DFI PIC-Q170 User manual

www.dfi.com
1
Chapter 1 Introduction
PIC-Q170/H110
Full Size PICMG 1.3
User’s Manual
A51900852
Preliminary
Version

www.dfi.com
2
Chapter 1 Introduction
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2018. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli-
ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

www.dfi.com
3
Chapter 1 Introduction
Copyright............................................................................................................. 2
Trademarks ........................................................................................................2
FCC and DOC Statement on Class B.....................................................2
Warranty..............................................................................................................4
Static Electricity Precautions......................................................................4
Safety Measures ..............................................................................................4
Before Using the System Board...............................................................5
Chapter 1 - Introduction .............................................................................6
Specifications ................................................................................................6
Features..........................................................................................................7
Chapter 2 - Hardware Installation................................................ 8
Board Layout.................................................................................................8
System Memory............................................................................................ 9
Installing the DIMM Module ........................................................................ 10
CPU ................................................................................................................ 11
Installing the CPU....................................................................................... 11
Installing the Fan and Heat Sink.................................................................. 13
Jumper Setting ........................................................................................... 14
Clear CMOS ............................................................................................... 14
Rare Panel I/O Ports................................................................................. 15
VGA Port.................................................................................................... 15
USB Ports................................................................................................... 16
RJ45 LAN Ports........................................................................................... 16
I/O Connectors ........................................................................................... 17
COM (Serial) Ports...................................................................................... 17
Digital I/O Connector.................................................................................. 18
SATA (Serial ATA) Connectors...................................................................... 18
Cooling Fan Connectors............................................................................... 19
Chassis Intrusion Connector ........................................................................ 19
Front Panel Connector ................................................................................ 20
LPT Connector............................................................................................ 20
DVI-D Connector (optional)......................................................................... 21
KB/MS Connector........................................................................................ 21
LPC Connector............................................................................................ 22
SMBus Connector ....................................................................................... 22
12V Power Connector ................................................................................. 23
Audio Connector......................................................................................... 23
Expansion Slot............................................................................................ 24
Battery....................................................................................................... 24
Table of Contents

www.dfi.com
4
Chapter 1 Introduction
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal-
lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-
nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installa-
tion or servicing. After installation or servicing, cover the system chassis before
plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com-
ponents. Perform the upgrade instruction procedures described at an ESD worksta-
tion only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chas-
sis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.

www.dfi.com
5
Chapter 1 Introduction
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• A CPU
• Memory module
• Storage devices such as hard disk drive, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

www.dfi.com
6
Chapter 1 Introduction
Chapter 1 - Introduction
Specifications
Chapter 1
SYSTEM Processor 7th Generation Intel®CoreTM Processors, LGA1151
Intel®CoreTM i7-7700 Processor, Four Core, 8M, 3.6GHz (4.2GHz), 65W
Intel®CoreTM i7-7700T Processor, Four Core, 8M, 2.9GHz (3.8GHz), 35W
Intel®CoreTM i5-7500 Processor, Four Core, 6M, 3.4GHz (3.8GHz), 65W
Intel®CoreTM i5-7500T Processor, Four Core, 6M, 2.7GHz (3.3GHz), 35W
Intel®CoreTM i3-7101E Processor, Dual Core, 3M, 3.9GHz, 54W
Intel®CoreTM i3-7101TE Processor, Dual Core, 3M, 3.4GHz, 35W
Intel®CoreTM G3930E Processor, Dual Core, 2M, 2.9GHz, 54W
Intel®CoreTM G3930TE Processor, Dual Core, 2M, 2.7GHz, 35W
6th Generation Intel®CoreTM Processors, LGA1151
Intel®CoreTM i7-6700 Processor, Four Core, 8M, 3.4GHz (4.0GHz), 65W
Intel®CoreTM i7-6700TE Processor, Four Core, 8M, 2.4GHz (3.4GHz), 35W
Intel®CoreTM i5-6500 Processor, Four Core, 6M, 3.2GHz (3.6GHz), 65W
Intel®CoreTM i5-6500TE Processor, Four Core, 6M, 2.3GHz (3.3GHz), 35W
Intel®CoreTM i3-6100 Processor, Dual Core, 4M, 65W
Intel®CoreTM i3-6100TE Processor, Dual Core, 4M, 2.7GHz, 35W
Intel®CoreTM G4400 Processor, Dual Core, 3M, 3.3GHz, 65W
Intel®CoreTM G4400TE Processor, Dual Core, 3M, 2.9GHz, 35W
Intel®CoreTM G3900 Processor, Dual Core, 2M, 2.8GHz, 65W
Intel®CoreTM G3900TE Processor, Dual Core, 2M, 2.6GHz, 35W
Chipset Q170/H110
Memory Two 288-pin DIMM up to 32GB
Dual Channel DDR4 1866/2133MHz
BIOS Insyde SPI 128Mbit
GRAPHICS Display 1 x VGA VGA: resolution up to 1920x1200 @ 60Hz
1 x DVI-D (available upon request) DVI-D: resolution up to 1920x1200 @ 60Hz
Dual
Displays
VGA + DVI-D (available upon request)
EXPANSION Interface 1 x PCIe x16 Gen. 3
4 x PCIe x1 Gen. 3
4 x PCI
1 x M.2 M key 2280 (PCIe/SATA3.0) (Q170 only)
ETHERNET Controller/
Phy
PIC-Q170:
1 x Intel®I211AT PCIe (10/100/1000Mbps)
1 x Intel®I219LM PCIe with iAMT11.6 (10/100/1000Mbps) (only Core i7/i5 supports iAMT)
PIC-H110:
1 x Intel®I211AT PCIe (10/100/1000Mbps)
1 x Intel®I219V PCIe (10/100/1000Mbps)
REAR I/O Ethernet 2 x GbE (RJ-45)
USB 2 x USB 3.0
Display 1 x VGA
1 x DVI-D (available upon request)
INTERNAL I/O Serial 2 x RS-232/422/485 (2.54mm pitch)
2 x RS232 (2.54mm pitch)
USB 2 x USB 3.0 (2.0mm pitch) (Q170 only)
6 x USB 2.0 (2.54mm pitch) (Q170), 4 x USB 2.0 (2.54mm pitch) (H110)
Audio 1 x Front Audio (2.54mm pitch)
SATA 4 x SATA 3.0 (up to 6Gb/s)
DIO 1 x 8-bit DIO
SMBus 1 x SMBus
ATX ATX 12V Power Connector and Expansion Goldfinger
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY TPM fTPM2.0 or DTPM2.0 (optional)
POWER Consumption TBD
OS SUPPORT Microsoft Windows 7 (32/64 bit)
Windows 8.1 (64 bit)
Windows 10 IoT Enterprise (64 bit)
Note: 7th Gen Intel Core processors only support Win 10.
Linux Ubuntu 16.04
ENVIRONMENT Temperature Operating: 0 to 60°C
Storage: -20 to 85°C
Humidity Operating: 5 to 90% RH
MTBF TBD
MECHANICAL Dimensions Full Size PICMG 1.3
338mm (13.3") x 126.39mm (4.98")

www.dfi.com
7
Chapter 1 Introduction
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR4
DDR4 delivers increased system bandwidth and improves performance. The advantages of
DDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2.
• Graphics
The integrated Intel®HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with out-
standing graphics responsiveness. These enhancements deliver the performance and compat-
ibility needed for today’s and tomorrow’s business applications. Supports DVI-D (optional) and
VGA interfaces for diaplay outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s.
• Gigabit LAN
Intel®I211AT PCI Express Gigabit Ethernet controller and Intel®I219LM PCI Express Gigabit
Ethernet controller support up to 1Gbps data transmission.
• Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It
is supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power
Management Event) signal. However, if your system is in the Suspend mode, you can power-
on the system only through an IRQ or DMA interrupt.
Chapter 1
• Wake-On-PS/2
This function allows you to use the PS/2 keyboard or PS/2 mouse to power-on the system.
• Wake-On-USB
This function allows you to use a USB keyboard or USB mouse to wake up a system from the
S3 (STR - Suspend To RAM) state.
• RTC Timer
The RTC installed on the system board allows your system to automatically power-on on the
set date and time.
• ACPI STR
The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)
specification. ACPI has energy saving features that enables PCs to implement Power Manage-
ment and Plug-and-Play with operating systems that support OS Direct Power Management.
ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM
function.
With the Suspend to RAM function enabled, you can power-off the system at once by pressing
the power button or selecting “Standby” when you shut down Windows®without having to go
through the sometimes tiresome process of closing files, applications and operating system.
This is because the system is capable of storing all programs and data files during the entire
operating session into RAM (Random Access Memory) when it powers-off. The operating ses-
sion will resume exactly where you left off the next time you power-on the system.
• Power Failure Recovery
When power returns after an AC power failure, you may choose to either power-on the system
manually or let the system power-on automatically.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmis-
sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces
power consumption, and is backward compatible with USB 2.0. It is a marked improvement in
device transfer speeds between your computer and a wide range of simultaneously accessibl
external Plug and Play peripherals.

www.dfi.com
8
Chapter 2 Hardware Installation
Chapter 2
Chapter 2 - Hardware Installation
Board Layout
12
9
COM 4
12
9
12
9
12
9
USB 2.0
USB 2.0
Buzzer
DIO
KB/MS
LGA 1151
SATA 2
SATA 3
SPI
Flash
BIOS
CPU FAN
1
12
10
USB 5-6
1
Clear CMOS
(JP1)
1
211
12
Front Panel Battery
DDR4_1
DDR4_2
1
2
1
910
2
12
10
USB 3-4
12
25
LPT
VGA
LAN 2
LAN 1
Intel
Q170/H110
Chassis
Intrusion
1
ASM1085
+12V Power
USB 1
USB 2
10
9
NCT6106D
11 11
SATA 0
SATA 1
USB 3.0USB 3.0
USB 3.0
12
10
USB 1-2
(Q170 only)
Standby Power LED
Intel
I211AT
TPM 2.0
1
System Fan 1
COM 3
COM 2
COM 1
1
2
5
SMBus
M.2 M Key
(Q170 only)
DVI-D (opt.)
Audio
1
910
2
LPC
1
13
2
14
11
110
USB 3.0
USB 3-4 (Q170 only)
1
229
30

www.dfi.com
9
Chapter 2 Hardware Installation
Chapter 2
System Memory
DDR4_1
Features
• Two 288-pin DDR4 DIMM sockets
• Supports 1866/2133 MHz DDR4 SDRAM
• Dual channel memory interface
• Supports maximum of 32GB system memory
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits (8B) from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel
DIMMs are on the same channel.
DIMMs in a channel can be identical or
completely different. However, we highly
recommend using identical DIMMs.
Not all slots need to be populated.
Dual Channel DIMMs of the same memory configuration
are on different channels.
Important:
You can populate either Channel A or Channel B first.
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wear-
ing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
DDR4_2

www.dfi.com
10
Chapter 2 Hardware Installation
Chapter 2
Installing the DIMM Module
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
1. Make sure the PC and all other peripheral devices connected to it has been
powered down.
2. Disconnect all power cords and cables.
3. Locate the DIMM socket on the system board.
4. Push the “ejector tabs” which are at the ends of the socket to the side.
Ejector tab
Ejector tab
5. Note how the module is keyed to the socket.
Key
Notch
7. Seat the module vertically, pressing it down firmly until it is completely seated
in the socket. The ejector tabs at the ends of the socket will automatically
snap into the locked position to hold the module in place.
6. Grasping the module by its edges, position the module above the socket with
the “notch” in the module aligned with the “key” on the socket. The keying
mechanism ensures the module can be plugged into the socket in only one
way.

www.dfi.com
11
Chapter 2 Hardware Installation
Chapter 2
CPU
The system board is equipped with a surface mount LGA 1151 socket. This socket is exclu-
sively designed for installing a LGA 1151 packaged Intel CPU.
Protective
cap
Important:
1. Before you proceed, make sure (1) the LGA 1151 socket comes with a protective
cap, (2) the cap is not damaged and (3) the socket’s contact pins are not bent. If
the cap is missing or the cap and/or contact pins are damaged, contact your dealer
immediately.
2. Make sure to keep the protective cap. RMA requests will be accepted and pro-
cessed only if the LGA 1155 socket comes with the protective cap.
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
Important:
The CPU socket must not come in contact with anything other than the CPU. Avoid
unnecessary exposure. Remove the protective cap only when you are about to install
the CPU.
Installing the CPU
1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the LGA 1151 CPU
socket on the system
board.
4. Unlock the socket by push-
ing the load lever down,
moving it sideways until it
is released from the reten-
tion tab; then lift the load
lever up.
Retention tab
Load lever

www.dfi.com
12
Chapter 2 Hardware Installation
Chapter 2
6. Remove the protective cap
from the CPU socket. The
cap is used to protect the
CPU socket against dust
and harmful particles.
Remove the protective cap
only when you are about
to install the CPU.
Load lever
Load
plate
5. Lifting the load lever will at
the same time lift the load
plate.
Lift the load lever up to
the angle shown on the
photo.
Protective cap
Important:
The CPU will fit in only one orientation and can easily be inserted without exerting
any force.
7. Insert the CPU into the
socket. The gold triangular
mark on the CPU must
align with the corner of
the CPU socket shown on
the photo.
The CPU’s notch will at
the same time fit into the
socket’s alignment key.
Alignment key
Alignment key
Gold triangular mark

www.dfi.com
13
Chapter 2 Hardware Installation
Chapter 2
8. Close the load plate then
push the load lever down.
While closing the load
plate, make sure the front
edge of the load plate
slides under the retention
knob.
Retention knob
9. Hook the load lever under
the retention tab.
Load lever
Retention tab
Installing the Fan and Heat Sink
The CPU must be kept cool by using a CPU fan with heat sink. Without sufficient air circula-
tion across the CPU and heat sink, the CPU will overheat damaging both the CPU and system
board.
1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of the
CPU. The thermal paste is usually supplied when you purchase the fan / heat sink assem-
bly. Do not spread the paste all over the surface. When you later place the heat sink on
top of the CPU, the compound will disperse evenly.
Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal
paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel the
strip that covers the paste before you place the fan / heat sink on top of the CPU.
2. Place the heat sink on top
of the CPU. The 4 push-
pins around the heat sink,
which are used to secure
the heat sink onto the sys-
tem board, must match the
4 mounting holes around
the socket.
Mounting hole
3. Orient the heat sink such
that the CPU fan’s cable is
nearest the CPU fan con-
nector.
CPU fan connector
Note:
A boxed Intel®processor already includes the CPU fan and heat sink assembly. If your
CPU was purchased separately, make sure to only use Intel®-certified fan and heat
sink.

www.dfi.com
14
Chapter 2 Hardware Installation
Chapter 2
Jumper Setting
Clear CMOS
If you encounter the following,
a) CMOS data becomes corrupted.
b) You forgot the supervisor or user password.
you can reconfigure the system with the default values stored in the ROM BIOS.
To load the default values stored in the ROM BIOS, please follow the steps below.
1. Power-off the system and unplug the power cord.
2. Set JP1 pins 2 and 3 to On. Wait for a few seconds and set JP1 back to its default setting,
pins 1 and 2 On.
3. Now plug the power cord and power-on the system.
JP1
2-3 On:
Clear CMOS
1-2 On:
Normal (default)
132
1
32
4. Rotate each push-pin ac-
cording to the direction of
the arrow shown on top of
the pin.
Push down two pushpins
that are diagonally across
the heat sink. Perform the
same procedure for the
other two push-pins.
Heat sink
“Locked” position of
push-pin
5. Connect the CPU fan’s
cable to the CPU fan
connector on the system
board.
“Unlocked” position
of push-pin
CPU fan connector

www.dfi.com
15
Chapter 2 Hardware Installation
Chapter 2
Rear Panel I/O Ports
The rear panel I/O ports consist of the following:
• 2 LAN ports
• 1 VGA port
• 2 USB 3.0 ports
USB 1
LAN 1 LAN 2 VGA USB 2
LAN
1
LAN
2
VGA Port
The VGA port is used for connecting a VGA monitor. Connect the monitor’s 15-pin D-shell cable
connector to the VGA port.After you plug the monitor’s cable connector into the VGA port,
gently tighten the cable screws to hold the connector in place.
BIOS Setting
Configure VGA in the Chipset menu (“North Bridge Configuration” submenu) of the BIOS. Refer
to chapter 3 for more information.
Driver Installation
Install the graphics driver. Refer to chapter 4 for more information.
VGA

www.dfi.com
16
Chapter 2 Hardware Installation
Chapter 2
USB Ports
USB allows data exchange between your computer and a wide range of simultaneously acces-
sible external Plug and Play peripherals.
The PIC-Q170 is equipped with two onboard USB 3.0 ports (USB 1&2). The three 10-pin con-
nectors allow you to connect 6 additional USB 2.0 ports (USB 1-2/3-4/5-6). The one 20-pin
connector allows you to connect 2 additional USB 3.0 ports (USB 3-4).
The PIC-H110 is equipped with two onboard USB 3.0 ports (USB 1&2). The two 10-pin con-
nectors allow you to connect 4 additional USB 2.0 ports (USB 3-4/5-6).
The additional USB ports may be mounted on a card-edge bracket. Install the card-edge
bracket to an available slot at the rear of the system chassis and then insert the USB port
cables to a connector.
BIOS Setting
Configure the onboard USB in the Advanced menu (“USB Configuration” submenu) of the
BIOS. Refer to chapter 3 for more information.
1
VCC
-Data
+Data
GND
VCC
-Data
+Data
GND
N.C.
2
10
9
USB 3-4
USB 1
USB 2
USB 2.0
USB 5-6
RJ45 LAN Ports
LAN 1 LAN 2
The LAN ports allow the system board to connect to a local area network by means of a net-
work hub.
BIOS Setting
Configure the onboard LAN in the Chipset menu (“South Bridge Configuration” submenu) of
the BIOS. Refer to chapter 3 for more information.
Driver Installation
Install the LAN drivers. Refer to chapter 4 for more information.
Features
• 1 Intel®I211AT Gigabit Ethernet LAN controller
• 1 Intel®I219LM Gigabit Ethernet LAN controller
LAN
1
LAN
2
USB 1-2
(Q170 Only)
USB 3.0
D-
GND
TX+
TX-
GND
RX+
PWR
D+
D-
GND
TX+
TX-
GND
RX+
RX-
PWR
Over Current ProtectionD+
RX-
USB 3.0
USB 3-4
(Q170 Only)

www.dfi.com
17
Chapter 2 Hardware Installation
Chapter 2
COM (Serial) Ports
COM 1 and COM 2 can be selected among RS232, RS422 and RS485. Configure COM 1 and
COM 2 serial communication mode in the BIOS (the “Super IO Configuration” submenu of the
Advanced menu). COM 3 and COM 4 are fixed at RS232.
The serial ports are asynchronous communication ports with 16C550A-compatible UARTs that
can be used with modems, serial printers, remote display terminals, and other serial devices.
Connecting External Serial Ports
Your COM port may come mounted on a card-edge bracket. Install the card-edge bracket to
an available slot at the rear of the system chassis then insert the serial port cable to the COM
connector. Make sure the colored stripe on the ribbon cable is aligned with pin 1 of the COM
connector.
BIOS Setting
Configure the serial ports in the Advanced menu (“Super IO Configuration” submenu) of the
BIOS. Refer to chapter 3 for more information.
COM 4
COM 3
COM 1/COM 2:
RS232/422/485
COM 3/COM 4:
RS232
COM 1
COM 2
I/O Connectors
12
9
Pin RS232 RS422 Full Duplex RS485
1DCD- TXD- DATA-
2RD TXD+ DATA+
3TD RXD+ N.C.
4DTR- RXD- N.C.
5GND GND GND
6DSR- N.C. N.C.
7RTS- N.C. N.C.
8CTS- N.C. N.C.
9RI- N.C. N.C.
COM 1/2
1
DCD-
SO-
GND
RTS-
SIN-
DTR-
DSR-
CTS-
RI-
2
9

www.dfi.com
18
Chapter 2 Hardware Installation
Chapter 2
The 8-bit Digital I/O connector provides powering-on function to external devices that are
connected to these connectors.
1
Digital I/O
Digital I/O Connector
Digital I/O Connector
Pin Function Pin Function
1DIO7 2DIO6
3DIO5 4DIO4
5DIO3 6DIO2
7DIO1 8DIO0
95V 10 GND
SATA (Serial ATA) Connectors
7
RXN
GND
TXP
TXN
GND
1
RXP
GND
SATA 3.0 6Gb/s
Features
The Serial ATA connectors are used to connect Serial ATA devices. Connect one end of the Se-
rial ATA cable to a SATA connector and the other end to your Serial ATA device.
BIOS Setting
Configure the Serial ATA drives in the Advanced menu (“SATA Configuration” submenu) of the
BIOS. Refer to chapter 3 for more information.
• SATA 0, SATA 1, SATA 2 and SATA 3 support data transfer rate up to 6Gb/s
10
9
2
11
SATA 3SATA 2
SATA 1
SATA 0

www.dfi.com
19
Chapter 2 Hardware Installation
Chapter 2
Cooling Fan Connectors
The fan connectors are used to connect cooling fans. The cooling fans will provide adequate
airflow throughout the chassis to prevent overheating the CPU and system board components.
BIOS Setting
The Advanced menu (“Hardware Health Configuration” submenu) of the BIOS will display the
current speed of the cooling fans. Refer to chapter 3 for more information.
CPU fan
Chassis Intrusion Connector
The board supports the chassis intrusion detection function. Connect the chassis intrusion
sensor cable from the chassis to this connector. When the system’s power is on and a chassis
intrusion occurred, an alarm will sound. When the system’s power is off and a chassis intrusion
occurred, the alarm will sound only when the system restarts.
12
Ground Signal
4
1
Sense
Power
Ground
Speed Control
System Fan 1
1
Sense
Power
Ground
3
Chassis
Intrusion

www.dfi.com
20
Chapter 2 Hardware Installation
Chapter 2
Front Panel Connector
HD-LED - HDD LED
This LED will light when the hard drive is being accessed.
RESET - Reset Switch
This switch allows you to reboot without having to power off the system.
ATX-SW - Power Switch
This switch is used to power on or off the system.
PWR-LED - Power/Standby LED
When the system’s power is on, this LED will light. When the system is in the S1 (POS - Power
On Suspend) state, it will blink every second. When the system is in the S3 (STR - Suspend To
RAM) state, it will blink every 4 seconds.
HD-LED RESET
PWR-LED ATX-SW
12
11
2
1
Pin Pin Assignment Pin Pin Assignment
HD-LED 3 HDD Power
PWR-LED
2 LED Power
5 Signal 4 LED Power
RESET 7 Ground 6 Signal
9 RST Signal ATX-SW 8 Ground
1, 11 N.C. 10 Signal
LPT Connector
LPT
The LPT port is for interfacing your PC to a parallel printer. It supports SPP, ECP and EPP.
SPP
(Standard Parallel Port)
Allows normal speed operation but in one
direction only.
ECP
(Extended Capabilities Port)
Allows parallel port to operate in bidirectional
mode and at a speed faster than the SPP’s data
transfer rate.
EPP
(Enhanced Parallel Port)
Allows bidirectional parallel port operation at
maximum speed.