Dell PowerEdge R410 User manual

PowerEdge R410 Technical Guidebook
Dell
DELLTM
POWEREDGETM R410
TECHNICAL GUIDEBOOK
INSIDE THE POWEREDGE R410

PowerEdge R410 Technical Guidebook
Dell
Table of Contents
1Product Comparison...................................................................................................................1
1.1 Overview..............................................................................................................................1
2New Technologies...................................................................................................................... 3
2.1 Overview..............................................................................................................................3
3System Overview .......................................................................................................................3
3.1 Overview..............................................................................................................................3
3.2 Product Features Summary ................................................................................................. 3
4Mechanical................................................................................................................................. 7
4.1 Chassis Description ............................................................................................................. 7
4.2 Dimensions and Weight ....................................................................................................... 7
4.3 Front Panel View and Features............................................................................................ 8
4.4 Back Panel View and Features ............................................................................................ 8
4.5 Power Supply Indicators....................................................................................................... 9
4.6 NIC Indicators.................................................................................................................... 10
4.7 Side Views and Features ................................................................................................... 10
4.8 Rails and Cable Management............................................................................................ 11
4.9 Fans................................................................................................................................... 11
4.10 Control Panel/LCD............................................................................................................. 12
4.10.1 Cover Latch................................................................................................................. 13
4.10.2 Bezel........................................................................................................................... 13
4.10.3 Hard Drive................................................................................................................... 14
4.10.4 Trusted Platform Management (TPM)......................................................................... 14
4.10.5 Power-Off Security...................................................................................................... 14
4.10.6 Intrusion Alert.............................................................................................................. 14
4.10.7 Secure Mode............................................................................................................... 15
4.11 USB Key ............................................................................................................................ 15
4.12 Battery ............................................................................................................................... 15
4.13 Field Replaceable Units (FRU)........................................................................................... 15
5Electrical .................................................................................................................................. 16
5.1 Volatility ............................................................................................................................. 16
5.2 ePPID ................................................................................................................................ 16
6Power, Thermal, Acoustic ........................................................................................................ 17
6.1 Power Supplies.................................................................................................................. 17
6.2 Power Supply Specifications.............................................................................................. 17
6.3 Environmental Specifications ............................................................................................. 19
6.4 Maximum Input Amps......................................................................................................... 19
6.5 Acoustics............................................................................................................................ 20
7Block Diagram.......................................................................................................................... 21
8Processors............................................................................................................................... 22
8.1 Overview............................................................................................................................ 22
8.2 Supported Processors........................................................................................................ 22
8.3 Processor Configurations................................................................................................... 23
8.4 Processor Installation......................................................................................................... 24

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9Memory....................................................................................................................................24
9.1 Overview............................................................................................................................ 24
9.2 DIMMs Supported.............................................................................................................. 24
9.3 Slots/Risers........................................................................................................................ 24
9.4 Mirroring............................................................................................................................. 25
10 Chipset..................................................................................................................................... 26
10.1 Overview............................................................................................................................ 26
11 BIOS........................................................................................................................................ 26
11.1 Overview............................................................................................................................ 26
11.2 Supported ACPI States...................................................................................................... 27
11.3 I2C (Inter-Integrated Circuit) ............................................................................................... 27
12 Embedded NICs/LAN on Motherboard (LOM).......................................................................... 27
12.1 Overview............................................................................................................................ 27
13 I/O Slots................................................................................................................................... 28
13.1 Overview with Description.................................................................................................. 28
13.2 Quantities and Priorities..................................................................................................... 28
13.3 Boot Order ......................................................................................................................... 29
14 Storage .................................................................................................................................... 29
14.1 Overview with Description.................................................................................................. 29
14.2 Drives................................................................................................................................. 31
14.3 RAID Configurations .......................................................................................................... 31
14.4 Storage Controllers............................................................................................................ 33
14.5 LED Indicators ................................................................................................................... 33
14.6 Optical Drives..................................................................................................................... 33
14.7 Tape Drives........................................................................................................................ 33
15 Video........................................................................................................................................ 34
15.1 Overview............................................................................................................................ 34
16 Audio........................................................................................................................................ 34
16.1 Overview............................................................................................................................ 34
17 Rack Information...................................................................................................................... 34
17.1 Overview............................................................................................................................ 34
17.1.1 Slide Rails................................................................................................................... 35
17.1.2 Static Rails.................................................................................................................. 35
17.2 Cable Management Arm (CMA) ......................................................................................... 36
18 Operating Systems................................................................................................................... 36
18.1 Overview............................................................................................................................ 36
18.2 Operating Systems Supported ........................................................................................... 36
19 Virtualization ............................................................................................................................ 38
19.1 Overview............................................................................................................................ 38
20 Systems Management.............................................................................................................. 39
20.1 Overview/Description ......................................................................................................... 39
20.2 Server Management........................................................................................................... 39

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20.3 Embedded Server Management......................................................................................... 40
20.4 Lifecycle Controller and Unified Server Configurator.......................................................... 40
20.5 iDRAC Express.................................................................................................................. 41
20.6 iDRAC6 Enterprise............................................................................................................. 41
21 Peripherals............................................................................................................................... 43
21.1 USB Peripherals................................................................................................................. 43
21.2 External Storage ................................................................................................................ 43
22 Packaging Options................................................................................................................... 43

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1 Product Comparison
1.1 Overview
The PowerEdge R410 is Dell’s entry 2-socket 1U rack server that supports the latest Intel chipset and
processors. With the new Intel architecture, the memory controller is built in the processor and each
processor in PowerEdge R410 supports 4 DIMMs. If two processors are installed, it supports 8 DIMMs
max. Dell introduces four 3.5” hard drive bays to maximize the storage capacity in this product space.
R410 also offers state-of-art features, including: hot-swap hard drive, redundant power supply, 2.5”
SAS or SSD, and quad pack LED or active LCD for diagnostic. The PowerEdge R410 also supports
Dell’s latest remote server management controller and iDRAC6, to easily manage the server.
Table 1. Comparison of R410 to SC1435 and R610
Feature/Spec R410 SC1435 (Predecessors) R610
(Next level up)
Processor Two-Socket Intel® Xeon®
processor 5500 series AMD Opteron 2XXX series Two-Socket Intel Xeon processor 5500 series
Front Side Bus IQP at 6.4 GT/s 1 GBz HyperTransport IQP at 6.4 GT/s
# Processors 1 to 2 1 or 2 1 to 2
# Cores Dual or Quad Dual or Quad Dual or Quad
L2/L3 Cache 4 MB or 8 MB 4 MB or 8 MB
Chipset Intel® 5500 chipset HT2100 + HT1000 Intel® 5520 chipset
DIMMs
4+4 DDR3
Unbuffered with ECC or
Registered with ECC
1333/1066/800M Hz
8 DDR2
Registered with ECC
667 MHz
6+6 DDR3
Unbuffered with ECC or
Registered with ECC
1333/1066/800 MHz
Min/Max RAM 1 GB/64 GB 512 MB/32 GB 1 GB/96 GB
HD Bays
4 x 3.5”
Optional Hot-Swap
Support 2.5" HDDs via
Hot-Swap tray
2x 3.5” 6 x 2.5” Hot-Swap
HD Types Default SATA. Optional
SAS and SSD via add-in
controller
Default SATA. Optional
SAS via add-in controller SAS or SSD
Ext Drive Bay(s) 1 for slim ODD 1 for slim ODD 1 for slim ODD
Embedded HD
Controller Chipset based SATA Chipset based SATA SAS 6/iR
Optional Storage
Controller
NON-RAID:
SAS 5/E
LSI 2032 (For TBU only)
RAID:
SAS 6/iR Modular
PERC 6/i, PERC 6/E
SAS 5/iR
SAS 6/iR
NON-RAID:
SAS 5/E
LSI 2032 (For TBU only)
RAID:
SAS 6/iR (Default)
PERC 6/i, PERC 6/E

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Feature/Spec R410 SC1435 (Predecessors) R610
(Next level up)
Availability
Hot-swap HDD;
Redundant PSU; Quad-
pack LED diagnostic/LCD
with Hot-swap HDD
chassis; Memory mirroring
Tool-less chassis; quad-
pack LED for diagnostic
Hot-swap HDD;
Redundant PSU; LCD
diagnostic; Memory
mirroring or sparing;
Internal SD card for
embedded Hypervisor
Server Mgt.
BMC, IPMI 2.0 compliant;
Full Open Manage suite
Optional; iDRAC6
Express, iDRAC6
Enterprise, Vflash
BMC, IPMI 2.0 compliant;
Dell Server Assistant
iDRAD 6 Express, BMC,
IPMI 2.0 compliant; Full
Open Manage suite
Optional; iDRAC6
Enterprise, Vflash
I/O Slots 1 x PCIe x16 (True x16,
Gen2); full height, half
length
1 PCIe x8 or one PCI-X
64/133; full height, half
length
2x PCIe x8; full height,
half length
RAID See optional Storage
Controller See optional Storage Controller See optional Storage Controller
NIC/LOM 2x GbE LOM
Optional: various NIC
available
2x GbE LOM
Optional: various NIC
available
2x GbE LOM with TOE
Optional: various NIC
available
USB Two front/two rear/two
internal Two front/two rear Two front/two rear/one
internal
Power Supplies
Non-Redundant, 480 W
(80+ SILVER)
Optional Redundant, 500
W (80+ GOLD)
Auto Ranging
(100V~240V)
Non-Redundant, 600 W
Auto Ranging (90V~264V)
Redundant,
502 W High Efficiency
PSU or 717 W High
capacity PSU
Fans Non-redundant, non-hot
swappable Non-redundant, non-hot swappable Redundant, Hot swappable
Form Factor 1U Rack 1U Rack 1U Rack
Dimension (HxWxD)
43.0 x 434.0 x 627.1 (mm)
(without ear, without
bezel)
1.69 x 17.09 x 24.69 (in)
1.68” x 16.78” x 24”
42.6 x 482.4 x 772 (mm)
(w latches, bezel and PSU
handles)
1.68 x 18.99 x 30.39 (in)
Weight Max: 35.02lbs (15.9Kg) Max: 31.0lbs (14.1Kg) Max: 39lbs (17.69Kg)

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2 New Technologies
2.1 Overview
• Intel 5500 chipset and Intel Xeon 5500 series processor (new Intel architecture)
• Memory RAS feature (mirroring)
• iDRAC6 (new Dell server remote management controller)
• Virtualization (support various virtualization applications)
• SSD advantage (support SSD drives)
3 System Overview
3.1 Overview
The PowerEdge R410 delivers the right combination of computing power and redundancy in an ultra-
dense chassis. It is positioned to compete against HP’s DL160/DL165, and IBM’s x3450/x3455. The
PowerEdge R410 provides:
• Outstanding price and feature set combination
• Industry leading features configurability without burdening the entry configuration price
• Industry leading server management with LifeCycle Controller available via optional iDRAC
Express or iDRAC Enterprise
• Security features with TPM, internal USB, and IPv6
• Industry leading storage expandability and $/GB with 4 x 3.5”/2.5” HDD, cabled and hot-swap
• Industry leading serviceability and diagnostics with optional interactive LCD
• Industry leading chassis depth of only 24” in its class for SMB closets, shallow racks, mobile
server enclosures, wall server enclosures, A/V racks and legacy server racks
3.2 Product Features Summary
Table 2. PowerEdge R410 Features and Descriptions
Features Descriptions
Chipset Intel® 5500 chipset (5500 24 + ICH10R)
CPU Intel Xeon® 5500 series processor (Intel 5500 EP)
DIMM 4+4 DDR3
Unbuffered with ECC or Registered with ECC
1333/1066/800 MHz
Memory
Modules 1 GB UDIMM/RDIMM 2 GB UDIMM/RDIMM
4 GB RDIMM
8 GB RDIMM
TPM TPM
TCM/NO TPM
Expansion Slots 1 PCI slots
Slot 1: PCIe x16 (True x16, Gen2), half length
Slot 2: Propriety for SAS 6/iR Modular card only

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Features Descriptions
LOM Two GbE (5716 dual port) without TOE
Management Full Open Manage
BMC, IPMI2.0 compliant
Optional: iDRAC6-Express, iDRAC6-Enterprice and Vflash
USB Two front/two rear/two internal
PSU Non-Redundant, 480 W (80+ SILVER)
Optional Redundant, 500 W (80+ GOLD)
Auto Ranging (100V~240V)
Availability Quad-pack LED diagnostic/LCD with Hot-swap HDD chassis
Embedded
Graphics Matrox G200eW with 8 MB
Resolution and
Colors 1280x1024 at 85 Hz for KVM and 1600x1200 at 60 Hz for video out
640x480 (60/72/75/85 Hz; 8/16/32-bit color)
800x600 (60/72/75/85 Hz; 8/16/32-bit color)
1024x768 (60/72/75/85 Hz; 8/16/32-bit color)
1152x864 (75 Hz; 8/16/32-bit color)
1280x1024 (60/75/85 Hz; 8/16-bit color)
1280x1024 (60 Hz, 32-bit color) (note 32 bit color is only supported at 60 Hz for this resolution)
Audio No speaker/no buzzer
Form Factor 1U Rack
Dimension
(HxWxD) 43.0 x 434.0 x 627.1 (mm) (without ear, without bezel) 1.69 x 17.09 x 24.69 (in)
Max Weight 15.9Kg/35.02lbs
Bezel Metal (Optional)
HDD Bays 4x 3.5"
Optional Hot-Swap
Support 2.5" HDDs via Hot-Swap tray
HDD/SATA 3.5"/7.2K
160 GB
250 GB
500 GB
750 GB
1000 GB
2000 GB (POST-RTS)
HDD/Near Line
SAS 3.5"/7.2K 500 GB
750 GB
1000 GB
2000 GB (POST-RTS)
HDD/SAS 3.5"/15K
146 GB
300 GB
450 GB
3.5"/10K

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Features Descriptions
600 GB
2.5"/10K (in 3.5" Bosshog)
73 GB
146 GB
300 GB
HDD/SSD 2.5" (in 3.5" Bosshog)
25 GB SATA SSD
50 GB SATA SSD
100 GB SATA SSD (POST-RTS)
Media Bay 1x slim ODD
RMSD DVD-ROM
DVD+/-RW
USB DVD-ROM
Backup Devices RD1000 (External)
DAT-72 (External)
LTO2-L (External)
LTO3-060 (External)
LTO3FH (External)
LTO4-120 HH (External)
LTO4-120 FH (External)
PV114T (External, 2U)
Tape
Automation TL2000/TL4000 ML6000
PV124T
TBU Software CommVault Galaxy
Symantec Backup Exec including Backup Exec System Recovery
Yosemite/Little Man
PV DAS/SAN MD1000
MD1120
MD3000/MD300i
Storage HBA NON-RAID:
SAS 5/E
LSI 2032 (For TBU only)
RAID:
SAS 6/iR Modular
PERC 6/i
PERC 6/E
NICs/Single Port Intel PRO/1000 PT Server Adapter
Intel 10 Gigabit AT Server Adapter
Broadcom NetXtreme II 57710 Single Port 10GBase-T Ethernet PCI-Express Network
Interface Card with TOE and iSCSI Offload
NICs/Dual Port Intel PRO/1000 PT Dual Port Server Adapter
Intel Gigabit ET Dual-Port Server Adapter
Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE

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Features Descriptions
Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE and iSCSI Offload
NICs/Quad Port Intel Gigabit VT Quad Port Server Adapter
Intel Gigabit ET Quad-Port Server Adapter
Broadcom ® NetXtreme II ® 5709 Quad Port Ethernet PCIe Card with TOE/iSCSI Offload
Infiniband NIC Mellanox: ConnectX™ IB HCA Card, Dual Port 20Gb/s InfiniBand, wth PCIe Gen2, PCIe 2.0
x8 5.0GT/s, MemFree, tall bracket, RoHS (R5) Compliant
QLogic : Pathscale DDR/QDR (whichever is current)
FC HBA LPE1150-E
LPe11002
LPe12000
LPe12002
QLE220
QLE2460
QLE2462
QLE2560
QLE2562
Solutions Database:
SQL2008
Virtualization:
VMWare ESX 3.5/ESXi 3.5 and ESX 4.0/ESXi 4.0
Hyper-V (Veridian and standalone Viridian)
Dell will not support XenServer. Citrix XenServer Enterprise (Std and Embedded) is supported
by Citrix.
HPCC:
Microsoft HPC Server 2008
Red Hat Enterprise Linux 5 for HPC
Operating
Systems Microsoft: Essential Business Server (Centro) 64-bit Standard(DIB) and Premium(DIB)
SBS2008 64-bit Standard and Premium (FI)
WS2008 32-bit Web, Standard, Enterprise (FI)
WS2008 64-bit Web, Standard, Enterprise, Datacenter, HPC Server 2008 (FI)
SBS2003 R2 32-bit Standard and Premium(DIB)
WS2003 R2 32-bit Standard, Enterprise
WS2003 R2 64-bit Standard, Enterprise, Datacenter(DIB)
WS2003 32-bit Web
Linux:
RHEL 4.7 ES/AS x86(DIB, NFI) (POST-RTS at Q2 block)
RHEL 4.7 ES/AS 64-bit(DIB, NFI) (POST-RTS at Q2 block)
RHEL 4.7 for HPC x86-64 (DIB)
RHEL 5.2 Standard/AP x86(DIB, NFI)
RHEL 5.2 Standard/AP 64-bit
RHEL 5.2 for HPC x86-64 (DIB)
SLES 10 SP2 64-bit(DIB, NFI)
SLES 11 64-bit (POST-RTS at Q2 block)

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4 Mechanical
4.1 Chassis Description
The PowerEdge R410 chassis design provides customers low-cost compute power with some
hardware redundancy ability. It is a new chassis design for two incoming chassis offering cabled hard
drive with LED module, and high-availability features such as hot-plug hard drives and LCD module.
Features include four 3.5” SATA or SAS hard drives (cabled or hot-swap), power supply (non-
redundant or redundant), dual Gigabit LOMs without TOE acceleration, four DIMM slots support each
CPU, TPM, one riser card for optional PCIe expansion card, optional iDRAC6 Enterprise and iDRAC6
Express card mounted on planar without PCI slot occupied, and support 11G slim static and slim sliding
rails.
4.2 Dimensions and Weight
Table 3. R410 Dimensions
Dimension (HxWxD)
(without ear, without
bezel)
43.0 x 434.0 x 627.1 (mm)
1.69 x 17.09 x 24.69 (in)
Max Weight 15.9Kg/35.02lbs
Table 4. Detailed Dimensions
Dimensions (mm)
Development
Name Model Number Xa Xb YZa
with
bezel
Za
without
bezel Zb* Zc Max Sys
Weight Chassis U
The PowerEdge
R410 PE R410 482.4 434.0 43.0 35.0 20.1 606.0 641.9 15.9Kg/35.02lbs
1U
Note
Zb goes to the nominal rear wall external surface where the motherboard I/O connectors reside.
Figure 1. R410 Top and Side Measurement Key

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4.3 Front Panel View and Features
Figure 2. Hot-Swap HDD view
Figure 3. Cabled HDD View
Figure 4. With Bezel View
Figure 5. Front Panel Controller
• Front control panel: 11G control panel
oFront KVM (2x USB, 1x Video)
oDiagnostic indicator (quad-pack LED with cabled HDD configuration; 11G LCD with hot-
swap HDD configuration)
oSystem ID button
oPower button
oHDD activity LED
oNMI button
oAsset Tag
4.4 Back Panel View and Features
Figure 6. With Redundant Power Supply
HDD_0
HDD_1
○
4
○
1
○
1
○
2
○
3
○
5
○
6
○
7
HDD_0
HDD_1
HDD_2
HDD_3
ODD

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Figure 7. With Non-redundant Power Supply
Figure 8. Rear Panel Connectors and LEDs
Rear I/O ports: layout follows 11G family look.
oActive ID CMA Jack
oSystem ID button
oBi-color system ID LED
o(2) Gigabit NIC ports
o(2) USB ports
oVideo
oSerial port
oRJ45 Connector on iDRAC6 Enterprise (optional)
4.5 Power Supply Indicators
Figure 9. Redundant PSU
Not lit — AC power is not connected.
Green — In standby mode, a green light indicates a valid AC source is connected to the power supply
and the power supply is operational. When the system is on, a green light also indicates that the power
supply is providing DC power to the system.
Amber — Indicates a problem with the power supply.
Alternating green and amber — When hot-adding a power supply, this indicates that the power supply
is mismatched with the other power supply (Ex. a High Output 500-W power supply and a 400-W power
supply are installed in the same system). Replace the power supply that has the flashing indicator with
a power supply that matches the capacity of the other installed power supply.
○
1
○
2
○
4
○
5
○
6
○
7
○
8
○
3

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4.6 NIC Indicators
Figure 10. Dual-Stacked RJ45 Connectors
Table 5. LED States
State Link LED
(Green/Yellow) Activity LED (Green)
No link Off Off
D0uninitalized (out of
box), D3cold, S4
(hibernation)
WOL disabled Off Off
WOL enabled, link, no
activity Green if the port is operating at maximum
port speed; Yellow
otherwise
Green if the port is
operating at maximum
port speed; Yellow
otherwise
Off
WOL enabled, link,
activity On (blinking at speed related to packet density)
Pre-OS POST or OS
without driver Link, no activity Off
Link, activity On (blinking at speed
related to packet density)
OS with driver Link, no activity Off
Link, activity On (blinking at speed
related to packet density)
4.7 Side Views and Features
Figure 11. Left Side View
Figure 12. Right Side View

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4.8 Rails and Cable Management
Table 6. Rails and Cable Management Descriptions
Rails
Support for low cost static rails
Support sliding rails
Support for tool-less installation in CEA-310-E compliant
square hole 4-post racks Including
Support for Dell 2410 24U Rack
Support for Dell 4210 Rack
Support for HP/Compaq 10xxx series
Support for tooled or tool-less installation in CEA-310-E
compliant round hole 4-post racks (tool-less preferred)
Support for flush and center mount installation in CEA-310-E
compliant 2-post racks (1U and 2U only)
Full extension required (to allow serviceability of key internal
components)
Cable Management Arm (CMA)
Support for maximum number of cables supported by
system
Support for status indicator cable
To be shipped separately from rail kit
If sliding rails are supported, then require CMA.
Table 7. MODs in BOM List
FU435 MOD,RCKRL,CMA,1U
MP488 CUS,RCKRL,CMA,1U
PT642 MOD,RCKRL,NO RAILS,1U
U944M MOD,RCKRL,2/4PST,1U,STAT,SFF
W625M CUS,RCKRL,2/4PST,1U,STAT,SFF
X196M MOD,RCKRL,RDYRL,1U,SL,SFF
Y160M CUS,RCKRL,RDYRL,1U,SL,SFF
4.9 Fans
There are total of six fans with redundant PSU in the system and four fans with non-redundant PSU.
Figure 13 shows:
• Four fans at right are the fans for the system, especially for the CPUs and memories.
• Two fans at left are there when the system is configured with redundant PSU. They cool down
the redundant PSU.

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Figure 13. R410 Fans
4.10 Control Panel/LCD
• Front control panel
• LCD Status Description
Figure 14. Front Controller Board with LCD
Internal USB
connector
LCD module and
cable/connector

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Figure 15. Front Controller Board with LEDSecurity
4.10.1 Cover Latch
Figure 16. Cover Latch
4.10.2 Bezel
Figure 17. Bezel
Cover
Latch
LED module
No cable and

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4.10.3 Hard Drive
Require bezel to avoid removing HDDs.
4.10.4 Trusted Platform Management (TPM)
Figure 18. TPM Module Location on the Motherboard
4.10.5 Power-Off Security
The control panel is designed so that the power switch cannot be accidentally activated. The lock on
the bezel secures the switch behind the bezel. In addition, a setting in the CMOS setup disables the
power button function.
4.10.6 Intrusion Alert
Chassis intrusion switch is located on the front panel board.
Figure 19. Chassis Intrusion Switch
TPM
Chip
TCM
Socket
Location

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4.10.7 Secure Mode
BIOS can enter a secure boot mode via setup. This mode includes the option to lock out the power and
NMI switches on the control panel or set up a system password. See the BIOS specification in the
HOM.
4.11 USB Key
Dell does not offer USB keys for factory installation.
4.12 Battery
Battery for the motherboard: CR2032
Figure 20. Battery Holder for PERC 6/i
Figure 21. Battery Holder for PERC
4.13 Field Replaceable Units (FRU)
Parts available for field replacement:
• Backplane
• CMOS battery
• Expansion card
• Front bezel

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• HDD
• I/O panel
• Memory
• ODD
• PDB
• Power supply
• Processor
• Processor shroud
• System board
• System cover
• System fan
5 Electrical
5.1 Volatility
The PowerEdge R410 contains volatile and non-volatile (NV) components. Volatile components lose
their data immediately upon removal of power from the component. Non-volatile components continue
to retain their data even after the power has been removed from the component. Components chosen
as user-definable configuration options (those to the motherboard) are not included in the statement of
volatility. Configuration option information (pertinent to options such as microprocessors, system
memory, remote access controllers, and storage controllers) is available separately. The NV
components present in the PowerEdge R410 server are discussed further in Error! Reference source
not found..
5.2 ePPID
The ePPID is an electronic repository for information from the PPID label stored in non-volatile RAM.
BIOS reports the ePPID information using SMBIOS data structures, and the ePPID includes:
• Dell part number
• Part revision level
• Country of origin
• Supplier ID code
• Date code (date of manufacture)
• Unique sequence number