Dell PowerEdge M610x Quick start guide

PowerEdge M610x
Technical Guide
PCIe expansion
capabilities in the
PowerEdge M610x
bring a new
dimension of
flexibility and
performance to
the Dell M-Series.

Dell
Dell PowerEdge M610x Technical Guide ii
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Revision 2 December 2010

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Dell PowerEdge M610x Technical Guide iii
Table of Contents
1Product Comparison ...........................................................................................1
1.1 Overview ..................................................................................................1
1.1.1 Unparalleled PowerEdge Flexibility .............................................................1
1.1.2 Uncompromised Performance ....................................................................1
1.1.3 Simplified Systems Management .................................................................1
1.2 Product Comparison .....................................................................................2
2New Technologies..............................................................................................4
2.1 Overview ..................................................................................................4
3System Information ............................................................................................5
3.1 Overview ..................................................................................................5
4Mechanical ......................................................................................................8
4.1 Chassis Description.......................................................................................8
4.2 Dimensions and Weight..................................................................................8
4.3 Internal Module View ....................................................................................9
4.4 Security....................................................................................................9
4.5 Cover Latch ...............................................................................................9
4.6 TPM (Trusted Platform Module)........................................................................9
4.7 Power Off Security.......................................................................................9
4.8 USB Key.................................................................................................. 10
4.9 Battery................................................................................................... 10
4.10 Field Replaceable Units (FRU)........................................................................ 10
4.11 User Accessible Jumpers, Sockets, and Connectors............................................... 10
5Power, Thermal, Acoustic .................................................................................. 11
5.1 Power Supplies ......................................................................................... 11
5.2 Power Efficiency ....................................................................................... 11
5.3 Thermal Operating and Storage Specifications .................................................... 11
5.4 Acoustics ................................................................................................ 12
6Processors..................................................................................................... 14
6.1 Overview ................................................................................................ 14
6.2 Features ................................................................................................. 14
6.3 Supported Processors.................................................................................. 16
6.4 Processor Installation.................................................................................. 16
7Memory ........................................................................................................ 17
7.1 Overview ................................................................................................ 17
7.2 DIMMs Supported ....................................................................................... 17
7.3 Memory Features....................................................................................... 18
7.4 Memory Speed Limitations............................................................................ 18
8Chipset ........................................................................................................ 20
8.1 Overview ................................................................................................ 20
8.2 I/O Hub (IOH) ........................................................................................... 20
8.2.1 QuickPath Interconnect (QPI) .................................................................. 20
8.2.2 PCI Express ........................................................................................ 20
8.2.3 Direct Media Interface (DMI) ................................................................... 20
8.2.4 I/O Controller Hub 9 (ICH9)..................................................................... 20
8.2.5 PCI Express Mezzanine Connectors ............................................................ 21
9BIOS ............................................................................................................ 22
9.1 Overview ................................................................................................ 22
9.2 Supported ACPI States................................................................................. 22

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Dell PowerEdge M610x Technical Guide iv
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 23
10.1 Overview ................................................................................................ 23
10.2 Platform Networking LAN on Motherboard (LOM) Technology Overview....................... 23
10.3 I/O Slots (I/O Mezzanine Card Options for M1000e) .............................................. 24
10.3.1 Overview .......................................................................................... 24
10.3.2 Options ............................................................................................ 24
10.3.3 PCIe Card Support................................................................................ 24
10.3.4 NVIDIA Cards ...................................................................................... 24
10.3.5 Fusion-io Cards ................................................................................... 25
11 Storage ........................................................................................................ 26
11.1 Overview ................................................................................................ 26
11.2 Hard Disk Drive Carriers............................................................................... 26
11.3 Empty Drive Bays....................................................................................... 26
11.4 Diskless Configuration Support ....................................................................... 26
11.5 Hard Drive LED Indicators............................................................................. 27
11.6 Optical Drives........................................................................................... 27
11.7 RAID Cards .............................................................................................. 28
11.7.1 SATA Repeater.................................................................................... 28
11.7.2 PERC6/i ............................................................................................ 28
11.7.3 H200................................................................................................ 28
11.7.4 H700 and H800.................................................................................... 28
11.8 LED Indicators .......................................................................................... 28
11.9 Optical Drives........................................................................................... 28
12 Video (PCI Video) ............................................................................................ 29
13 Rack Information............................................................................................. 30
14 Operating Systems ........................................................................................... 31
15 Virtualization ................................................................................................. 32
15.1 Resources................................................................................................ 32
15.2 Advanced Infrastructure Manager by Scalent ...................................................... 32
15.3 Vizioncore ............................................................................................... 32
16 Systems Management........................................................................................ 34
16.1 Overview ................................................................................................ 34
16.2 Server Management.................................................................................... 34
16.3 Embedded Server Management ...................................................................... 35
16.4 Lifecycle Controller and Unified Server Configurator ............................................ 35
16.5 The iDRAC6 Enterprise ................................................................................ 36
16.6 Chassis Management Controller (CMC) .............................................................. 37
17 Peripherals.................................................................................................... 38
17.1 USB Peripherals......................................................................................... 38
17.2 External Storage........................................................................................ 38
Appendix A. Standards Compliance ........................................................................... 39
Appendix B. Regulatory Certifications........................................................................ 41
Appendix C. Additional Technical Specifications ........................................................... 42
Tables
Table 1. Product Comparisons .................................................................................2
Table 2. Product Features ......................................................................................5
Table 3. Operating and Storage Specifications ............................................................ 12
Table 4. Typical Configuration for Acoustical Performance Analysis................................... 13
Table 5. Comparison of Processor Technology ............................................................ 15

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Dell PowerEdge M610x Technical Guide v
Table 6. Supported Processors ............................................................................... 16
Table 7. Maximum Supported Memory Frequencies ...................................................... 19
Table 8. Supported Video Modes ............................................................................ 29
Table 9. Unified Server Configurator Features and Description......................................... 35
Table 10. Features List for BMC, iDrac, and vFlash ........................................................ 36
Table 11. Standards Compliance and Specifications ....................................................... 39
Table 12. Technical Specifications ........................................................................... 42
Figures
Figure 1. PowerEdge M1000e ...................................................................................8
Figure 2. Internal View ..........................................................................................9
Figure 3. 2.5‖ HDD Carrier .................................................................................... 26

1Product Comparison
1.1 Overview
With PCIe expansion options and a feature rich Chassis Management Controller, the Dell™
PowerEdge™ M610x allows you to efficiently run applications, consolidate your data center, and
simplify data management.
The PowerEdge M610x enables you to incorporate a vast array of PCIe-based products into the Blade
Chassis framework with enough power and cooling to efficiently deploy even the most feature-rich,
expansion-card-based solutions. With the addition of the PCIe expansion module, the PowerEdge
M610x blade server is an ideal solution for organizations that need maximum flexibility and
performance with high reliability. Maximized Gen2 PCIe expansion is finally realized within a blade.
1.1.1 Unparalleled PowerEdge Flexibility
The PowerEdge M610x PCIe expansion module includes two full-length x16 PCIe Gen2 slots with
supplemental power connectors that enable maximum wattage for one 300W dual-slot card or two
250W single-slot cards. These PCIe slots are capable of supporting everything from H-series external
RAID controllers to general-purpose computing-on-graphics processing units (GPGPU).
Now, a single M610x, equipped with a NVIDIA®Tesla™ GPGPU card, can perform over 400 Gigaflops of
double-precision computations for demanding, floating-point-intensive workloads. Communication
between the host system and the Tesla processors is maximized by providing x16 Gen2 PCIe
bandwidth while the efficient Dell M1000e chassis powers and cools the solution to its maximum
247W TDP (Thermal Design Power).
1.1.2 Uncompromised Performance
The PowerEdge M610x is an energy-efficient, optimized full-height two-socket server for
virtualization and database applications. Additional manageability features make it easy to use,
manage and deploy. As an ideal PCIe Host server, the M610x features the reliability of two 2.5‖ SAS
or SSD hot-swappable hard drives and the IO throughput of a dual-port embedded gigabit NIC and two
additional network daughtercards. Intel®Xeon®processors 5600 series, plus up to 192GBs of DDR3
memory, offer high performance with low power consumption for a variety of dense-environment
workloads. The Platinum level (+94%) powered and modularly cooled PCIe expansion module delivers
up to 8 Gigabytes per second of application throughput.
1.1.3 Simplified Systems Management
Spend more time on your business and less on maintaining your IT with embedded system
management features on the PowerEdge M610x and the Chassis Management Controller (CMC).
Simplified server and chassis management is achieved through automated discovery which automates
configuration of new hardware through a one-to-many relationship and enables pre-provisioning of
LAN/SAN resources.
In addition, one-to-many updating through the CMC and Virtual File Share simplifies the update
process for BIOS, firmware and drivers without additional software. Proactive management provides
immediate access to system status, issues and alerts through a single, easy-to-use interface that
includes one-click key functions to help quickly resolve issues.

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Dell PowerEdge M610x Technical Guide 2
1.2 Product Comparison
Table 1. Product Comparisons
M610x
M610
M710HD
M710
Description
Special purpose
Full-height 2S
General purpose Half-
height 2S
General purpose
Half-height 2S
General purpose
Full-height 2S
Processor
2 Socket Intel®Xeon®Processor 5500 or 5600 Series
Front Side
Bus
Two Intel QuickPath Interconnect (QPI)
# Proc
Sockets
2
Max # Cores
per Socket
Up to 6
L2/L3 Cache
8MB (5500 Series) or 12MB (5600 Series)
Chipset
Intel 5500
Intel 5500
Intel 5520
Intel 5520
DIMMs
12 x DDR3 DIMMs
(800/1066/1333MHz)
12 x DDR3 DIMMs
(800/1066/1333MHz)
18 x DDR3 DIMMs
(800/1066/1333MHz)
18 x DDR3 DIMMs
(800/1066/1333MHz)
Min/Max RAM
1GB - 192GB (16GB
DIMMS)
1GB - 192GB (16GB
DIMMS)
1GB–192GB (16GB
DIMMS)
1GB - 192GB (16GB
DIMMS)
Form Factor
Full-Height Blade,
Dual
Socket/Expansion
module
Half-Height Blade,
Dual Socket
Half-Height Blade,
Dual socket
Full-Height Blade,
Dual Socket
HDD Bays
(2.5” only)
SAS: Hot-Pluggable 2
x 2.5‖
SATA: 1 x 2.5‖
SAS: Hot-Pluggable 2
x 2.5‖
SATA: 1 x 2.5‖
SAS: Hot-Pluggable 2
x 2.5‖
SSD SATA: 2 x 2.5‖
SAS: Hot-Pluggable 4
x 2.5‖
SSD SATA: 2 x 2.5‖
HDD Types
SAS/SSD
HDD
Controller
H200
H700
H800
SAS6E
H200
Non-RAID SATA (1
HDD only)
SAS6/iR
PERC6i with RAID
battery
Embedded H200
H200
SAS6/iR
PERC6i with RAID
battery
Optional HD
Controller
SAS6/iR
PERC6i with RAID
battery
SAS6/iR
PERC6i with RAID
battery
Embedded H200
SAS6/iR PERC6i with
RAID battery
Availability
Hot-plug hard drives
ECC memory
Single Device Data Correction (SDDC)
Supports memory demand and patrol
scrubbing
High-availability failover cluster support

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Dell PowerEdge M610x Technical Guide 3
M610x
M610
M710HD
M710
Server
Management
Integrated Dell Remote Access Controller iDRAC6 Express/Enterprise (both standard) w/
IPMI 2.0 +vMedia/vKVM, and CMC (on the PowerEdge M1000e chassis)
Mezz Slots
2 x8 (PCI Gen 2);
Fabric B limited to a
small form factor
(SFF) mezzanine
card
2 x8 (PCI Gen 2);
Fabric B limited to a
small form factor
(SFF) mezzanine
card
2 x8 PCIe Mezzanine
Cards
1 x4 and 3 x 8 PCIe
Mezzanine Cards
IO slots
Two x16 PCIe Gen2
H800 / 6GB SAS
NVIDIA®M1060 and
M2050-204
NA
NA
NA
RAID
0,1
0,1
0,1
0,1,5
NIC/LOM
2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator
2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator
4 x 1GbE dual
Broadcom®
BCM5709S
4 x TOE with
optional iSCSI
offload
USB
2 external, 1
internal
2 external, 1
internal
2 x external USB 2.0
ports at front bezel
1 x internal USB port
3 x external USB 2.0
ports at front bezel
1 x internal USB port
SD Card
2: 1 for Persistent
Storage 1 for
Management
2: 1 for Persistent
Storage 1 for
Management
2 x internal SD slot
1 for Persistent
Storage
1 for Management
(can also be
configured as
redundant SD cards
for embedded
hypervisor)
1 x internal SD slot
1 for Persistent
Storage
1 for Management
TPM
Yes, except in China where TCM is the standard
Video
Matrox®G200eW integrated into iDRAC chip
Power
Supplies
See the PowerEdge M1000e Technical Guide.
Fans
See the PowerEdge M1000e Technical Guide.
Chassis
See the PowerEdge M1000e Technical Guide.

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Dell PowerEdge M610x Technical Guide 4
2New Technologies
2.1 Overview
The PowerEdge M610x offers you expandability. The M610x is a half-height blade (based on the M610
server technology) and PCIe card expansion module within a PowerEdge M1000e full-height blade
enclosure which provides the capability to use standard PCIe cards. Similar to the PowerEdge M610,
the PowerEdge M610x features:
Dual quad- and six-core Intel Xeon processor 5500 and 5600 series
Intel IOH (24D I/O Hub)
Intel QuickPath Architecture
DDR3 memory
DIMM thermal sensors
PCI Express Generation 2
Internal SD Module
iDRAC6 Express
The M610x incorporates the system board of the M610 plus a PCI module—two x16 PCIe slots. The
module’s 2nd Generation expansion slots can accommodate any standard full-length or full-height
PCIe card. Supplemental power connectors allow, for the first time in the PowerEdge family,
utilization of up to 2 x 250W or 1 x 350W PCIe cards (inclusive of GPGPUs1).
1General-Purpose computation on Graphics Processing Units

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Dell PowerEdge M610x Technical Guide 5
3System Information
3.1 Overview
Table 2. Product Features
Feature
Technical Specifications
Processors
Intel®Xeon®processor 5500 and 5600 series quad and six-core
60W, 80W, and 95W TDP options
Chipset
Intel®5520
Memory1
1GB/2GB/4GB/8GB/16GB 1066 and 1333MHz DDR3
12 DIMM Slots with support for up to 192GBs using RDIMMs
Drive Bays
Two 2.5‖ SAS/Solid State hot-swappable drives
Storage1
Internal Hot-Swappable Drives:
2.5‖ SAS (10K rpm): 146GB, 300GB, or 600GB
2.5‖ SAS (15K rpm): 73GB or 146GB
2.5‖ SATA (7.2k rpm): 80GB, 120GB, 160GB or 250GB, or 500GB
Solid State Drives (SSD): 100GB
Solid State Storage Cards:
Fusion-io®160IDSS—160GB ioDrive PCIe solid state storage card
Fusion-io®640IDSS—640GB ioDrive Duo PCIe solid state storage card
Maximum Internal Disk Storage:
Up to 1.2TB using two 2.5‖ 600GB hot-plug SAS hard drives
RAID Controller
Options
PERC H200 Modular RAID Controller (6Gb/s)
PERC H700 Modular RAID Controller (6Gb/s) with 512 MB battery-backed cache
I/O Mezzanine Card
Options
Fully populated mezzanine card slots and switch modules will yield 3 redundant I/O
fabrics per blade.
1Gb and 10Gb Ethernet:
Dual-Port Broadcom®Gb Ethernet w/ TOE (BCM-5709S)
Quad-Port Intel®Gb Ethernet
Quad-Port Broadcom®Gb Ethernet (BCM-5709S)
Dual-Port Intel®10Gb Ethernet
Dual-Port Broadcom®10Gb Ethernet (BCM-57711)
10Gb Enhanced Ethernet and Converged Network Adapters (CEE/DCB/FCoE):
Dual-Port Intel®10Gb Enhanced Ethernet (FcoE Ready for Future Enablement)
Dual-Port Emulex®Converged Network Adapter (OCM10102-F-M) - Supports CEE/DCB
10GbE + FCoE
Dual-Port Qlogic®Converged Network Adapter (QME8142) - Supports CEE/DCB 10GbE
+ FCoE

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Dell PowerEdge M610x Technical Guide 6
Fibre Channel:
Dual-Port QLogic®FC8 Fibre Channel Host Bus Adapter (HBA) (QME2572)
Dual-Port Emulex®FC8 Fibre Channel Host Bus Adapter (HBA) (LPe1205-M)
Infiniband:
Dual-Port Mellanox®ConnectX-2™ Dual Data Rate (DDR) and Quad Data Rate (QDR)
InfiniBand
Communications
Two embedded Broadcom®NetXtreme II™ 5709 Gigabit Ethernet NICs with failover
and load balancing.
TOE (TCP/IP Offload Engine) supported on Microsoft®Windows Server®2003 SP1 or
higher with Scalable Networking Pack. iSCSI Offload supported on Windows Server®
2003 SP1 or higher, Red Hat®Enterprise Linux®5, and SUSE®Linux®Enterprise Server
10. Scalable Networking Pack for Windows Server®2003 is not required.
Boot from SAN (iSCSI and FC) supported
Optional add-in NICs: See I/O Mezzanine Card Options
Optional add-in HBAs: See I/O Mezzanine Card Options
PCIe Expansion Bay
Two 2nd-generation full-length x16 slots with supplemental power for either two
cards at 250 watt draws or one card at a 300watt draw.
GPGPU Options:
NVIDIA®Tesla™M1060–240 core, double-
width PCIe card with 4GB of memory
NVIDIA®Tesla™ M2050/M2070–448 Core,
double-width PCIe card with 3/6GB of
ECC memory
SAS/PERC Options:
Dell™ H800 PERC–Dual-port 6Gb/s SAS
RAID controller with up to 512MB cache
Dell™ SAS6E HBA–Dual-port 6Gb/s SAS
HBA
Solid State Storage Options:
Fusion-io®160IDSS—160GB ioDrive PCIe
solid state storage card
Fusion-io®640IDSS—640GB ioDrive Duo
PCIe solid state storage card
Operating Systems
Microsoft®Windows®Essential Business Server 2008
Microsoft®Windows Server®2008 SP2, x86/x64 (x64 includes Hyper-V™ )
Microsoft®Windows Server®2008 R2, x64 (includes Hyper-V™ v2)
Microsoft®Windows®HPC Server 2008
Novell®SUSE®Linux®Enterprise Server
Red Hat®Enterprise Linux®
Sun®Solaris™
For more information on the specific versions and additions, visit
http://www.dell.com/OSsupport.
Virtualization OS
Support
Microsoft®Windows Server®2008, with Hyper-V™
VMware®vSphere™ Version 4.0 (including ESX v4.0/ ESXi™ v4.0)
Optional Embedded Hypervisors:
Citrix®XenServer™
Microsoft®Windows Server®2008, with Hyper-V™
VMware®ESXi™ 4.1

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Dell PowerEdge M610x Technical Guide 7
Management Options
Dell™ OpenManage™ software tools
Dell Management Console
Integration with 3rd party management solutions via the Dell Certified Partner
Program
Altiris™ Deployment Solution for Dell Blade Servers
Designed to help reduce deployment time from hours to minutes
Integrated Dell Remote Access Controller (iDRAC)
Out-of-Band alerting, status, inventory, and troubleshooting via Secure Web GUI /
CLI (telnet/SSH)
Console Redirection
vMedia (virtual media)—Map optical or hard drives to the blade from remote
workstations over a network
vKVM (virtual KVM) out-of-band remote console redirection—supports Java or ActiveX
plug-ins
IPMI 2.0 support
Power Supply
Supplied by Dell™ PowerEdge™ M1000e Blade Chassis
Video
Integrated Matrox®G200 w/ 8MB memory
Systems Management
BMC, IPMI2.0 compliant
Dell™ OpenManage™ featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller
iDRAC6 Enterprise with optional vFlash
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.

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Dell PowerEdge M610x Technical Guide 8
4Mechanical
4.1 Chassis Description
The PowerEdge M610x is a full-height blade server that requires an M1000e chassis to operate.
Figure 1. PowerEdge M1000e
The M610x server occupies 2 slots in the M1000e rack chassis for a maximum of 8 blades in one
M1000e chassis. It can be mixed with other existing Dell blades and is designed to mix with possible
future half- and full-height double-wide blades. Some highlights are:
Two full-size standard PCI-E x16
Front Cable Access provided for add-in cards
Support for RAID
Support for persistent storage (internal USB connector and two external SD card slots)
Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.
4.2 Dimensions and Weight
The PowerEdge M610x dimensions and weight are as follows:
Height: 38.5cm (15.2in)
Width: 5cm (2in)
Depth: 48.6cm (19.2in)
Weight (Maximum Configuration): 11.1kg (24.5lb)

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Dell PowerEdge M610x Technical Guide 9
4.3 Internal Module View
A view of the internal module is shown in Figure 2. See the Opening and Closing the Blade section in
the Installing Blade Components chapter of the Dell PowerEdge Modular Systems Hardware Owner’s
Manual for more information.
Figure 2. Internal View
4.4 Security
The M610x offers a configurable client IP address range for clients connecting to iDRAC6. For
additional information regarding the PowerEdge M610x security features, see the Dell PowerEdge
Modular Systems Hardware Owner’s Manual.
4.5 Cover Latch
The blade module includes a latch for the cover. See the Opening and Closing the Blade section in
the Installing Blade Components chapter in the Dell PowerEdge Modular Systems Hardware Owner’s
Manual for more information.
4.6 TPM (Trusted Platform Module)
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. TCM is
available in China.
4.7 Power Off Security
Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.

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Dell PowerEdge M610x Technical Guide 10
The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power
button and USB ports.
4.8 USB Key
The M610x provides an internal USB connector for a USB flash memory key. The USB memory key can
be used as a boot device, security key, or mass storage device.
4.9 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip
4.10 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number
4.11 User Accessible Jumpers, Sockets, and Connectors
For information, see the System Board Information chapter in the Dell PowerEdge Modular Systems
Hardware Owner’s Manual.

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Dell PowerEdge M610x Technical Guide 11
5Power, Thermal, Acoustic
5.1 Power Supplies
See the PowerEdge M1000e Technical Guide for information on power supplies and power supply
specifications.
5.2 Power Efficiency
One of the main features of blade servers is enhanced power efficiency. The M610x achieves higher
power efficiency by implementing the following features:
•User-configurable power options through the M1000e Chassis Management Controller (CMC)
(see the M1000e documentation online at support.dell.com for further details)
•Improved power budgeting
•Voltage Regulator (VR) efficiency improvements
•CPU VR dynamic phase shedding
•Switching regulators instead of linear regulators
•Closed loop thermal throttling
•Use of DDR3 memory (lower voltage compared to DDR2)
•Memory VR static phase shedding
•BIOS Power/Performance options page
•Active Power Controller (BIOS-based CPU P-state manager)
•Ability to throttle memory
•Ability to disable a CPU core
•Ability to turn off embedded NICs or PCIe lanes when not being used
•Energy Smart components at the M1000e chassis level to selectively enable more computing
performance with less power consumption.
5.3 Thermal Operating and Storage Specifications
The M610x thermal solution includes:
Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling directs airflow through the components to maintain proper cooling
Custom designed heat sinks maintain CPU, DIMM, and board-level chip temperatures within
thermal design targets
Separate airflow cooling path for the two full-length x16 PCIe Gen2 slots.
Support for dual slot NVIDIA®GPU cards up to 250W.
Highly Optimized Fan Control Algorithm
oBase fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
oComponent algorithms: CPU PID, DIMMs, HW Configuration, IOH, GPU, and External
Ambient.
oThe highest fan speed request from the above algorithms is used to set the
appropriate fan speed for the blade.
oAmbient and HW Configuration sets the minimum –other algorithms increase fan speed
to maintain proper cooling.

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Dell PowerEdge M610x Technical Guide 12
Thermal specifications for the PowerEdge M610x are detailed in Table 3 along with other important
operating and storage information.
Table 3. Operating and Storage Specifications
Temperature
Operating
10o to 35o C (50oto 95oF) with a maximum temperature gradation of
10oC per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1oF/500ft
Storage
-40oto 65oC (-40oto 149oF) with a maximum temperature gradation
of 20oC per hour
Relative Humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation of
10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of
10% per hour
Maximum Vibration
Operating
0.26 Grms at 5-350 Hz in operational orientations
Storage
1.54 Grms at 10-250 Hz in all orientations
Maximum Shock
Operating
Half sine shock in all operational orientations of 31 G +/- 5% with a
pulse duration of 2.6 ms +/- 10%
Storage
Half sine shock on all six sides of 71 G +/- 5% with a pulse duration
of 2 ms +/- 10%
Altitude
Operating
-15.2m to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 ft, the maximum temperature is
derated 1oF/550 ft
Storage
-16 to 10,600 m (-50 to 35,000 ft)
5.4 Acoustics
Adherence to Dell’s high sound quality standards. Sound quality is different from
sound power level and sound pressure level in that it describes how humans respond
to annoyances in sound, like whistles, hums, etc. One of the sound quality metrics in
the Dell specification is prominence ratio of a tone.
Acoustical Performance of Typical Configuration. When installed in the M1000e
blade chassis, typical configuration2of M610x blade results in the following idle
2Typical configuration means projected average quantity, type, capacity, speed, etc., of components. Configuration for which
data reported is listed in the following table.

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Dell PowerEdge M610x Technical Guide 13
acoustical performance in 23±2° C ambient: LwA-UL3= 8.2 bels and no prominent
tones4.
Table 4. Typical Configuration for Acoustical Performance Analysis
Chassis
Description
Quantity
Blade
M610x
4
Slots populated
1, 2, 3, 4
Power supply
2360-W
6
Blanks
8
System Fans
M1000e fan
9
Blade Internals
Description
Quantity
CPU
Intel E5620 80W
2
DIMM
4 GB Dual Rank
12
Mezz Cards
Dual port GbE FC
2
HDD
SAS 2.5‖ 146 GB, 15 krpm
2
3LwA –UL is the upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in
accordance to ISO 7779 (1999).
4Prominent tone: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if discrete tones are prominent.
The system is placed in a rack with its bottom at 75 cm from the floor. The acoustical transducer is at front bystander position,
ref ISO7779 (1999) Section 8.6.2.

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Dell PowerEdge M610x Technical Guide 14
6Processors
6.1 Overview
The Intel Xeon processor 5500 and 5600 series are designed specifically for servers and workstation
applications. These processors feature quad-core processing to maximize performance and
performance/watt for data center infrastructures and highly dense deployments. They feature Intel
Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems and use a 1366-contact Flip-Chip Land Grid Array (FC-LGA) package that plugs into
a surface-mount socket. The M610x provides support for up to two processors.
6.2 Features
Key features of the Intel Xeon processor 5500 series include:
•Up to four cores per processor
•Two point-to-point QuickPath Interconnect links at 6.4 GT/s
•45 nm process technology
•No termination required for non-populated CPUs (must populate CPU socket 1 first)
•Integrated QuickPath DDR3 memory controller
•64-byte cache line size
•RISC/CISC hybrid architecture
•Compatible with existing x86 code base
•MMX™ support
•Execute Disable Bit
•Intel Wide Dynamic Execution
Executes up to four instructions per clock cycle
•Simultaneous Multi-Threading (SMT) capability
•Support for CPU Turbo Mode (on certain SKUs)
Increases CPU frequency if operating below thermal, power and current limits
•Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
•Intel®64 Technology
•Intel®VT-x and VT-d Technology for virtualization support
•Enhanced Intel®SpeedStep®Technology
•Demand-based switching for active CPU power management as well as support for ACPI P-
States, C-States and T-States
The Intel Xeon processor 5600 series encompasses all the features of the 5500 series along with:
•New top BIN processors at 130W TDP
•Support for DDR3L, 1.35v DIMMs for even lower system power
•Support for memory sparing
•AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL.
•Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks

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Dell PowerEdge M610x Technical Guide 15
oDell BIOS enablement in the future will include a test and development BIOS at
launch, and a full production BIOS in Q4 of 2010
Table 5. Comparison of Processor Technology
Intel®Xeon®Processor
5400 Series
5500 Series
5600 Series
# Cores
4
4
6
Last Level Cache
2 x 6 MB shared
8 MB shared
12 MB shared
FSB (MHz) / Link Frequency
(GT/s)
1333 MHz
Up to 6.4 GT/s
Up to 6.4 GT/s
Max TDP
120W
130W for WS
95W for Server
130W for WS and
Server
Max Frequency
>3 GHz
>3 GHz
>3 GHz
Memory Controller
Separate in
chipset
Integrated 3-channel
DDR3
Integrated 3-
channel DDR3
Process Technology
45nm
45nm
32nm
Intel®Trusted Execution
Technology
No
No
Yes
Intel®Advanced Encryption
Security- New Instructions
No
No
Yes
Intel®Virtualization
Technology
Yes
Yes
Yes
Intel®64
Yes
Yes
Yes
Intel®Hyper-Threading
Technology
No
Yes
Yes
Socket
LGA 771
LGA1366
LGA1366