Diamond Systems FLOYD FLD-BB01 User manual

FLOYD™
NVIDIA®Jetson Nano and Xavier NX Carrier Board
User Manual
Revision 1.09
© Copyright 2020
Diamond Systems Corporation
www.diamondsystems.com
FOR TECHNICAL SUPPORT
PLEASE CONTACT:
Email: [email protected]

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 2
Contents
1.  Important Safe Handling Information ............................................................................................................ 4 
2.  Introduction...................................................................................................................................................... 6 
 Floyd Carrier Board Overview...................................................................................................................... 6 
 Floyd Carrier Board Models.......................................................................................................................... 7 
3.  JetBox Floyd System ...................................................................................................................................... 8 
4.  Jetson Module Technical Specifications ...................................................................................................... 9 
5.  Functional Overview...................................................................................................................................... 11 
 Power Supply Specifications...................................................................................................................... 11 
 Camera Serial Interface (CSI) .................................................................................................................... 11 
 Controller Area Network (CAN).................................................................................................................. 11 
 Digital I/O.................................................................................................................................................... 11 
 Display........................................................................................................................................................ 11 
 Ethernet Ports............................................................................................................................................. 12 
 PoE (Power over Ethernet)......................................................................................................................... 12 
 Audio Interface............................................................................................................................................ 12 
 LED Indicators............................................................................................................................................ 12 
 Micro SD Socket......................................................................................................................................... 12 
 PCIe Link Routing Map............................................................................................................................... 13 
 PCIe M.2 SSD Socket ................................................................................................................................ 13 
 PCIe MiniCard Socket ................................................................................................................................ 13 
 Serial Port Interfaces.................................................................................................................................. 14 
 USB Ports................................................................................................................................................... 14 
 Utility Header Connector ............................................................................................................................ 14 
6.  Block Diagram................................................................................................................................................ 15 
7.  Connector and Jumper Locations ............................................................................................................... 17 
 Main Component Locations........................................................................................................................ 17 
 I/O Connectors, Jumpers and Led Specifications...................................................................................... 18 
 Front-Facing Connectors............................................................................................................................ 19 
 Expansion Slot and Switch Locations ........................................................................................................ 20 
8.  I/O Connectors............................................................................................................................................... 21 
 Power In Connector: J3.............................................................................................................................. 21 
 PoE Power-In Connector: J34 (FLD-BB01 only)........................................................................................ 21 
 RTC Battery Connector: J15 ...................................................................................................................... 21 
 Camera Connectors: J12, J13, J14............................................................................................................ 22 
 Controller Area Network (CAN) Connector: J11 (FLD-BB01 Only)............................................................ 23 
 Ethernet Connectors: J7............................................................................................................................. 23 
 HDMI Connector: J5................................................................................................................................... 23 
 USB 2.0 Port Connector: J4....................................................................................................................... 24 
 USB 3.0 Port Connector: J6....................................................................................................................... 24 
 Micro SD Connector: J18 ........................................................................................................................... 24 
 PCIe M.2 SSD Socket (M-KEY) Connector: J19........................................................................................ 25 
 PCIe Mini Card Connector: J17 (FLD-BB01 only)...................................................................................... 26 
 Serial Port and GPIO Connectors: J1, J9................................................................................................... 27 

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 3
 Utility Connector: J16 ................................................................................................................................. 28 
 Fan Connector: J20.................................................................................................................................... 28 
9.  I/O Connector List.......................................................................................................................................... 29 
 I/O Cables................................................................................................................................................... 29 
10.  Configuration Jumpers ................................................................................................................................. 30 
 Digital I/O Enable Pull-Up Pull-Down: JP1................................................................................................. 30 
 Protocol Mode Selection and Enable Termination: JP2............................................................................. 31 
 USB 1 Host/Device Select: JP3.................................................................................................................. 31 
11.  Flashing the BSP Image................................................................................................................................ 33 
12.  Thermal Solutions.......................................................................................................................................... 36 
13.  System Assembly.......................................................................................................................................... 38 
 General Description.................................................................................................................................... 38 
 Required Parts............................................................................................................................................ 38 
 Assembly Instructions................................................................................................................................. 38 
 Install Jetson Module....................................................................................................................... 39 
 Install Heat Sink............................................................................................................................... 40 
 Install Fan ........................................................................................................................................ 41 
14.  Specifications................................................................................................................................................. 42 
15.  Limited Warranty Policy................................................................................................................................ 43 

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 4
1. IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handlin
g
procedures when workin
g
with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothin
g
and/or accessories.
A
lwa
y
s store this product in ESD-protective packa
g
in
g
when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD
(Electrostatic Discharge)-sensitive. This increases the likelihood of the boards incurring accidental damage during
handling, installation, and connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in sequential
order:
Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
Unpack components and remove them from their anti-static bags only when they are ready to be
used.
Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure or
damage. In this type of damage, the board eventually stops functioning because of some defective components.
Usually, the failure can be identified and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB surface,
cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may not
cause damage to the circuitry, depending on components located near the edges. Most Diamond System boards
are designed with a minimum 25 mils clearance between the board edge and component pad. The Ground/power
planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type of damage.
However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located close
to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If
multiple boards are stored together, they should be contained in bins with dividers placed between the boards. Do
not pile boards on top of each other or cram too many boards within a small location. This can cause damage to
connector pins or fragile components.

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 5
Damage During Installation on a PC/104 Stack: Damage on boards can also occur while installing the board in
a PC/104 Stack A common cause of damage occurs when the connector pins are misaligned with their
corresponding interfaces on the stack.
For example, during installation, if a PC/104 board pin-mapping is misaligned/shifted by 1 row or 1 column, it can
cause the 12V power and Ground signal lines on the bus to contact the wrong pins on the board and damage
components linked to the data bus lines.
Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape using
needle-nose pliers.
The most common cause of a bent connector pin is when the board is pulled off a stack by tugging it at angles
from one end of the connector to the other, to release it off the stack. Tugging the board off the stack in this
manner can bend the pin(s) significantly.
A similar situation can occur when pulling a ribbon cable off a pin header. If the pins are bent too severely,
bending them back can cause them to weaken or break. In this case, the connector must be replaced.
Power Damages: There are various causes of power-specific damages that can occur while handling the board.
Some common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board while it is
powered-up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to withstand a
reverse power supply connection. This will destroy almost all ICs connected to the power supply. In this case, the
board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive power will often
have a visible hole or show some deformation on the surface due to vaporization inside the package.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified
voltage, the digital circuitry can be damaged. The acceptable voltage range, on most Diamond Systems boards
connected to digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage beyond
this limit can damage the circuitry.
Other considerations are Logic Signals, which are typically generated between 12V to 24V.
If a Digital I/O Line of 12V to 24V is connected to a 5V logic chip, the chip will be damaged, and the damage could
extend to other chips in the circuit.
IMPORTANT! Always check power connections twice before powering up!

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 6
2. INTRODUCTION
Floyd Carrier Board Overview
Floyd is a family of carrier boards that turns the Nvidia Jetson Nano and Xavier NX GPU modules into
complete embedded computers. Two models are available with different feature sets. Both models will work
with both Jetson modules. Customization is available to fine tune the carrier board to remove unneeded
features for cost reduction or to support additional features, including PCIe lane routing and CAN transceiver
selection.
The following table summarizes the on-board I/O features and connector types.
Feature Description Connector Type
Modules Jetson Nano
Jetson Xavier NX
Camera Interface 3 x4 Lane CSI-2 Interfaces 3x 30-Pin Micro Coaxial Cable
Connectors
Display 1x HDMI 2.0a/b with Audio routed from the Module Dual-Port Vertically Stacked
HDMI Connector
1x HDMI 2.0a/b without Audio via DP-HDMI Bridge
without Audio
Ethernet Controllers 2x PoE+ capable 10/100/1000 Mbps RJ45
with In-built Magnetics and LEDs 1x Dual Port RJ-45 PoE+
Connector
PoE Power 50V to 57V Input Supply 2-pin header
Serial Ports 2x Ports Jumper Configurable RS-232/422/485
through SP336 Transceivers 1x DB9 male connector
Part of 2 x 10 pin header
USB 2x USB 2.0 Dual-Port Vertically Stacked type
A Receptacle
1x USB 3.0 1x USB 3.0 Upright type A
Receptacle
CAN Interface 1x CAN 1x4 JST Connector
Digital I/O 8x. Obtained using I
2
C GPIO Expander Part of 2 x 10 pin header
Mass Storage 1x mPCIe Socket RA PCIe Mini Card 52 Position 1x M.2 PCIe SSD Socket RA M.2 2280
1x Micro-SD Socket Push-pull R/A Type
Fan 1 Fan Connector with tachometer and PWM control 1 x4 SMD Connector
RTC Battery 3V Power Input 1x2 Connector
Utility Connector Force recovery, Power button, Reset, I
2
C (3.3V),
SPI (3.3V), Debug UART, Force Off 2 x 10 pin header
Operating System
Linux Kernel Version 4.9.140
Mechanical, Electrical, and Environmental Properties
Form-Factor L 5.8” x W 3.04” (147mm x 77mm).
Power Input Range 7V to 24V Wide Input Supply DC Barrel Jack
Operating Temperature -25°C to +75°C Ambient
Cooling Mechanism Heat sink, optional fan (optional
accessories)

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 7
Floyd Carrier Board Models
The Floyd carrier board is available in two models:
1. FLD-BB01 full feature with PoE support and minicard socket
2. FLD-BB02 low-cost model with reduced feature set
Feature FLD-BB01 FLD-BB02
Camera CSI 4-Lane 3 3
CAN Xavier NX Module
only No
Gigabit Ethernet 2 1
GPIO 3.3V 8 8
HDMI 2 1
M.2 PCIe Socket PCIe x1 PCIe x4
MiniCard, PCIe Socket Yes No
PoE Yes No
SD Card Yes Yes
Serial Interface 2x
RS 232/422/485 1 x RS-232 1 x RS-232/485
USB 3.0 1 1
USB 2.0 2 2

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 8
3. JETBOX FLOYD SYSTEM
JETBOX-FLOYD is a compact Nvidia Jetson AI computing platform ready to deploy. It includes the Jetson Nano
or NX module installed on our FLOYD carrier board with a Linux OS installed and preconfigured to support all the
I/O on Floyd.
The system is available multiple standard configurations to meet a range of customer needs. The 01 full-feature
models feature dual Ethernet ports with PoE support using an external power injector, two multi-protocol serial
ports, dual HDMI displays, and a PCIe minicard socket. The 02 low-cost models have fewer baseline I/O features
but offer a faster-performance PCIe x4 NVME M.2 socket. Both models will support one channel of CAN 2.0B with
the Xavier NX module installed.
Jetbox-Floyd features multiple expansion sockets for additional I/O and storage capacity to meet a wide range of
application needs. Dual SMA antenna cutouts support the installation of wifi and cellular modem modules for
network connectivity. The enclosure is DIN rail mountable or can be used in a “table top” scenario.
The system is compatible with both 12V and 24V DC power supplies. A 12VDC universal AC adapter is included
with the system. Visit www.diamondsystems.com/products/jetboxfloyd for more details.
Jetbox-Floyd is available in four standard baseline configurations of Jetson module and baseboard features:
Feature JB-FLD-NAO-01 JB-FLD-NAO-02 JB-FLD-XNX-01 JB-FLD-XNX-02
Jetson module Nano Nano Xavier NX Xavier NX
Gigabit Ethernet 2 1 2 1
PoE Both ports No Both ports No
HDMI 2 1 2 1
Camera CSI 4-lane 3 3 3 3
USB 3.0 1 1 1 1
USB 2.0 2 2 2 2
M.2 2280 socket PCIe x1 PCIe x4 PCIe x1 PCIe x4
Minicard socket Full size PCIe No Full size PCIe No
SD card Yes Yes Yes Yes
GPIO 3.3V 8 8 8 8
Serial 2x RS-232/422/485
1x RS-232
1x RS-232/485 2x RS- 232/422/485 1x RS-232 1x RS-232/485
CAN 2.0 No No 1 No

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 9
4. JETSON MODULE TECHNICAL SPECIFICATIONS
Below is a high level summary of Jetson module features. Please visit nvidia.com or search online for more
complete information on the Jetson Nano and Xavier NX GPU modules.
Feature Description
Jetson Nano Jetson Xavier NX
Processing
AI Performance 472 GFLOPs @ 10 W 14 TOPS (INT8)
@ 10 W 21 TOPS (INT8) @ 15 W
472 GFLOPs
SoC NVIDIA Tegra X1 Series NVIDIA Xavier
GPU NVIDIA Maxwell Architecture with 128 NVIDIA
CUDA® Cores @ 921MHz 0.5 TFLOPs
(FP16)
384-core NVIDIA Volta™ GPU with 48
Tensor Cores
CPU 64-bit Quad-core ARM A57 @ 1.43GHz
Quad-core ARM Cortex®-A57 CPU Complex 6-core NVIDIA Carmel 6-Core Arm® v8.2
64-bit CPU, 6 MB L2 + 4 MB L3
Deep Learning
Accelerator – (2x) NVIDIA Deep Learning Accelerator (NVDLA) Engines
Memory 4GB 64-bit LPDDR4 @ 1600MHz, 25.6 GB/s 8 GB 128-bit LPDDR4x @ 1600 MHz,
51.2GB/s
Video Encode
4Kp30 | (4x) 1080p30 | (2x)
1080p60 (HEVC) 50MP/Sec
1x 4K @ 30 (HEVC)
2x 1080p @ 60 (HEVC)
4x 1080p @ 30 (HEVC); 4x 720p @ 6 (HEVC)
9x 720p @ 30 (HEVC)
2x 464MP/Sec (HEVC)
2x 4K @ 30 (HEVC)
6x 1080p @ 60 (HEVC)
14x 1080p @ 30 (HEVC)
Video Decode
4Kp60 | (2x) 4Kp30 | (8x) 1080p30 | (4x)
1080p60, 500MP/sec
1x 4K @ 60 (HEVC)
2x 4K @ 30 (HEVC)
4x 1080p @ 60 (HEVC)
8x 1080p @ 30 (HEVC)
9x 720p @ 60 (HEVC)
2x 690MP/sec (HEVC)
2x 4K @ 60 (HEVC)
4x 4K @ 30 (HEVC)
12x 1080p @ 60 (HEVC)
16x 1080p @ 30 (H.264)
32x 1080p @ 30 (HEVC)
Vision Accelerator – 7-way VLIW Processor
Interfaces
Camera Expansion
Header
Up to 4 Cameras
12 Lanes (3 x 4 or 4 x 2) MIPI CSI-2
D-PHY 1.1 (1.5 Gb/s Per Pair)
Up to 6 Cameras (24 via Virtual Channels)
12 Lanes MIPI CSI-2
D-PHY 1.2 (Up to 30 Gbps)
Connectivity Wi-Fi (Requires External Chip)
1 Gigabit Ethernet, M.2 Key E 1 Gigabit Ethernet, MAC, Reduced Gigabit
Media Independent (RGMII) Interface
Display HDMI 2.0, DisplayPort eDP 1.4 2 Multi-Mode DP 1.4/eDP 1.4/HDMI 2.0
Miscellaneous I/O's (3x) I2C | (2x) SPI | UART | I2S | GPIOs
GPIO, I2C, I2S, SPI, UART UFS, I2S, I2C, SPI, CAN, GPIOs, UART,
SD
Networking 10/100/1000 BASE-T Ethernet 10/100/1000 BASE-T Ethernet
PCIe 1 x4 (PCIe Gen2) 1 x1 (PCIe Gen3) + 1 x4 (PCIe Gen4),
Total 144 GT/s* (PCIe Gen3, Root Port &
Endpoint)
Storage 16 GB eMMC 5.1
MicroSD Card (16GB UHS-1 Recommended
Minimum) 16 GB eMMC 5.1
USB 1x USB 3.0, 3x USB 2.0 1x USB 3.1, 3x USB 2.0
Miscellaneous I/O's GPIO, I2S, i2c, SPI, UART GPIO, I2S, i2c, SPI, UART

FLOYD User Manual rev 1.09 www.diamondsystems.com Page 10
Mechanical, Electrical, and Environmental Properties
Form-Factor L 2.74” X W 1.77" (69.6 mm x 45 mm) L 2.74” X W 1.77" (69.6 mm x 45 mm)
Connector 260-Pin SO-DIMM Connector 260-Pin SO-DIMM Connector
Cooling Solution Heat sink / fan sink available Heat sink / fan sink available
Voltage Input 5V 5V
Power Input Range 5W / 10W 10W / 15W
Ambient Operating
Temperature Range -25°C to 75°C -25°C to 75°C