Cypress Semiconductor CY62148E User manual

CY62148E MoBL®
4-Mbit (512K x 8) Static RAM
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document #: 38-05442 Rev. *F Revised March 28, 2007
Features
• Very high speed: 45 ns
• Voltage range: 4.5V–5.5V
• Pin compatible with CY62148B
• Ultra low standby power
— Typical standby current: 1 µA
— Maximum standby current: 7 µA (Industrial)
• Ultra low active power
—Typical active current: 2.0 mA @ f = 1 MHz
• Easy memory expansion with CE, and OE features
• Automatic power down when deselected
• CMOS for optimum speed and power
• Available in Pb-free 32-pin TSOP II and 32-pin SOIC [2]
packages
Functional Description [1]
The CY62148E is a high performance CMOS static RAM
organized as 512K words by 8 bits. This device features
advanced circuit design to provide ultra low active current.
This is ideal for providing More Battery Life™ (MoBL®) in
portable applications such as cellular telephones. The device
also has an automatic power down feature that significantly
reduces power consumption when addresses are not toggling.
Placing the device into standby mode reduces power
consumption by more than 99% when deselected (CE HIGH).
The eight input and output pins (IO0through IO7) are placed
in a high impedance state when:
• Deselected (CE HIGH)
• Outputs are disabled (OE HIGH)
• Write operation is active (CE LOW and WE LOW)
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. Data on the eight IO pins (IO0through IO7)
is then written into the location specified on the address pins
(A0through A18).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing Write Enable (WE) HIGH.
Under these conditions, the contents of the memory location
specified by the address pins appear on the IO pins.
Product Portfolio
Product Range VCC Range (V) Speed
(ns)
Power Dissipation
Operating ICC (mA)
Standby ISB2 ( µA)
f = 1MHz f = fmax
Min Typ [3] Max Typ [3] Max Typ [3] Max Typ [3] Max
CY62148ELL TSOP II Ind’l 4.5 5.0 5.5 45 2 2.5 15 20 1 7
CY62148ELL SOIC Ind’l/Auto-A 4.5 5.0 5.5 55 2 2.5 15 20 1 7
Notes
1. For best practice recommendations, refer to the Cypress application note “System Design Guidelines” at http://www.cypress.com.
2. SOIC package is available only in 55 ns speed bin.
3. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA= 25°C.
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 2 of 10
Logic Block Diagram
Pin Configuration [2, 4]
A0IO0
IO7
IO1
IO2
IO3
IO4
IO5
IO6
A1
A2
A3
A4
A5
A6
A7
A8
A9
SENSE AMPS
POWER
DOWN
CE
WE
OE
A13
A14
A15
A16 A17
ROW DECODER
COLUMN DECODER
512K x 8
ARRAY
INPUT BUFFER
A10
A11
A12
A18
Note
4. NC pins are not connected on the die.
1
2
3
4
5
6
7
8
9
10
11
14
31
32
12
13
16
15
29
30
21
22
19
20
27
28
25
26
17
18
23
24
32-pin SOIC/TSOP II Pinout
Top View
A
17
A
16
A
15
A
14
A
13
A
12
A
11
A
10
A
9
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
IO
0
IO
1
IO
2
IO
3
IO
4
IO
5
IO
6
IO
7
VSS
VCC
A
18
WE
OE
CE
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 3 of 10
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................ –65°C to + 150°C
Ambient Temperature with
Power Applied............................................ –55°C to + 125°C
Supply Voltage to Ground
Potential.................................–0.5V to 6.0V (VCCmax + 0.5V)
DC Voltage Applied to Outputs
in High-Z State [5, 6]................–0.5V to 6.0V (VCCmax + 0.5V)
DC Input Voltage [5, 6] ............ –0.5V to 6.0V (VCCmax + 0.5V)
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current ......................................................>200mA
Operating Range
Device Range Ambient
Temperature VCC [7]
CY62148E Ind’l/Auto-A –40°C to +85°C 4.5V to 5.5V
Electrical Characteristics (Over the Operating Range)
Parameter Description Test Conditions 45 ns 55 ns [2] Unit
Min Typ [3] Max Min Typ [3] Max
VOH Output HIGH
Voltage
IOH = –1 mA 2.4 2.4 V
VOL Output LOW Voltage IOL = 2.1 mA 0.4 0.4 V
VIH Input HIGH Voltage VCC = 4.5V to 5.5V 2.2 VCC + 0.5 2.2 VCC + 0.5 V
VIL Input LOW voltage VCC = 4.5V to 5.5V For TSOPII
package
–0.5 0.8 V
For SOIC
package
–0.5 0.6 [8]
IIX Input Leakage
Current
GND < VI< VCC –1 +1 –1 +1 µA
IOZ Output Leakage
Current
GND < VO <VCC, Output Disabled –1 +1 –1 +1 µA
ICC VCC Operating
Supply Current
f = fmax = 1/tRC VCC = VCC(max)
IOUT = 0 mA
CMOS levels
15 20 15 20 mA
f = 1 MHz 2 2.5 2 2.5
ISB2 [9] Automatic CE Power
down Current —
CMOS Inputs
CE > VCC – 0.2V
VIN > VCC – 0.2V or VIN <0.2V,
f = 0, VCC = VCC(max)
17 17µA
Capacitance (For All Packages) [10]
Parameter Description Test Conditions Max Unit
CIN Input Capacitance TA= 25°C, f = 1 MHz,
VCC = VCC(typ)
10 pF
COUT Output Capacitance 10 pF
Notes
5. VIL(min) = –2.0V for pulse durations less than 20 ns for I < 30 mA.
6. VIH(max) = VCC+0.75V for pulse durations less than 20 ns.
7. Full device AC operation assumes a minimum of 100 µs ramp time from 0 to VCC(min) and 200 µs wait time after VCC stabilization.
8. Under DC conditions the device meets a VIL of 0.8V. However, in dynamic conditions Input LOW Voltage applied to the device must not be higher than 0.6V. This
is applicable to SOIC package only. Refer to AN13470 for details.
9. Only chip enable (CE) must be HIGH at CMOS level to meet the ISB2 spec. Other inputs can be left floating.
10. Tested initially and after any design or process changes that may affect these parameters.
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 4 of 10
Thermal Resistance [10]
Parameter Description Test Conditions SOIC
Package
TSOP II
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
75 77 °C/W
ΘJC Thermal Resistance
(Junction to Case)
10 13 °C/W
AC Test Loads and Waveforms
Parameters 5.0V Unit
R1 1800 Ω
R2 990 Ω
RTH 639 Ω
VTH 1.77 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ [3] Max Unit
VDR VCC for Data Retention 2 V
ICCDR Data Retention Current VCC= VDR, CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
Ind’l/Auto-A 1 7 µA
tCDR [10] Chip Deselect to Data Retention Time 0 ns
tR [11] Operation Recovery Time tRC ns
Data Retention Waveform
3.0V
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THEVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
VCC(min) VCC(min)
tCDR
VDR >2.0V
DATA RETENTION MODE
tR
VCC
CE
Note
11. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 5 of 10
Switching Characteristics (Over the Operating Range) [12]
Parameter Description 45 ns 55 ns [2] Unit
Min Max Min Max
Read Cycle
tRC Read Cycle Time 45 55 ns
tAA Address to Data Valid 45 55 ns
tOHA Data Hold from Address Change 10 10 ns
tACE CE LOW to Data Valid 45 55 ns
tDOE OE LOW to Data Valid 22 25 ns
tLZOE OE LOW to LOW Z [13] 55ns
tHZOE OE HIGH to High Z [13, 14] 18 20 ns
tLZCE CE LOW to Low Z [13] 10 10 ns
tHZCE CE HIGH to High Z [13, 14] 18 20 ns
tPU CE LOW to Power up 00ns
tPD CE HIGH to Power down 45 55 ns
Write Cycle [15]
tWC Write Cycle Time 45 55 ns
tSCE CE LOW to Write End 35 40 ns
tAW Address Setup to Write End 35 40 ns
tHA Address Hold from Write End 0 0 ns
tSA Address Setup to Write Start 0 0 ns
tPWE WE Pulse Width 35 40 ns
tSD Data Setup to Write End 25 25 ns
tHD Data Hold from Write End 0 0 ns
tHZWE WE LOW to High-Z [13, 14] 18 20 ns
tLZWE WE HIGH to Low-Z [13] 10 10 ns
Notes
12. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels
of 0 to 3V, and output loading of the specified IOL/IOH as shown in the “AC Test Loads and Waveforms” on page 4.
13. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
14. tHZOE, tHZCE, and tHZWE transitions are measured when the outputs enter a high impedance state.
15. The internal write time of the memory is defined by the overlap of WE, CE = VIL. All signals must be ACTIVE to initiate a write and any of these signals can
terminate a write by going INACTIVE. The data input setup and hold timing should be referenced to the edge of the signal that terminates the write.
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 6 of 10
Switching Waveforms
Read Cycle No. 1 (Address Transition Controlled) [16, 17]
Read Cycle No. 2 (OE Controlled) [17, 18]
Write Cycle No. 1 (WE Controlled, OE HIGH During Write) [19, 20]
PREVIOUS DATA VALID DATA VALID
RC
tAA
tOHA
tRC
ADDRESS
DATA OUT
50%
50%
DATA VALID
tRC
tACE
tDOE
tLZOE
tLZCE
tPU
HIGH IMPEDANCE
tHZOE
tHZCE
tPD
IMPEDANCE
ICC
ISB
HIGH
ADDRESS
CE
DATA OUT
VCC
SUPPLY
CURRENT
OE
DATA VALID
tHD
tSD
tPWE tSA
tHA tAW
tSCE
tWC
tHZOE
ADDRESS
CE
WE
DATA IO
OE
NOTE
21
Notes:
16. Device is continuously selected. OE, CE = VIL.
17. WE is HIGH for read cycles.
18. Address valid before or similar to CE transition LOW.
19. Data IO is high impedance if OE = VIH.
20. If CE goes HIGH simultaneously with WE HIGH, the output remains in high impedance state.
21. During this period, the IOs are in output state and input signals must not be applied.
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 7 of 10
Write Cycle No. 2 (CE Controlled) [19, 20]
Write Cycle No. 3 (WE Controlled, OE LOW) [20]
Truth Table
CE WE OE IO’s Mode Power
H X X High Z Deselect/Power down Standby (ISB)
L H L Data Out Read Active (ICC)
L L X Data In Write Active (ICC)
L H H High Z Selected, Outputs Disabled Active (ICC)
Switching Waveforms (continued)
tWC
DATA VALID
tAW
tSA
tPWE
tHA
tHD tSD
tSCE
ADDRESS
CE
DATA IO
WE
DATA VALID
tHD
tSD
tLZWE
tPWE tSA
tHA tAW
tSCE
tWC
tHZWE
ADDRESS
CE
WE
DATA IO
NOTE
21
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 8 of 10
Ordering Information
Speed
(ns) Ordering Code Package Diagram Package Type Operating Range
45 CY62148ELL-45ZSXI 51-85095 32-pin Thin Small Outline Package II (Pb-free) Industrial
55 CY62148ELL-55SXI 51-85081 32-pin Small Outline Integrated Circuit (Pb-free) Industrial
55 CY62148ELL-55SXA 51-85081 32-pin Small Outline Integrated Circuit (Pb-free) Automotive-A
Contact your local Cypress sales representative for availability of these parts.
Package Diagrams
Figure 1. 32-pin TSOP II, 51-85095
51-85095-**
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 9 of 10
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Figure 2. 32-pin (450 MIL) Molded SOIC, 51-85081
MoBL is a registered trademark, and More Battery Life is a trademark of Cypress Semiconductor. All product and company names
mentioned in this document are the trademarks of their respective holders.
Package Diagrams (continued)
0.546[13.868]
0.440[11.176]
0.101[2.565]
0.050[1.270]
0.014[0.355]
0.118[2.997]
0.004[0.102]
0.047[1.193]
0.006[0.152]
0.023[0.584]
0.793[20.142]
0.450[11.430]
0.566[14.376]
0.111[2.819]
0.817[20.751]
BSC.
0.020[0.508]
MIN.
MAX.
0.012[0.304]
0.039[0.990]
0.063[1.600]
SEATING PLANE
116
17 32
0.004[0.102]
51-85081-*B
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CY62148E MoBL®
Document #: 38-05442 Rev. *F Page 10 of 10
Document History Page
Document Title: CY62148E MoBL®, 4-Mbit (512K x 8) Static RAM
Document Number: 38-05442
REV. ECN NO. Issue
Date
Orig. of
Change Description of Change
** 201580 01/08/04 AJU New Data Sheet
*A 249276 See ECN SYT Changed from Advance Information to Preliminary
Moved Product Portfolio to Page 2
Added RTSOP II and Removed FBGA Package
Changed VCC stabilization time in footnote #7 from 100 µs to 200 µs
Changed ICCDR from 2.0 µA to 2.5 µA
Changed typo in Data Retention Characteristics(tR) from 100 µs to tRC ns
Changed tOHA from 6 ns to 10 ns for both 35 ns and 45 ns Speed Bin
Changed tHZOE, tHZWE from 12 to 15 ns for 35 ns Speed Bin and 15 to 18 ns for 45
ns Speed Bin
Changed tSCE from 25 to 30 ns for 35 ns Speed Bin and 40 to 35 ns for 45 ns Speed
Bin
Changed tHZCE from 12 to18 ns for 35 ns Speed Bin and 15 to 22 ns for 45 ns
Speed Bin
Changed tSD from 15 to 18 ns for 35 ns Speed Bin and 20 to 22 ns for
45 ns Speed Bin
Changed tDOE from 15 to 18 ns for 35 ns Speed Bin
Corrected typo in Package Name
Changed Ordering Information to include Pb-Free Packages
*B 414820 See ECN ZSD Changed from Preliminary to Final
Changed the address of Cypress Semiconductor Corporation on Page #1 from
“3901 North First Street” to “198 Champion Court”
Removed 35ns Speed Bin
Removed “L” version of CY62148E
Changed ICC (Typ) value from 1.5 mA to 2 mA at f=1 MHz
Changed ICC (Max) value from 2 mA to 2.5 mA at f=1 MHz
Changed ICC (Typ) value from 12 mA to 15 mA at f=fmax
Removed ISB1 spec from the Electrical characteristics table
Changed ISB2 Typ values from 0.7 µA to 1 µA and Max values from 2.5 µA to 7 µA
Modified footnote #4 to include current limit
Removed redundant footnote on DNU pins
Changed the AC testload capacitance from 100 pF to 30 pF on page #4
Changed test load parameters R1, R2, RTH and VTH from 1838 Ω, 994 Ω,
645 Ω and 1.75V to 1800 Ω, 990 Ω, 639 Ω and 1.77V
Changed ICCDR from 2.5 µA to 7 µA
Added ICCDR typical value
Changed tLZOE from 3 ns to 5 ns
Changed tLZCE and tLZWE from 6 ns to 10 ns
Changed tHZCE from 22 ns to 18 ns
Changed tPWE from 30 ns to 35 ns
Changed tSD from 22 ns to 25 ns
Updated the ordering information table and replaced Package Name column with
Package Diagram
*C 464503 See ECN NXR Included Automotive Range in product offering
Updated the Ordering Information
*D 485639 See ECN VKN Corrected the operating range to 4.5V - 5.5V on page# 3
*E 833080 See ECN VKN Added footnote #8
Added VILspec for SOIC package
*F 890962 See ECN VKN Added Automotive-A part and its related information
Removed Automotive-E part and its related information
Added footnote #2 related to SOIC package
Added footnote #9 related to ISB2
Added AC values for 55 ns Industrial-SOIC range
Updated Ordering Information table
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