Dell PowerEdge M610x Quick start guide

PowerEdge M610x
Technical Guide
PCIe expansion
capabilities in the
PowerEdge M610x
bring a new
dimension of
flexibility and
performance to the
Dell M-Series.

Dell
Dell PowerEdge M610x Technical Guide ii
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December 2012 | Version 6.0

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Dell PowerEdge M610x Technical Guide iii
Table of Contents
1Product Comparison ...........................................................................................6
1.1 Overview ..................................................................................................6
1.1.1 Unparalleled PowerEdge Flexibility .............................................................6
1.1.2 Uncompromised Performance ....................................................................6
1.1.3 Simplified Systems Management .................................................................6
1.2 Product Comparison .....................................................................................7
2Key Technologies...............................................................................................9
2.1 Overview ..................................................................................................9
3System Information .......................................................................................... 10
4Mechanical .................................................................................................... 13
4.1 Chassis Description..................................................................................... 13
4.2 Dimensions and Weight................................................................................ 13
4.3Internal Module View .................................................................................. 14
4.4 Security.................................................................................................. 14
4.5 Cover Latch ............................................................................................. 14
4.6 Trusted Platform Module.............................................................................. 14
4.7 Power Off Security..................................................................................... 14
4.8 USB Key.................................................................................................. 14
4.9 Battery................................................................................................... 14
4.10 Field Replaceable Units ............................................................................... 15
4.11 User Accessible Jumpers, Sockets, and Connectors............................................... 15
5Power, Thermal, Acoustic .................................................................................. 16
5.1Power Supplies ......................................................................................... 16
5.2 Power Efficiency ....................................................................................... 16
5.3 Thermal Operating and Storage Specifications .................................................... 16
5.4 Acoustics ................................................................................................ 17
6Processors..................................................................................................... 19
6.1 Overview ................................................................................................ 19
6.2 Features ................................................................................................. 19
6.3 Supported Processors.................................................................................. 20
6.4 Processor Installation.................................................................................. 21
7Memory ........................................................................................................ 22
7.1 Overview ................................................................................................ 22
7.2 DIMMs Supported ....................................................................................... 22
7.3 Memory Features....................................................................................... 23
7.4 Speed .................................................................................................... 23
8Chipset ........................................................................................................ 25
8.1 Overview ................................................................................................ 25
8.2 I/O Hub .................................................................................................. 25
8.2.1 QuickPath Interconnect ......................................................................... 25
8.2.2 PCI Express ........................................................................................ 25
8.2.3 Direct Media Interface........................................................................... 25
8.2.4 I/O Controller Hub 9 ............................................................................. 25
8.2.5 PCI Express Mezzanine Connectors ............................................................ 26
9BIOS ............................................................................................................ 27
9.1 Overview ................................................................................................ 27
9.2 Supported ACPI States................................................................................. 27
10 Embedded NICs/LAN on Motherboard..................................................................... 28

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Dell PowerEdge M610x Technical Guide iv
11 I/O Mezzanine Card Options................................................................................ 29
11.1.1 Overview .......................................................................................... 29
11.1.2 Options ............................................................................................ 29
11.1.3 PCIe Card Support................................................................................ 29
11.1.4 GPGPU Cards...................................................................................... 29
11.1.5 Fusion-io Cards ................................................................................... 30
12 Storage ........................................................................................................ 31
12.1 Overview ................................................................................................ 31
12.2 Hard Disk Drive Carriers............................................................................... 31
12.3 Empty Drive Bays....................................................................................... 31
12.4 Diskless Configuration Support ....................................................................... 31
12.5 Hard Drive LED Indicators............................................................................. 31
12.6 Optical Drives........................................................................................... 31
12.7 RAID Cards .............................................................................................. 32
12.7.1 SATA Repeater.................................................................................... 32
12.7.2 PERC6/i ............................................................................................ 32
12.7.3 H200................................................................................................ 32
12.7.4 H700 and H800.................................................................................... 32
12.8 LED Indicators .......................................................................................... 32
12.9 Optical Drives........................................................................................... 32
13 Video........................................................................................................... 33
14 Rack Information............................................................................................. 34
15 Operating Systems ........................................................................................... 35
16 Virtualization ................................................................................................. 36
16.1 Resources................................................................................................ 36
16.2 Advanced Infrastructure Manager by Scalent ...................................................... 36
17 Systems Management........................................................................................ 37
17.1 Overview ................................................................................................ 37
17.2 Server Management.................................................................................... 37
17.3 Embedded Server Management ...................................................................... 38
17.4 Lifecycle Controller and Unified Server Configurator ............................................ 38
17.5 Integrated Dell Remote Access Controller.......................................................... 39
17.6 iDRAC6 Enterprise...................................................................................... 39
17.7 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ............................................. 39
17.8 Chassis Management Controller (CMC) .............................................................. 41
18 Peripherals.................................................................................................... 42
18.1 USB Peripherals......................................................................................... 42
18.2 External Storage........................................................................................ 42
Appendix A. Statement of Volatility .......................................................................... 43
Appendix B. Certifications ..................................................................................... 49
Regulatory Certifications ............................................................................. 49B 1.
Product Safety Certifications......................................................................... 49B 2.
Electromagnetic Compatibility....................................................................... 50B 3.
Ergonomics, Acoustics and Hygienics ............................................................... 50B 4.
Appendix C. Industry Standards ............................................................................... 51
Tables
Table 1. Product Comparisons .................................................................................7
Table 2. Product Features .................................................................................... 10
Table 3. Operating and Storage Specifications ............................................................ 17

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Dell PowerEdge M610x Technical Guide v
Table 4. Acoustical Performance of M1000e Chassis with Four M610x Blades Installed ............. 18
Table 5. Comparison of Processor Technology ............................................................ 20
Table 6. Supported Processors ............................................................................... 20
Table 7. Maximum Supported Memory Frequencies ...................................................... 24
Table 8. Supported Video Modes ............................................................................ 33
Table 9. Server Management Documentation and Information.......................................... 37
Table 10. Unified Server Configurator Features and Description......................................... 38
Table 11. Features List for Base Management Functionality, iDRAC, and vFlash Media .............. 39
Table 12. PowerEdge M610x Statement of Volatility....................................................... 43
Table 13. Product Safety Certifications...................................................................... 49
Table 14. Electromagnetic Compatibility Certifications................................................... 50
Table 15. Ergonomics, Acoustics and Hygienics............................................................. 50
Table 16. Industry Standards .................................................................................. 51
Figures
Figure 1. PowerEdge M1000e ................................................................................. 13
Figure 2. Internal View ........................................................................................ 14
Figure 3. 2.5‖ HDD Carrier .................................................................................... 31

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Dell PowerEdge M610x Technical Guide 6
1Product Comparison
1.1 Overview
With PCI Express®(PCIe) expansion options and a feature rich Chassis Management Controller, the
Dell™ PowerEdge™ M610x allows you to efficiently run applications, consolidate your data center,
and simplify data management.
The PowerEdge M610x enables you to incorporate a vast array of PCIe-based products into the blade
chassis framework with enough power and cooling to efficiently deploy even the most feature-rich,
expansion-card-based solutions. With the addition of the PCIe expansion module, the PowerEdge
M610x blade server is an ideal solution for organizations that need maximum flexibility and
performance with high reliability. Maximized PCIe Generation 2 (Gen2) expansion is finally realized
within a blade.
1.1.1 Unparalleled PowerEdge Flexibility
The PowerEdge M610x PCIe expansion module includes two full-length x16 PCIe Gen2 slots with
supplemental power connectors that enable maximum wattage for one 300W dual-slot card or two
250W single-slot cards. These PCIe slots are capable of supporting everything from H-series external
RAID controllers to general-purpose computing-on-graphics processing units (GPGPU).
Now, a single M610x, equipped with a NVIDIA®Tesla™ or AMD ATI FirePro™GPU card, can perform
over 400 Gigaflops of double-precision computations for demanding, floating-point-intensive
workloads. Communication between the host system and the GPU processors is maximized by
providing x16 PCIe Gen2 bandwidth, while the efficient Dell M1000e chassis powers and cools the
solution to its maximum 247 W TDP (Thermal Design Power).
1.1.2 Uncompromised Performance
The PowerEdge M610x is an energy-efficient, optimized full-height two-socket server for
virtualization and database applications. Additional manageability features make it easy to use,
manage and deploy. As an ideal PCIe Host server, the M610x features the reliability of two 2.5‖ SAS
or SSD hot-swappable hard drives and the I/O throughput of a dual-port embedded gigabit NIC and
two additional network daughtercards. Intel®Xeon®processors 5600 series, plus up to 192 GB of
DDR3 memory, offer high performance with low-power consumption for a variety of
dense-environment workloads. The Platinum level (+94%) powered and modularly cooled PCIe
expansion module delivers up to 8 GB per second of application throughput.
1.1.3 Simplified Systems Management
Spend more time on your business and less on maintaining your IT with embedded system
management features on the PowerEdge M610x and the Chassis Management Controller (CMC).
Simplified server and chassis management is achieved through automated discovery that automates
configuration of new hardware through a one-to-many relationship and enables pre-provisioning of
LAN/SAN resources.
In addition, one-to-many updating through the CMC and Virtual File Share simplifies the update
process for BIOS, firmware and drivers without additional software. Proactive management provides
immediate access to system status, issues and alerts through a single, easy-to-use interface that
includes one-click key functions to help quickly resolve issues.

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Dell PowerEdge M610x Technical Guide 7
1.2 Product Comparison
Table 1 compares the PowerEdge M610x blade server to the PowerEdge M610x, M710HD, and M710
servers.
Table 1. Product Comparisons
M610x
M610
M710HD
M710
Description
Special purpose
full-height 2S
General purpose
half-height 2S
General purpose
half-height 2S
General purpose
full-height 2S
Processor
Intel®Xeon®Processor 5500 or 5600 Series
Front Side
Bus
Two Intel QuickPath Interconnect (QPI)
Sockets
Two
Cores per
Socket
Up to six
L2/L3 Cache
8 MB (5500 Series) or 12 MB (5600 Series)
Chipset
Intel 5520
DIMMs
12 x DDR3 DIMMs (800/1066/1333MT/s)
18 x DDR3 DIMMs (800/1066/1333MT/s)
Min/Max RAM
1 GB –192 GB (16 GB DIMMS)
Form Factor
Full-Height Blade,
Dual
Socket/Expansion
module
Half-Height Blade,
Dual Socket
Half-Height Blade,
Dual socket
Full-Height Blade,
Dual Socket
HDD Bays
(2.5” only)
SAS: Two hot-pluggable 2.5‖
SATA: One 2.5‖
SAS: Two
hot-pluggable 2.5‖
SSD SATA: Two 2.5‖
SAS: Four
hot-pluggable 2.5‖
SSD SATA: Two 2.5‖
HDD Types
SAS/SSD
HDD
Controller
PERC Η200
PERC Η700
PERC Η800
SAS6/Ε
PERC H200
PERC Η700
PERC 6/i
SAS6/iR
CERC 6/i
Embedded PERC
H200
PERC H200
PERC H700
CERC 6/i
Optional HD
Controller
SAS6/iR
PERC6/i with RAID
battery
SAS6/iR
PERC6/i with RAID
battery
Embedded H200
SAS6/iR
PERC6i with RAID
battery
Availability
Hot-plug hard drives
ECC memory
Single Device Data Correction (SDDC)
Supports memory demand and patrol
scrubbing
High-availability failover cluster support
Server
Integrated Dell Remote Access Controller iDRAC6 Express/Enterprise (both standard) with

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Dell PowerEdge M610x Technical Guide 8
M610x
M610
M710HD
M710
Management
IPMI 2.0 +vMedia/vKVM, and CMC (on the PowerEdge M1000e chassis)
Mezz Slots
Two x8 PCIe Gen2;
Fabric B limited to
a small form factor
(SFF) mezzanine
card
Two x8 PCIe Gen2;
Fabric B limited to a
small form factor
(SFF) mezzanine
card
Two x8 PCIe
mezzanine cards
One x4 and three x8
PCIe mezzanine
cards
I/O slots
Two x16 PCIe Gen2
H800/6 GB SAS
NVIDIA®M2050-
204, M2070, and
M2070Q
AMD FirePro™
V7800P
NA
NA
NA
RAID
0,1
0,1
0,1
0,1,5
NIC/LOM
Two-port
Broadcom®5709S
1 Gb with TOE plus
optional iSCSI
accelerator
Two-port Broadcom
5709S
1 Gb with TOE plus
optional iSCSI
accelerator
Four 1 GbE dual
Broadcom BCM5709S
Four TOE with
optional iSCSI
offload
USB
Two external USB 2.0 ports at front bezel
One internal USB port
Three external USB
2.0 ports at front
bezel
One internal USB
port
SD Card
Two:
One for Persistent
Storage
One for
Management
Two:
One for Persistent
Storage
One for Management
Two internal SD slots
One for Persistent
Storage
One for Management
(can also be
configured as
redundant SD cards
for embedded
hypervisor)
One internal SD slot
One for Persistent
Storage
OR
One for Management
TPM
Yes, except in China where TCM is the standard
Video
Matrox®G200eW integrated into iDRAC chip
Power
Supplies
See the PowerEdge M1000e Technical Guide.
Fans
See the PowerEdge M1000e Technical Guide.
Chassis
See the PowerEdge M1000e Technical Guide.

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Dell PowerEdge M610x Technical Guide 9
2Key Technologies
2.1 Overview
The Dell™ PowerEdge™ M610x offers you expandability. The M610x is a half-height blade (based on
the M610 server technology) and PCIe card expansion module within a PowerEdge M1000e full-height
blade enclosure that provides the capability to use standard PCIe cards. Similar to the PowerEdge
M610, the PowerEdge M610x features:
Dual quad- and six-core Intel®Xeon®processor 5500 and 5600 series
Intel IOH (24D I/O Hub)
Intel QuickPath Architecture
DDR3 memory
DIMM thermal sensors
PCI Express®Generation 2
Internal SD Module
iDRAC6 Express
The M610x incorporates the system board of the M610 plus a PCI module—two x16 PCIe slots. The
module’s 2nd Generation expansion slots can accommodate any standard full-length or full-height
PCIe card. Supplemental power connectors allow, for the first time in the PowerEdge family, up to
two 250W-PCIe cards or one 350W-PCIe card (inclusive of General-Purpose computation on Graphics
Processing Units or GPGPU).

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Dell PowerEdge M610x Technical Guide 10
3System Information
Table 2 summarizes the product features for the Dell™ PowerEdge™ M610x. For the latest information
on supported features, visit Dell.com.
Table 2. Product Features
Feature
Technical Specifications
Processors
Intel®Xeon®processor 5500 and 5600 series
quad- and six-core 60 W, 80 W, 95 W, and 130 W TDP options
Chipset
Intel 5520
Memory1
1 GB, 2 GB, 4 GB, 8 GB, 16 GB 1066 MT/s and 1333 MT/s DDR3
12 DIMM slots with support for up to 192 GB using RDIMMs
Drive Bays
Two 2.5‖ SAS/Solid State hot-plug drives
Storage1
Internal hot-plug hard drive options:
2.5‖ SAS (10 K rpm): 146 GB, 300 GB, 600 GB, or 900 GB
2.5‖ SAS (15 K rpm): 146 GB
2.5‖ SATA (7.2 K rpm): 160 GB, 250 GB, or 500 GB
Solid State Drives (SSD): 50 GB or 100 GB
Solid State Storage Cards:
Fusion-io®160 GB ioDrive PCIe solid state storage card
Fusion-io 640 GB ioDrive Duo PCIe solid state storage card
Fusion-io 320GB ioDrive Mono PCIe solid state storage card
Fusion-io 640GB ioDrive Mono PCIe solid state storage card
Fusion-io 1.28TB ioDrive Duo PCIe solid state storage card
Maximum Internal Disk Storage:
Up to 1.8 TB using two 2.5‖ 900 GB hot-plug SAS hard drives
RAID Controller
Options
PERC H200 Modular RAID Controller (6 Gb/s)
PERC H700 Modular RAID Controller (6 Gb/s) with 512 MB battery-backed cache
I/O Mezzanine Card
Options
Fully populated mezzanine card slots and switch modules will yield three redundant
I/O fabrics per blade.
1 Gb and 10 Gb Ethernet:
Dual-Port Broadcom®Gb Ethernet with TOE (BCM-5709S)
Quad-Port Intel Gb Ethernet
Quad-Port Broadcom Gb Ethernet (BCM-5709S)
Dual-Port Intel 10Gb Ethernet
Dual-Port Broadcom 10Gb Ethernet (BCM-57711)
10Gb Enhanced Ethernet and Converged Network Adapters (CEE/DCB/FCoE):
Dual-Port Intel 10Gb Enhanced Ethernet (FcoE Ready for Future Enablement)
Dual-Port Emulex®Converged Network Adapter (OCM10102-F-M; supports CEE/DCB

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Dell PowerEdge M610x Technical Guide 11
Feature
Technical Specifications
10GbE + FcoE)
Dual-Port Qlogic®Converged Network Adapter (QME8142; supports CEE/DCB 10GbE
+ FcoE)
Fibre Channel:
Dual-Port QLogic FC8 Fibre Channel Host Bus Adapter (HBA) (QME2572)
Dual-Port Emulex FC8 Fibre Channel Host Bus Adapter (HBA) (LPe1205-M)
Emulex 8 or 4 Gb/s Fibre Channel Pass-Through Module
InfiniBand™:
Dual-Port Mellanox®ConnectX®-2 Dual Data Rate (DDR) and Quad Data Rate (QDR)
InfiniBand
Communications
Two embedded Broadcom NetXtreme II™ 5709 Gigabit Ethernet NICs with failover and
load balancing.
TOE (TCP/IP Offload Engine) supported on Microsoft®Windows Server®2003 SP1 or
higher with Scalable Networking Pack. iSCSI Offload supported on Windows Server®
2003 SP1 or higher, Red Hat®Enterprise Linux®5, and SUSE®Linux®Enterprise Server
10. Scalable Networking Pack for Windows Server®2003 is not required.
Boot from SAN (iSCSI and FC) supported
Optional add-in NICs: See I/O Mezzanine Card Options
Optional add-in HBAs: See I/O Mezzanine Card Options
PCIe Expansion Bay
Two 2nd-generation full-length x16 slots with supplemental power for either two
cards at 250 W draws or one card at a 300 W draw.
Supported GPU Options:
NVIDIA®Tesla™M2050–204 448 core,
double-width PCIe card with 3GB of
memory
NVIDIA Tesla M2070/M2070Q 448 core,
double-width PCIe card with 6GB of
memory
AMD FirePro™V7800P 1,440 core, single-
width PCIe card with 2GB of memory
SAS/PERC Options:
Dell H800 PERC dual-port 6 Gb/s SAS RAID
controller with up to 512MB cache
Dell SAS6E HBA dual-port 6 Gb/s SAS HBA
Solid State Storage Options:
Fusion-io®160GB ioDrive PCIe solid state
storage card
Fusion-io®320GB ioDrive PCIe solid state
storage card
Fusion-io®640GB ioDrive PCIe solid state
storage card
Fusion-io®640GB ioDrive Duo PCIe solid
state storage card
Fusion-io®1.28TB ioDrive Duo PCIe solid
state storage card
Operating Systems
Microsoft Windows Server®2012
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Microsoft Windows HPC Server 2008
Novell®SUSE®Linux Enterprise Server
Red Hat®Enterprise Linux®
Oracle®Solaris™

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Dell PowerEdge M610x Technical Guide 12
Feature
Technical Specifications
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
Virtualization OS
Support
Citrix®XenServer®
Microsoft Hyper-V through Microsoft Windows Server 2008
VMware®vSphere®including ESX™and ESXi™
Red Hat Enterprise Virtualization®
Management Options
Dell OpenManage™ software tools
Dell Management Console
Integration with 3rd party management solutions via the Dell Certified Partner
Program
Altiris™ Deployment Solution for Dell Blade Servers
Designed to help reduce deployment time from hours to minutes
Integrated Dell Remote Access Controller (iDRAC)
Out-of-Band alerting, status, inventory, and troubleshooting via Secure Web GUI /
CLI (telnet/SSH)
Console Redirection
vMedia (virtual media)—Map optical or hard drives to the blade from remote
workstations over a network
vKVM (virtual KVM) out-of-band remote console redirection—supports Java or ActiveX
plug-ins
IPMI 2.0 support
Power Supply
Supplied by Dell PowerEdge M1000e Blade Chassis
Video
Integrated Matrox®G200 w/ 8 MB memory
Systems Management
BMC, IPMI2.0 compliant
Dell OpenManage featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller
iDRAC6 Enterprise with optional vFlash
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.

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Dell PowerEdge M610x Technical Guide 13
4Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ M610x is a full-height blade server that requires an M1000e chassis to
operate.
Figure 1. PowerEdge M1000e
The M610x server occupies two slots in the M1000e rack chassis for a maximum of eight blades in one
M1000e chassis. It can be mixed with other existing Dell blades and is designed to mix with possible
future half- and full-height double-wide blades. Some highlights are:
Two full-size standard PCIe x16
Front-cable access provided for add-in cards
Support for RAID
Support for persistent storage (internal USB connector and two external SD card slots)
Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.
4.2 Dimensions and Weight
The PowerEdge M610x dimensions and weight are as follows:
Height: 38.5cm (15.2in)
Width: 5cm (2in)
Depth: 48.6cm (19.2in)
Weight (Maximum Configuration): 11.1kg (24.5lb)

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Dell PowerEdge M610x Technical Guide 14
4.3 Internal Module View
A view of the internal module is shown in Figure 2. See the Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
Figure 2. Internal View
4.4 Security
The M610x offers a configurable client IP address range for clients connecting to iDRAC6. For
additional information regarding the PowerEdge M610x security features, see the Dell PowerEdge
Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals.
4.5 Cover Latch
The blade module includes a latch for the cover. See the Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
4.6 Trusted Platform Module
The Trusted Platform Module (TPM) is used to generate/store keys, protect/authenticate passwords,
and create/store digital certificates. TPM can also be used to enable the BitLocker™ hard drive
encryption feature in Windows Server 2008. TPM is enabled through a BIOS option and uses HMAC-
SHA1-160 for binding. TCM is available in China.
4.7 Power Off Security
Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.
The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power
button and USB ports.
4.8 USB Key
The M610x provides an internal USB connector for a USB flash memory key. The USB memory key can
be used as a boot device, security key, or mass storage device.
4.9 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip

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Dell PowerEdge M610x Technical Guide 15
4.10 Field Replaceable Units
The planar contains a serial EEPROM to contain Field Replaceable Units (FRU) information including
Dell part number, part revision level, and serial number.
4.11 User Accessible Jumpers, Sockets, and Connectors
For information, see the System Board Information chapter in the Dell PowerEdge Modular Systems
Hardware Owner’s Manual on Support.Dell.com/Manuals.

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Dell PowerEdge M610x Technical Guide 16
5Power, Thermal, Acoustic
5.1 Power Supplies
See the PowerEdge M1000e Technical Guide for information on power supplies and power supply
specifications.
5.2 Power Efficiency
One of the main features of blade servers is enhanced power efficiency. The Dell™ PowerEdge™
M610x achieves higher power efficiency by implementing the following features:
•User-configurable power options through the M1000e Chassis Management Controller (CMC)
(see the M1000e documentation online at Support.Dell.com for further details)
•Improved power budgeting
•Voltage Regulator (VR) efficiency improvements
•CPU VR dynamic phase shedding
•Switching regulators instead of linear regulators
•Closed loop thermal throttling
•Use of DDR3 memory (lower voltage compared to DDR2)
•Memory VR static phase shedding
•BIOS Power/Performance options page
•Active Power Controller (BIOS-based CPU P-state manager)
•Ability to throttle memory
•Ability to disable a CPU core
•Ability to turn off embedded NICs or PCIe lanes when not being used
•Energy Smart components at the M1000e chassis level to selectively enable more computing
performance with less power consumption.
5.3 Thermal Operating and Storage Specifications
The M610x thermal solution includes:
Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling directs airflow through the components to maintain proper cooling
Custom designed heat sinks maintain CPU, DIMM, and board-level chip temperatures within
thermal design targets
Separate airflow cooling path for the two full-length x16 PCIe Gen2 slots.
Support for dual slot NVIDIA®GPU cards up to 250 W.
Highly Optimized Fan Control Algorithm
oBase fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
oComponent algorithms: CPU PID, DIMMs, HW Configuration, IOH, GPU, and External
Ambient.
oThe highest fan speed request from the above algorithms is used to set the
appropriate fan speed for the blade.
oAmbient and HW Configuration sets the minimum; other algorithms increase fan speed
to maintain proper cooling.

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Dell PowerEdge M610x Technical Guide 17
Thermal specifications for the PowerEdge M610x are detailed in Table 3 along with other important
operating and storage information.
Table 3. Operating and Storage Specifications
Temperature
Operating
10o to 35o C (50oto 95oF) with a maximum temperature gradation of
10oC per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1oF/500ft
Storage
-40oto 65oC (-40oto 149oF) with a maximum temperature gradation
of 20oC per hour
Relative Humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation of
10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of
10% per hour
Maximum Vibration
Operating
0.26 Grms at 5-350 Hz in operational orientations
Storage
1.54 Grms at 10-250 Hz in all orientations
Maximum Shock
Operating
Half sine shock in all operational orientations of 31 G +/- 5% with a
pulse duration of 2.6 ms +/- 10%
Storage
Half sine shock on all six sides of 71 G +/- 5% with a pulse duration
of 2 ms +/- 10%
Altitude
Operating
-15.2m to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 ft, the maximum temperature is
derated 1oF/550 ft
Storage
-16 to 10,600 m (-50 to 35,000 ft)
Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels
measured at ≤ 50% relative humidity)
5.4 Acoustics
The acoustical design of the PowerEdge M610x reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles or hums. Definitions for
acoustical performance data are as follows:
•Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other
specific activity.
•LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296
(1988) and measured in accordance to ISO 7779 (1999).

Dell
Dell PowerEdge M610x Technical Guide 18
Table 4 shows the acoustical performance for a typical configuration of the M1000e chassis with four
PowerEdge M610x blade servers installed. Acoustical performance varies with hardware
configurations.
Table 4. Acoustical Performance of M1000e Chassis with Four M610x Blades Installed
Typical Configuration (per blade) @ 23±2°C Ambient in M1000e
Chassis
Operating
Mode
LwA-UL
(bels)
Processors
Hard Drives
DIMMs
Mezzanine Cards
Two Intel®
Xeon®E5620
(80W)
Two SAS 2.5‖
146 GB (15
K)
12 4GB
DDR3
Two dual-port
GbE FC
Idle
8.2

Dell
Dell PowerEdge M610x Technical Guide 19
6Processors
6.1 Overview
The Intel®Xeon®processor 5500 and 5600 series are designed specifically for servers and workstation
applications. These processors feature quad-core processing to maximize performance and
performance/watt for data center infrastructures and highly dense deployments. They feature Intel
Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems and use a 1366-contact Flip-Chip Land Grid Array (FC-LGA) package that plugs into
a surface-mount socket. The Dell™ PowerEdge™ M610x provides support for up to two processors.
6.2 Features
Key features of the Intel Xeon processor 5500 series include:
•Up to four cores per processor
•Two point-to-point QuickPath Interconnect links at 6.4 GT/s
•45 nm process technology
•No termination required for non-populated CPUs (must populate CPU socket 1 first)
•Integrated QuickPath DDR3 memory controller
•64-byte cache line size
•RISC/CISC hybrid architecture
•Compatible with existing x86 code base
•MMX™ support
•Execute Disable Bit
•Intel Wide Dynamic Execution
•Executes up to four instructions per clock cycle
•Simultaneous Multi-Threading (SMT) capability
•Support for CPU Turbo Mode (on certain SKUs)
•Increases CPU frequency if operating below thermal, power and current limits
•Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
•Intel 64 Technology
•Intel VT-x and VT-d Technology for virtualization support
•Enhanced Intel SpeedStep®Technology
•Demand-based switching for active CPU power management as well as support for ACPI
P-States, C-States and T-States
The Intel Xeon processor 5600 series encompasses all the features of the 5500 series along with:
•New top BIN processors at 130W TDP
•Support for DDR3L, 1.35v DIMMs for even lower system power
•Support for memory sparing
•AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL
•Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks

Dell
Dell PowerEdge M610x Technical Guide 20
Table 5. Comparison of Processor Technology
Intel Xeon Processor
5400 Series
5500 Series
5600 Series
Cores
Four
Four
Six
Last Level Cache
Two 6 MB shared
8 MB shared
12 MB shared
FSB (MT/s) / Link Frequency
(GT/s)
1333 MT/s
Up to 6.4 GT/s
Up to 6.4 GT/s
Max TDP
120 W
130 W for WS
95 W for Server
130 W for WS and
Server
Max Frequency
>3 GHz
>3 GHz
>3 GHz
Memory Controller
Separate in
chipset
Integrated 3-channel
DDR3
Integrated 3-
channel DDR3
Process Technology
45 nm
45 nm
32 nm
Intel®Trusted Execution
Technology
No
No
Yes
Intel®Advanced Encryption
Security- New Instructions
No
No
Yes
Intel®Virtualization
Technology
Yes
Yes
Yes
Intel®64
Yes
Yes
Yes
Intel®Hyper-Threading
Technology
No
Yes
Yes
Socket
LGA771
LGA1366
LGA1366
6.3 Supported Processors
Table 6. Supported Processors
Model
Speed
TDP
Power
Cache
Cores
Max
Memory
Speed
QPI Link
Speed
Turbo
Mode
Enabled
Hyper-
threading
X5690
3.46 GHz
130 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5680
3.33 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5675
3.06 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5670
2.93 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5660
2.8 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5650
2.66 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
L5640
2.26 GHz
60 W
12 M
6
1066 MT/s
5.86 GT/s
Yes
Yes
E5649
2.53 GHz
80 W
12 M
6
1333 MT/s
5.86 GT/s
Yes
Yes