Continental Refrigerator FE5NA0D31 Guide

FE5NA0D31 Module Specification
Internal
FE5NA0D31
5G DSDA NAD Module
OEM Manual and User Guide v1
(For Use during Certification)

FE5NA0D31 Module Specification
Internal
Table of Contents
1FE5NA0D31 MODULE........................................................................................................................................................... 6
1.1 KEY FEATURES.......................................................................................................................................................................... 6
1.1.1 Air Interface Support ........................................................................................................................................................ 6
1.2 PACKAGE................................................................................................................................................................................. 6
1.3 BAND CONFIGURATIONS SUPPORTED............................................................................................................................................ 7
2REGULATORY COMPLIANCE NOTES...................................................................................................................................... 7
2.1 REGULATORY COMPLIANCE NOTES ............................................................................................................................................... 7
2.1.1 FCC: .................................................................................................................................................................................. 7
2.2 DEVICE INSTALLATION AND USER MANUAL .................................................................................................................................... 7
2.3 ANTENNA REQUIREMENTS FOR USE WITH MODULE: ......................................................................................................................... 8
2.4 INSTRUCTIONS TO OEMS: .......................................................................................................................................................... 9
3RECOMMENDED NAD INTERFACES ...................................................................................................................................... 9
4EXAMPLE OF NAD MODULE LABEL....................................................................................................................................... 9
5NAD MODULE RF CHARACTERISTICS .................................................................................................................................. 10
5.1 NAD MODULE RF TRANSMITTER OUTPUT POWER........................................................................................................................ 10
5.2 NAD MODULE RF RECEIVER SENSITIVITY .................................................................................................................................... 11
6MECHANICAL INFORMATION............................................................................................................................................. 11
6.1 MODULE EXPLODED VIEW ........................................................................................................................................................ 12
6.2 MODULE SIDE VIEW................................................................................................................................................................ 13
7STORAGE AND HANDLING ................................................................................................................................................. 14
7.1 MOISTURE SENSITIVITY LEVEL (MSL).......................................................................................................................................... 14
8PART RELIABILITY............................................................................................................................................................... 14
9LAYOUT AND ROUTING RECOMMENDATIONS................................................................................................................... 14
9.1 ANTENNAS ......................................................................................................................................................................... 14
9.1.1 NAD Antenna Breakout.................................................................................................................................................. 14
9.1.2 Integrated Device RF Insertion Loss ............................................................................................................................... 17
9.2 SDC /EMMC ROUTING .......................................................................................................................................................... 17

FE5NA0D31 Module Specification
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List of Figures
Figure 6-1: Module Exploded View 12
Figure 6-2: Module Top View 13
Figure 6-3 Module Side View 13
Figure 9-1: Antenna Pad Ground Cutouts (NAD bottom layer) 15
Figure 9-2 Antenna Pad Ground Cutout x8 (detail view) 15
Figure 9-3: Antenna Pad Ground Cutout Recommended (Main Board, top layer/NAD side) 15
Figure 9-4 Antenna Pad Ground Cutout x8 (detail view) 16
Figure 9-5: Recommended PCB Stack-up 16

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List of Tables
Table 9-1: RF Antenna Layout Parameters 16
Table 9-2: SDC / eMMC Layout Parameters 17

FE5NA0D31 Module Specification
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Terms and Acronyms
⚫BB Baseband
⚫DCM Data Connectivity Module (also, "TCU")
⚫DRX Discontinuous Reception
⚫EN-DC E-UTRAN New Radio –Dual Connectivity (LTE and NR simultaneously)
⚫ES Engineering Sample
⚫FDD Frequency Division Duplex
⚫GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema
⚫GNSS Global Navigation Satellite System
⚫GPIO General Purpose Input Output
⚫GSM Global System for Mobile
⚫HSIC High Speed Inter-Chip
⚫HU Head Unit
⚫LTE Long Term Evolution
⚫MP Mass Production
⚫NAD Network Access Device
⚫OEM Original Equipment Manufacturer
⚫PCB Printed Circuit Board
⚫PCIe Peripheral Component Interconnect Express
⚫PHY Physical Layer
⚫PMIC Power Management IC
⚫SIM Subscriber Identity Module
⚫SoC System-On-a-Chip (refers to the Qualcomm SA515M IC)
⚫TCU Telematics Control Unit (also, "DCM")
⚫TDD Time Division Duplex
⚫TSP Telematics Service Provider
⚫UMTS Universal Mobile Telecommunication System
⚫WCDMA Wideband Code Division Multiple Access

FE5NA0D31 Module Specification
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FE5NA0D31 Module
1FE5NA0D31 Module
The FE5NA0D31 Module incorporates 5G New Radio technology with Dual Sim Dual Access technology. The
NAD is part of a family of proprietary embedded 5G wireless modules designed by Continental Automotive
Systems, Inc. The modules are intended to be integrated into Data Connectivity Modules (DCMs) or Head
Units (HUs) designed and produced by Continental or by a 3rd party for use by automotive OEMs. DCMs
will be installed into vehicles during the OEM’s factory assembly process and will not be accessible without
use of special tools. Primary use-cases are data-centric with data and voice connections to Telematics
Service Providers (TSP).
Note: The FE5NA0D31 Module support the DSDA (Dual Sim Dual Access) feature in HW, but DSDA is
disabled from SW config, so the FE5NA0D31 will behavior like a single SIM Module.
1.1 Key Features
1.1.1 Air Interface Support
•5G NR: 3GPP Release 15
•Sub-6 Ghz 5G NR bands n77, n78
•LTE FDD/TDD: 3GPP Rel. 15 Category 15
•UMTS: HSUPA CAT6 (SIM1 only)
•GSM: EGPRS Rel-12
•VoLTE –HD Voice
•Embedded Qualcomm GNSS Sub-system
•High Precision GNSS
•SBAS supported: EGNOS/MSAS/QZSS/WAAS/GAGAN
1.2 Package
•764-pin LGA module of size 52 x 60 x 3.1 mm

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1.3 Band Configurations Supported
Table 1-1: FE5NA0D31 Band Configuration Support
Model
Region
5G NR Band
(SIM1)
LTE
(SIM1 and SIM2))
C-V2X
Bands
UMTS Bands
(SIM1)
GSM
(SIM1
&2)
GNSS
FE5NA0D31
NA
n2, n5, n25, n41, n66,
n71, n77, n78
1,2,3,4,5,7,12,13,14,17,25,26,
28a,28b,29RX,30RX,41, 66, 71
---
2, 4, 5
2,5
B1I,
E1,
G1, L1
Notes:
1.The module supports n77 U.S. band from 3700 to 3980 MHz
2.The module disables n78 via software
2Regulatory Compliance Notes
2.1 Regulatory Compliance Notes
2.1.1 FCC:
This device complies with Part 15, Part 22(H), Part 24(E) and Part 27 of the FCC Rules. The FCC ID for this
device is LHJ-FE5NA0D31. Part 15 operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired
operation.
2.2 Device Installation and User Manual
The FE5NA0D31 module is a proprietary product designed and manufactured by Continental Automotive
Systems, Inc. for integration into Telematics control units manufactured by Continental Automotive
Systems, Inc. for automotive OEMs.
i. The module is limited to installation ONLY in an integrated device manufactured by Continental
Automotive Systems, Inc.
ii. During manufacturing process of the integrated device, the module is soldered onto the PCB of the
integrated device.
iii. The integrated device must provide RF connectors to external antennas or RF traces to connect the
FE5NA0D31 modules to antennas inside the integrated device. The typical reference design for the
RF trace layout, including PCB stack-up and trace length is described in Section 6 of this document.
iv. Automotive OEM is responsible for ensuring that the end-user has no manual instructions to remove
or install module.
v. The module is limited to installation in mobile applications, according to Part 2.1091(b).
vi. No other operation configurations are allowed.

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vii. Changes or modifications to this system by other than a facility authorized by Continental could void
authorization to use this equipment.
viii.The module must be installed to provide a separation distance of at least 20 cm from all persons and
must not be co-located or operate in conjunction with any other antenna or transmitter.
ix. The integrator is responsible for fulfilling FCC and IC requirements for the integrated device.
If Continental chooses to re-use modular approval, then the TCU shall be clearly labeled with an external
label containing the integrated modem’s FCC ID. For example, the label can include text “Contains device
with FCC ID: LHJ-FE5NA0D31 and IC: 2807E-FE5NA0D31”.
2.3 Antenna requirements for use with module:
The module must be installed to provide a separation distance of at least 20cm from all persons and must
not be co-located or operating in conjunction with any other antenna or transmitter. Additional testing and
certification for SAR will be required if the distance limitation cannot be met.
The FE5NA0D31 module does not contain internal antennas and external antenna must be provided by the
integrator or OEM. Based on FCC OET Bulletin 65 Supplement C and 47 CRF §2.1091 and on RSS-102 Issue 5,
for all standalone NR/LTE/WCDMA/GSM operations the maximum antenna gain including cable loss shall
not exceed the following values:
⚫GSM850: 4.5 dBi
⚫GSM1900: 2.5 dBi
⚫WCDMA Band II: 2.5 dBi
⚫WCDMA Band IV: 5.5 dBi
⚫WCDMA Band V: 4.5 dBi
⚫LTE B2: 2.5 dBi
⚫LTE B4: 5.5 dBi
⚫LTE B5: 4.5 dBi
⚫LTE B7: 6 dBi
⚫LTE B12: 6 dBi
⚫LTE B13: 6 dBi
⚫LTE B14: 6 dBi
⚫LTE B17: 6 dBi
⚫LTE B25: 2.5 dBi
⚫LTE B26: 4.5 dBi
⚫LTE B41: 6 dBi
⚫LTE B66: 5.5 dBi
⚫LTE B71: 6 dBi
⚫NR Band n2: 2.5 dBi
⚫NR Band n5: 4.5 dBi
⚫NR Band n25: 2.5 dBi
⚫NR Band n41: 6 dBi
⚫NR Band n66: 5.5 dBi
⚫NR Band n71: 6 dBi
⚫NR Band n77: 3 dBi

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This radio transmitter (FCC ID: LHJ-FE5NA0D31) has been approved by FCC to operate with the antenna
types listed above with the maximum permissible gain indicated. Antenna types not included in this list,
having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this
device.
2.4 Instructions to OEMs:
Continental must instruct the automotive OEM and provide them to include the following information into
the car user’s manual (i.e. for the DCM):
1. End-users must be provided with transmitter/antenna installation requirements and operating
conditions for satisfying RF exposure compliance:
2. A separate section should clearly state “FCC RF Exposure requirements:”
3. Required operating conditions for end users.
4. The antenna used with this device must be installed to provide a separation distance of at least
20cm from all persons, and must not transmit simultaneously with any other transmitter, except in
accordance with FCC multi-transmitter product procedures.
5. The Maximum ERP/EIRP and maximum antenna gain required for compliance with Parts 15, 22H,
24E, and 27.
6. Clear instructions describing the other party’s responsibility to obtain station licensing.
3Recommended NAD Interfaces
Integrators are strongly recommended to provide access to the following NAD communication ports to be
used for debugging, certification, or other developmental activity.
•HS-USB 2.0
•2-wire UART
•JTAG
•RF Ports: If any on-board antennas are used by the product, provisions should be made to support
conducted RF measurements on all antenna interfaces
•SIM Interface: Electrical performance of the SIM interface is always evaluated during certification
testing of the final product. Product teams should insure that the SIM interface can be accessed for
testing without degrading its integrity.
4Example of NAD Module Label

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Figure 4-1: Module Label Example
5NAD Module RF Characteristics
5.1 NAD Module RF Transmitter Output Power
The Transmitter Power at the NAD antenna terminal (not the RF port of the evaluation board or the
Telematics/parent module) at Room Temperature:
⚫GSM 850/900: +32.5 dBm +1.0/-2.0 dB
⚫GSM 1900/1800: +29.5 dBm +1.0/-2.0 dB
⚫EDGE 850/900: +26.5 dBm +1.0/-2.0 dB
⚫EDGE 1800/1900: +25.5 dBm +1.0/-2.0 dB
⚫WCDMA: + 23.5 dBm to +1.0/-2.0 dB
⚫LTE: +23 dBm +1.0/-2.0 dB
⚫LTE B41 HPUE: +26 dBm +1.0/-2.0 dB
⚫5G NR FDD bands and TDD n41: +23 dBm +1.0/-2.0 dB
⚫5G TDD HPUE n77: +26 dBm +1.0/-2.0
Allowance for reduction in maximum transmitter power is specified in the 3GPP standard for GPRS
multi-slot operation. Per 3GPP TS 05.05, the following Maximum Output Power Reduction will be
taken during Multi-slot GPRS operation (MSPP = 0):
•0 dB back -off for 1TX slot
•3 dB back-off for 2TX slots
•4.5 dB back-off for 3TX slots
•6 dB back-off for 4TX slots
Per 3GPP TS 05.05, the following Maximum Output Power Reduction will be taken during Multi-slot
EDGE operation (MSPP = 0):
•0 dB back -off for 1TX slot
•2.0 dB back-off for 2TX slots

FE5NA0D31 Module Specification
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•3.0 dB back-off for 3TX slots
•4.0 dB back-off for 4TX slots
.
5.2 NAD Module RF Receiver Sensitivity
The Receiver Sensitivity at the NAD antenna terminal (not the RF port of the evaluation board or the
Telematics/parent module) at Room Temperature:
⚫GSM low bands (800/900): 3GPP TS 51.010-1 Section 14.2
⚫WCDMA bands: 3GPP TS 34.121-1 Section 6.2
⚫LTE bands: 3GPP TS GPP 36.521 Section 7.3
⚫5G NR bands: 3GPP TS GPP 38.521 Section 7.3
⚫GNSS bands: -163 dBm (in Out-Of-Service mode)
6Mechanical Information

FE5NA0D31 Module Specification
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6.1 Module Exploded View
Figure 6-1: Module Exploded View

FE5NA0D31 Module Specification
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Figure 6-2: Module Top View
6.2 Module Side View
Figure 6-3 Module Side View

FE5NA0D31 Module Specification
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7Storage and Handling
7.1 Moisture Sensitivity Level (MSL)
All NAD modules are moisture sensitive and should be kept in their sealed moisture resistant bags until
ready for assembly onto the DCM via the soldering process. Any parts that are not used immediately should
be properly resealed in the same moisture resistant bag using appropriate equipment or placed into a dry
box until they are needed again. The moisture sensitivity level (MSL) shown below is the amount of time the
NAD modules may be exposed before this action must be taken. If the allowed MSL time elapses, the NAD
modules must be baked per standard protocol to remove moisture.
Moisture Sensitivity Level: MSL Level 3 (1 Week)
This remainder of this section will be completed in a future release of this document.
8Part Reliability
This section will be completed in a future release of this document.
9Layout and Routing Recommendations
9.1 ANTENNAS
The NAD has eight antenna pins.
•LTE/5G NR: LTE_ANT_1 –LTE_ANT_2
•GNSS: GNSS_ANT_1, GNSS_ANT_2
•DSDA: ANT5_DSDA, ANT6_DSDA
9.1.1 NAD Antenna Breakout
The FE5NA0D31 should be oriented on the main board to minimize the length of the primary Cellular TX/RX
antenna (ANT1). This 50ohm line should be as short as possible to the external RF connector or internal
antenna feed point.
The RF traces on the main board connecting from the NAD antenna pins can be either stripline or microstrip,
but the microstrip routing must be on the layer opposite from the NAD, since the bottom layer of the NAD
will be mostly ground and it would become a near RF short to any trace that runs on the main board’s top
layer, while still underneath the NAD. For a given line length, the stripline approach will tend to be more
lossy, so it is generally not recommended. Thus, microstrip antenna lines are favored in most cases.
9.1.1.1 NAD Antenna Pad Ground Cutout
It is likely that the parent device’s PCB will use only thru-hole vias, and so the antenna pads on the parent
PCB may need to be offset slightly from their vias for manufacturability reasons. The NAD bottom layers
have been designed to accomodate this need, and ground cutout in these layers has been extended to avoid
shorting to those vias on the parent PCB’s top layer, where it mates with the NAD. Figure 9-1 details the
ground cutout provided on the bottom six layers of the NAD. The PCB of the parent device should utilize
this cutout area for placement of any thru vias which serve the antenna pads:

FE5NA0D31 Module Specification
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Figure 9-1: Antenna Pad Ground Cutouts (NAD bottom layer)
Figure 9-2 provides a more detailed view of the cutout around each antenna pad on the NAD PCB.
Figure 9-3 Antenna Pad Ground Cutout x8 (detail view)
9.1.1.2 Parent PCB Antenna Pad Design Recommendation
The main board on which the FE5NA0D31 will be mounted should have ground cut out under the RF
antenna pins of the NAD as shown in Figure 9-4 and Figure 9-4:
Figure 9-5: Antenna Pad Ground Cutout Recommended (Main Board, top layer/NAD side)

FE5NA0D31 Module Specification
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Figure 9-6 Antenna Pad Ground Cutout x8 (detail view)
The dimensions of the RF trace on the Main Board will be dependent on the layer stack-up of the board,
their thicknesses and how many layers are used. As an example, the main PCB shown in Figure 9-5 is a 6
layer stack up with Ground cut out on layer 5 so the microstrip lines on the bottom (layer 6) reference
Ground on layer 4. For this example, the dielectric thickness from L6 to L4 is 21.2 mils.
Figure 9-7: Recommended PCB Stack-up
Using an online microstrip impedance tool, the calculation resulting in microstrip line width [w] of 37.7mils
(967micron).
The line width will of course vary, depending on the stack up and use of layers on the main board. In the
end, the characteristics of the RF traces connecting to the NAD on the main board should remain within the
guidelines of Table 9-1.
Table 9-2: RF Antenna Layout Parameters

FE5NA0D31 Module Specification
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Type of Guidance
Requirement
Trace impedance
50±10% Ohms, single-ended
Total route length
< 100 mm
Ground between signals
> 1 x [RF line width] with stitched VIA to ground layer
Spacing to other signals
> 3 times RF line width, to any non-RF traces
VSWR for Cellular Antenna
ports
< 3:1
•Trace impedances apply to either microstrip or stripline.
•Length for all antenna traces should be kept to a minimum, with priority on cellular antenna 1.
9.1.2 Integrated Device RF Insertion Loss
The integrated device TX and RX performance must comply with 3GPP and MNO RF requirements at the RF
connectors. In addition, in some use cases, such as on-board antenna, TRP and TIS performance
requirements must be met. It is a Product Team’s responsibility to insure the integrated device complies
with these requirements.
The Insertion Loss between NAD’s RF and the parent module antenna terminal (RF Connector of the
evaluation board or the Telematics/parent module) must be kept at minimum and not to exceed these
values:
•RF Loss < 0.6dB from 700 - 1000MHz
•RF Loss < 1.2dB from 1.7 - 2.7GHz
•RF Loss < 2.5dB from 2.7 –6.0GHz
9.2 SDC / eMMC Routing
Table 9-3: SDC / eMMC Layout Parameters
Type of Guidance
Requirement
Trace impedance
50-Ohms ± 10% single-ended
Total route length
< 50-mm recommended, but 75-mm is acceptable
Trace matching (SDC application)
< 1.6-mm
Trace matching (eMMC application)
< 5 - mm
Trace spacing
> 0.508-mm / > 20-mils
Number of vias per trace
< 5
Spacing to other signals
>= 2 times line width
•Trace impedances should follow table, either as microstrip or stripline.
•Trace lengths should follow table.
•Number of vias per trace should follow table.
•No stubs allowed on traces.
•No test points allowed on traces.
•Trace lengths should follow table.
•Spacing to ground or other signals on outside of bundled signals should follow table.