non-PVC)
NKTU01 Termination unit cable (PVC)
NKTU02 Termination module cable (PVC)
NKTU11 Termination unit cable (non-PVC)
NKTU12 Termination module cable (non-PVC)
NTMP01 Multifunction processor termination unit
Table 1-3. Glossary of Terms and Abbreviations
Term Description
Configuration The act of setting up equipment to accomplish specific functions or a list of parame-
ters associated with such a setup.
Controlway High speed, redundant, peer-to-peer communication link. Used to transfer informa-
tion between intelligent modules within a process control unit.
Dipswitch A dual in-line package that contains switches.
EWS Engineering work station.
Executive Block Fixed function block that determines overall module operating characteristics.
Function Block The occurrence of a function code at a block address of a module.
Function Code An algorithm which manipulates specific functions. These functions are linked
together to form the control strategy.
I/O Expander Bus Parallel communication bus between the master and slave modules.
MFP Multifunction processor module. A multi-loop controller with data acquisition and
information processing capabilities.
MFT Machine fault timer. Reset by the processor during normal operation. If not reset
regularly, the MFT times-out and the module stops.
MMU Module mounting unit. A card cage that provides electrical and communication sup-
port for INFI 90 OPEN/Network 90®modules.

INTRODUCTION
SPECIFICATIONS
1 - 6 WBPEEUI230018A0
®
SPECIFICATIONS
Refer to Table 1-4 for the specifications of the IMMFP11
Multi-Function Processor Module.
Module Bus Peer-to-peer communication link used to transfer information between intelligent
modules within a process control unit.
Node A point of interconnection to a network.
PCU Process control unit. A node on the plant-wide communication network containing
control and I/O modules.
SAC Analog control station.
Termination Module Provides input/output connection between plant equipment and the INFI 90 OPEN/
Network 90 modules.
Termination Unit Provides input/output connection between plant equipment and the INFI 90 OPEN/
Network 90 modules.
Table 1-3. Glossary of Terms and Abbreviations (continued)
Term Description
Table 1-4. Specifications
Property Characteristic/Value
Microprocessor 32-bit processor (16-bit external bus) running at 16 MHz
Memory
Total
Available
512 kbytes ROM
256 kbytes RAM
64 kbytes NVRAM
163,248 bytes RAM
62,656 bytes NVRAM
Power Requirements +5 VDC @ 2 A; 10 W typical
Serial Ports Two RS-232-C ports, or one RS-485 and one RS-232-C port all of
which link signals at a rate of up to 19.2 kbaud.
Station Support Sixty-four 40-kbaud serial stations (IISAC01) or
eight 5-kbaud serial stations (NDCS03 or NDIS01).
Redundant Communication Link
Rate and Type 1 Mbaud serial link.
Electromagnetic/ Radio
Frequency Interference Values not available at this time. Keep cabinet doors closed. Do not use communication equipment any closer than 2 meters from the cabi-
net.
Programmability C, BASIC, BATCH, ladder, function codes, and user-defined functions.
Dimensions 35.56 mm wide (1.40 in.)
177.80 mm high (7.00 in.)
298.45 mm long (11.75 in.)
Mounting Occupies one slot in a standard INFI 90 OPEN module mounting unit.
Ambient Temperature 0°to 70°C (32°to 158°F)
Relative Humidity 5% to 95% up to 55°C (131°F)(noncondensing)
5% to 45% above 55°C (131°F)(noncondensing)
Atmospheric Pressure Sea level to 3 km (1.86 mi)

INTRODUCTION
SPECIFICATIONS
WBPEEUI230018A0 1 - 7
Air Quality Noncorrosive
Certification CSA certified for use as process control equipment in an ordinary (non-
hazardous) location. Factory Mutual approved for use in Class I, Divi-
sion 2, hazardous locations.
Table 1-4. Specifications (continued)
Property Characteristic/Value

INTRODUCTION
WBPEEUI230018A0 2 - 1
SECTION 2 - DESCRIPTION AND OPERATION
INTRODUCTION
The IMMFP11 Multi-Function Processor Module functions like
a series of functional blocks working together. To explain how
the MFP module works, this section shows MFP module func-
tionality as a block diagram (refer to Figure 2-1) and then
explains each block in the following text.
MICROPROCESSOR
The microprocessor, operating at 16 megahertz, enables mod-
ule operation and control. The operating system instructions
and function code library of the microprocessor reside in read
only memory (ROM). Since the microprocessor is responsible
for overall module operation, it communicates with all the
functional blocks. The microprocessor also constantly triggers
the machine fault timer (MFT) circuit. If the microprocessor or
module software fails and the MFT circuit is not reset, the MFT
Figure 2-1. IMMFP11 Module Functional Block Diagram
CLOCK/
TIMER
MACHINE
FAULT
TIMER
I/O
EXPANDER
BUS
I/O
SECTION
LEDS,
SWITCHES
AND
CONTROL
OUTPUT
TO
P2 TO
P3 TO
P1
BA
TO
P3 TO P3
T01698A
SERIAL
PORTS DMA SECTION
CONTROLWAY REDUNDANCY
LINK DCS LINK
MICROPROCESSOR
NVRAMROMRAM
DATA BUS

DESCRIPTION AND OPERATION
CLOCK AND TIMER
2 - 2 WBPEEUI230018A0
®
circuit issues a board-wide reset and the status LED turns red.
This condition is known as a fatal error.
CLOCK AND TIMER
The clock section provides the clock signals that drive the mod-
ule at 16 megahertz. Additionally, this section supplies the
lower order clock signals for the on-board serial links, and the
system timer for uniform control algorithm execution. All clock
signals originate from either the 32-megahertz or 7.3728-mega-
hertz oscillators on the multifunction processor module.
The timer section keeps the multifunction processor module
task scheduling at the proper intervals. One of the UART
devices used for serial communication contains the timer
section.
MEMORY
The MFP module contains 512 kilobytes of ROM memory, 256
kilobytes of random access memory (RAM) and 64 kilobytes of
nonvolatile random access memory (NVRAM). It is important to
remember that only 163,248 bytes of RAM memory and 62,256
bytes of NVRAM memory are available for user configurations.
The ROM memory holds the operating system instructions for
the microprocessor. The RAM memory provides temporary
storage and a copy of the modules configuration. The NVRAM
memory holds the module configuration (control strategy
designed with function codes). The ability to retain information
when power is lost makes this type of memory unique.
Back-up batteries in the NVRAM device that keep the memory
active makes this possible.
A key feature of the RAM and ROM memory of the MFP module
is that it requires only one wait state. This means that the
microprocessor need only wait one clock cycle before it can
check the data in memory. This results in quicker operation.
I/O EXPANDER BUS
The I/O expander bus resides on the backplane of the module
mounting unit. This bus, an eight-bit parallel bus, provides the
communication path for I/O data between control and I/O
modules. It supports up to 64 low power I/O modules. The bus
uses a protocol designed by Elsag Bailey to insure data integ-
rity. The bus bandwidth is 500 kilobytes per second, however
actual throughput is about 100 kilobytes per second.
I/O SECTION
The input and output section interface allows the microproces-
sor to read the switches that tell it how to operate and what

DESCRIPTION AND OPERATION
SERIAL CHANNELS
WBPEEUI230018A0 2 - 3
address it has. This section contains the latches whose
outputs connect to LEDs one through eight and the status
LED. Additionally this section contains an output that desig-
nates this module as the primary module. Upon a failover, this
output turns off and the backup module output energizes as it
takes over. This output actuates an LED that indicates which
module is the primary.
Additionally, the input and output section monitors the stop/
reset pushbutton. Pressing the pushbutton once causes this
section to bring the module to an orderly stop after completing
any input or output function currently in progress. Pressing
the pushbutton a second time resets the module.
SERIAL CHANNELS
The MFP module contains two independent, general purpose
serial channels. One use is for language support (C and
BASIC). Each channel supports standard baud rates up to
19.2 kilobaud. The appropriate termination unit or termina-
tion module uses standard D-type connectors. The NTMP01,
NIMP01, or NIMP02 termination device optically isolates these
communication channels. This optical isolation eliminates the
need to tie chassis ground to system common and alleviates
the potential of damage from ground currents. One channel
can also be used as a RS-485 connection.
DMA SECTION
The microprocessor sets this section for direct memory access
or DMA. The DMA section allows data being received or trans-
mitted over the various communication paths to be transferred
directly to or from the RAM memory without microprocessor
intervention. This process is known as cycle stealing. It greatly
reduces the overhead associated with the microprocessor doing
such data moves. This circuitry is used for the higher speed
communication paths where the microprocessor would be
overloaded handling the data moves, specifically Controlway.
The 40-kilobaud station link and the redundancy link also use
this feature.
CONTROLWAY
The Controlway is the high-speed version of the module bus. It
provides a one-megabaud peer-to-peer communication link
capable of supporting up to 32 connections. The Controlway
interface is provided by a custom Elsag Bailey integrated cir-
cuit that links the MFP module to the Controlway. It has full
DMA capabilities (allowing for quicker operation), and two
redundant, independent communication channels.