Colnatec Eon User manual
PC-based monitor
user manual
eonTM
Eon™
WARNING All electrical components are to be considered extremely
dangerous if tampered with in any way. Colnatec is not liable for any injury
WARRANTY LABEL If the warranty label has been tampered with, “VOID”
will appear where the warranty label was originally placed. If this is visible
at the time of arrival, it is important that you contact Colnatec immediately
after receiving the product.
© Copyright 2014 Colnatec
All information contained within this
technical manual and accompanying
pages are copyright of Colnatec.
All rights reserved. It is a breach of
copyright if this technical manual is
copied, distributed, or reproduced,
in whole or part, using any means
whatsoever, without the prior written
approval of Colnatec.
Colnatec gives no condition or
warranty, expressed or implied,
manual or accompanying hardware
product. Colnatec reserves the right
to make changes to this technical
manual or accompanying hardware
or design without notice to any
person or company.
Colnatec shall not be liable for any
indirect, special, consequential or
incidental damages resulting from
the use of this technical manual
or the accompanying hardware or
design whether caused through
Colnatec’s negligence or otherwise.
March 2014
Version 3.0
EXAMINE YOUR NEW EON™FOR ANY SIGNS OF PHYSICAL
DAMAGE. ALSO, ENSURE THAT THE TAMPER-EVIDENT LABELS
ARE INTACT Before shipping, your Eon™ was calibrated and tested by
Colnatec to meet the highest quality standards. It is important that you
take a few minutes to inspect the product to ensure that your equipment
was not damaged or otherwise tampered with during transit.
About Eon™
With the ability to sense deposition and temperature with high precision,
the Eon™
™provides features that help improve
measurement accuracy for better process monitoring.
LabVIEW® Interface
that provides an operating
environment that is intuitive, efficient, and impressive.
Software Updates
™interface software can be upgraded on site to provide software
available.
Inspection & Initial Setup
Examine Eon™for any signs of physical damage. Also, make sure that the
tamper-evident labels are intact. In order to ensure safe, correct operation
of your Eon™, please follow the step-by-step instructions presented in the
Eon™ Quick Start guide included with your product.
Warranty
Eon™is warranted to the original purchaser to be free of any
manufacturing-related defects for one year from the date of purchase.
Colnatec reserves the right to repair or replace the unit after inspection.
What Is the Eon™ Thin-Film Monitor?
ii
Safety Information..........................................................................................................
Copyright........................................................................................................................
About Eon™...................................................................................................................
Software Updates...........................................................................................................
Inspection and Initial Setup.............................................................................................
Warranty.........................................................................................................................
Section 1: System Components
1.0 Eon™ Package Contents.......................................................................
1.1
Section 2: Electronics and Connections
2.0 Connecting Eon™ Inputs........................................................................
2.1 Connecting Eon™ Outputs.....................................................................
2.2 Connecting Mirage™ Inputs...................................................................
2.3 Connecting Mirage™ Outputs................................................................
2.4 Mirage™ Features..................................................................................
Section 3: Front Panel Controls and Displays
3.0 Controls..................................................................................................
3.2 Status Displays......................................................................................
3.3 Graphs....................................................................................................
4.0 .............................................................
Section 5:
5.0 ...................................................................
Section 6: Device Parameters
6.0 Setup Menu: Device Parameters............................................................
Section 7: First Start
7.0 Communication Port Selection...............................................................
7.1 Procedure...............................................................................................
Contents
p. 1
p. 2
p. 4
p. 4
p. 5-6
p. 5-6
p. 6
p. 7-8
p. 8-9
p. 9
p. 11-13
p. 14-15
p. 16-17
p.18
p. 19
i
i
i
ii
ii
ii
ii
Section 8: Using the Software
8.0
8.1 Adding a Process...................................................................................
8.2 Starting
8.3 Starting a Cleaning Process...................................................................
Section 9: .............................................................................................
10.0 Device Parameters.................................................................................
10.1 Deposition Settings.................................................................................
10.2 Measurement..........................................................................................
10.3 Process Display......................................................................................
10.4 Communications.....................................................................................
10.5 Device Settings.......................................................................................
Index...............................................................................................................................
Contents
p. 19
p. 19
p. 20
p. 20
p. 21
p. 22
p. 22
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p. 23
p. 23
p. 23
p. 24
1
2
3
4
5 .......................................................................
6
7
Tables & Figures
p. 21
p. 22
p. 22
p. 22
p. 23
p. 23
p. 23
p. 1
p. 2
p. 2
p. 3
p. 3
p. 5
p. 7
p. 10
p. 11
p. 14
p. 16
p. 18
Figures
Eon™ System Components............................................................................
Eon™ Front
Eon™ Rear
Mirage™ Connections.....................................................................................
Front Panel Indicators and Controls...............................................................
Cleaning Menu................................................................................................
Setup Device Parameters Display...................................................................
ComPort Selection Display..............................................................................
A
B
C
D
E
F
G
I
J
K
Section 1 System Components & Connections
Power Supply Cable
North America standard plug,
Europlug available on request
Power Supply
Input: 100-200VAC, 50/60Hz, 2.0A
Output: 24V-3.75A, 90W MAX
Eon™Controller has heater and
RTD output/input, BNC sensor
inputs, Type K Thermocouple
inputs, power input, and RS-232
ComPort for connection to PC.
Eon™ Quick Start Guide
Eon™ Software Disc
Eon™ software, Labview runtime,
USB drivers, and manual.
Software requires administrative
privileges to install and run.
BNC to Microdot Cable
USB to RS-232 Adaptor
RS-232 Extension Cable
Standard, male-to-female
serial cable
Quartz Crystals
Figure A: Eon™Package Components
Mirage™ Connection Cables
Air-cooling and relay cabling used
with Mirage™
Mirage™ Air Cooling System
Input 1/4” NPT Female Connection
Cable
Male-to-female serial cable.
™
The only self-heating and self-
cleaning thin lm sensor head on
the market; provides user with
unmatched control and precision
substrate
source
shutter
Eon software
installed on your PC
EonController
Self-Cleaning
Figure B: Tempe™ Sensor Head
Figure C: Connections between Tempe™ System Components
Tempe™ Sensor Head & System Connections
2
3 ft Max
Figure D: Eon™Front Hardware Connections
Section 2 Electronics and Connections
Figure E: Eon™Rear Hardware Connections
Variable Stat Indicator
RS-232
For connecting Eon-LT™to PC
Power Input
24 VDC Power Input
3
Controls Tempe™ sensor head
BNC Sensor Inputs
Connects to sensor heads
Measures temperature using
thermocouples
0-5 VDC & Relay Output
Controls relays
how hardware should be connected in order to prevent damage to Eon™.
2.0 - 2.1 Connecting Eon™ Inputs & Outputs
2.1 Connecting Outputs
Make sure the correct hardware is
used with these outputs.
2.1.1 DB9 Connector
Connects the 24 VDC Mirage™, and the relay control.
2.1.2 DB15 Connector
4
2.0 Connecting Inputs
Make sure the correct hardware is
used with these inputs.
2.0.1 Power
Only the provided power supply should be used with Eon™.
Not doing so will cause hardware damage to Eon™ that will not
be covered by warranty. Ensure that the power supply has a 24
VDC.
2.0.2 ComPort
Connect an RS232 cable to this port. Always use the provided
USB to RS232 cable.
2.0.3 BNC Sensor Inputs
Eon™
™and the
30 cm.
Receives temperature data.
2.0.5
Connects to
2.2 Hardware and Connections: Mirage™ Air-Cooling System
Exhaust Port
Quietly expels and
disperses used air
Compressed Air Input
CAUTION
Cold Air Output to
1/4” push-to-connect tting;
2 ft. (.609 mm) insulated tubing
provided
Relay Input from Eon™
Used for controlling the Mirage™
Figure F: Mirage™Connections
2.2 Mirage™ Air-Cooling System
Mirage™ Cooling System
2.2.1 Activating Mirage™
Pressing the Cool button on the main screen activates the Mirage™.
WARNING Operating temperature be allowed to
exceed 500°C. Equipment damage will likely result.
5
2.3 Mirage™ Features
6
2.3 Mirage™ Features
Mirage™ contains several key features that, alone, make the
Mirage™ a singular technological achievement.
2.3.1 Refrigerant-Free Air Cooling
Not only maintainence free and environmentally safe, but when
using regulated air the Mirage™ is easily capable of holding the
Mirage™ produces a temperature output capability of
500°C.
2.3.3 Quiet Operation
While the cold air output is connected to the
head through a cooling line, the Mirage™ reduces noise by
2.3.4 Versatility of Application
Working from a simple relay input, the Mirage™ can be used as
a cooling device in alternative applications.
Section 3 Front Panel Controls and Displays
Figure G: Front Panel
3.0 Controls
Change settings, activate
controls, and halt process runs.
7
3.0.5 Clean
Utilizing a “bake” process that heats the sensor head
in situ
, residual deposition
3.0.6 Relay 1
Actuates Relay 1.
3.0.7 Relay 2
Actuates Relay 2.
3.0 - 3.1 Controls and Displays
8
3.0.10
Allows for automated temperature control of the sensor head. Before
been selected in the Setup menu.
3.0.8 Setup
Change settings to materials, processes, etc.
3.1.1 Film
3.1.2 Rate
Displays the current rate of deposition in angstroms per second.
Displays the current thickness of the material in kilo-angstroms or
angstroms.
3.1.5 Frequency
Displays the current frequency of the crystal in hertz.
3.1 Status Displays
3.0.9 Process
Select the active process.
3.1 - 3.2 Status Displays and Graphs
9
3.2 Graphs
change the scale of the x-axis and y-axis.
3.2.1 Rate Graph
Displays a graphical representation of the rate as a function of time*.
time*.
Displays a graphical representation of thickness as a function of time*.
3.2.4 Frequency
Displays a graphical representation of frequency as a function of time*.
*Unit time is dependent on sample period
3.1.7 Crystal
Displays when crystal health falls below 50%.
10
3.3 Cleaning Menu
Figure H: Cleaning Menu
Current temperature of the
cleaning process
Current heater power
Abort
Aborts cleaning process
(available only in cleaning menu)
3.3 Cleaning Menu
Status
Current status of cleaning
process
11
Saves the deposition settings under a new layer named as stated.
Updates any changes to the selected layer.
Clears all of the saved layers.
4.0.5 Material
Dropdown option enables selection of the material being deposited.
4.0.6 Density
Density of the material to be deposited is automatically populated when a
material is selected. For custom densities, select “Custom” under material
and enter the desired density.
4.0.7 Finish
Closes the Setup Menu.
4.0 Setup Menu:
Layer Tab
buttons and selections
that are used to
change layer materials,
display material
density, and Z-Factor
Figure I: Layer Buttons
Section 4 Layer Buttons/Selections
4.0 Layer Buttons/Selections
4.0.8 Z-Factor
Z-Factor of Material 1. Field automatically populates with the selection of
Z-Factor can be manually adjusted through the dropdown
arrows.
12
4.0.9 P
Proportional of the heater.
4.0.10 I
Integral of the heater.
4.0.11 D
Derivative of the source.
4.0.14 Soak Power
Soak power percentage.
4.0.15
crystal cleaning.
4.0.16
Amount of time required for cleaning the monitor crystal in seconds.
Amount of time required for cleaning the monitor crystal in seconds.
4.0.18 Source Select
Select the source which will control the material deposition
4.0.19 Sensor Select
Select the sensor that will monitor the deposition.
Control the time delay between the predeposit and automatic deposition.
13
4.0 Layer Buttons/Selections
14
5.0.1 Set Process Name
Enter a process name.
5.0.3 Save Process
When a new process name is entered, this button will be enabled to save a
new process.
When a process is selected from the process list, this button will be
enabled to load the process. Processes are automatically loaded. If the
process is changed press the “load process” button to reload the previous
settings.
5.0.5 Update Process
When the process has been changed, press the update process button to
save the changes.
5.0.6 Clear All Process
Deletes all of the saved processes.
Section 5 Process Buttons/Selections
5.0 Setup Menu:
Process Tab
to create a deposition
process. Multiple layers
layers
can be selected for
codeposition.
Figure J: Process Buttons
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