Dell PowerEdge R210 II Quick start guide

PowerEdge R210 II
Technical Guide
The PowerEdge
R210 II offers
performance, energy
efficiency and ease
of management for
businesses of all
sizes.

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PowerEdge R210 II Technical Guide
This document is for informational purposes only. Dell reserves the right to make changes without
further notice to any products herein. The content provided is as is and without express or implied
warranties of any kind.
Dell, PowerEdge, and ReadyRails are trademarks of Dell, Inc. Citrix is a registered trademark and
XenServer is a trademark of Citrix Systems, Inc. and/or one or more of its subsidiaries, and may be
registered in the United States Patent and Trademark Office and in other countries. Intel, Xeon,
Celeron, and Pentium are registered trademarks and Core is a trademark of Intel Corporation in the
U.S. and other countries. Broadcom is a registered trademark and NetXtreme is a trademark of
Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the
EU. Matrox is a registered trademark of Matrox Electronic Systems Ltd. Microsoft and SQL Server are
either registered trademarks or trademarks of Microsoft Corporation in the United States and/or
other countries. Red Hat is a registered trademark of Red Hat, Inc. in the United States and other
countries. Linux is a registered trademark of Linus Torvalds. Symantec is a trademark owned by
Symantec Corporation or its affiliates in the U.S. and other countries. VMware is a registered
trademark and vSphere is a trademark of VMware, Inc. in the United States and/or other
jurisdictions. Insyde is a registered trademark of Insyde Software. Other trademarks and trade names
may be used in this document to refer to either the entities claiming the marks and names or their
products. Dell disclaims proprietary interest in the marks and names of others.
©Copyright 2011 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful
and strictly forbidden.
June 2011

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Table of Contents
1Product Comparison ...........................................................................................7
1.1 Overview ..................................................................................................7
1.2 Key Benefits ..............................................................................................7
1.3 Flexible, Secure Technology............................................................................7
1.4 Easy to Manage ...........................................................................................8
1.5 Comparison ...............................................................................................8
2New Technologies............................................................................................ 10
3System Overview ............................................................................................. 11
4Mechanical .................................................................................................... 13
4.1 Chassis Description..................................................................................... 13
4.2 Dimensions and Weight................................................................................ 13
4.3 Front Panel View and Features ...................................................................... 14
4.4 Back Panel View and Features ....................................................................... 14
4.5 Power Button LED ...................................................................................... 14
4.6 System Status ID........................................................................................ 15
4.7 NIC Indicators........................................................................................... 15
4.8 Internal Chassis Views ................................................................................. 15
4.9Rails ...................................................................................................... 16
4.9.1 ReadyRails Static Rails .......................................................................... 16
4.10 Fans ...................................................................................................... 16
4.11 LED Control Panel...................................................................................... 17
4.12 Security.................................................................................................. 17
4.12.1 Cover Latch ....................................................................................... 17
4.12.2 Bezel ............................................................................................... 17
4.12.3 Hard Drive......................................................................................... 17
4.12.4 Trusted Platform Module (TPM) ................................................................ 17
4.12.5 Power Switch Security........................................................................... 18
4.12.6 Intrusion Alert .................................................................................... 18
4.12.7 Secure Mode ...................................................................................... 18
4.13 USB Key.................................................................................................. 18
4.14 Battery................................................................................................... 18
4.14.1 Field Replaceable Units (FRU).................................................................. 18
4.15 User Accessible Jumpers, Sockets, and Connectors............................................... 18
5Power, Thermal, Acoustic .................................................................................. 19
5.1Power Supplies ......................................................................................... 19
5.2 Power Supply Specifications.......................................................................... 19
5.3 Heat Dissipation ........................................................................................ 19
5.4 Environmental Specifications......................................................................... 20
5.5 ENERGY STAR Compliance ............................................................................ 21
5.6 Thermal.................................................................................................. 21
5.7 Acoustics ................................................................................................ 21
6Processors..................................................................................................... 24
6.1 Overview ................................................................................................ 24
6.2 Features ................................................................................................. 24
6.3 Supported Processors.................................................................................. 24
6.4 Processor Configurations.............................................................................. 25
6.5 Processor Installation.................................................................................. 25
7Memory ........................................................................................................ 26

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7.1 Overview ................................................................................................ 26
7.2 DIMMs Supported ....................................................................................... 26
7.3 DIMM Slots............................................................................................... 26
7.4 Speed .................................................................................................... 26
7.5 Sparing................................................................................................... 27
7.6 Mirroring................................................................................................. 27
7.7 RAID ...................................................................................................... 27
7.8 Supported Configurations ............................................................................. 27
8Chipset ........................................................................................................ 28
8.1 Overview ................................................................................................ 28
8.2 Direct Media Interface ................................................................................ 28
8.3 PCI Express Interface .................................................................................. 28
8.4 SATA Interface.......................................................................................... 28
8.5 AHCI...................................................................................................... 28
8.6 PCI Interface............................................................................................ 28
8.7 Low Pin Count (LPC) Interface ....................................................................... 28
8.8 Serial Peripheral Interface (SPI) ..................................................................... 28
8.9 Compatibility Module .................................................................................. 29
8.10 Advanced Programmable Interrupt Controller (APIC)............................................. 29
8.11 USB Interface ........................................................................................... 29
8.12 Real-Time Clock (RTC) ................................................................................ 29
8.13 GPIO...................................................................................................... 30
8.14 Enhanced Power Management........................................................................ 30
8.15 System Management Features........................................................................ 30
8.15.1 TCO Timer......................................................................................... 30
8.15.2 Processor Present Indicator..................................................................... 30
8.15.3 Error Code Correction (ECC) Reporting ....................................................... 30
8.15.4 Function Disable.................................................................................. 30
8.15.5 Intruder Detect ................................................................................... 30
8.16 System Management Bus (SMBus 2.0) ............................................................... 31
8.17 Intel Virtualization Technology for Directed I/O .................................................. 31
9BIOS ............................................................................................................ 32
9.1 Overview ................................................................................................ 32
9.2 Supported ACPI States................................................................................. 33
9.2.1 Power Management Modes...................................................................... 33
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 36
10.1 Overview ................................................................................................ 36
10.2 Features ................................................................................................. 36
11 PCI Slots ....................................................................................................... 37
11.1 Overview ................................................................................................ 37
11.2 Quantities and Priorities .............................................................................. 37
11.3 PCI Card Dimensions ................................................................................... 37
12 Storage ........................................................................................................ 38
12.1 Overview ................................................................................................ 38
12.2 Hard Drives.............................................................................................. 38
12.3 RAID Configurations.................................................................................... 38
12.4 Optical Drives........................................................................................... 39
12.5 Tape Drives ............................................................................................. 39
13 Video........................................................................................................... 40
14 Rack Information............................................................................................. 41
14.1 Overview ................................................................................................ 41

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14.2 Rails ...................................................................................................... 41
14.3 Cable Management Arm (CMA) ....................................................................... 42
14.4 Rack View ............................................................................................... 42
15 Operating Systems ........................................................................................... 44
16 Systems Management........................................................................................ 45
16.1 Overview ................................................................................................ 45
16.2 Server Management.................................................................................... 45
16.3 Embedded Server Management ...................................................................... 46
16.4 Dell Lifecycle Controller and Unified Server Configurator ....................................... 46
16.5 Integrated Dell Remote Access Controller.......................................................... 47
16.6 iDRAC6 Express ......................................................................................... 47
16.7 iDRAC6 Enterprise...................................................................................... 47
16.8 iDRAC6 Enterprise with Virtual Flash (vflash) Media .............................................. 47
17 Peripherals.................................................................................................... 50
Appendix A. Statement of Volatility .......................................................................... 51
Appendix B. Certifications ..................................................................................... 54
B 1. Regulatory Certifications ............................................................................. 54
B 2. Product Safety Certifications......................................................................... 54
B 3. Electromagnetic Compatibility....................................................................... 55
B 4. Ergonomics, Acoustics and Hygienics ............................................................... 55
Appendix C. Industry Standards ............................................................................... 56
Tables
Table 1. Comparison of PowerEdge R210 II to R210 and R310.............................................8
Table 2. Product Feature Summary ......................................................................... 11
Table 3. Power Supply Specifications ....................................................................... 19
Table 4. Environmental Specifications...................................................................... 20
Table 5. Shock and Vibration Specifications ............................................................... 21
Table 6. Acoustical Specifications........................................................................... 22
Table 7. Supported Intel Xeon Processors.................................................................. 24
Table 8. Supported Intel Desktop Processors .............................................................. 25
Table 9. DIMMs Supported .................................................................................... 26
Table 10. Supported Configurations .......................................................................... 27
Table 11. Supported ACPI States.............................................................................. 33
Table 12. Power Management Features...................................................................... 34
Table 13. Power Profiles ....................................................................................... 35
Table 14. Supported Hard Drives.............................................................................. 38
Table 15. Factory RAID Configurations ....................................................................... 38
Table 16. Graphics Video Modes .............................................................................. 40
Table 17. Supported Racks..................................................................................... 41
Table 18. Rail Adjustability Ranges and Depth ............................................................. 41
Table 19. Unified Server Configurator Features and Description......................................... 46
Table 20. Features List for Base Management Functionality, iDRAC6, and vFlash..................... 48
Table 21. Volatility Table ...................................................................................... 51
Table 22. Product Safety Certifications...................................................................... 54
Table 23. Electromagnetic Compatibility Certifications................................................... 55
Table 24. Ergonomics, Acoustics and Hygienics............................................................. 55
Table 25. Industry Standards .................................................................................. 56

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Figures
Figure 1. Chassis Dimensions.................................................................................. 13
Figure 2. Front View (With Bezel)............................................................................ 14
Figure 3. Front View (Without Bezel)........................................................................ 14
Figure 4. Back View ............................................................................................ 14
Figure 5. Power Button ........................................................................................ 15
Figure 6. Internal Chassis View ............................................................................... 16
Figure 7. Front Panel View with LED Control Panel ....................................................... 17
Figure 8. LED Control Panel (Detailed View) ............................................................... 17
Figure 9. Formulas for Maximum Operating Temperature for Given Altitude (°C) ................... 20
Figure 10. Formulas for Maximum Operating Temperature for Given Altitude (°F).................... 20
Figure 11. A4 Static Rail System ............................................................................... 42
Figure 12. A6 Static Rail System ............................................................................... 42
Figure 13. A4 and A6 Rail Systems in 2-post Center-Mount Configuration ............................... 43
Figure 14. A4 and A6 Rail Systems in 2-post Flush-Mount Configuration................................. 43

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PowerEdge R210 II Technical Guide
1Product Comparison
1.1 Overview
The PowerEdge R210 II is an entry-level, yet enterprise ready, ultra-dense 1-socket 1U rack server
that is well suited for a broad range of workloads, from small businesses applications to high-density,
scale-out compute farms. It offers the performance and features to run your business applications
that facilitate data coordination and sharing, data protection, management, and scalability to
support business growth.
With a full selection of processors to meet your performance needs, the R210 II supports the Intel®
Xeon®processor E3-1200 product family, the Intel Core™ i3-2100 product family, and Intel Pentium®
processors. Also included are four DIMM slots with enough memory to handle common applications,
hard drive options for two 3.5" or four 2.5‖ (available Q2 2011) cabled hard drives for flexible
internal local storage, one PCIe true x16 slot to connect a variety of peripherals, as well as the full
Dell OpenManage™suite of systems management for ease of deployment, monitoring, and ongoing
maintenance.
1.2 Key Benefits
Designed for powerful and balanced performance, the PowerEdge R210 II delivers:
Built-in Reliability, Security and Energy Efficiency: Built-in redundant hard drives,
encryption, security and data protection options, lower wattage power supplies, and ease of
deployment.
Business Value: Performance headroom and capacity expansion allow the R210 II to grow as
your business grows. A choice of options enables you to tailor your R210 II configuration to
your compute requirements.
Simplified Management: Manage the R210 II with the full suite of Dell OpenManage systems
management software throughout the server lifecycle.
Better Performance with Less Noise: Business performance with similar sound levels as a
desktop computer to meet the needs of sound-sensitive office environments.
1.3 Flexible, Secure Technology
Securing your most valuable asset—your data—is important. That is why the PowerEdge R210 II has
data protection options to help keep your data as safe as possible. Coupled with the latest version of
Microsoft®Windows®Small Business Server 2011 (SBS 2011), the PowerEdge R210 II provides an
integrated solution that can further protect your data by providing automatic backup and restore
functionality as well as offering email, remote access, and collaboration to help take your business
to the next level. The R210 II also includes lower wattage power supplies and features a built-in user
interface for ease of deployment. With the PowerEdge R210 II you can:
Protect data with hardware- and software-enabled encryption.
Secure business information with a RAID configuration to make copies of data automatically.
Provide email, collaboration, remote access, automatic backup, and data restore
functionality with Windows SBS 2011.
Deploy your server faster and achieve productivity sooner with optional embedded
management.

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1.4 Easy to Manage
The Dell PowerEdge R210 II lets you focus on running your business rather than running your servers.
Dell OpenManage systems management software helps to automate common management tasks,
thereby enhancing efficiency, improving productivity, and reducing the potential for error (which can
cause downtime).
The optional Dell Lifecycle Controller can simplify administrator tasks by performing a complete set
of functions such as system deployment, system updates, hardware configuration and diagnostics
from a single intuitive interface called Unified Server Configurator in a pre-OS environment. This
eliminates the need to use and maintain multiple pieces of disparate CD/DVD media. With Dell
Lifecycle Controller server deployment automation, the R210 II is up and running fast.
1.5 Comparison
Table 1. Comparison of PowerEdge R210 II to R210 and R310
Feature
R210
R210 II
R310
Processor
Intel®Xeon®processor
3400 series
Intel Celeron®G1101
Intel Pentium®G6950
Intel Core™i3 processor
500 series
Intel Xeon processor E3-
1200 product family,
Intel Core processor i3-2100
product family
Intel Xeon processors 3400
series
Intel Celeron G1101
Intel Pentium G6950
Intel Core i3 processor 500
series
Front Side Bus
Direct Media Interface
(DMI) 2.5Gb/s
Direct Media Interface II
(DMI) 5.0Gb/s
Direct Media Interface
(DMI) 2.5Gb/s
Sockets
1
1
1
Cores
2 or 4
2 or 4
2 or 4
L2/L3 Cache
Up to 8MB
Up to 8MB
Up to 8MB
Chipset
Intel 3420
Intel C202
Intel 3420
DIMMs
4 DDR3 1066/1333MHz
4 DDR3 1333MHz
6 DDR3 1066/1333MHz
Min/Max RAM
1GB/32GB
1GB/32GB
1GB/32GB
Hard Drive Bays
2 x 3.5‖ or
2 x 2.5‖
2 x 3.5‖ or
4 x 2.5‖ (available Q2 2011)
4 x 3.5‖ or
4 x 2.5‖
Optional hot-plug
Hard Drive Types
SATA SSD, SAS, nearline
SAS, SATA
SATA SSD, SAS, nearline
SAS, SATA
SATA SSD, SAS, nearline
SAS, SATA
External Drive
Bay
1 for slim optical disk
drive (ODD)
1 for slim optical disk drive
(ODD)
1 for slim optical disk drive
(ODD)
Embedded Hard
Drive Controller
Chipset-based SATA
Chipset-based SATA, PERC
S100 (embedded SW RAID)
Intel 3420, PERC S100
(embedded SW RAID)

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Feature
R210
R210 II
R310
Optional Storage
Controller
Non-RAID:
SAS 5/E
LSI 2032 (for tape
backup unit only)
RAID:
SAS 6/iR
PERC 6/E
PERC S100 (software
RAID)
PERC S300 (software
RAID)
PERC H200
PERC H800
Non-RAID:
6Gb/s SAS HBA
RAID:
PERC S100 (software RAID)
PERC S300 (software RAID)
PERC H200
PERC H800 (available
Q4 2011)
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gb/s SAS HBA
RAID:
SAS 6/iR
PERC 6/E
SAS 5/E
PERC S300 (software RAID)
PERC H200
PERC H700
PERC H800
Availability
ECC memory, quad-pack
LED diagnostic, add-in
RAID, TPM/CTPM
ECC memory, quad-pack
LED diagnostic, add-in
RAID, TPM/CTPM (available
Q3 2011)
ECC memory, hot-plug hard
drives, redundant power
supplies, quad-pack LED
diagnostic or LCD (with hot-
plug hard drive chassis),
TPM
Server Mgt.
BMC, IPMI 2.0 compliant,
full Dell OpenManage™
suite
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash media
BMC, IPMI 2.0 compliant,
full Dell OpenManage suite
Optional: iDRAC6 Express,
iDRAC6 Enterprise, vFlash
media
BMC, IPMI 2.0 compliant,
full Dell OpenManage suite
Optional: iDRAC6 Express,
iDRAC6 Enterprise, vFlash
media
I/O Slots
1 x PCIe x16
1 x PCIe x16
1 x PCIe x16 (x8 routing)
1 x PCIe x8 (x8 routing)
1 x PCIe x8 (x4 routing)
RAID
See RAID options in
chapter 12
See RAID options in chapter
12
See RAID options in chapter
12
NIC/LOM
2 x GbE LOM
2 x GbE LOM
2 x GbE LOM
USB
2 front, 2 back, 2
internal
2 front, 2 back, 2 internal
2 front, 2 back, 2 internal
Power Supplies
Non-redundant, 250W
(80+ Bronze) auto-
ranging (100V~240V)
Non-redundant, 250W
(80+ Bronze) auto-ranging
(100V~240V)
Non-redundant, 350W
(80+ Bronze)
Optional redundant, 400W
(80+ Silver) auto-ranging
(100V~240V)
Fans
Non-redundant, non-hot-
pluggable
Non-redundant, non-hot-
pluggable
Non-redundant, non-hot-
pluggable
Form Factor
1U Rack
1U Rack
1U Rack

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2New Technologies
New technologies on the Dell PowerEdge™ R210 II include the following:
New processors, including the Intel®Xeon®processor E3-1200 product family and the Intel
Core™ processor i3-2100 product family
Improved acoustics in small offices or branch offices over the predecessor system
(PowerEdge R210)
Shorter rack rail kits
Front ear rack mounting option
1333 MHz 2 Gb-based memory
8 GB UDIMMs
SAS 6 Gbps HBA external controller
More efficient power supply (89%) (available Q3 2011)
2 Gb and 4 Gb memory DRAM technology
Support for 3.5‖ 3 TB nearline SAS 7.2K rpm hard drives (available Q2 2011)
Support for up to four 2.5‖ SSD or SAS hard drives (available Q2 2011)

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PowerEdge R210 II Technical Guide
3System Overview
Table 2. Product Feature Summary
Feature
Technical Specification
Form Factor
1U rack
Processors
Quad-core Intel®Xeon®processor E3-1200 product family
Dual-core Intel Core™ processor i3-2100 product family
Processor Sockets
1
Front Side Bus or
HyperTransport
DMI II (Direct Media Interface)
Cache
8MB
Chipset
Intel C202
Memory1
Up to 32GB (4 DIMMs): 1GB/2GB/4GB/8GB DDR3 up to 1333MHz
I/O Slots
1 PCIe x16 G2 slot
RAID Controller
Internal Controllers:
PERC H200 (6Gb/s)
PERC S100 (software based)
PERC S300 (software based)
External Controllers:
PERC H800 (6Gb/s) (available Q4 2011)
External HBAs (non-RAID):
6GB/s SAS HBA
Drive Bays
Cabled options available:
Up to two 3.5‖ SAS or SATA
Up to four 2.5‖ SSD or SAS2
Maximum Internal
Storage
Up to 4TB
Hard Drives1
Cabled hard drive options:
3.5‖ SAS (15K, 10K), nearline SAS (7.2K), SATA (7.2K, 5.4K)
2.5‖ SSD or SAS (10K)2
Communications
Broadcom®NetXtreme® 5709 Dual Port Gigabit Ethernet NIC, Copper, w/TOE PCIe x4
Broadcom NetXtreme 5709 Dual Port Gigabit Ethernet NIC, Copper, TOE/iSCSI PCIe x4
Broadcom NetXtreme II 5709 Quad Port Gigabit Ethernet NIC, Copper, w/TOE/iSCSI
PCIe x4
Intel Gigabit ET Dual Port Adapter, Gigabit Ethernet NIC, PCIe x4
Intel Gigabit ET Quad Port Adapter, Gigabit Ethernet NIC, PCIe x4

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PowerEdge R210 II Technical Guide
Power Supply
Single cabled power supply (250W)
Availability
Quad-pack LED diagnostics, ECC memory, add-in RAID, TPM/TCM
Video
Matrox®G200eW with 8MB memory
Remote Management
iDRAC6 optional
Systems Management
Dell OpenManage™
BMC
IPMI 2.0 compliant
Unified Server Configurator
Lifecycle Controller enabled through optional iDRAC6 Express, iDRAC6 Enterprise,
and vFlash
Rack Support
ReadyRails™ static rails for toolless mounting in 4-post racks with square or
unthreaded round holes or tooled mounting in 4-post threaded and 2-post (Telco)
racks
Operating Systems
Microsoft®Windows®Small Business Server 2011
Microsoft Windows Server®2008 R2 Foundation3 SP1 (includes Hyper-V™ v2)
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V™)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V™ v2)
Novell®SUSE®Linux®Enterprise Server
Red Hat®Enterprise Linux
For more information on the specific versions and additions, visit
www.dell.com/OSsupport.
Featured Database
Application
Microsoft SQL Server®solutions (see Dell.com/SQL)
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.
2Maximum of four hard drives available Q2 2011.
3Windows Server 2008 R2 Foundation allows only 15 user accounts and requires certain Active Directory (AD)
configurations. If not configured according to the product documentation, the software will generate
warnings to correct the configuration. After a certain amount of time, the software will only run for one hour
at a time until the configuration is corrected. For more information about these features review the product
documentation located at http://go.microsoft.com/fwlink/?LinkId=143551

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4Mechanical
4.1 Chassis Description
The PowerEdge R210 II is a 1U rack-mount design that supports the following features:
Two cabled 3.5‖ drive bays for SATA or SAS hard drives or four 2.5‖ drive bays for SAS or SSD
drives (available Q2 2011)
Dual Gigabit LAN on motherboard (LOM)
Four DIMM slots
TPM security feature
One riser card for optional PCIe expansion card
Optional iDRAC6 Enterprise and iDRAC6 Express card mounted on planar (without PCI slot
occupied)
Support for 11G slim static and slim sliding rails.
Single non-redundant power supply
Diagnostic LED panel
4.2 Dimensions and Weight
Figure 1 details the dimensions and weight for the PowerEdge R210 II.
Xa
Xb
Y
Za
(With
Bezel)
Zb*
Zc
Max Weight
482.6mm
434mm
42.4mm
35mm
390.7mm
394.3mm
8.05 kg
(17.76 lbs)
*Zb measures to the nominal rear wall external surface where the motherboard I/O connectors reside.
Figure 1. Chassis Dimensions

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4.3 Front Panel View and Features
Figure 2 and Figure 3 show the front views of the PowerEdge R210 II.
Figure 2. Front View (With Bezel)
Figure 3. Front View (Without Bezel)
See the Front-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge R210 II Owner’s Manual on Support.Dell.com for more information.
4.4 Back Panel View and Features
Figure 4 shows the back view of the PowerEdge R210 II.
Figure 4. Back View
See the Back-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge R210 II Owner’s Manual on Support.Dell.com for more information.
4.5 Power Button LED
All Dell PowerEdge servers have a green LED integrated in the power button which indicates the
system‘s power state.

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PowerEdge R210 II Technical Guide
Figure 5. Power Button
See the About Your System chapter of the PowerEdge R210 II Owner’s Manual on Support.Dell.com
for more information.
4.6 System Status ID
The System Status ID indicators are two LEDs—one on the front panel of the system and one on the
back panel. These LEDs indicates the system state.
See the About Your System chapter of the PowerEdge R210 II Owner’s Manual on Support.Dell.com
for more information.
4.7 NIC Indicators
See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge R210 II
Owner’s Manual on Support.Dell.com for more information.
4.8 Internal Chassis Views
Figure 6 shows the internal view of the PowerEdge R210 II server.

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PowerEdge R210 II Technical Guide
Figure 6. Internal Chassis View
4.9 Rails
4.9.1 ReadyRails Static Rails
ReadyRailsTM Static Rails for 4-post and 2-post racks support the following:
Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks
including all generations of Dell racks
Tooled installation in 19‖ EIA-310-E compliant threaded hole 4-post and 2-post racks
See section 14 for more details.
4.10 Fans
There are three system fans located in the R210 II system.

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For information on removing and installing the system fans, see the Installing System Components
chapter of the PowerEdge R210 II Owner’s Manual on Support.Dell.com for more information.
4.11 LED Control Panel
Figure 7 and Figure 8 show the LED control panel.
Figure 7. Front Panel View with LED Control Panel
Figure 8. LED Control Panel (Detailed View)
For a complete description of LED indicators, their causes, and possible courses of action to take to
resolve an error, see the Diagnostic Lights (Optional) section in the About Your System chapter in the
PowerEdge R210 II Owner’s Manual on Support.Dell.com.
4.12 Security
4.12.1 Cover Latch
The PowerEdge R210 II comes with a coin-lock entry latch on the top cover of the unit and provides
security for the entire system. The lock provides for toolless access to the chassis.
4.12.2 Bezel
A metal bezel an available option and is mounted to the front of the chassis. A lock on the bezel is
used to protect un-authorized access to system peripherals and the power button. System status on
the LED control panel is viewable even when the bezel is installed.
4.12.3 Hard Drive
Cabled hard drives are only accessible by opening the top cover, thus locking the top cover secures
the hard drives.
For information about installing or removing the hard drives, see the Hard Drives section in the
Installing System Components chapter in the PowerEdge R210 II Owner’s Manual on
Support.Dell.com.
4.12.4 Trusted Platform Module (TPM)
The PowerEdge R210 II uses a TPM encryption chip solution on the system board with BIOS support
worldwide, except for China where Trusted Computing Module (TCM) is the standard. TPM is disabled
by default.

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PowerEdge R210 II Technical Guide
The TPM is used to generate and store keys, protect and authenticate passwords, and create and
store digital certificates. The TPM can also be used to store Microsoft®BitLocker™keys for hard drive
encryption features in Microsoft®Windows Server®2008. TPM is enabled through a BIOS option and
uses HMAC-SHA1-160 for binding.
4.12.5 Power Switch Security
The control panel is designed so the power switch cannot be accidentally activated. The lock on the
bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that
disables the power button function.
4.12.6 Intrusion Alert
A chassis intrusion switch mounted inside the system chassis on the front panel board, and is used to
detect chassis intrusion. When the cover is opened, the switch circuit closes and indicates intrusion.
4.12.7 Secure Mode
BIOS has the ability to enter a secure boot mode through setup. This mode includes the option to
lock out the power and NMI switches on the control panel or set up a system password.
For more information, see the Using the System Setup Program and Boot Manager chapter in the
PowerEdge R210 II Owner’s Manual on Support.Dell.com.
4.13 USB Key
The PowerEdge R210 II supports two internal USB connectors which can be used for USB keys.
4.14 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the Intel®SP5100 chip.
4.14.1 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to store Field Replaceable Unit (FRU) information including Dell
part numbers, part revision levels, and serial numbers. This information is used by the SEL (system
event log) and the BMC (baseboard management controller).
4.15 User Accessible Jumpers, Sockets, and Connectors
See the Jumpers and Connectors chapter in the PowerEdge R210 II Owner’s Manual on
Support.Dell.com.

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PowerEdge R210 II Technical Guide
5Power, Thermal, Acoustic
5.1 Power Supplies
The base system includes a single 250W power supply. This unit provides power to the planar, the
internal hard drive bays, and one slim optical disk drive bay. Power is soft-switched, allowing power
cycling using a switch on the front of the system enclosure or through software control (server
management functions). The power system is compatible with industry standards, such as ACPI and
Server 2000. The power supply is equipped with automatic input voltage detection.
5.2 Power Supply Specifications
Table 3. Power Supply Specifications
Feature
Non-redundant Power Supply
Dimensions
L-210 mm x W-106 mm x H-40
mm
Status Indicators
None
Integrated Fans
One
AC Cord Rating
15 Amps @ 120 VAC, 10 Amps @
240 VAC
Input Voltage
90 –264 VAC
Auto-ranging
Yes
Line Frequency
47–63 Hertz
Maximum Inrush Current
Under typical line conditions
and over the entire system
ambient operating range, the
inrush current may reach 55
Amps for 10 ms or less.
Hot-plug Capability
No
Output Power
250W
Maximum Heat Dissipation
1039 BTU per hour maximum
Efficiency
20% to 100% Load
82% to 85% @ 115 VAC
82% to 85% @ 230 VAC
5.3 Heat Dissipation
The heat dissipation for the R210 II power supply is measured at 1040 BTU/hr (maximum).

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PowerEdge R210 II Technical Guide
5.4 Environmental Specifications
The airborne contaminant level is class G2 or lower as defined by ISA-S71.04-1985.
Table 4 lists the environmental specifications for the R210 II.
Table 4. Environmental Specifications
Specification
Operating Requirements
Non-Operating Requirements
Temperature Ranges
(for altitude ≤ 900m or 2952.75ft)
10°C to 35°C
(50°F to 95°F)
-40°C to 65°C
(-40°F to 149°F)
Temperature Ranges
(for altitude > 900m or 2952.75ft)
10°C to T1°C
(50°F to T2°F)
Temperature Gradient
(maximum per 60 minutes)
10°C
20°C
Humidity Percent Ranges
(noncondensing)
20% to 80%
(maximum wet bulb
temperature = 29°C)
5% to 95%
(maximum wet bulb
temperature = 38°C)
Humidity Gradient
(maximum per 60 minutes)
10%
10%
Altitude Ranges
Low Limits
-50ft
(-15.2m)
-50ft
(-15.2m)
High Limits
10,000ft
(3048m)
35,000ft
(10,668m)
1Use the formulas in Figure 9 to calculate the maximum operating temperature (in °C) for a given altitude. Use
the first formula if the altitude is stated in meters; use the second formula if the altitude is stated in feet.
2Use the formulas in Figure 10 to calculate the maximum operating temperature (in °F) for a given altitude.
Use the first formula if the altitude is stated in meters; use the second formula if the altitude is stated in feet.
Figure 9. Formulas for Maximum Operating Temperature for Given Altitude (°C)
Figure 10. Formulas for Maximum Operating Temperature for Given Altitude (°F)