Diamond Systems ELTON ELT-BB01 User manual

ELTON™
Carrier for NVIDIA®AGX Xavier Module
USER MANUAL
Revision No
Release Date
Comments
1.01
08/05/2019
Initial Release
1.02
01/14/2020
Major Feature Updates
1.03
01/26/2020
Added Sections: PC/10, DAQ, and Getting Started
1.04
03/27/2020
Added Addendum
© Copyright 2020
Diamond Systems Corporation
www.diamondsystems.com
FOR TECHNICAL SUPPORT
PLEASE CONTACT:
Email: [e-mail]

Elton User Manual Rev 1.04 www.diamondsystems.com Page 2
Contents
1. Important Safe Handling Information .............................................................................................................4
2. Introduction.......................................................................................................................................................6
Elton Baseboard Overview............................................................................................................................6
Elton Baseboard Models ...............................................................................................................................7
AGX Xavier Modules Overview.....................................................................................................................7
3. Functional Overview.........................................................................................................................................9
Processor Modules........................................................................................................................................9
Power Supply Specifications .........................................................................................................................9
Backup Battery ..............................................................................................................................................9
Ethernet Ports............................................................................................................................................. 10
Display Controller ....................................................................................................................................... 10
Camera Serial Interface (CSI).................................................................................................................... 10
Audio Interface............................................................................................................................................ 11
Serial Ports................................................................................................................................................. 11
PCIe/USB 3.1/UFS Link Routing Controllers ............................................................................................. 11
PCIe MiniCard Socket ................................................................................................................................ 13
PCI-104 and OneBank PCIe/104 Expansion Interface .............................................................................. 13
USB Ports................................................................................................................................................... 13
PCIe M.2 Socket......................................................................................................................................... 13
UFS and Micro SD Socket.......................................................................................................................... 13
Data Acquisition (DAQ) I/O Interface.......................................................................................................... 13
Controller Area Network (CAN) Interface................................................................................................... 14
Utility Header Connector ............................................................................................................................ 14
LED Indicators............................................................................................................................................ 14
4. Functional Block Diagram ............................................................................................................................ 15
Elton Baseboard Block Diagram................................................................................................................. 15
AGX Xavier Series Module Block Diagram ................................................................................................ 16
5. Mechanical Drawing ...................................................................................................................................... 17
6. Connector and Jumper Location ................................................................................................................. 18
7. I/O Connectors, Jumpers and LED Specifications..................................................................................... 20
8. Connector Pinout Specifications ................................................................................................................. 21
Power IN Connector: J16 ........................................................................................................................... 21
RTC Battery Connector: J8 ........................................................................................................................ 21
Ethernet Connectors: J17, J18................................................................................................................... 21
Audio Signal Connector: J13...................................................................................................................... 22
HDMI Connector: J19................................................................................................................................. 22
LVDS LCD Connector: J7........................................................................................................................... 23
LCD Backlight Connector: J4 ..................................................................................................................... 23
USB 2.0 Port Connector: J20..................................................................................................................... 24
PCIe/104 Connector: J1 ............................................................................................................................. 24
PCI-104 Connector: J2............................................................................................................................... 25
Camera Expansion Connector: J12............................................................................................................ 26
Serial Port Connectors: J22, J23................................................................................................................ 27
USB 3.1 Port Connectors: J3, J21.............................................................................................................. 28
PCIe MiniCard Connector: J14................................................................................................................... 28
M.2 PCIe SSD Socket (M-KEY) Connector: J9.......................................................................................... 29
Data Acquisition (DAQ) Connector: J24..................................................................................................... 30
Utility Connector: J11 ................................................................................................................................. 30
CAN Connectors: J5, J6............................................................................................................................. 31
UFS Interface Connector: J15.................................................................................................................... 31
9. I/O Connector List.......................................................................................................................................... 32
I/O Cables................................................................................................................................................... 32
10. Jetson Xavier B2B Connector Interface...................................................................................................... 33

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11. PC/104 Expansion System............................................................................................................................ 35
Overview..................................................................................................................................................... 35
Functional Block Diagram........................................................................................................................... 36
PC/104 Bus Framework ............................................................................................................................. 36
PCIe/104 Type 1 and Type 2 Standards.................................................................................................... 37
PCI/104-Express Version 1.0 and 1.1 Host Board Compatibility ............................................................... 38
PCI/104-Express Version 1.0 and 1.1 Peripheral Board Compatibility...................................................... 38
PCIe/104 Features ..................................................................................................................................... 38
PCI/104-Express Features ......................................................................................................................... 39
PCIe/104 OneBank and PCI Express Connector....................................................................................... 40
PCIe/104 3-Bank PCI Express Connector ................................................................................................. 41
Resources................................................................................................................................................... 41
12. Jumper Description ....................................................................................................................................... 42
Input Voltage Selection: JP1 ...................................................................................................................... 42
Serial Termination and USB Mode Selection: JP2..................................................................................... 43
Serial Termination Debug UART and PCIe/104 Power: JP3 ..................................................................... 44
13. Getting Started............................................................................................................................................... 45
Flashing Operating System to AGX Xavier Series Module........................................................................ 45
14. Data Acquisition (DAQ) SubSystem ............................................................................................................ 48
SAM Data Acquisition Circuit...................................................................................................................... 48
Analog Inputs.............................................................................................................................................. 48
Analog Outputs........................................................................................................................................... 51
Digital I/O Operations ................................................................................................................................. 52
Miscellaneous Functions ............................................................................................................................ 52
15. Thermal Solutions.......................................................................................................................................... 54
Baseboard Heat Spreader Specifications .................................................................................................. 55
16. Specifications................................................................................................................................................. 57
17. Addendum ...................................................................................................................................................... 58
Programming NXP PTN3460 Chip............................................................................................................. 58
Camera Installation Procedures................................................................................................................. 61
Serial Multiprotocol Configuration............................................................................................................... 64
CAN Controller Configuration..................................................................................................................... 65
18. Limited Warranty Policy................................................................................................................................ 66

Elton User Manual Rev 1.04 www.diamondsystems.com Page 4
1. IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD
(Electrostatic Discharge)-sensitive. This increases the likelihood of the boards incurring accidental damage
during handling, installation, and connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in
sequential order:
Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
Unpack components and remove them from their anti-static bags only when they are ready to be
used.
Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure
or damage. In this type of damage, the board eventually stops functioning because of some defective
components. Usually, the failure can be identified and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A
common observation is that of a screwdriver slipping on the board during installation, causing a gouge on the
PCB surface, cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may
not cause damage to the circuitry, depending on components located near the edges. Most Diamond System
boards are designed with a minimum 25 mils clearance between the board edge and component pad. The
Ground/power planes are located a minimum of 20 mils from the edge to avoid possible shorting from this
type of damage. However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice
for board manufacturers. Though Diamond Systems boards are resilient to damages, the components located
close to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If
multiple boards are stored together, they should be contained in bins with dividers placed between the boards.
Do not pile boards on top of each other or cram too many boards within a small location. This can cause
damage to connector pins or fragile components.

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Damage During Installation in a PC/104 Stack: Damage on boards can also occur while installing the board
in a PC/104 Stack A common cause of damage occurs when the connector pins are misaligned with their
corresponding interfaces on the stack.
For example, during installation, if a PC/104 board pin-mapping is misaligned/shifted by 1 row or 1 column, it
can cause the 12V power and Ground signal lines on the bus to contact the wrong pins on the board and
damage components linked to the data bus lines.
Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape
using needle-nose pliers.
The most common cause of a bent connector pin is when the board is pulled off a stack by tugging it at angles
from one end of the connector to the other, to release it off the stack. Tugging the board off the stack in this
manner can bend the pin(s) significantly.
A similar situation can occur when pulling a ribbon cable off a pin header. If the pins are bent too severely,
bending them back can cause them to weaken or break. In this case, the connector must be replaced.
Power Damages: There are various causes of power-specific damages that can occur while handling the
board. Some common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board
while it is powered-up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to
withstand a reverse power supply connection. This will destroy almost all ICs connected to the power supply.
In this case, the board will likely be irreparable and must be replaced. A chip destroyed by reverse or
excessive power will often have a visible hole or show some deformation on the surface due to vaporization
inside the package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the
board, the input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will
withstand an erroneous connection of up to 36V on the analog inputs, even when the board is powered off,
but not on all boards, and not under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a
power supply voltage, the output can be damaged. On most Diamond boards, a short circuit to Ground on an
analog output will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified
voltage, the digital circuitry can be damaged. The acceptable voltage range, on most Diamond Systems
boards connected to digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V).
Overvoltage beyond this limit can damage the circuitry.
Other considerations are Logic Signals, which are typically generated between 12V to 24V.
If a Digital I/O Line of 12V to 24V is connected to a 5V logic chip, the chip will be damaged, and the damage
could extend to other chips in the circuit.
IMPORTANT! Always check twice before Powering Up!

Elton User Manual Rev 1.04 www.diamondsystems.com Page 6
2. INTRODUCTION
Elton Baseboard Overview
The Elton baseboard is the latest product from Diamond Systems to integrate the newly-released Standalone
NVIDIAAGX Xavier System on Module (SoM) Series:
AGX Xavier
AGX Xavier 8 GB
NOTE: Currently the Elton Board Support Package (BSP) supports the AGX Xavier Module Series only.
Support for the AGX Xavier 8 GB Modules will be provided subsequently.
Packaged in an ultra-compact sized form-factor measuring H 6” x W 4”(152.4 mm x 101.6 mm) Elton
baseboard is empowered to deliver the latest technologically innovative breakthroughs by converging Fifth
Generation (5G) and Fourth Generation (4G) Networking Technologies.
The Elton baseboard integrates the AGX Xavier Series Module to offer a full-featured, embedded system
that significantly enhances performance, power efficiency, and optimized I/O capabilities, for processing
real-time Artificial Intelligence (AI), Machine and Deep Learning and high-level Audiovisual (AV) computing
tasks at unconventional speeds.
Feature Description and Connector Type
Feature
Description
Connector Type
Power
9V-20V Wide Input Supply Range
2x2 Samtec IPL1
USB Interfaces
2x USB 2.0
2x5 Header
2x USB 3.1
2x5 Header (x2)
Ethernet Controllers
10/100/1000 Mbps through I210 Controller with On-board
Magnetics
RJ45 GbE
2x5 Header
10/100/1000 Mbps through RGMII Interface to KSZ9031
PHY with On-board Magnetics
RJ45 GbE
2x5 Header
Mass Storage
1 MINI-PCI EXPRESS (mPCIe) Socket
RA PCIe MiniCard
52 Position (52-Pin-
Card-Edge-Type
Connector)
1 M.2 PCIe SSD Socket 2242 (22mm wide x 42mm long)
M.2 Socket
1 Universal Flash Storage (UFS) and Micro SD
UFS & Micro SD Push-
Pull Type Connector
Expansion Connections
PCIe/104 3-Bank (4Nos x1 PCIe, 2x USB 2.0, 1No x8
PCIe)
156 POS SMT
Mezzanine
PCI-104 via PCIe to PCI Bridge
PCI 104 Press-Fit
Connector
Audio Interface
Via SGTL500 CODEC
2x5 Header
Serial Ports
4 RS-232/422/485 Ports. Software configurable through
SP336 Transceivers
2x5 Header (x2)
Display Connectors
1 HDMI 2.0a/b Routed from the Module
2x10 Header
1 Dual-Channel eDP to LVDS and Backlight
2x15 Header
Camera Interface
4 x4 / 8 x2 Lane CSI-2 Camera Interface
2 x 6 0 Receptacle SMT
Data Acquisition (DAQ)
6x SE ADC Input / 3x DE ADC Input to SAM Controller
2x DAC via SAM Controller
2x13 Header
Digital I/Os
13 Digital I/O via SAM Controller
CAN Header
2x CAN
1x4 1.25mm SMD
Utility Connectors
PWR_BTN, RESET, FORCE RECOVERY
2x3 Header

Elton User Manual Rev 1.04 www.diamondsystems.com Page 7
Operating System Support
Linux Kernel version 4.4.38; Ubuntu 16.04 AArch64
Mechanical, Electrical, and Environmental Properties
Form-Factor
H 6” x W 4” (152.4 mm x 101.6 mm)
Cooling Mechanism
Conduction Cooling
Power Input Range
+9V to +20V
Operating Temperature
Range
-25°C to +80°C Ambient
Elton Baseboard Models
Elton baseboard variants offer a complete modular platform in compliance with requisite specifications that
support a wide range of interface options such as board-to-board (B2B) connectors for I/O peripherals, built-
in microcontroller, memory, Ethernet, USB, UART, mini-PCI Express interfaces –designed for end-user
customization
The Elton Group includes three variants which are listed in the following table. All variants incorporate the
same functionalities and differ only in feature requirements.
Model
Feature
ELT-BB01
PCIe/104

ELT-BB02
PCIe/104, and PCI-104

ELT-BB03
PCIe/104, and PCI-104
X
AGX Xavier Modules Overview
Measuring L x 3.93”X W 3.42" X H 0.62" (100 mm x 87 mm x 0.02 mm) the AGX Xavier and AGX Xavier 8
Series are autonomous, highly sophisticated, low-powered modules, engineered to process more than 32
and 20 trillion operations per second respectively, at a speed of 56 Gbit per second.
Embedded with 9 billion Transistors and a 699 Neuro-Mezzanine Pin Board-to-Board connector that
supports Hi-Speed I/O processing of data including PCI/PCIe Gen 5 and Gen 4 technologies, the modules
enable Deep Learning Applications to operate in Small Form-Factor (SFF) products such as Computer-on-
Module (COMs), and Smart devices such as Cameras, within a secure and automotive environment.
The circuitry and I/O connectors on the baseboard utilize all available features of the AGX Xavier Series
Module to deliver highly versatile performance in industrial environments.

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AGX Xavier Series Feature Description
Feature
Description
AGX XAVIER
AGX XAVIER 8 GB
GPU
512-core NVIDIA Volta™ GPU
with 64 Tensor Cores
384-core NVIDIA Volta™ GPU
with 48 Tensor Cores
DL Accelerator
(2x) NVIDIA Deep Learning Accelerator
(NVDLA) Engines
(2x) NVIDIA (NVDLA) Engines
CPU
8-core ARMv8.2 @ 64-bit CPU,
8 MB L2 + 4 MB L3
6-core Arm®v8.2 64-bit CPU,
6 MB L2 + 4 MB L3
Memory
16 GB 256-bit LPDDR4x | 136.5 GB/s
8 GB 256-bit LPDDR4x | 85.3 GB/s
Video Encode
2x 1000MP/sec
4x 4K @ 60 (HEVC)
16x 1080p @ 60 (HEVC)
32x 1080p @ 30 (HEVC)
2x 464MP/sec
2x 4K @ 30 (HEVC)
6x 1080p @ 60 (HEVC)
14x 1080p @ 30 (HEVC)
Video Decode
2x 1500MP/sec
2x 8K @ 30 (HEVC)
6x 14k @ 60 (HEVC)
26x 1080p @ 60 (HEVC)
72x 1080p @ 30 (HEVC)
2x 690MP/sec
2x 4K @ 60 (HEVC)
12x 1080p @ 60 (HEVC)
32x 1080p @ 30 (HEVC)
Vision Accelerator
7-way VLIW Processor
7-way VLIW Processor
Camera Expansion
Header
16x CSI-2 Lanes
(40 Gbps in D-PHY V1.2 or 109 Gbps in CPHY
v1.1)
8x SLVS-EC Lanes (up to 18.4 Gbps)
Up to 16 Simultaneous Cameras
16x CSI-2 Lanes
(40 Gbps in D-PHY V1.2 or 64 Gbps in CPHY
v1.1)
8x SLVS-EC Lanes (up to 18.4 Gbps)
Up to 16 Simultaneous Cameras
PCIe
5x PCIe Gen4 (16GT/s) Controllers
1x8, 1x4, 1x2, 2x1
PCIe Gen4, Root Port and Endpoint
5x PCIe Gen4 (16GT/s) Controllers
1x8, 1x4, 1x2, 2x1
PCIe Gen3
Storage
32 GB eMMC 5.1
32 GB eMMC 5.1
UPHY
3x USB 3.1 (10 Gb/s) (4x) USB 2.0 ports
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen4)
3x USB 3.1, 4x USB 2.0
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen3)
Connectivity
1 Gigabit Ethernet, MAC, Reduced Gigabit
Media Independent (RGMII) Interface
1 Gigabit Ethernet, MAC, Reduced Gigabit
Media Independent (RGMII) Interface
Miscellaneous I/O's
UFS, I2S, i2c, SPI, CAN, GPIOs, UART, SD
UFS, I2S, i2c, SPI, CAN, GPIOs, UART, SD
Mechanical, Electrical, and Environmental Properties
Form-Factor
H 3.93” x W 3.42” (100 x 87 mm; 16 mm Z-height)
Weight
280 Grams (9.87 Ounces) +/- 10 grams with Packaging including Thermal Transfer Plate (TTP)
Connector
699-Pin Board-to-Board Connector
Cooling Solution
Integrated Thermal Transfer Plate (TTP) with Heat Pipe
Power Input Range
9.0-20VDC
Operating Temperature
Range
25°C to 80°C

Elton User Manual Rev 1.04 www.diamondsystems.com Page 9
3. FUNCTIONAL OVERVIEW
The following section provides functional details of the key sub-systems implemented on the baseboard.
Processor Modules
The baseboard currently supports the Jetson™Series AGX Xavier Modules.
Both series, the AGX Xavier and Xavier 8 GB Modules integrate 512-core NVIDIA Volta GPU with Tensor
Cores, and offer 16 GB of 256-bit LPDDR4x memory with 137 GB/s of bandwidth at 2133 MHz bus speeds
that enable AI-powered platform tools to process high resolution computing tasks at 20 to 32 Tera Operations
Per Second (TOPS) respectively.
The modules encapsulate a high-density 699-pin board-to-board connector for breaking out high-speed I/O
signals to carrier board systems This enables seamless integration of applications and devices across a
wide range of products and form-factors.
Power Supply Specifications
Elton baseboard is powered by a wide input voltage range of +9V to +20V.
Alternatively, the baseboard can be powered from a +12V input source on the PCIe/104 or PCI-04 power
supply board by mounting the Jumper at location 5 on JP3. This disables the 5V and 3.3V power feed from
the Elton baseboard to the PCIe/104 or PCI-104 Cards.
NOTE: The 12V pins on the PCI-104 connector are powered by the main input voltage. To meet the PCI-
104 module I/O card requirements of 12V, the main input voltage supply unit must operate at
+12V.
Power supply voltages for the baseboard are derived from the +(9V-20V) input source. The power supply
unit must meet standards that support the highest bandwidth of on-board memory with additional reserves
to support the add-on features listed in the table below.
Power Requirements for Supplementary Features
Feature
12V
5V
3.3V
AGX Xavier Series Module
2.5A
PCI-104 and OneBank™PCIe/104 Modules
1.0A
2A
2A
LCD Power
1.1A
1.4A
0.7A
PCIe MiniCard Socket
2A
M.2 SSD
0.5A
USB 2.0/3.1 (0.5A per USB 2.0 Port and 1A per USB 3.1 Port)
3A
Camera Circuit
0.2A
0.4A
Second Ethernet Circuit
0.3A
Miscellaneous
1A
Backup Battery
The baseboard contains an on-board RTC (Real-Time Clock) battery holder which accommodates a BR-
2032/BN coin cell. The default board configuration includes an installed coin cell. A 2 x1 input connector is
provided to enable the use of an external battery for rugged applications.

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Ethernet Ports
The baseboard is equipped with two Gigabit Ethernet ports.
1. A 10/100/1000 Ethernet port is derived from the Intel WGI210IT PCIe Ethernet controller which
is accessed via x1 PCIe Lane routed from the module.
2. A 10/100/1000 Ethernet port is derived from the RGMII (Reduced Gigabit Media-Independent
Interface) output of the module connected to the on-board KSZ9031 PHY from Microchip.
Each Port is equipped with on-board magnetics and 2x5 headers that are compatible with Diamond Systems
standard Ethernet cables.
On-board LEDs are available to indicate the Link, Activity, and Speed status associated with each port. The
LEDs are located along the board edge near the Ethernet connectors.
NOTE: The Ethernet port connectors do not provide access to the LED signals. Refer to Section: 3.18
LED Indicators for more details.
Display Controller
The baseboard supports HDMI 2.0 a/b Video Output. The HDMI port is routed from the AGX Xavier Series
Module and is implemented through a 2x10 header.
Dual-channel LVDS interface functionality is obtained by connecting the Embedded DisplayPort™(eDP) to
a LVDS device such as the NXP PTN3460 bridge IC, to enable a dual-channel LVDS-LCD output.
The LCD Backlight control is implemented by a Pulse-Width Modulation (PWM) circuit which is located on a
separate latching connector.
To implement a dual-channel on the LVDS-LCD output, the NXP PTN3460 bridge IC must be programmed
to enable processes from the incoming DisplayPort (DP) stream, perform DP to LVDS protocol conversion
between the Embedded DisplayPort (eDP) source and LVDS display panel. Refer to Section: Addendum for
programming instructions.
Camera Serial Interface (CSI)
The AGX Xavier Series Module support four MIPI (Mobile Industry Processor Interface) CSI x4 bricks,
enabling a wide array of device types and combinations to be implemented. Up to four 4-lane, six 2-lane, or
six 1-lane configurations or combinations of camera streams are available. Each lane supports up to 16
Virtual Channels (VC). Each data channel has a peak bandwidth of up to 2.5 Gbps.
Similar to the Xavier Developer Kit Carrier Board, the baseboard supports four MIPI CSI x4 camera
interfaces through a 120-pin daughterboard connector.
Add-on camera boards from Leopard Imaging/e-con Systems can be plugged into the daughterboard
connector to support the four 4-lane or six 2-lane cameras. Alternatively, clients can customize a
daughterboard to suit their requirements.
The daughterboard connector also supports i2c and control signals which enable users to directly interface
the camera to the baseboard.
Refer to Section 17.2: Camera Installation Procedures of the Addendum for installation and operation
procedures.